CN219999684U - Multilayer circuit board - Google Patents
Multilayer circuit board Download PDFInfo
- Publication number
- CN219999684U CN219999684U CN202321312583.2U CN202321312583U CN219999684U CN 219999684 U CN219999684 U CN 219999684U CN 202321312583 U CN202321312583 U CN 202321312583U CN 219999684 U CN219999684 U CN 219999684U
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- CN
- China
- Prior art keywords
- circuit board
- mounting seat
- module
- multilayer
- modules
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 238000012360 testing method Methods 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Combinations Of Printed Boards (AREA)
Abstract
The utility model relates to the field of multilayer circuit boards, in particular to a multilayer circuit board, which comprises a plurality of circuit board modules arranged in a stacked manner, wherein each circuit board module comprises a circuit board body, a first mounting seat and a second mounting seat which are fixed at two ends of the circuit board body, the first mounting seat positioned at the end part of the lower circuit board module between adjacent circuit board modules is hinged with the second mounting seat positioned at the end part of the upper circuit board module through a hinge, the second mounting seat positioned at the end part of the lower circuit board module between adjacent circuit board modules is clamped with the second mounting seat positioned at the end part of the upper circuit board module, the multilayer circuit board is convenient for centralized maintenance and test, the two ends of the adjacent circuit board modules are mutually connected, and the multilayer circuit board is relatively stable and avoids the damage of the circuit board body. Through a plurality of circuit board module that stacked setting, whole circuit board is more concentrated, reduces occupied space.
Description
Technical Field
The present utility model relates to the field of multilayer circuit boards, and in particular, to a multilayer circuit board.
Background
There are also many multi-layer circuit boards in the prior art. However, in the prior art, the multi-layer circuit board is generally directly and fixedly connected by adopting a screw or buckle structure, when an electrical component needs to be mounted or dismounted, the screws and buckles at corresponding positions need to be completely dismounted, for example, when the multi-layer circuit board formed by the first layer, the second layer and the third layer is required to be overhauled, the first layer or the third layer of circuit board needs to be completely dismounted and connected with the second layer of circuit board, and after the overhauling is completed, the screws or buckles at all the connecting positions need to be fixedly connected, positioning operation is required in the process of fixing connection, the whole dismounting process is complex, the operation is not easy, and the circuit board is also easy to damage.
Accordingly, there is a need to provide a new multilayer circuit board that solves the above-mentioned technical problems.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a multilayer circuit board, which comprises a plurality of circuit board modules arranged in a stacked manner, wherein each circuit board module comprises a circuit board body, a first mounting seat and a second mounting seat which are fixed at two ends of the circuit board body, the first mounting seat positioned at the end part of the lower circuit board module is hinged with the second mounting seat positioned at the end part of the upper circuit board module through a hinge between adjacent circuit board modules, and the second mounting seat positioned at the end part of the lower circuit board module is clamped with the first mounting seat positioned at the end part of the upper circuit board module between adjacent circuit board modules.
Preferably, adjacent circuit board bodies are electrically connected through connecting wires.
Preferably, the connector male heads are arranged at the two ends of the connecting wire, and the circuit board body is provided with connector female heads matched with the connector male heads.
Preferably, the top edge of the second installation seat is provided with a clamping plate, and the bottom edge of the first installation seat is provided with a clamping seat matched with the clamping plate.
Preferably, the side wall of the first installation seat is provided with a containing groove for containing the clamping plate at the position opposite to the clamping seat.
Preferably, the clamping plate and the second mounting seat are in an integrated structure, and the clamping seat and the first mounting seat are in an integrated structure.
Preferably, the side walls of the first mounting seat and the second mounting seat are respectively provided with a mounting groove for accommodating the hinge.
Preferably, the circuit board body is fixedly connected with the first mounting seat and the second mounting seat through screws.
Preferably, a heat dissipation channel is formed between adjacent circuit board modules.
Preferably, after the circuit board modules are all unfolded, the plurality of circuit board modules are located in the same plane.
Compared with the related art, the multilayer circuit board provided by the utility model has the following beneficial effects: can make corresponding cassette and cardboard separation as required, make corresponding circuit board body expose and overhaul or change (independently expose the circuit board body that damages), also can all separate cassette and cardboard, make all circuit board modules wholly expand and be in the coplanar, be convenient for concentrate maintenance and test, both ends interconnect between the adjacent circuit board module, it is more stable, avoid circuit board body to damage.
Through a plurality of circuit board module that stacked setting, whole circuit board is more concentrated, reduces occupied space.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a multi-layer circuit board according to the present utility model;
FIG. 2 is a schematic diagram of a multi-layer circuit board according to a second embodiment of the present utility model;
FIG. 3 is a schematic diagram of a circuit board module according to the present utility model;
FIG. 4 is an enlarged schematic view of the region X in FIG. 3 according to the present utility model;
FIG. 5 is an enlarged schematic view of the region Y in FIG. 3 according to the present utility model;
fig. 6 is a schematic view of a hinge installation position provided by the utility model.
Reference numerals in the drawings: 1. a circuit board module; 11. a circuit board body; 111. a connector female; 12. a first mount; 121. a clamping seat; 122. a receiving groove; 13. a second mounting base; 131. a clamping plate; 2. a hinge; 3. a connecting wire; 31. a connector male; a. a mounting groove; b. and a heat dissipation channel.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Specific implementations of the utility model are described in detail below in connection with specific embodiments.
