CN220123343U - Heat radiation structure of electronic ballast - Google Patents

Heat radiation structure of electronic ballast Download PDF

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Publication number
CN220123343U
CN220123343U CN202321646378.XU CN202321646378U CN220123343U CN 220123343 U CN220123343 U CN 220123343U CN 202321646378 U CN202321646378 U CN 202321646378U CN 220123343 U CN220123343 U CN 220123343U
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China
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electronic ballast
water
water cooling
cooling layer
heat dissipation
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CN202321646378.XU
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Chinese (zh)
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丘振良
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Shanghang Yideli Technology Co ltd
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Shanghang Yideli Technology Co ltd
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Abstract

The utility model discloses a radiating structure of an electronic ballast, which belongs to the technical field of electronic ballasts and comprises a water-cooling structure, wherein mounting plates are arranged on two sides of the bottom end of the water-cooling structure, a clamping structure is arranged on one side, close to each other, of each two groups of mounting plates, an electronic ballast is arranged between the two groups of mounting plates, two sides of the electronic ballast are clamped with the clamping structure, and the top of the electronic ballast is propped against the water-cooling structure; the clamping structure comprises two groups of grooves formed in one side of the mounting plate, a cavity is formed in one side, away from the electronic ballast, of the grooves, a rotary rod is rotationally connected in the cavity, a supporting structure is arranged at the top end of one side of the rotary rod, a clamping block is arranged at the bottom end of the top end of one side of the rotary rod, and the supporting structure and the clamping block are both in sliding connection with the rotary rod. The device can realize the rapid disassembly of the electronic ballast and the heat dissipation structure, so as to facilitate the maintenance or replacement of the electronic ballast.

