CN220074145U - Improved plate polishing device - Google Patents
Improved plate polishing device Download PDFInfo
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- CN220074145U CN220074145U CN202321689326.0U CN202321689326U CN220074145U CN 220074145 U CN220074145 U CN 220074145U CN 202321689326 U CN202321689326 U CN 202321689326U CN 220074145 U CN220074145 U CN 220074145U
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- polishing
- mounting plate
- cylinder group
- die holder
- base
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- 238000007494 plate polishing Methods 0.000 title claims abstract description 11
- 238000005498 polishing Methods 0.000 claims abstract description 91
- 230000000712 assembly Effects 0.000 claims abstract description 4
- 238000000429 assembly Methods 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000003754 machining Methods 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The utility model relates to an improved plate polishing device, which comprises an upper grinding component and a lower grinding component which are arranged up and down, wherein the upper grinding component comprises an upper die holder, a first base is horizontally arranged at the top in the upper die holder, a first linkage cylinder group is uniformly arranged at the lower end of the first base, the telescopic end of the first linkage cylinder group is connected with a first mounting plate, and a first polishing machine is uniformly arranged on the lower end surface of the first mounting plate; the lower grinding assembly comprises a lower die holder, a second base is horizontally arranged at the bottom in the lower die holder, a second linkage cylinder group is uniformly arranged on the upper end face of the second base, the telescopic end of the second linkage cylinder group is connected with a second mounting plate, a second polishing machine is arranged in the middle of the second mounting plate, and polishing assemblies are symmetrically arranged on two sides of the second polishing machine. This modified panel burnishing and polishing device can adjust panel burnishing and polishing thickness by oneself, through last the cooperation of grinding the subassembly with grinding the subassembly down, can realize the upper and lower simultaneous burnishing and polishing of panel, shortens the burnishing and polishing time, improves whole production machining efficiency.
Description
Technical Field
The utility model relates to the technical field of polishing devices, in particular to an improved plate polishing device.
Background
With the continuous progress of society, the mechanical processing industry has rapidly developed. In the mechanical Azier process of the plate, grinding and polishing are important components. The traditional plate polishing is that after the single-sided polishing is carried out, the polishing of the other side is carried out, so that the operation is more complicated, the efficiency is low, the thickness of the whole polishing cannot be ensured, and great trouble is brought to the whole production and processing of people, so that the actual production and processing of people are inconvenient.
Disclosure of Invention
The utility model aims to solve the technical problems that: in order to solve the problems in the prior art, an improved plate polishing device is provided, the polishing thickness of the plate can be automatically adjusted, the upper and lower simultaneous polishing of the plate can be realized through the matching of an upper polishing component and a lower polishing component, the polishing time is shortened, the overall production and processing efficiency is improved, and the device is convenient to widely popularize and use.
The technical scheme adopted for solving the technical problems is as follows: an improved plate polishing device comprises an upper grinding assembly and a lower grinding assembly which are arranged up and down, wherein the upper grinding assembly comprises an upper die holder, a first base is horizontally arranged at the inner top of the upper die holder, a first linkage cylinder group is uniformly arranged at the lower end of the first base, a telescopic end of the first linkage cylinder group is connected with a first mounting plate, and a first polishing machine is uniformly arranged on the lower end face of the first mounting plate; the lower grinding assembly comprises a lower die holder, a second base is horizontally arranged at the bottom in the lower die holder, a second linkage cylinder group is uniformly arranged on the upper end face of the second base, the telescopic end of the second linkage cylinder group is connected with a second mounting plate, a second polishing machine is arranged in the middle of the second mounting plate, and polishing assemblies are symmetrically arranged on two sides of the second polishing machine.
Further, in the above technical solution, the polishing assembly includes a polishing motor, a polishing head, and a polishing sheet; the polishing motor is horizontally arranged on the second mounting plate, the output end of the polishing motor is connected with the polishing head, and the polishing head is provided with a polishing sheet.
Further, in the above technical solution, a first protection cover is disposed between the first polishing machines.
Further, in the above technical solution, a second protection cover is disposed outside the second polishing machine.
Further, in the above technical solution, the first polishing machine is opposite to the second polishing machine and the polishing component.
Further, in the above technical solution, the distance measuring devices are mounted on the first mounting plate and the second mounting plate.
The beneficial effects of the utility model are as follows: according to the improved plate polishing device, the polishing thickness of the plate can be automatically adjusted, the upper and lower plates can be polished simultaneously through the cooperation of the upper polishing assembly and the lower polishing assembly, the polishing time is shortened, the overall production and processing efficiency is improved, and the device is convenient to widely popularize and use.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
Fig. 1 is a schematic structural view of the present utility model.