Referring to fig. 1 to 2, the multi-layer circuit board provided by the embodiment of the utility model comprises a plurality of stacked circuit board modules 1, wherein the circuit board modules 1 comprise a circuit board body 11, a first mounting seat 12 and a second mounting seat 13 which are fixed at two ends of the circuit board body 11, the first mounting seat 12 positioned at the end part of the lower circuit board module 1 between adjacent circuit board modules 1 is hinged with the second mounting seat 13 positioned at the end part of the upper circuit board module 1 through a hinge 2, and the second mounting seat 13 positioned at the end part of the lower circuit board module 1 between adjacent circuit board modules 1 is clamped with the first mounting seat 12 positioned at the end part of the upper circuit board module 1.
The adjacent circuit board bodies 11 are electrically connected through the connecting wires 3, the connector male heads 31 are arranged at two ends of the connecting wires 3, and the circuit board bodies 11 are provided with connector female heads 111 matched with the connector male heads 31, so that the circuit board bodies 11 are used in series.
Referring to fig. 3-5, the top edge of the second mounting seat 13 is provided with a clamping plate 131, and the bottom edge of the first mounting seat 12 is provided with a clamping seat 121 matched with the clamping plate 131, so that the structure is simple and the clamping effect is good.
The side wall of the first mounting seat 12 is provided with a containing groove 122 for containing the clamping plate 131 at a position opposite to the clamping seat 121.
The clamping plate 131 and the second mounting seat 13 are of an integrated structure, and the clamping seat 121 and the first mounting seat 12 are of an integrated structure, so that the processing is convenient and the stability is relatively stable.
The side walls of the first mounting seat 12 and the second mounting seat 13 are respectively provided with a mounting groove a for accommodating the hinge 2, so that the adjacent circuit board modules 1 can be unfolded into the same plane.
The circuit board body 11 is fixedly connected with the first mounting seat 12 and the second mounting seat 13 through screws, so that the circuit board module 1 can be conveniently assembled and disassembled.
And a heat dissipation channel b is formed between the adjacent circuit board modules 1, and air is blown along the heat dissipation channel b through a heat dissipation fan, so that heat can be effectively dissipated.
When the circuit board modules 1 are all unfolded, the circuit board modules 1 are located in the same plane, so that the circuit board modules 1 are convenient to overhaul.
Working principle: when a certain circuit board body 11 needs to be overhauled, the connecting line at a belief position is pulled out, then the corresponding clamping seat 121 and the clamping plate 131 can be separated, the set certain circuit board body 11 is exposed for overhauling or replacement, the clamping seat 121 and the clamping plate 131 can be completely separated, the circuit board module 1 is completely unfolded to be positioned in the same plane, so that the concentrated overhauling and testing of all the circuit board bodies 11 are facilitated, in addition, the hinge connection is always maintained in the disassembly process, the connection part can be positioned through overturning during the fixation, the fixation connection of a screw or a buckle is very convenient, and the operation is very convenient.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (10)
1. The utility model provides a multilayer circuit board, its characterized in that, includes a plurality of circuit board module (1) of stacked setting, circuit board module (1) include circuit board body (11) and fix first mount pad (12) and second mount pad (13) at circuit board body (11) both ends, and lie in first mount pad (12) of lower floor's circuit board module (1) tip between adjacent circuit board module (1) and hinge (2) and second mount pad (13) of upper circuit board module (1) tip are articulated, lie in second mount pad (13) and first mount pad (12) joint of upper circuit board module (1) tip of lower floor's circuit board module (1) tip between adjacent circuit board module (1) simultaneously.
2. The multilayer circuit board according to claim 1, characterized in that adjacent circuit board bodies (11) are electrically connected by connecting wires (3).
3. The multilayer circuit board according to claim 2, wherein the connector male (31) is provided at both ends of the connecting wire (3), and the circuit board body (11) is provided with a connector female (111) which mates with the connector male (31).
4. A multi-layer circuit board according to claim 3, characterized in that the top edge of the second mounting seat (13) is provided with a clamping plate (131), and the bottom edge of the first mounting seat (12) is provided with a clamping seat (121) matched with the clamping plate (131).
5. The multi-layer circuit board according to claim 4, wherein the side wall of the first mounting seat (12) is provided with a receiving groove (122) for receiving the clamping plate (131) at a position opposite to the clamping seat (121).
6. The multi-layer circuit board according to claim 4, wherein the clamping plate (131) and the second mounting base (13) are in an integrated structure, and the clamping base (121) and the first mounting base (12) are in an integrated structure.
7. The multilayer circuit board according to claim 1, characterized in that the first mount (12) and the second mount (13) side walls are each provided with a mounting slot (a) for receiving a hinge (2).
8. The multilayer circuit board according to claim 1, characterized in that the circuit board body (11) is fixedly connected with the first mount (12) and the second mount (13) by screws.
9. The multilayer circuit board according to claim 1, characterized in that heat dissipation channels (b) are formed between adjacent circuit board modules (1).
10. The multilayer circuit board according to claim 1, characterized in that several circuit board modules (1) are in the same plane when the circuit board modules (1) are fully unfolded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321312583.2U CN219999684U (en) | 2023-05-25 | 2023-05-25 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321312583.2U CN219999684U (en) | 2023-05-25 | 2023-05-25 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219999684U true CN219999684U (en) | 2023-11-10 |
Family
ID=88603728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321312583.2U Active CN219999684U (en) | 2023-05-25 | 2023-05-25 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219999684U (en) |
-
2023
- 2023-05-25 CN CN202321312583.2U patent/CN219999684U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |