CN220079181U

CN220079181U - Boat structure

Info

Publication number: CN220079181U
Application number: CN202320686439.9U
Authority: CN
Inventors: 朱太荣; 林佳继; 张武; 刘群
Original assignee: Laplace New Energy Technology Co ltd
Current assignee: Laplace New Energy Technology Co ltd
Priority date: 2023-03-29
Filing date: 2023-03-29
Publication date: 2023-11-24
Anticipated expiration: 2033-03-29

Abstract

The utility model relates to the technical field of semiconductor devices, in particular to a boat structure. Comprising the following steps: the boat body is provided with an air inlet end and an air outlet end; the first uniform flow component is detachably arranged at the air inlet end; the second uniform flow component is detachably arranged at the air outlet end; the first flow homogenizing component comprises a guide piece and a flow homogenizing piece positioned behind the guide piece, wherein the guide piece is used for guiding airflow from the outside to flow to the flow homogenizing piece, the flow homogenizing piece is provided with a plurality of flow homogenizing holes, and the flow homogenizing holes are configured to enable the airflow from the outside to enter the inner cavity of the boat body along the horizontal direction. By additionally arranging the first uniform flow component, the plane of the first uniform flow component is perpendicular to the air flow direction of the gaps between adjacent silicon wafers, so that the air flow can uniformly and smoothly flow through the heads and the tails of the boat, and the film coating is uniform. By adding the second uniform flow component, the second uniform flow component increases the resistance of the silicon wafer area close to the air outlet end, so that the phenomenon that the process gas is pumped away without participating in the reaction, and the thickness of the plated film in each part of the boat is uneven is avoided.

Description

Boat structure

Technical Field

The utility model relates to the technical field of semiconductor devices, in particular to a boat structure.

Background

Semiconductor or photovoltaic materials are widely used in industries such as electronics and new energy, and the semiconductor and photovoltaic materials can be applied to products such as solar cells after various processing treatments, sheet materials are sent into a reaction furnace body to react under certain process conditions such as temperature and pressure to coat films on the sheet materials, so that a semiconductor device is needed.

The aluminum boat uniform flow structure is used as a part of the semiconductor device and is used for uniformly coating the solar cell. When the aluminum boat deposits in the ALD (ALD process reaction temperature is about 250 ℃), the whole airflow direction of the tubular ALD furnace body is that the furnace mouth is in air and flows to the furnace tail, the air flows through the aluminum boat and the silicon wafer in the middle, and the pump pumps the adjacent air from the furnace tail. Because the process gas just enters, the airflow flow of the silicon wafer area close to the gas inlet end of the furnace mouth is larger, the airflow flow route is uncertain, and the silicon wafer is easy to blow to shake, so that the thickness of the plated film of the silicon wafer is uneven; on the one hand, the process gas flowing through the silicon wafer area close to the gas outlet end of the furnace tail is pumped away without participating in the reaction, so that the film thickness is uneven, and on the other hand, the gas flow is concentrated at the gas outlet position of the silicon wafer gap when the pump pumps gas from the furnace tail, so that the gas flow distribution of the silicon wafer area close to the furnace tail is uneven. In addition, the aluminum boat is placed on the tubular ALD furnace body, the air inlet direction of the process gas, the length direction of the aluminum boat and the air exhaust direction are sequentially corresponding, and silicon wafers close to the air inlet end and the air outlet end are easy to shake due to large air flow, so that the silicon wafers are subjected to adverse effects such as cracking and crushing.

Disclosure of Invention

The purpose of the utility model is that: in order to solve the technical problems, the utility model provides a boat structure, which aims to realize uniform air flow distribution of silicon wafer areas in the boat.

In some embodiments of the utility model there is provided a boat structure comprising:

the boat body is provided with an air inlet end and an air outlet end;

the first uniform flow component is detachably arranged at the air inlet end;

the second uniform flow component is detachably arranged at the air outlet end;

the first flow homogenizing component comprises a guide piece and a flow homogenizing piece positioned at the rear of the guide piece, wherein the guide piece is used for guiding airflow from the outside to flow to the flow homogenizing piece, the flow homogenizing piece is provided with a plurality of flow homogenizing holes, and the flow homogenizing holes are configured to enable the airflow from the outside to enter the inner cavity of the boat body along the horizontal direction.

