CN219978461U - Chip low temperature testing device - Google Patents
Chip low temperature testing device Download PDFInfo
- Publication number
- CN219978461U CN219978461U CN202320668057.3U CN202320668057U CN219978461U CN 219978461 U CN219978461 U CN 219978461U CN 202320668057 U CN202320668057 U CN 202320668057U CN 219978461 U CN219978461 U CN 219978461U
- Authority
- CN
- China
- Prior art keywords
- cooling
- chip
- plate
- kettle body
- kettle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 71
- 238000001816 cooling Methods 0.000 claims abstract description 100
- 239000000110 cooling liquid Substances 0.000 claims abstract description 39
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 5
- 239000002826 coolant Substances 0.000 claims description 28
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000002528 anti-freeze Effects 0.000 claims description 3
- 230000005494 condensation Effects 0.000 abstract description 3
- 238000009833 condensation Methods 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 8
- 238000005057 refrigeration Methods 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 210000005056 cell body Anatomy 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a chip low-temperature testing device which comprises a containing kettle, a chip testing tool and a cooling liquid circulating mechanism, wherein the chip testing tool is arranged in the containing kettle, the lower end of the containing kettle is provided with a nitrogen inlet communicated with the inside of the containing kettle, the nitrogen inlet is provided with an air inlet valve, the upper end of the containing kettle is provided with an air outlet communicated with the inside of the containing kettle, the air outlet is provided with a one-way exhaust valve, the one-way exhaust valve is used for discharging air in the containing kettle, the chip testing tool is provided with a cooling mechanism, a cooling flow passage is arranged in the cooling mechanism, the cooling mechanism is provided with a cooling liquid inlet and a cooling liquid outlet, the cooling liquid circulating mechanism is arranged outside the containing kettle, the cooling liquid circulating mechanism is provided with a liquid outlet and a liquid return inlet, the liquid outlet is communicated with the cooling liquid inlet and the cooling liquid return outlet through hoses penetrating through the containing kettle, and the chip testing tool is used for carrying out low-temperature testing on chips, and has a simple structure, so that the chips can not generate condensation phenomenon at the temperature of minus 40 ℃.
Description
Technical Field
The utility model belongs to the field of chip detection equipment, and particularly relates to a chip low-temperature testing device.
Background
In the chip test link, different requirements on various indexes of the chip test by customers are different, and some customers need to test the various indexes of the chip under the environment of-40 ℃, so that the test requirements are improved, the difficulty is increased, and meanwhile, the test bench of the chip test fixture is required to be cooled to-40 ℃, but condensation and final icing are easy to occur on the surface of the chip test fixture at-40 ℃, so that the normal operation of the chip test fixture is affected.
Disclosure of Invention
In order to solve the technical problems, the utility model aims to provide the low-temperature chip testing device which has a simple structure and can provide a low dew point for a chip testing tool.
In order to achieve the above object, the technical scheme of the present utility model is as follows: the utility model provides a chip low temperature testing arrangement, is including holding cauldron, chip test fixture and coolant circulation mechanism, the chip test fixture is installed hold in the cauldron, just hold the lower extreme of cauldron be provided with rather than the nitrogen gas entry of inside intercommunication, just nitrogen gas entry department is equipped with the admission valve, hold the upper end of cauldron be provided with rather than the gas vent of inside intercommunication, just gas vent department is provided with one-way discharge valve, one-way discharge valve is used for supplying to hold the gaseous outer arranging in the cauldron, have cooling mechanism on the chip test fixture, cooling mechanism has the cooling runner, cooling mechanism has coolant inlet and coolant outlet, coolant circulation mechanism arranges in hold outside the cauldron, coolant circulation mechanism has liquid outlet and liquid return port, just liquid outlet and coolant inlet and liquid return port are through respectively run through hold the hose intercommunication of cauldron, chip test fixture is used for carrying out the low temperature test to the chip.
The beneficial effects of the technical scheme are that: through will in holding the cauldron is placed to chip test fixture, when the chip is placed on chip test fixture, lets in dry nitrogen gas through the nitrogen gas entry to the cauldron is internal, and the nitrogen gas can upwards extrude the internal air of cauldron to discharge through the gas vent this moment, and the dew point of nitrogen gas is less than-40 ℃, and humidity is low, so chip test device even when the temperature reduces-40 ℃, the phenomenon that the condensation was frozen can not appear on its surface this time to can simulate by chip test fixture and test the chip under the condition of-40 ℃.