Description

Heat radiation structure of electronic ballast
Technical Field
The utility model relates to the field of electronic ballasts, in particular to a heat dissipation structure of an electronic ballast.
Background
The electronic ballast is one kind of ballast, and is electronic equipment for driving electronic light source to produce required lighting, and modern fluorescent lamp has electronic ballast, so that it is light, small and even can be integrated with lamp tube, and the electronic ballast may have the function of raising current frequency or current waveform to improve or eliminate the flickering phenomenon of fluorescent lamp.
The electronic ballast has electronic devices inside, the electronic devices in the electronic ballast generate more heat during the working time of the electronic ballast, and then in order to prolong the service life of the electronic ballast, the electronic ballast is provided with a heat dissipation structure to dissipate heat, and the heat dissipation structure is required to be disassembled when the electronic ballast needs to be overhauled or replaced after the heat dissipation structure is arranged at present, so that the heat dissipation structure and the electronic ballast are usually fixedly connected at present and are more complex during disassembly.
Disclosure of Invention
In order to overcome the defects of the prior art, the technical problem to be solved by the utility model is to provide the radiating structure of the electronic ballast, which can realize the rapid disassembly of the electronic ballast and the radiating structure so as to facilitate the maintenance or the replacement of the electronic ballast.
To achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a radiating structure of an electronic ballast, which comprises a water cooling structure, wherein mounting plates are arranged at two sides of the bottom end of the water cooling structure, clamping structures are arranged at one sides of two groups of mounting plates, which are close to each other, an electronic ballast is arranged between the two groups of mounting plates, two sides of the electronic ballast are clamped with the clamping structures, and the top of the electronic ballast is abutted against the water cooling structure; the clamping structure comprises two groups of grooves formed in one side of the mounting plate, a cavity is formed in one side, away from the electronic ballast, of the grooves, a rotary rod is rotationally connected in the cavity, a supporting structure is arranged at the top end of one side of the rotary rod, a clamping block is arranged at the bottom end of the top end of one side of the rotary rod, and the supporting structure and the clamping block are both in sliding connection with the rotary rod.
The preferable technical scheme of the utility model is that the abutting structure comprises a telescopic rod which is in sliding connection with a rotary rod, a spring is wound on the outer side of a driving end of the telescopic rod, and an abutting block is fixedly connected with the driving end of the telescopic rod.
The preferable technical scheme of the utility model is that two groups of sliding grooves are formed in one side of the rotating rod, sliding blocks are connected in a sliding manner in the concave sliding grooves, and the two groups of sliding blocks are respectively connected with the telescopic rod and the clamping block in a rotating manner.
The preferable technical scheme of the utility model is that the water cooling structure comprises a water cooling layer propped against the top of the electronic ballast, wherein the top of the water cooling layer is provided with a cooling layer which is used for cooling the water cooling layer, the top of the cooling layer is provided with a communication layer, and the communication layer is communicated with the water cooling layer.
The water cooling layer and the communication layer comprise a first water conveying pipe, a second water conveying pipe and a third water conveying pipe, and the water conveying direction of the second water conveying pipe is opposite to that of the first water conveying pipe and the second water conveying pipe.
The cooling layer comprises an air inlet formed in one side and an air outlet formed in the other side, a vent is formed in one side of the mounting plate, and heat dissipation fans are arranged in the air outlet and the vent.
Compared with the prior art, the utility model has the beneficial effects that: through the setting of butt subassembly and fixture block for when needs to install electronic ballast and heat radiation structure, butt structure drive rotary rod rotates and makes fixture block and electronic ballast lateral wall realize the joint, when needs dismantlement, thereby the fixture block can promote the rotary rod and rotate and make one end and electronic ballast lateral wall offset when butt structure is compressed, thereby make butt structure and fixture block one end all offset with electronic ballast lateral wall can not produce the interference to water-cooling structure, mounting panel and joint structure upward movement, whole convenient operation is swift, only need upwards mention heat radiation structure can accomplish the dismantlement to heat radiation structure, the installation to heat radiation structure can be accomplished in the downward press, in order to conveniently overhaul or change electronic ballast.
The radiating structure of the electronic ballast provided by the utility model can realize the rapid disassembly of the electronic ballast and the radiating structure, so as to facilitate the maintenance or replacement of the electronic ballast.
Drawings
FIG. 1 is a front view of a heat dissipating structure provided in an embodiment of the present utility model;
FIG. 2 is an enlarged view of the structure at A provided in the embodiments of the present utility model;
FIG. 3 is a top view of a water cooling layer provided in an embodiment of the present utility model;
in the drawings, the list of components represented by the various numbers is as follows:
1. a water cooling structure; 11. a water cooling layer; 12. a cooling layer; 121. an air inlet; 122. an air outlet; 13. a communication layer; 14. a first water pipe; 15. a second water pipe; 16. a third water pipe; 2. a mounting plate; 21. a groove; 22. a cavity; 23. a vent; 3. a clamping structure; 31. a rotating rod; 311. a chute; 32. a clamping block; 33. an abutting structure; 331. a telescopic rod; 332. a spring; 333. an abutment block; 34. a slide block; 4. an electronic ballast; 5. a heat radiation fan.
Detailed Description
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
The heat dissipation structure of the electronic ballast comprises a water cooling structure 1, wherein mounting plates 2 are arranged on two sides of the bottom end of the water cooling structure 1, clamping structures 3 are arranged on one sides, close to each other, of the two groups of mounting plates 2, an electronic ballast 4 is arranged between the two groups of mounting plates 2, two sides of the electronic ballast 4 are clamped with the clamping structures 3, and the top of the electronic ballast 4 is propped against the water cooling structure 1; the clamping structure 3 comprises two groups of grooves 21 formed in one side of the mounting plate 2, a cavity 22 is formed in one side, far away from the electronic ballast 4, of the grooves 21, a rotary rod 31 is connected in a rotary mode in the cavity 22, an abutting structure 33 is arranged at the top end of one side of the rotary rod 31, a clamping block 32 is arranged at the bottom end of the side of the rotary rod 31, and the abutting structure 33 and the clamping block 32 are both in sliding connection with the rotary rod 31.