In some embodiments of the present utility model, the air inlet end and the air outlet end of the boat body are both provided with a clamping assembly, the clamping assembly includes a plurality of clamping blocks, the plurality of clamping blocks together form a clamping space for clamping the first uniform flow assembly or the second uniform flow assembly, and the first uniform flow assembly or the second uniform flow assembly is detachably mounted on the clamping blocks.

In some embodiments of the present utility model, the clamping block is provided with a plurality of first clamping slots, and the first uniform flow component or the second uniform flow component is vertically clamped in the first clamping slots.

In some embodiments of the present utility model, the guide member is provided with a plurality of diversion holes, and the diversion holes and the uniform flow holes are arranged in a staggered manner.

In some embodiments of the present utility model, the silicon wafer carrier further comprises a support structure disposed in the boat body, wherein the plurality of silicon wafers are obliquely disposed in the support structure, the support structure comprises a plurality of support pieces, the plurality of support pieces form multi-point support for the silicon wafers, the support pieces comprise support bodies connected with the boat body, and the silicon wafers are detachably mounted on the support bodies.

In some embodiments of the present utility model, the support body is provided with a plurality of second clamping slots, and the silicon wafer is obliquely clamped in the second clamping slots.

In some embodiments of the utility model, the silicon wafer is tilted at an angle of 2 ° -6 °.

In some embodiments of the present utility model, the boat body has a left side wall and a right side wall that are disposed opposite to each other, the left side wall and the right side wall are each provided with a plurality of third clamping slots, the end portion of the support body is formed with a mounting portion, the mounting portion includes a first mounting portion and a second mounting portion that are clamped in the third clamping slots, the first mounting portion has a first end face, a second end face, and a third end face, the first end face, the second end face, and the third end face are all in surface contact with an inner wall of the third clamping slot, the second mounting portion is abutted to the left side wall or the right side wall of the boat body, and a connection portion between the second mounting portion and the first mounting portion abuts against a slot edge of the third clamping slot.

In some embodiments of the present utility model, the upper end of the boat body has an opening, and the upper end of the boat body is provided with a boat cover, and the boat cover is used for closing the opening so as to prevent the airflow in the boat body from flowing to the upper part of the furnace tube.

In some embodiments of the utility model, the second uniform flow component is identical in structure to the first uniform flow component.

Compared with the prior art, the boat structure provided by the embodiment of the utility model has the beneficial effects that:

by additionally arranging the first uniform flow component, the plane of the first uniform flow component is perpendicular to the air flow direction of the gaps between adjacent silicon wafers, so that the air flow can uniformly and smoothly flow through the heads and the tails of the boat, and the film coating is uniform.

By adding the second uniform flow component, the second uniform flow component increases the resistance of the silicon wafer area close to the air outlet end, so that the phenomenon that the process gas is pumped away without participating in the reaction, and the thickness of the plated film is uneven in each part in the boat is avoided; in addition, the buffer zone is equivalent to an airflow concentration buffer zone, so that the airflow concentration at the air outlet of the silicon wafer gap when the pump pumps air from the tail of the furnace is avoided, and the coating is uneven.

Drawings

FIG. 1 is a schematic view showing a boat structure in a preferred embodiment of the present utility model;

FIG. 2 is a schematic view of another boat structure in accordance with the preferred embodiment of the present utility model;

FIG. 3 is an enlarged schematic view at A in FIG. 2;

FIG. 4 is a schematic view of a first uniform flow component in a preferred embodiment of the present utility model;

fig. 5 is a schematic structural view of a support structure in a preferred embodiment of the present utility model.

In the figure, the boat body is-100; an air inlet end-110; the air outlet end is 120; boat cover-130; a third clamping groove position-200; front half silicon wafer area-210; the second half section silicon wafer area-220; clamping block-300; a first slot-310; a first uniform flow component-400; a guide-410; flow homogenizing element-420; a second uniform flow component-500; a support body-610; second slot-620; silicon wafer-800.

