CN220020775U

CN220020775U - Chip assembly production line of piezoresistor

Info

Publication number: CN220020775U
Application number: CN202321566920.0U
Authority: CN
Inventors: 莫益梁; 梁东明; 叶荣
Original assignee: Zhaoqing City Jiehong Electronic Co ltd
Current assignee: Zhaoqing City Jiehong Electronic Co ltd
Priority date: 2023-06-19
Filing date: 2023-06-19
Publication date: 2023-11-14
Anticipated expiration: 2033-06-19

Abstract

The utility model discloses a chip assembly production line of a piezoresistor, which comprises the following steps: the unreeling mechanism comprises a first unreeling device, a second unreeling device and a third unreeling device, wherein the first unreeling device is used for supplying carrier tapes, the second unreeling device is used for supplying adhesive tapes, and the third unreeling device is used for supplying leads; the conveying mechanism comprises a material channel, wherein the material channel receives the carrier tape and the adhesive tape; the cutting mechanism is used for cutting the lead into a certain length; a molding mechanism comprising a first molding assembly and a second molding assembly; a tin applying mechanism for applying tin to the mounting portion; the assembly mechanism comprises a vibration disc, a material moving assembly and an assembly, wherein the vibration disc is used for conveying chips, the material moving assembly is used for transferring the chips to the assembly, and the assembly is used for assembling the chips to the mounting part; and the welding mechanism can heat the mounting part and the chip to weld and fix the mounting part and the chip. The utility model can reduce the occupation of workshop sites, improve the automation degree and improve the production efficiency.

Description

Chip assembly production line of piezoresistor

Technical Field

The utility model relates to the technical field of piezoresistors, in particular to a chip assembly production line of a piezoresistor.

Background

The production steps of the piezoresistor comprise the working procedures of lead forming, chip combining, welding and the like, and particularly, the lead forming is to punch the lead into a required shape, so that the chip can be installed and combined in the lead, and after the chip and the lead are assembled, the chip and the lead are welded and fixed by soldering tin.

However, the existing varistor production equipment has single function, and the varistor needs to be used in each process to be corresponding to the production equipment, such as a stamping forming machine for a lead forming process and a chip assembling machine for a chip assembling process, so that the automation degree is low and the production efficiency is low.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides a chip assembly production line of a piezoresistor, which can reduce the occupation of workshop sites, improve the automation degree and improve the production efficiency.

According to an embodiment of the first aspect of the present utility model, a chip assembly line for a varistor includes: the unreeling mechanism comprises a first unreeling device, a second unreeling device and a third unreeling device, wherein the first unreeling device is used for supplying a carrier tape, the second unreeling device is used for supplying adhesive tapes, and the third unreeling device is used for supplying leads; a transport mechanism including a lane receiving the carrier tape and the adhesive tape, the carrier tape and the adhesive tape being movable along the lane; the cutting mechanism is arranged in the wire outlet direction of the third unreeling device and is used for cutting the lead wire into a certain length; the forming mechanism is arranged in the wire outlet direction of the shearing mechanism and comprises a first forming assembly and a second forming assembly which are sequentially arranged along the length direction of the material channel, the first forming assembly is used for stamping the lead wire to form a U shape and arranging the lead wire into a carrier tape, and the first forming assembly is used for stamping the end part of the lead wire to form an X-shaped mounting part; the tin feeding mechanism is arranged in the wire outlet direction of the forming mechanism and is used for feeding tin to the mounting part; the assembly mechanism is arranged in the wire outlet direction of the tin feeding mechanism and comprises a vibration disc, a material moving assembly and an assembly, wherein the vibration disc is used for conveying chips, the material moving assembly is used for transferring the chips to the assembly, and the assembly is used for assembling the chips to the mounting part; and the welding mechanism is arranged in the wire outlet direction of the assembly mechanism and can heat the mounting part and the chip so as to fix the mounting part and the chip in a welding way.

According to some embodiments of the utility model, the conveying mechanism comprises a conveying assembly arranged on the material channel and a first motor for driving the conveying assembly to convey, the conveying assembly comprises an upper roller and a lower roller, and the upper roller and the lower roller clamp and convey the carrier tape and the adhesive tape.

According to some embodiments of the utility model, the cutting mechanism comprises a cutting seat and a cutter, wherein the cutting seat is provided with a first through hole for accommodating the lead to pass through, and the cutter is movably arranged at the wire outlet end of the first through hole.