In the above technical scheme, the accommodating kettle comprises a kettle body and a kettle cover, the kettle body is a groove body with an upward notch, the kettle cover is rotatably installed at the notch of the kettle body, the kettle cover is capable of being arranged at the upper end of the kettle body through a quick-release bolt sealing cover, the nitrogen inlet is arranged at the lower end of the kettle body, the exhaust port is arranged on the kettle cover, the chip testing tool is arranged in the kettle body, and two hoses are all sealed to penetrate through the side wall of the kettle body.
The beneficial effects of the technical scheme are that: the structure is simple, so that the kettle cover of the accommodating kettle is convenient to open or close, and the sealing effect is good when the kettle cover is closed.
In the above technical scheme, the chip testing tool further comprises a three-degree-of-freedom moving mechanism and an IPT workpiece table, wherein the three-degree-of-freedom moving mechanism is arranged in the middle of the inner bottom wall of the kettle body, the driving end of the three-degree-of-freedom moving mechanism faces upwards, the cooling mechanism is arranged at the driving end of the three-degree-of-freedom moving mechanism, the IPT workpiece table is arranged at the upper end of the cooling mechanism, the upper end of the cooling mechanism is used for placing a chip to be tested, the cooling mechanism is used for cooling the IPT workpiece table, and the three-degree-of-freedom moving mechanism is used for driving the cooling mechanism to drive the IPT workpiece table to horizontally move and/or horizontally rotate.
The beneficial effects of the technical scheme are that: the three-degree-of-freedom moving mechanism drives the cooling mechanism and the IPT workpiece table to move and/or rotate on the horizontal plane so as to test the chip at low temperature under the condition of simulated motion.
In the above technical scheme, the three-degree-of-freedom moving mechanism comprises an electric two-dimensional moving part and an electric rotary workbench, wherein the electric two-dimensional moving part is arranged on the inner bottom wall of the kettle body, the electric rotary workbench is arranged at the driving end of the electric two-dimensional moving part, the driving end of the electric rotary workbench forms the driving end of the three-degree-of-freedom moving mechanism, the electric two-dimensional moving part is used for driving the electric rotary workbench to horizontally move, and the electric rotary workbench is used for driving the cooling mechanism to drive the IPT workpiece bench to horizontally rotate.
The beneficial effects of the technical scheme are that: the structure is simple.
In the above-mentioned technical scheme cooling body includes bottom plate, cooling plate, TEC refrigeration piece and apron, the bottom plate level sets up the drive end of electronic swivel work head, the cooling plate is installed the upper end of bottom plate, just be equipped with in the cooling plate the cooling runner, just cooling liquid entry and coolant liquid export all set up on the lateral wall of cooling plate, the apron sets up the upper end of cooling plate, just the TEC refrigeration piece presss from both sides and establishes between apron and the hole cooling plate, just the refrigeration side of TEC refrigeration piece up, and the side that generates heat down, the IPT work head is installed the upper end of apron, the cooling plate is used for right the side that generates heat of TEC refrigeration piece cools off.
The beneficial effects of the technical scheme are that: the cooling device is simple in structure, the TEC cooling piece cools the cover plate and the IPC workpiece table, and the cooling plate takes away heat emitted by the TEC cooling piece during cooling through circulating cooling liquid.
According to the technical scheme, the upper end of the bottom plate is convexly provided with a plurality of columns, and the cooling plate is arranged at the upper ends of the columns.
The beneficial effects of the technical scheme are that: therefore, heat on the cooling plate can be reduced and transferred to the three-degree-of-freedom moving mechanism through the bottom plate.
In the above technical scheme, two pipeline interfaces are further arranged on the side wall of the kettle body, the two pipeline interfaces are in one-to-one correspondence with the cooling liquid inlets and the cooling liquid outlets on the cooling mechanism, the cooling liquid inlets and the cooling liquid outlets are respectively communicated with one end of the corresponding pipeline interfaces, which is positioned in the kettle body, through a hose, and the liquid outlet and the liquid return outlet of the cooling liquid circulation mechanism are respectively communicated with one end of the corresponding pipeline interfaces, which is positioned outside the kettle body.