The reference numerals in the drawings are: 1. the polishing device comprises an upper die holder, 2, a first base, 3, a first linkage cylinder group, 4, a first mounting plate, 5, a first polishing machine, 6, a lower die holder, 7, a second base, 8, a second linkage cylinder group, 9, a second mounting plate, 10, a second polishing machine, 11, a polishing motor, 12, a polishing head, 13, a polishing sheet, 14, a first protective cover, 15, a second protective cover, 16 and a distance meter.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
In the utility model, the first linkage cylinder group 3, the second linkage cylinder group 8, the first polishing machine 5, the second polishing machine 10, the polishing motor 11 and the range finder 16 are installed and used in a matching way after being purchased from the market according to specific models.
The improved plate polishing device is shown in fig. 1, and comprises an upper grinding assembly and a lower grinding assembly which are arranged up and down, wherein the upper grinding assembly comprises an upper die holder 1, a first base 2 is horizontally arranged at the top in the upper die holder 1, a first linkage cylinder group 3 is uniformly arranged at the lower end of the first base 2, the telescopic end of the first linkage cylinder group 3 is connected with a first mounting plate 4, and a first polishing machine 5 is uniformly arranged on the lower end surface of the first mounting plate 4; the lower grinding assembly comprises a lower die holder 6, a second base 7 is horizontally arranged at the inner bottom of the lower die holder 6, a second linkage cylinder group 8 is uniformly arranged on the upper end face of the second base 7, the telescopic end of the second linkage cylinder group 8 is connected with a second mounting plate 9, a second polishing machine 10 is arranged at the upper middle part of the second mounting plate 9, and polishing assemblies are symmetrically arranged on two sides of the second polishing machine 10.
Wherein the polishing assembly comprises a polishing motor 11, a polishing head 12 and a polishing sheet 13; the polishing motor 11 is horizontally arranged on the second mounting plate 9, the output end of the polishing motor 11 is connected with the polishing head 12, and the polishing head 12 is provided with a polishing sheet 13. A first protective cover 14 is arranged between the first polishing machines 5. A second protective cover 15 is arranged outside the second grinder 10. The first grinder 5 is opposite the second grinder 10 and the polishing assembly. The distance measuring instrument 16 is arranged on the first mounting plate 4 and the second mounting plate 9.
The use principle of the improved plate polishing device is as follows:
firstly, an operator can respectively control the operation of the first linkage cylinder group 3 and the second linkage cylinder group 8 through an external controller, and control the operation of the first linkage cylinder group 3 to promote the whole first mounting plate 4 to move downwards, so that the lower end surface of the first polishing machine 5 can move downwards; by controlling the operation of the second linkage cylinder group 8, the overall movement of the second mounting plate 9 can be realized, and the polishing and the upward movement of the polished surface can be realized; in this way, an effective adjustment and control of the polishing thickness can be achieved, and the thickness of the plate after polishing can be further known by the respective distance measuring device 16.
The foregoing description is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical solution of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. An improved plate polishing device is characterized in that: the upper grinding assembly comprises an upper die holder, a first base is horizontally arranged at the inner top of the upper die holder, a first linkage cylinder group is uniformly arranged at the lower end of the first base, the telescopic end of the first linkage cylinder group is connected with a first mounting plate, and a first polishing machine is uniformly arranged on the lower end face of the first mounting plate; the lower grinding assembly comprises a lower die holder, a second base is horizontally arranged at the bottom in the lower die holder, a second linkage cylinder group is uniformly arranged on the upper end face of the second base, the telescopic end of the second linkage cylinder group is connected with a second mounting plate, a second polishing machine is arranged in the middle of the second mounting plate, and polishing assemblies are symmetrically arranged on two sides of the second polishing machine.
2. An improved board sanding and polishing device as defined in claim 1, wherein: the polishing assembly comprises a polishing motor, a polishing head and a polishing sheet; the polishing motor is horizontally arranged on the second mounting plate, the output end of the polishing motor is connected with the polishing head, and the polishing head is provided with a polishing sheet.
3. An improved board sanding and polishing device as defined in claim 1, wherein: a first protective cover is arranged between the first polishing machines.
4. An improved board sanding and polishing device as defined in claim 1, wherein: the outer side of the second polishing machine is provided with a second protective cover.
5. An improved board sanding and polishing device as defined in claim 1, wherein: the first polishing machine is opposite to the second polishing machine and the polishing component.
6. An improved board sanding and polishing device as defined in claim 1, wherein: and the distance measuring instrument is arranged on the first mounting plate and the second mounting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321689326.0U CN220074145U (en) | 2023-06-29 | 2023-06-29 | Improved plate polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321689326.0U CN220074145U (en) | 2023-06-29 | 2023-06-29 | Improved plate polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220074145U true CN220074145U (en) | 2023-11-24 |
Family
ID=88830730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321689326.0U Active CN220074145U (en) | 2023-06-29 | 2023-06-29 | Improved plate polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220074145U (en) |
-
2023
- 2023-06-29 CN CN202321689326.0U patent/CN220074145U/en active Active
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