Detailed Description

The following describes in further detail the embodiments of the present utility model with reference to the drawings and examples. The following examples are illustrative of the utility model and are not intended to limit the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1 to 4, a boat structure according to a preferred embodiment of the present utility model includes:

a boat body 100 having an inlet end 110 and an outlet end 120;

the first uniform flow component 400 is detachably installed at the air inlet end 110;

the second uniform flow component 500 is detachably installed at the air outlet end 120;

the first flow homogenizing component 400 includes a guide 410 and a flow homogenizing member 420 located behind the guide 410, wherein the guide 410 is used for guiding the airflow from the outside to flow to the flow homogenizing member 420, and the flow homogenizing member 420 is provided with a plurality of flow homogenizing holes configured to enable the airflow from the outside to enter the inner cavity of the boat 100 along the horizontal direction.

Specifically, the air inlet end 110 and the air outlet end 120 of the boat body 100 are both provided with clamping assemblies, the clamping assemblies include a plurality of clamping blocks 300, the clamping blocks 300 together form a clamping space for clamping the first uniform flow assembly 400 or the second uniform flow assembly 500, the clamping blocks 300 are provided with a plurality of first clamping slots 310, and the first uniform flow assembly 400 or the second uniform flow assembly 500 is vertically clamped in the first clamping slots 310.

Specifically, the guide 410 is provided with a plurality of guide holes, and the guide holes and the uniform flow holes are arranged in a staggered manner.

Specifically, the first flow homogenizing component 400 includes at least one guide member 410 and one flow homogenizing member 420, and the flow homogenizing member 420 and the guide member 410 are arranged in a staggered manner, so that the uniform air flow entering the boat 100 from the inlet end is ensured, and the silicon wafers 800 in the boat 100 are better contacted.

Specifically, the second uniform flow component 500 has the same structure as the first uniform flow component 400, the arrangement direction of the second uniform flow component 500 is perpendicular to the air flow direction, the air outlet cross section area of the gap of the silicon wafer 800 is reduced (the flow speed is increased, the air pressure is reduced), the arrangement plane of the second uniform flow component 500 is perpendicular to the air flow so as to increase the resistance of the silicon wafer 800 near the air outlet end 120, and the phenomenon that the process air is pumped away without participating in the reaction, and the thickness of the plated film in each part of the boat is uneven is avoided; in addition, the buffer zone is equivalent to an air flow concentration buffer zone, so that the air flow concentration at the air outlet of the clearance of the silicon wafer 800 when the pump pumps air from the tail of the furnace is avoided, and the film plating is uneven.

As shown in fig. 5, in a preferred embodiment of the present utility model, the apparatus further includes a support structure disposed in the boat 100, the plurality of silicon wafers 800 are obliquely disposed in the support structure, the support structure includes a plurality of support members, the plurality of support members form a multi-point support for the silicon wafers 800, the support members include a support body 610 connected to the boat 100, the support body 610 is provided with a plurality of second clamping slots 620, and the silicon wafers 800 are obliquely clamped in the second clamping slots 620.

Specifically, the inclination angle of the silicon wafer 800 is 2 ° -6 °, and preferably, the inclination angle of the silicon wafer 800 is 5 °.

As shown in fig. 3, specifically, the boat body 100 has left and right side walls that are disposed opposite to each other, the left and right side walls are each provided with a plurality of third clamping slots 200, the end of the support body 610 is formed with an installation portion, the installation portion includes a first installation portion 6100 and a second installation portion 6101 that are clamped in the third clamping slots 200, the first installation portion 6100 has a first end face, a second end face, and a third end face, the first end face, the second end face, and the third end face all form surface contact with the inner wall of the third clamping slot 200, the active surface of the support body 610 and the third clamping slot 200 is increased, the second installation portion abuts against the left side wall or the right side wall of the boat body 100, and the junction of the second installation portion and the first installation portion abuts against the slot edge of the third clamping slot 200. Compared with the conventional mounting manner, through the arrangement, the left end and the right end of the supporting body 610 can be better limited, and the third clamping groove 200 can better support the supporting body 610, so that better mounting conditions are provided for mounting the silicon wafer. Meanwhile, the upper end of the third clamping groove position 200 is of an open structure, so that the support body 610 is convenient to assemble and disassemble, and the aim of convenient replacement is fulfilled. With the above-mentioned mounting structure, the connection between the supporting body 610 and the boat body 100 is improved, so as to prevent the supporting body 610 from being easily separated from the boat body 100 during actual operation, thereby causing the risk of cracking the silicon wafer on the supporting body 610.