The beneficial effects of the technical scheme are that: thus, the firmness of hose connection can be improved.
The cooling liquid used by the cooling liquid circulation mechanism in the technical scheme is antifreeze cooling liquid.
The beneficial effects of the technical scheme are that: thus, the cooling liquid can be prevented from freezing and failing to flow under the low-temperature condition.
Drawings
FIG. 1 is a schematic diagram of a low-temperature chip testing apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a cooling mechanism according to an embodiment of the present utility model;
fig. 3 is a detailed schematic diagram of a chip low-temperature testing device according to an embodiment of the utility model.
In the figure: the device comprises a containing kettle, a nitrogen inlet 11, an air inlet 12, an air inlet 13, an air outlet 14, a one-way air outlet valve 15, a kettle body 151 pipeline interface, a 152 threading hole, a kettle cover 16, a chip testing tool 2, a cooling mechanism 21, a bottom plate 211, a cylinder 2111, a cooling plate 212, a cooling liquid inlet 2121, a cooling liquid outlet 2122, a TEC refrigerating sheet 213, a cover plate 214, a three-degree-of-freedom moving mechanism 22, an electric two-dimensional moving part 221, an electric rotating workbench 222, an IPT workbench 23, a cooling liquid circulating mechanism 3 and a hose 4.
Detailed Description
The principles and features of the present utility model are described below with examples given for the purpose of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1 and 3, this embodiment provides a chip low temperature testing device, including holding cauldron 1, chip test fixture 2 and coolant circulation mechanism 3, chip test fixture 2 installs in holding cauldron 1, just hold the lower extreme of cauldron 1 be provided with rather than inside intercommunication's nitrogen gas entry 11, just nitrogen gas entry 11 department is equipped with admission valve 12, hold the upper end of cauldron 1 be provided with rather than inside intercommunication's gas vent 13, just gas vent 13 department is provided with one-way discharge valve 14, one-way discharge valve 14 is used for supplying the gas in holding cauldron 1 to be discharged outward, have cooling mechanism 21 on the chip test fixture 2, cooling mechanism 21 has cooling runner in, cooling mechanism 21 has coolant inlet 2121 and coolant outlet 2122, coolant circulation mechanism 3 arranges in outside holding cauldron 1, coolant circulation mechanism 3 has liquid outlet and liquid inlet 2121 and coolant liquid outlet 2122 respectively through running through holding cauldron 1 ℃ and being provided with one-way discharge valve 14, thereby can reduce the chip and place the chip and take place the chip to the temperature to the low temperature at this time and place at 40-the chip test fixture through the low temperature and place the chip test fixture and the chip and the temperature is used for the chip is in the chip test fixture is up to the chip test fixture is at 40-40, and the chip low temperature is placed in the chip test fixture is at this time and the chip test fixture is cooled down to be cooled down to the chip test fixture is at 40.
Among the above-mentioned technical scheme hold cauldron 1 including the cauldron body 15 and cauldron lid 16, the cauldron body 15 is the notch cell body that the notch is up, just the cauldron lid 16 rotates to be installed the notch department of the cauldron body 15, the upper end of the cauldron body 15 (similar to the cauldron body of autoclave and the connected mode of cauldron lid, it belongs to prior art, and will not be repeated here) is established to the sealed lid of quick detach bolt, nitrogen gas entry 11 sets up the lower extreme of the cauldron body 15, gas vent 13 sets up on the cauldron lid 16, chip test frock 2 sets up in the cauldron body 15, and two hose 4 all seal runs through the lateral wall of the cauldron body 15, its simple structure so makes the cauldron lid that holds the cauldron open or close the time all comparatively convenient, and it is sealed effectual when closing.
