CN220108363U - Heat dissipation shell of edge computing unit and edge computing device - Google Patents

Abstract

The embodiment of the utility model provides a heat dissipation shell of an edge computing unit and an edge computing device. A heat dissipating housing comprising: the circuit board comprises an upper shell, a lower shell and a lower shell, wherein the outer top of the upper shell is provided with a plurality of heat dissipation teeth, and the inner top of the upper shell is provided with a mounting structure for mounting a circuit board; the upper shell is provided with a concave radiating fan mounting notch with an upward opening; and the radiating fan is arranged at the radiating fan mounting notch. The edge computing device includes a heat dissipating housing. The embodiment of the utility model solves the technical problem of insufficient heat dissipation of the traditional edge computing unit.

Description

Heat dissipation shell of edge computing unit and edge computing device

Technical Field

The utility model relates to the technical field of intelligent vehicle networking, in particular to a heat dissipation shell of an edge computing unit and an edge computing device.

Background

And the edge computing unit is used for the intelligent vehicle networking field and the vehicle-road cooperation field. The edge computing unit is arranged on the road side intelligent body to sense pedestrians and vehicles on the road and to interact information with the server and the vehicles. With the current progress of software algorithms and other technologies, the requirements on the computing power of the edge computing unit are increasing. The amount of heat generated by the edge calculation unit is also increasing. The heat dissipation requirements for the edge computing units are increasing. The edge computing unit is installed in outdoor, roadside and other places with bad influence, the environmental temperature in summer is very high, and the serious failure results such as equipment crash can be caused by the fact that the edge computing unit has no good heat dissipation capability.

Therefore, the insufficient heat dissipation of the conventional edge computing unit is a technical problem that needs to be solved by those skilled in the art.

The above information disclosed in the background section is only for enhancement of understanding of the background of the utility model and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.

Disclosure of Invention

The embodiment of the utility model provides a heat dissipation shell of an edge computing unit and an edge computing device, which are used for solving the technical problem of insufficient heat dissipation of the traditional edge computing unit.

According to a first aspect of an embodiment of the present utility model, there is provided a heat dissipation case of an edge calculation unit, including:

the circuit board comprises an upper shell, a lower shell and a lower shell, wherein the outer top of the upper shell is provided with a plurality of heat dissipation teeth, and the inner top of the upper shell is provided with a mounting structure for mounting a circuit board; the upper shell is provided with a concave radiating fan mounting notch with an upward opening;

and the radiating fan is arranged at the radiating fan mounting notch.

According to a second aspect of an embodiment of the present utility model, there is provided an edge computing device including:

the heat dissipation shell;

and the circuit board is used as an edge computing unit and is arranged at the inner top of the upper shell, a main chip on the front surface of the circuit board is contacted with the heat pipe, and a secondary chip on the front surface of the circuit board is contacted with the heat conducting column.

By adopting the technical scheme, the embodiment of the utility model has the following technical effects:

the outer top of the upper shell is provided with a plurality of heat dissipation teeth, and the circuit board is arranged at the mounting structure of the inner top of the upper shell, namely, the circuit board is directly arranged at the inner top of the upper shell. The outer top of the upper shell is provided with a concave radiating fan mounting notch with an upward opening, namely, a radiating fan is embedded in the region of the upper shell where radiating teeth are formed, so that the radiating fan is more close to a circuit board serving as a heat source, and the radiating fan blows air to rapidly take away heat at the radiating teeth. Thus, the circuit board is arranged at the inner top of the upper shell, and the circuit board is very close to the heat radiating teeth of the outer top of the upper shell and also very close to the heat radiating fan. According to the heat dissipation shell of the edge computing unit, the upper shell with the heat dissipation teeth is matched with the heat dissipation fan, so that heat generated by a circuit board can be rapidly dissipated.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

FIG. 1 is a schematic diagram of a heat dissipation housing of an edge computing unit according to an embodiment of the present utility model;

FIG. 2 is a schematic view of the heat dissipating housing of FIG. 1 at another angle;

FIG. 3 is a schematic view of the heat dissipation housing shown in FIG. 1 at a further angle;

FIG. 4 is an exploded view of the heat dissipating housing of FIG. 1;

FIG. 5 is a schematic view of an upper shell of the heat dissipating housing of FIG. 4;

fig. 6 is a schematic view of the upper shell of fig. 5 in contact with a main chip on the front side of the circuit board.

Reference numerals:

upper case 1, heat radiating teeth 11, mounting structure 12, heat pipe 13, heat conducting column 14, heat radiating fan mounting recess 15, heat radiating fan 16, fan cover 17,

the lower case 2, the heat dissipation block 21,

the front cover plate 3 is provided with a front cover plate,

a main chip 41.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present utility model more apparent, the following detailed description of exemplary embodiments of the present utility model is provided in conjunction with the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model and not exhaustive of all embodiments. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

Example 1

As shown in fig. 1 to 6, a heat dissipation case of an edge computing unit according to an embodiment of the present utility model includes:

an upper case 1, an outer top of which has a plurality of heat radiating teeth 11, and an inner top of which 1 has a mounting structure 12 for mounting a circuit board; the upper case 1 has a concave radiator fan mounting recess 15 with an opening facing upward;

a heat radiation fan 16 mounted at the heat radiation fan mounting recess 15.

In the heat dissipation shell of the edge computing unit provided by the embodiment of the utility model, the outer top of the upper shell is provided with a plurality of heat dissipation teeth, and the circuit board is arranged at the mounting structure of the inner top of the upper shell, namely, the circuit board is directly arranged at the inner top of the upper shell. The outer top of the upper shell is provided with a concave radiating fan mounting notch with an upward opening, namely, a radiating fan is embedded in the region of the upper shell where radiating teeth are formed, so that the radiating fan is more close to a circuit board serving as a heat source, and the radiating fan blows air to rapidly take away heat at the radiating teeth. Thus, the circuit board is arranged at the inner top of the upper shell, and the circuit board is very close to the heat radiating teeth of the outer top of the upper shell and also very close to the heat radiating fan. According to the heat dissipation shell of the edge computing unit, the upper shell with the heat dissipation teeth is matched with the heat dissipation fan, so that heat generated by a circuit board can be rapidly dissipated.

Specifically, the circuit board serves as an edge calculation unit.

Specifically, the height of the heat dissipation teeth can be set higher, so that the heat dissipation area is larger, the heat dissipation speed is higher, the air duct is accelerated to circulate, and the heat dissipation efficiency is higher.

Specifically, the upper case 1 and the heat radiating teeth 11 are formed as a whole by an integrated process.

In practice, as shown in fig. 4, the heat dissipation housing further includes:

a louver type fan cover 17 installed at the cooling fan installation recess 15 to cover the cooling fan 16.

The shutter type fan cover plate protects the cooling fan and prevents foreign matters from entering the cooling fan.

Specifically, the independently arranged shutter type fan cover plate can well fix and hide the cooling fan through the mounting screw.

In operation, as shown in fig. 1 and 3, the fan cover 17 is flat with the heat dissipating teeth of the upper case.

Therefore, the heat dissipation teeth of the upper shell and the fan cover plate are flat, so that the design of the outer top of the heat dissipation shell is concise and attractive.

In practice, as shown in fig. 4, the upper shell 1 has a notch structure with a downward opening;

as shown in fig. 4, the heat dissipation case of the edge calculation unit further includes:

the lower shell 2 is fixedly arranged at the opening of the upper shell 1;

a plurality of heat dissipation blocks 21 for contacting with a plurality of chips on the back surface of the circuit board are fixed on the inner side of the lower case 2.

Thus, after the upper shell and the lower shell are fixedly installed, an accommodating space is formed between the notch of the upper shell and the lower shell, and the circuit board is positioned in the accommodating space and is fixed with the inner top of the upper shell. After the circuit board is installed through the installation structure, a plurality of chips on the back surface of the circuit board are contacted with the radiating block, so that heat generated on the back surface of the circuit board is quickly transferred to the radiating block. The front and back sides of the circuit board as the edge calculation unit have chips. Therefore, heat is dissipated for the front and back surfaces of the circuit board respectively, so that the heat dissipation efficiency of the heat dissipation shell of the edge computing unit is higher.