According to some embodiments of the utility model, the first molding assembly includes a fixed die and a movable die movable relative to the fixed die, the fixed die and the movable die cooperatively punching the lead when the movable die is close to the fixed die, and the movable die loading the lead into the carrier tape when the movable die is far from the fixed die.

According to some embodiments of the utility model, the second molding assembly includes a profile that is liftable toward or away from an inner side of the lead, and further includes first and second stamping parts that are respectively located at both sides of the profile, and the first and second stamping parts are respectively operable to stamp both ends of the lead to form the mounting portion.

According to some embodiments of the utility model, the vibration plate is connected with a discharge chute, which accommodates the chip.

According to some embodiments of the utility model, the material moving assembly comprises a suction cup, a lifting frame connected with the suction cup, and a translation member connected with the lifting frame, wherein the suction cup is used for sucking the chip from the material discharging groove.

According to some embodiments of the utility model, the assembly component comprises a transfer table located at one side of the material channel, a pushing block slidably arranged on the transfer table, and a pressing block located above the material channel, wherein the transfer table receives a chip from the sucker, the pressing block can press down one end of the mounting portion to enable the mounting portion to form a clamping opening, and the pushing block can push the chip to the clamping opening.

According to some embodiments of the utility model, the tin feeding mechanism comprises a tin furnace for heating tin liquid, a funnel positioned above the tin furnace, and a liquid pump for driving the tin liquid to flow from the tin furnace to the funnel, wherein a first channel is formed between the bottom of the funnel and an opening of the tin furnace, and the first channel accommodates the installation part to pass through.

According to some embodiments of the utility model, the soldering mechanism has a high-frequency heating soldering device, and the mounting portion and the chip are connected with solder liquid through the high-frequency heating soldering device.

The chip assembly production line of the piezoresistor has at least the following beneficial effects:

1. according to the utility model, the first unreeling device, the second unreeling device and the third unreeling device are used for respectively supplying the carrier tape, the adhesive tape and the lead, so that the carrier tape and the adhesive tape can move along the material channel, and meanwhile, the shearing mechanism can cut the lead into a certain length, so that the subsequent stamping forming of the lead is facilitated, and the lead is conveniently loaded into the carrier tape.

2. According to the utility model, the first molding assembly and the second molding assembly are arranged, the first molding assembly can punch the lead to form a U shape and load the lead into the carrier tape, and then the first molding assembly can punch the end part of the lead to form an X-shaped mounting part, so that the chip can be conveniently embedded in the mounting part in a follow-up manner.

3. According to the utility model, the vibration disc, the material moving component and the assembly component are arranged, so that the vibration disc can convey chips, then the material moving component transfers the chips to the assembly component, and finally the assembly component assembles the chips to the mounting part, thereby improving the assembly efficiency.

4. According to the utility model, the tin-plating mechanism and the welding mechanism are arranged, the tin-plating mechanism is utilized to tin the mounting part, and then the mounting part provided with the chip passes through the welding mechanism, and the welding mechanism can heat the mounting part and the chip so as to weld and fix the mounting part and the chip, thereby avoiding the chip from being separated from the mounting part.

5. According to the utility model, the coil placing mechanism, the conveying mechanism, the shearing mechanism, the forming mechanism, the tin feeding mechanism, the assembling mechanism and the welding mechanism are arranged, so that a production line body is formed, and further, independent equipment is not required to be used in each working procedure, so that the occupation of workshop sites is reduced, the automation degree of the equipment is improved, and the production efficiency is improved.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic diagram of a chip assembly line for a varistor according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a chip assembly line of the varistor shown in FIG. 1 from another perspective;

FIG. 3 is a schematic diagram of a chip assembly line of the varistor shown in FIG. 1 from another perspective;

FIG. 4 is a schematic diagram of a chip assembly line of the varistor shown in FIG. 1 from another perspective;

fig. 5 is a schematic structural view of another view of the chip assembly line for a varistor shown in fig. 1.

Reference numerals: 100-first unwinder, 110-second unwinder, 120-third unwinder, 130-carrier tape, 140-adhesive tape, 150-lead, 160-lane, 170-first forming assembly, 180-second forming assembly, 190-mount, 200-vibratory pan, 210-chip, 220-transport assembly, 230-cutting stand, 240-cutter, 250-first through hole, 260-fixed die, 270-movable die, 280-master die, 290-first stamping, 300-second stamping, 310-discharge chute, 320-suction cup, 330-crane, 340-translating member, 350-intermediate turntable, 360-pusher, 370-briquetting, 380-tin furnace, 390-hopper, 400-liquid pump, 410-first lane, 420-high frequency heating welder.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

A chip assembly line for a varistor according to an embodiment of the present utility model will be described with reference to the accompanying drawings.