In the above technical scheme, the chip testing tool 2 further includes a three-degree-of-freedom moving mechanism 22 and an IPT workpiece table 23, the three-degree-of-freedom moving mechanism 22 is disposed in the middle of the inner bottom wall of the kettle body 15, and the driving end thereof faces upwards, the cooling mechanism 21 is disposed at the driving end of the three-degree-of-freedom moving mechanism 22, the IPT workpiece table 23 is disposed at the upper end of the cooling mechanism 21, the upper end thereof is used for placing a chip to be tested, the cooling mechanism 21 is used for cooling the IPT workpiece table 23, the three-degree-of-freedom moving mechanism 22 is used for driving the cooling mechanism 21 to drive the IPT workpiece table 23 to horizontally move and/or horizontally rotate, the three-degree-of-freedom moving mechanism drives the cooling mechanism and the IPT workpiece table to horizontally move and/or rotate, so that the chip is tested at a low temperature under a simulated motion condition. The IPT workpiece table (copper column with heat and electric conduction performance) is provided with a test circuit, the test circuit is provided with a chip placing station (probe electrified with the chip is arranged at the test circuit), the test circuit and the chip are in a conducting state when the chip is placed at the chip placing station, and the test circuit belongs to the prior art and is not described in detail herein.
In the above technical solution, the three-degree-of-freedom moving mechanism 22 includes an electric two-dimensional moving member 221 and an electric rotating table 222, the electric two-dimensional moving member 221 is disposed on an inner bottom wall of the kettle body 15, the electric rotating table 222 is mounted on a driving end of the electric two-dimensional moving member 221, the driving end of the electric rotating table 222 forms the driving end of the three-degree-of-freedom moving mechanism 22, the electric two-dimensional moving member 221 is used for driving the electric rotating table 222 to horizontally move, and the electric rotating table 222 is used for driving the cooling mechanism 21 to drive the IPT workpiece table 23 to horizontally rotate, so that the structure is simple. The electric two-dimensional moving part can adopt an XY two-axis electric sliding table, the electric rotary workbench can adopt an electric rotary platform on the market, which belongs to the prior art, and is not repeated herein, in order to avoid a hose winding pipe, the electric rotary workbench can only rotate forward or reversely within a 360-degree range, namely can not face a reverse rotation angle of 360 degrees, and the length of the hose needs to reserve the rotating allowance of the electric rotary workbench.
In the above technical solution, the cooling mechanism 21 includes a bottom plate 211, a cooling plate 212, a TEC cooling plate 213 and a cover plate 214, the bottom plate 211 is horizontally disposed at the driving end of the electric rotary table 222, the cooling plate 212 is mounted at the upper end of the bottom plate 211, the cooling plate 212 is internally provided with a cooling flow channel (preferably, the cooling flow channel is a serpentine channel), the cooling liquid inlet 2121 and the cooling liquid outlet 2122 are both disposed on the side wall of the cooling plate 212, the cover plate 214 is disposed at the upper end of the cooling plate 212, the TEC cooling plate 213 is sandwiched between the cover plate 214 and the pit cooling plate, the cooling side of the TEC cooling plate 213 faces upward, the heating side faces downward, the IPT work table 23 is mounted at the upper end of the cover plate 214, the cooling plate 212 is used for cooling the heating side of the TEC cooling plate 213, the cooling plate is simple in structure, and the cooling plate and the ipcp work table are cooled by the cooling plate, and the heat emitted by the cooling plate is carried away by the cooling liquid circulating cooling liquid.
As shown in fig. 2, the edges of the bottom plate, the cooling plate and the cover plate are all provided with a plurality of holes (similar to a flange plate) which vertically penetrate and are aligned with each other at intervals, a bolt is inserted into the aligned holes, and at least one nut is connected to the threaded end of the bolt to connect the bottom plate 211, the cooling plate 212, the TEC cooling plate 213 and the cover plate 214 together (wherein the TEC cooling plate 213 is sandwiched between the cooling plate and the cover plate).
In the above technical solution, a plurality of columns 2111 are protruding from the upper end of the bottom plate 211, and the cooling plate 212 is mounted on the upper ends of the columns 2111 (to reduce the contact area between the bottom plate and the cooling plate, thereby reducing the heat transfer between the bottom plate and the cooling plate), so that the heat on the cooling plate can be reduced to be conducted to the three-degree-of-freedom moving mechanism through the bottom plate.