When the heat dissipation structure is disassembled, the mounting plate 2 moves upwards when the water cooling structure 1 moves upwards, because the clamping block 32 and the abutting structure 33 are fixed at two ends of one side of the rotating rod 31 and the rotating rod 31 is rotationally connected with the side wall of the cavity 22, when the side wall of the electronic ballast 4 pushes the clamping block 32 to move along the groove 21 to the side far away from the electronic ballast 4, the clamping block 32 slides along the rotating rod 31 and pushes the rotating rod 31 to rotate clockwise, one end of the abutting structure 33 at the top side slides to the side close to the electronic ballast 4, the other end of the abutting structure 33 abuts against the side wall of the electronic ballast 4, the abutting structure 33 is compressed, because the abutting structure 33 has elastic force, when the abutting structure 33 slides to the top side of the electronic ballast 4, one end of the abutting structure 33 extends out of the mounting plate 2 due to the blocking effect of the side wall of the electronic ballast 4 on the abutting structure 33 being lost, then the water cooling structure 1 drives the mounting plate 2 and the clamping structure 3 to move upwards until the bottom end of the mounting plate 2 is completely separated from the top of the electronic ballast 4, at the moment, the electronic ballast 4 and the heat dissipation structure are detached, when the mounting is needed, the water cooling structure 1 drives the mounting plate 2 and the clamping structure 3 to slide downwards along the side wall of the electronic ballast 4, when the electronic ballast 4 moves to the side wall to be propped against the clamping block 32, the clamping block 32 is pushed to slide far away from the electronic ballast 4, so that the rotating rod 31 rotates clockwise and simultaneously drives one end of the abutting structure 33 to slide close to the electronic ballast 4, at the moment, one end of the abutting structure 33 is propped against the side wall of the electronic ballast 4, at the moment, the abutting structure 33 is compressed, because the abutting structure 33 has elasticity, when the clamping block 32 moves to the clamping position with the side wall of the electronic ballast 4, the elastic force of the abutting structure 33 drives the rotating rod 31 to rotate anticlockwise, so that the clamping block 32 is clamped with the side wall of the electronic ballast 4, and the installation of the heat dissipation structure and the electronic ballast 4 is realized; through the setting of butt joint structure 33 and fixture block 32 for when needs to install electronic ballast 4 and heat radiation structure, butt joint structure 33 drives rotary rod 31 and rotates and make fixture block 32 and electronic ballast 4 lateral wall realize the joint, when needs dismantlement, fixture block 32 can promote rotary rod 31 and rotate thereby make butt joint structure 33 compressed one end and electronic ballast 4 lateral wall counterbalance, thereby make butt joint structure 33 and fixture block 32 one end all with electronic ballast 4 lateral wall counterbalance can not produce the interference to water-cooling structure 1, mounting panel 2 and joint structure 3 upward movement, whole convenient operation is swift, only need upwards mention heat radiation structure can accomplish the dismantlement to heat radiation structure, the installation to heat radiation structure can be accomplished to the downward pressure, with the convenience overhauls or changes electronic ballast 4.
As a possible implementation manner of the present solution, preferably, the abutting structure 33 includes a telescopic rod 331 slidably connected to the rotating rod 31, a spring 332 is wound around the outer side of the driving end of the telescopic rod 331, and an abutting block 333 is fixedly connected to the driving end of the telescopic rod 331; the abutting structure 33 can be elastic through the spring 332, so that the rotating rod 31 can be driven to rotate when the clamping block 32 moves to the clamping part of the side wall of the electronic ballast 4, the clamping of the clamping block 32 and the side wall of the electronic ballast 4 is realized, and the telescopic rod 331 can prevent the spring 332 from bending when being telescopic, so that the service life of the spring 332 is prolonged.
As a possible implementation manner of the present solution, preferably, two sets of sliding grooves 311 are provided on one side of the rotating rod 31, sliding blocks 34 are slidably connected in the sliding grooves 311, and the two sets of sliding blocks 34 are respectively rotatably connected with the telescopic rod 331 and the clamping block 32; the sliding block 34 slides in the sliding groove 311, so that the clamping block 32 and the telescopic rod 331 are driven to slide along the groove 21 when the rotary rod 31 rotates, and the side wall of the electronic ballast 4 is quickly disassembled.
As a possible implementation manner of the present solution, preferably, the water cooling structure 1 includes a water cooling layer 11 that abuts against the top of the electronic ballast 4, a cooling layer 12 is disposed on the top of the water cooling layer 11, the cooling layer 12 is used for cooling the water cooling layer 11, a communication layer 13 is disposed on the top of the cooling layer 12, and the communication layer 13 is communicated with the water cooling layer 11; the water circulation use can be achieved through the communication layer 13 and the water cooling layer 11, so that the water utilization rate is improved, meanwhile, the top side of the water cooling layer 11 and the bottom of the communication layer 13 are cooled through the cooling layer 12, the water flow temperature can be reduced better, and the top of the electronic ballast 4 can be cooled better through the water flow.
As a possible implementation manner of the present solution, it is preferable that the water cooling layer 11 and the communication layer 13 each include a first water pipe 14, a second water pipe 15, and a third water pipe 16, and the water delivery direction of the second water pipe 15 is opposite to that of the first water pipe 14 and the second water pipe 15; by arranging the first water conveying pipe 14, the second water conveying pipe 15 and the third water conveying pipe 16, the water conveying directions of two adjacent groups of water conveying pipes are opposite, water flow is uniform left and right for cooling hot gas when the top of the electronic ballast 4 is cooled by the water cooling layer 11, and the situation that the water temperature in the water conveying pipes is increased due to the fact that the front section of the water flow cools the electronic ballast 4 when the water cooling layer 11 only has one water conveying pipe is avoided, so that the cooling effect of the rear section on the electronic ballast 4 is weakened.
As a possible implementation manner of the present solution, preferably, the cooling layer 12 includes an air inlet 121 formed on one side and an air outlet 122 formed on the other side, a vent 23 is formed on one side of the mounting plate 2, and heat dissipation fans 5 are disposed in the air outlet 122 and the vent 23; through the air inlets 121 and the air outlets 122 at the two sides of the cooling layer 12, ventilation can be realized on the top side of the water cooling layer 11, so that water flow in the water cooling layer 11 is cooled, and the temperature of the water cooling layer 11 is reduced, so that hot air in the electronic ballast 4 is cooled better; the bottom of one side of the electronic ballast 4 is provided with an air inlet, the top of the other side is provided with an air outlet communicated with the air vent 23, and as the density of hot air is greater than that of cold air, the hot air can be gathered at the top of the electronic ballast 4, so that the hot air can flow towards one side of the heat dissipation fan 5 when the heat dissipation fan 5 rotates, the hot air can be discharged out of the electronic ballast 4, and meanwhile, the air flow in the electronic ballast 4 is accelerated, so that a better cooling effect is achieved.
While the utility model has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the utility model. The utility model is not to be limited by the specific embodiments disclosed herein, but rather, embodiments falling within the scope of the appended claims are intended to be embraced by the utility model.