Referring to fig. 1, a chip 210 assembling device for a varistor according to an embodiment of the present utility model includes an unreeling mechanism, a conveying mechanism, a shearing mechanism, a forming mechanism, a tin feeding mechanism, an assembling mechanism and a welding mechanism.

The unreeling mechanism comprises a first unreeler 100, a second unreeler 110 and a third unreeler 120, wherein the first unreeler 100 is used for supplying a carrier tape 130, the second unreeler 110 is used for supplying an adhesive tape 140, and the third unreeler 120 is used for supplying a lead 150.

Wherein, conveying mechanism includes material way 160, and material way 160 receives carrier tape 130 and sticky tape 140, and carrier tape 130 and sticky tape 140 can follow material way 160 and remove.

The cutting mechanism is disposed in the wire outlet direction of the third unreeling device 120, and is used for cutting the lead wire 150 into a certain length.

The forming mechanism is disposed in the wire outlet direction of the shearing mechanism, and includes a first forming assembly 170 and a second forming assembly 180 sequentially disposed along the length direction of the material channel 160, the first forming assembly 170 is used for stamping the lead 150 to form a U shape and loading the lead 150 into the carrier 130, and the first forming assembly 170 is used for stamping the end of the lead 150 to form an X-shaped mounting portion 190.

Wherein, the tin feeding mechanism is arranged in the wire outlet direction of the forming mechanism and is used for feeding tin to the mounting part 190.

The assembly mechanism is arranged in the wire outlet direction of the tin plating mechanism, and comprises a vibration disc 200, a material moving component and an assembly component, wherein the vibration disc 200 is used for conveying the chip 210, the material moving component is used for transferring the chip 210 to the assembly component, and the assembly component is used for assembling the chip 210 to the mounting part 190.

Wherein, the welding mechanism is arranged in the wire outlet direction of the assembling mechanism, and the welding mechanism can heat the mounting part 190 and the chip 210 so as to weld and fix the mounting part 190 and the chip 210.

In some embodiments of the present utility model, the conveying mechanism includes a conveying assembly 220 disposed on the material channel 160, and a first motor driving the conveying assembly 220 to convey, wherein the conveying assembly 220 includes an upper roller and a lower roller, and the upper roller and the lower roller clamp the conveying carrier 130 and the adhesive tape 140.

In some embodiments of the present utility model, the cutting mechanism includes a cutting seat 230 and a cutter 240, the cutting seat 230 is provided with a first through hole 250 for receiving the lead 150 therethrough, and the cutter 240 is movably disposed at an outlet end of the first through hole 250, so that the lead 150 is cut by the cutter 240 after passing through the first through hole 250.

It should be noted that the cutter 240 may be moved by an air cylinder.

In some embodiments of the present utility model, referring to fig. 2, the first molding assembly 170 includes a fixed die 260 and a movable die 270, the movable die 270 being movable relative to the fixed die 260, the fixed die 260 and the movable die 270 being engaged to punch the lead 150 when the movable die 270 is adjacent to the fixed die 260, the movable die 270 loading the lead 150 into the carrier tape 130 when the movable die 270 is distant from the fixed die 260.

Thus, when the movable die 270 approaches the fixed die 260, the fixed die 260 and the movable die 270 cooperate to press the lead 150 so that the lead 150 takes a U-shape, and then, the movable die 270 is away from the fixed die 260, the movable die 270 loads the lead 150 into the carrier tape 130, and the adhesive tape 140 adheres the U-shaped lead 150 to the carrier tape 130.

It should be noted that the movable mold 270 may be moved by an air cylinder.

In some embodiments of the present utility model, referring to fig. 1 and 3, the second molding assembly 180 includes a master pattern 280, the master pattern 280 being liftable toward or away from the inner side of the lead 150, and the second molding assembly 180 further includes first and second stamping members 290 and 300 respectively disposed at both sides of the master pattern 280, and the first and second stamping members 290 and 300 respectively stamp both ends of the lead 150 to form the mounting portion 190.

Thus, the fence 280 can be raised to position the inside of the lead 150, and then the first stamping 290 and the second stamping 300 can be simultaneously brought close to the side wall of the fence 280, and the first stamping 290 and the second stamping 300 can respectively stamp both ends of the lead 150 so that the leads 150 intersect to form the X-shaped mounting portion 190.