Specifically, the boat body 100 is provided with a support body 610 in the short direction, and the support body 610 is provided with a second clamping groove for inclining the silicon wafer 800 by 2 ° to 6 °. The silicon wafer is obliquely arranged, when the silicon wafer 800 faces the atmospheric air flow from the air inlet end 110, the silicon wafer 800 is reduced from shaking under the action of gravity, the silicon wafer 800 is prevented from being broken and falling down, the gap of the silicon wafer 800 below is blocked, and the gap of the silicon wafer 800 above is increased; specifically, in the gap of the silicon wafer 800 in the broken area, the lower portion is blocked so that the amount of process gas is reduced or film coating is impossible (film thickness), and the upper portion is enlarged so that the amount of process gas is greater (film thickness), resulting in uneven film thickness of the film coated adjacent to the silicon wafer 800.

In a preferred embodiment of the present utility model, the upper end of the boat body 100 has an opening, the upper end of the boat body 100 is provided with a boat cover 130, and the boat cover 130 is used for closing the opening to prevent the air flow in the boat body 100 from flowing to the upper side of the furnace tube. And simultaneously, the sediment generated by the reaction is prevented from falling into the surface of the silicon wafer 800, so that the surface of the silicon wafer 800 is granular or the film thickness is uneven.

The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present utility model, and these modifications and substitutions should also be considered as being within the scope of the present utility model.

Claims

1. A boat structure comprising:

the boat body is provided with an air inlet end and an air outlet end;

the first uniform flow component is detachably arranged at the air inlet end;

the second uniform flow component is detachably arranged at the air outlet end;

2. The boat structure of claim 1, wherein the air inlet end and the air outlet end of the boat body are both provided with clamping assemblies, the clamping assemblies comprise a plurality of clamping blocks, the clamping blocks jointly form a clamping space for clamping the first uniform flow assembly or the second uniform flow assembly, and the first uniform flow assembly or the second uniform flow assembly is detachably mounted on the clamping blocks.

3. The boat structure of claim 2, wherein the clamping block is provided with a plurality of first clamping slots, and the first flow homogenizing component or the second flow homogenizing component is vertically clamped in the first clamping slots.

4. The boat structure of claim 1 wherein the guide member is provided with a plurality of deflector holes, the deflector holes being offset from the uniform flow holes.

5. The boat structure of claim 1, further comprising a support structure disposed within the boat body, wherein a plurality of silicon wafers are disposed obliquely to the support structure, wherein the support structure comprises a plurality of support members, wherein the plurality of support members provide a multi-point support for the silicon wafers, wherein the support members comprise a support body coupled to the boat body, and wherein the silicon wafers are detachably mounted to the support body.

6. The boat structure of claim 5, wherein the support body is provided with a plurality of second clamping slots, and the silicon wafer is clamped in the second clamping slots in an inclined manner.

7. The boat structure of claim 5 wherein the silicon wafer is tilted at an angle of 2 ° -6 °.

8. The boat structure of claim 6, wherein the boat body has left and right side walls disposed opposite to each other, the left and right side walls are each provided with a plurality of third clamping slots, the end of the support body is formed with a mounting portion, the mounting portion includes a first mounting portion and a second mounting portion that are clamped in the third clamping slots, the first mounting portion has a first end face, a second end face and a third end face, the first end face, the second end face and the third end face are all in surface contact with the inner wall of the third clamping slot, the second mounting portion is abutted to the left or right side wall of the boat body, and the junction of the second mounting portion and the first mounting portion is abutted to the slot edge of the third clamping slot.

9. The boat structure of claim 1, wherein the upper end of the boat body has an opening, and the upper end of the boat body is provided with a boat cover for closing the opening to prevent the flow of air in the boat body from flowing to above the furnace tube.

10. The boat structure of claim 1 wherein the second uniform flow assembly is identical to the first uniform flow set structure.