In practice, as shown in fig. 4, 5 and 6, the heat dissipation housing further comprises:

the heat pipe 13 is used for contacting with the main chip 41 on the front surface of the circuit board and is tightly fixed on the inner top of the upper shell 1;

a plurality of heat conductive posts 14 for contacting with the sub-chip of the front surface of the circuit board, fixed at the inner top of the upper case 1; among the chips on the front side of the circuit board, the chips other than the main chip 41 on the front side of the circuit board are all sub-chips on the front side of the circuit board.

The inner top of the upper shell is fixed with a heat pipe and a heat conduction column for heat dissipation. After the circuit board serving as the edge computing unit is installed through the installation structure, the positions of the parts of the heat dissipation shell and the circuit board from top to bottom are sequentially provided with heat dissipation teeth positioned above, heat pipes and heat conduction columns positioned in the middle and the circuit board positioned below. The main chip on the front side of the circuit board is contacted with the heat pipe, and the heat pipe serving as a heat transfer element rapidly transfers heat generated by the main chip on the front side of the circuit board to the upper shell and the heat dissipation teeth, so that heat dissipation of the main chip on the front side of the circuit board is realized. The heat conduction column serving as a heat transfer element rapidly transfers heat generated by the secondary chip on the front side of the circuit board to the upper shell and the heat dissipation teeth, so that heat dissipation of the secondary chip on the front side of the circuit board is realized. According to the heat dissipation shell of the edge computing unit, the heat dissipation of the edge computing unit is realized through the cooperation of the heat dissipation fan, the heat dissipation teeth, the heat pipe and the heat conduction column.

In practice, as shown in fig. 5 and 6, the heat pipe 13 is a U-shaped heat pipe, and the U-shaped side surface of the heat pipe 13 is tightly fixed on the inner top of the upper shell 1.

The U-shaped side surface of the heat pipe is tightly attached to the inner top of the upper shell, so that the contact area between the heat pipe and the inner top of the upper shell is large, and heat dissipation is fast.

In practice, as shown in fig. 5 and 6, the upper case 1 is a rectangular upper case;

the number of the heat pipes 13 is two, and the two heat pipes 13 are fixed along the length direction of the upper shell.

The upper shell is a rectangular upper shell, and the two heat pipes are uniformly arranged, so that the heat dissipation of the heat dissipation shell of the edge computing unit is faster, the heat dissipation efficiency is higher, the heat dissipation is more balanced, and the temperature of the main chip on the front face of the circuit board is balanced.

In practice, as shown in fig. 4, the radiator fan mounting recess 15 is provided along the width direction of the upper case 1, and the radiator fan mounting recess 15 is located at the middle of the length direction of the upper case 1.

The heat dissipation fan is arranged in such a way that the heat dissipation fan can uniformly dissipate heat for the upper shell and the heat dissipation teeth.

In practice, as shown in fig. 4, there are two heat dissipation fans 16, and the two heat dissipation fans 16 are arranged along the width direction of the upper case 1.

The two radiating fans are arranged in a mode that the whole width direction of the upper shell can radiate heat rapidly.

In practice, as shown in fig. 1 and 4, the heat dissipation teeth 11 are disposed parallel to the length direction of the heat dissipation housing, and a wind channel along the length direction is formed between every two adjacent heat dissipation teeth 11, and one end of the wind channel is led to the side part of the heat dissipation fan, and the other end is led to the outside of the heat dissipation housing.

The circuit board is positioned in a small area of the inner top of the upper shell, namely the area of the heat source is smaller. The heat dissipation teeth 11 are arranged parallel to the length direction of the heat dissipation shell, so that local heat of the upper shell can be rapidly dissipated to the whole upper shell. Correspondingly, the air duct formed between every two adjacent radiating teeth 11 along the length direction is longer, and the heat can be quickly radiated by means of the air duct and the radiating fan.

In practice, as shown in fig. 2 and 4, the heat dissipation case of the edge computing unit further includes:

a front cover plate 3 fixed to a side of the recess structure of the upper case 1; wherein the front cover plate 3 is provided with a plurality of interface through holes.

The interface vias provide space for wiring of the circuit board. The upper shell fixed with the heat pipe and the heat conducting column, the lower shell fixed with the heat radiating block and the front cover plate are provided with three single main body parts, so that the number of the parts is small, the whole assembly fit gap is reduced, the heat pipe and the heat conducting column are more concise and attractive, and meanwhile, the manufacturing cost is lower.

Example two

An edge computing device according to an embodiment of the present utility model includes:

the heat dissipation housing of the first embodiment;

as shown in fig. 6, a circuit board as an edge calculating unit is installed at the inner top of the upper case, and a main chip 41 of the front side of the circuit board is in contact with the heat pipe, a sub chip of the front side of the circuit board is in contact with the heat conductive post, and a plurality of fins of the back side of the circuit board are in contact with the heat dissipating block.

Therefore, chips on the front side and the back side of the circuit board can be used for heat dissipation, so that the heat dissipation speed of the edge computing device is high, and the heat dissipation efficiency is high.

In describing the present utility model and its embodiments, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", "height", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description and simplification of the description, and are not indicative or implying that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

In the present utility model and its embodiments, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrated; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model and its embodiments, unless explicitly specified and limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include both the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

The above disclosure provides many different embodiments, or examples, for implementing different structures of the utility model. The foregoing description of specific example components and arrangements has been presented to simplify the present disclosure. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (9)

1. A heat dissipating housing for an edge computing unit, comprising:

the circuit board comprises an upper shell, a lower shell and a lower shell, wherein the outer top of the upper shell is provided with a plurality of heat dissipation teeth, and the inner top of the upper shell is provided with a mounting structure for mounting a circuit board; the upper shell is provided with a concave radiating fan mounting notch with an upward opening; the upper shell is of a notch structure with a downward opening;

a heat radiation fan installed at the heat radiation fan installation recess;

the lower shell is fixedly arranged at the opening of the upper shell;

and a plurality of heat dissipation blocks for contacting with the chips on the back surface of the circuit board are fixed on the inner side of the lower shell.

2. The heat dissipating housing of an edge computing unit of claim 1, further comprising:

and the fan cover plate is arranged at the position of the radiating fan mounting notch and covers the radiating fan.

3. The heat dissipating housing of an edge computing unit of claim 2, wherein the fan cover is leveled with the heat dissipating teeth of the upper shell.

4. The heat dissipating housing of an edge computing unit of claim 3, further comprising: the heat pipe is used for being contacted with the main chip on the front surface of the circuit board and is tightly fixed on the inner top of the upper shell;

a plurality of heat conduction columns for contacting with the secondary chip on the front surface of the circuit board and fixed at the inner top of the upper shell;

the heat pipe is a U-shaped heat pipe, and the U-shaped side surface of the heat pipe is tightly fixed at the inner top of the upper shell.

5. The heat dissipating housing of an edge computing unit of claim 4, wherein the upper housing is a rectangular upper housing;

the number of the heat pipes is two, and the two heat pipes are fixed along the length direction of the upper shell.

6. The heat dissipating housing of an edge computing unit of claim 5, wherein the heat dissipating fan mounting recess is disposed along a width direction of the upper case, and the heat dissipating fan mounting recess is located in a middle of a length direction of the upper case.

7. The heat dissipating housing of an edge computing unit of claim 1, wherein the heat dissipating teeth are disposed parallel to a length direction of the heat dissipating housing, a lengthwise air channel is formed between every two adjacent heat dissipating teeth, and one end of the air channel is led to a side of the heat dissipating fan, and the other end is led to an outside of the heat dissipating housing.

8. The heat dissipating housing of an edge computing unit of claim 7, further comprising:

a front cover plate fixed to a side surface of the recess structure of the upper case; the front cover plate is provided with a plurality of interface through holes.

9. An edge computing device, comprising:

a heat dissipating housing according to any one of claims 1 to 8;

and the circuit board is used as an edge computing unit and is arranged at the inner top of the upper shell, a main chip on the front surface of the circuit board is contacted with the heat pipe, and a secondary chip on the front surface of the circuit board is contacted with the heat conducting column.