It should be noted that, the master die 280, the first stamping part 290 and the second stamping part 300 may be driven to lift by using an air cylinder, and the first stamping part 290 and the second stamping part 300 may be driven to translate by using another two air cylinders.

In some embodiments of the present utility model, the assembly includes a transfer table 350 located at one side of the lane 160, a pushing block 360 slidably disposed at the transfer table 350, and a pressing block 370 located above the lane 160, the transfer table 350 receiving the chip 210 from the suction cup 320, and referring to fig. 4, the pressing block 370 can press down one end of the mounting part 190 to form a nip with the mounting part 190, and the pushing block 360 can push the chip 210 to the nip, so that the nip of the mounting part 190 can clamp the chip 210.

In some embodiments of the present utility model, the vibration plate 200 is connected with a discharge slot 310, and the discharge slot 310 accommodates the chip 210, thereby facilitating the subsequent suction of the chip 210 by the suction cup 320.

In some embodiments of the present utility model, the transfer assembly includes a suction cup 320, a lift frame 330 coupled to the suction cup 320, and a translation member 340 coupled to the lift frame 330, the suction cup 320 for sucking the chip 210 from the discharge chute 310.

It should be noted that, the lifting frame 330 may be driven to lift by an air cylinder, and the translating member 340 may be driven to move by another air cylinder.

In some embodiments of the present utility model, referring to fig. 5, the tin applying mechanism includes a tin furnace 380 for heating tin liquid, a funnel 390 located above the tin furnace 380, and a liquid pump 400 for driving tin liquid from the tin furnace 380 to flow to the funnel 390, wherein a first passage 410 is formed between a bottom of the funnel 390 and an opening of the tin furnace 380, and the first passage 410 accommodates the mounting portion 190.

Therefore, after the mounting portion 190 passes through the first channel 410, the molten tin from the funnel 390 falls into the mounting portion 190, so that the mounting portion 190 is tin-plated, and the chip 210 is conveniently fixed on the mounting portion 190 by using the molten tin.

Meanwhile, the funnel 390 may be continuously supplied with the tin solution using the liquid pump 400.

In some embodiments of the present utility model, the soldering mechanism has a high frequency heating solder 420, and the mounting portion 190 and the chip 210 are connected to the mounting portion 190 and the chip 210 by the high frequency heating solder 420.

The rf heater welder 420 is commercially available.

Thus, the present embodiment has the following effects:

1. the utility model utilizes the first unreeling device 100, the second unreeling device 110 and the third unreeling device 120 to respectively supply the carrier band 130, the adhesive tape 140 and the lead 150 by arranging the unreeling mechanism, the conveying mechanism and the shearing mechanism, so that the carrier band 130 and the adhesive tape 140 can move along the material channel 160, and meanwhile, the shearing mechanism can cut the lead 150 into a certain length, thereby facilitating the subsequent stamping forming of the lead 150 and the loading of the lead 150 into the carrier band 130.

2. In the utility model, by arranging the first molding assembly 170 and the second molding assembly 180, the first molding assembly 170 can punch the lead 150 into a U shape and load the lead 150 into the carrier tape 130, and then the first molding assembly 170 can punch the end of the lead 150 into the X-shaped mounting part 190, thereby facilitating the subsequent clamping and embedding of the chip 210 in the mounting part 190.

3. According to the utility model, the vibration plate 200, the material moving component and the assembling component are arranged, so that the vibration plate 200 can convey the chip 210, then the material moving component transfers the chip 210 to the assembling component, and finally the assembling component assembles the chip 210 to the mounting part 190, thereby improving the assembling efficiency.

4. According to the utility model, the tin-plating mechanism and the welding mechanism are arranged, the tin-plating mechanism is utilized to tin the mounting part 190, and then the mounting part 190 with the chip 210 mounted thereon passes through the welding mechanism, and the welding mechanism can heat the mounting part 190 and the chip 210 so as to weld and fix the mounting part 190 and the chip 210, thereby preventing the chip 210 from being separated from the mounting part 190.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims

1. A chip assembly line for a varistor, comprising:

an unreeling mechanism comprising a first unreeler (100), a second unreeler (110) and a third unreeler (120), the first unreeler (100) being used for supplying a carrier tape (130), the second unreeler (110) being used for supplying an adhesive tape (140), the third unreeler (120) being used for supplying a lead (150);

a conveying mechanism comprising a lane (160), the lane (160) receiving the carrier tape (130) and the adhesive tape (140), the carrier tape (130) and the adhesive tape (140) being movable along the lane (160);

the shearing mechanism is arranged in the wire outlet direction of the third unreeling device (120) and is used for cutting the lead (150) into a certain length;

the forming mechanism is arranged in the wire outlet direction of the shearing mechanism and comprises a first forming assembly (170) and a second forming assembly (180) which are sequentially arranged along the length direction of the material channel (160), the first forming assembly (170) is used for punching the lead (150) to form a U shape and loading the lead (150) into a carrier tape (130), and the first forming assembly (170) is used for punching the end part of the lead (150) to form an X-shaped mounting part (190);

the tin feeding mechanism is arranged in the wire outlet direction of the forming mechanism and is used for feeding tin to the mounting part (190);

the assembly mechanism is arranged in the wire outlet direction of the tin feeding mechanism and comprises a vibration disc (200), a material moving assembly and an assembly, wherein the vibration disc (200) is used for conveying chips (210), the material moving assembly is used for transferring the chip (210) to the assembling assembly, and the assembling assembly is used for assembling the chip (210) to the mounting part (190);

and a welding mechanism provided in the wire outlet direction of the assembly mechanism, the welding mechanism being capable of heating the mounting portion (190) and the chip (210) to weld and fix the mounting portion (190) and the chip (210).

2. The chip assembly line of a varistor according to claim 1, wherein the conveying mechanism comprises a conveying component (220) arranged on the material channel (160), and a first motor for driving the conveying component (220) to convey, the conveying component (220) comprises an upper roller and a lower roller, and the upper roller and the lower roller clamp and convey the carrier tape (130) and the adhesive tape (140).

3. The chip assembly line of a varistor according to claim 1, wherein the cutting mechanism comprises a cutting seat (230) and a cutter (240), the cutting seat (230) is provided with a first through hole (250) for accommodating the lead (150) therethrough, and the cutter (240) is movably disposed at an outgoing line end of the first through hole (250).

4. The die assembly line of a varistor according to claim 1, wherein said first molding member (170) includes a fixed die (260) and a movable die (270), said movable die (270) being movable relative to said fixed die (260), said fixed die (260) and said movable die (270) being adapted to press said lead (150) when said movable die (270) is adjacent to said fixed die (260), said movable die (270) being adapted to load said lead (150) into said carrier tape (130) when said movable die (270) is remote from said fixed die (260).

5. The die assembly line of a varistor of claim 1, wherein the second molding assembly (180) includes a master (280), the master (280) being liftable toward and away from the inner side of the lead (150), the second molding assembly (180) further including first and second stamping members (290, 300) disposed on opposite sides of the master (280), the first and second stamping members (290, 300) being respectively operable to stamp opposite ends of the lead (150) to form the mounting portion (190).

6. The varistor die assembly line according to claim 1, wherein the vibration plate (200) is connected with a discharge groove (310), and the discharge groove (310) accommodates the die (210).

7. The varistor die assembly line of claim 6, wherein the material handling assembly includes a suction cup (320), a lift (330) coupled to the suction cup (320), and a translation member (340) coupled to the lift (330), the suction cup (320) configured to hold the die (210) from the discharge chute (310).

8. The assembly line for chip assembly of a varistor according to claim 7, wherein the assembly comprises a transfer table (350) located at one side of the material channel (160), a pushing block (360) slidably disposed on the transfer table (350), and a pressing block (370) located above the material channel (160), wherein the transfer table (350) receives the chip (210) from the suction cup (320), and the pressing block (370) can press down one end of the mounting portion (190) to enable the mounting portion (190) to form a nip, and the pushing block (360) can push the chip (210) to the nip.

9. The chip assembly line of a varistor according to claim 1, wherein the tin feeding mechanism comprises a tin furnace (380) for heating tin liquid, a funnel (390) located above the tin furnace (380), and a liquid pump (400) for driving the tin liquid to flow from the tin furnace (380) to the funnel (390), wherein a first channel (410) is formed between the bottom of the funnel (390) and the opening of the tin furnace (380), and the first channel (410) accommodates the mounting portion (190) to pass through.

10. The die assembly line of a varistor according to claim 1, wherein said soldering mechanism has a high-frequency heating soldering device (420), and said mounting portion (190) and said die (210) are connected with solder liquid through said high-frequency heating soldering device (420) to said mounting portion (190) and said die (210).