Claims (6)

1. An electronic ballast heat radiation structure, which is characterized in that: the electronic ballast comprises a water cooling structure (1), wherein mounting plates (2) are arranged on two sides of the bottom end of the water cooling structure (1), clamping structures (3) are arranged on one sides, close to each other, of the two groups of mounting plates (2), electronic ballasts (4) are arranged between the two groups of mounting plates (2), two sides of each electronic ballast (4) are clamped with the corresponding clamping structures (3), and the tops of the electronic ballasts (4) are abutted against the water cooling structure (1);
the clamping structure (3) comprises two groups of grooves (21) formed in one side of the mounting plate (2), a cavity (22) is formed in one side, away from the electronic ballast (4), of the grooves (21), a rotating rod (31) is rotationally connected in the cavity (22), an abutting structure (33) is arranged at the top end of one side of the rotating rod (31) and a clamping block (32) is arranged at the bottom end of the rotating rod, and the abutting structure (33) and the clamping block (32) are both in sliding connection with the rotating rod (31).
2. The electronic ballast heat dissipation structure as set forth in claim 1, wherein: the abutting structure (33) comprises a telescopic rod (331) which is slidably connected with the rotary rod (31), a spring (332) is wound on the outer side of the driving end of the telescopic rod (331), and an abutting block (333) is fixedly connected with the driving end of the telescopic rod (331).
3. The electronic ballast heat dissipation structure as set forth in claim 1, wherein: two groups of sliding grooves (311) are formed in one side of the rotating rod (31), sliding blocks (34) are connected in a sliding mode in the sliding grooves (311), and the two groups of sliding blocks (34) are respectively connected with the telescopic rod (331) and the clamping block (32) in a rotating mode.
4. The electronic ballast heat dissipation structure as set forth in claim 1, wherein: the water cooling structure (1) comprises a water cooling layer (11) propped against the top of the electronic ballast (4), a cooling layer (12) is arranged on the top of the water cooling layer (11), the cooling layer (12) is used for cooling the water cooling layer (11), a communication layer (13) is arranged on the top of the cooling layer (12), and the communication layer (13) is communicated with the water cooling layer (11).
5. The electronic ballast heat dissipation structure as set forth in claim 4, wherein: the water cooling layer (11) and the communication layer (13) comprise a first water conveying pipe (14), a second water conveying pipe (15) and a third water conveying pipe (16), and the water conveying direction of the second water conveying pipe (15) is opposite to that of the first water conveying pipe (14) and the second water conveying pipe (15).
6. The electronic ballast heat dissipation structure as set forth in claim 4, wherein: the cooling layer (12) comprises an air inlet (121) formed in one side and an air outlet (122) formed in the other side, a vent (23) is formed in one side of the mounting plate (2), and a heat dissipation fan (5) is arranged in each of the air outlet (122) and the vent (23).
CN202321646378.XU 2023-06-27 2023-06-27 Heat radiation structure of electronic ballast Active CN220123343U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321646378.XU CN220123343U (en) 2023-06-27 2023-06-27 Heat radiation structure of electronic ballast

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321646378.XU CN220123343U (en) 2023-06-27 2023-06-27 Heat radiation structure of electronic ballast

Publications (1)

Publication Number Publication Date
CN220123343U true CN220123343U (en) 2023-12-01

Family

ID=88892854

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321646378.XU Active CN220123343U (en) 2023-06-27 2023-06-27 Heat radiation structure of electronic ballast

Country Status (1)

Country Link
CN (1) CN220123343U (en)

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