In the above technical solution, two pipe interfaces 151 are further disposed on the side wall of the tank body 15, the two pipe interfaces 151 are in one-to-one correspondence with the cooling liquid inlets 2121 and the cooling liquid outlets 2122 on the cooling mechanism 21, the cooling liquid inlets 2121 and the cooling liquid outlets 2122 are respectively communicated with one end, located in the tank body 15, of the corresponding pipe interfaces 151 through a hose 4, and the liquid outlet and the liquid return port of the cooling liquid circulation mechanism 3 are respectively communicated with one end, located outside the tank body 15, of the corresponding pipe interfaces 151, so that the firmness of hose connection can be improved.
In the above technical solution, the coolant used by the coolant circulation mechanism 3 is antifreeze coolant, so that the coolant can be prevented from freezing and failing to flow under the low temperature condition.
Preferably, a temperature sensor (used for detecting the real-time temperature of the cover plate or the IPT workpiece table) can be additionally arranged on the cover plate or the IPT workpiece table, a threading hole 152 can also be directly arranged on the side wall of the kettle body, and a conducting wire for accommodating electric elements (an electric rotary workbench 222, an electric two-dimensional moving part 221, a TEC refrigerating sheet 213, a temperature sensor and a testing circuit) in the kettle can directly pass through the threading hole (a threading sealing ring is arranged at the threading hole) in a sealing way to penetrate out of the accommodating kettle so as to be positioned outside the kettle body and be in contact with terminal equipment (which can comprise a controller (which can be an arm series singlechip and testing equipment for performing chip performance test) for controlling the three-degree-of-freedom moving mechanism, the TEC refrigerating sheet 213 and the temperature sensor to operate, and belongs to the prior art, and is not repeated here).
The cooling liquid circulation mechanism can adopt the existing cooling water circulation machine (a water pump is arranged in the cooling water circulation mechanism to serve as the power for cooling liquid circulation).
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (8)
1. Chip low temperature testing arrangement, its characterized in that, including holding cauldron (1), chip test fixture (2) and coolant circulation mechanism (3), chip test fixture (2) are installed hold cauldron (1) in, just hold the lower extreme of cauldron (1) be provided with rather than inside intercommunication nitrogen gas entry (11), just nitrogen gas entry (11) department is equipped with admission valve (12), the upper end that holds cauldron (1) is provided with gas vent (13) rather than inside intercommunication, just gas vent (13) department is provided with one-way discharge valve (14), one-way discharge valve (14) are used for supplying to hold the gaseous outer row in cauldron (1), have cooling mechanism (21) on chip test fixture (2), have cooling runner in cooling mechanism (21), cooling mechanism (21) have coolant inlet (2121) and coolant outlet (2122), coolant circulation mechanism (3) are arranged in hold outside cauldron (1), coolant circulation mechanism (3) have liquid mouth and liquid return mouth, just coolant inlet 2121 and coolant outlet (2121) and coolant outlet (2) are used for holding chip test fixture (2) and are held respectively to chip test fixture (2).
2. The chip low-temperature test device according to claim 1, wherein the accommodating kettle (1) comprises a kettle body (15) and a kettle cover (16), the kettle body (15) is a groove body with an upward notch, the kettle cover (16) is rotatably installed at the notch of the kettle body (15), the kettle cover (16) is arranged at the upper end of the kettle body (15) through a quick-release bolt sealing cover, the nitrogen inlet (11) is arranged at the lower end of the kettle body (15), the exhaust port (13) is arranged on the kettle cover (16), the chip test tool (2) is arranged in the kettle body (15), and two hoses (4) are all sealed to penetrate through the side wall of the kettle body (15).
3. The chip low-temperature test device according to claim 2, wherein the chip test fixture (2) further comprises a three-degree-of-freedom moving mechanism (22) and an IPT workpiece table (23), the three-degree-of-freedom moving mechanism (22) is arranged in the middle of the inner bottom wall of the kettle body (15), the driving end of the three-degree-of-freedom moving mechanism is upward, the cooling mechanism (21) is arranged at the driving end of the three-degree-of-freedom moving mechanism (22), the IPT workpiece table (23) is arranged at the upper end of the cooling mechanism (21), the upper end of the cooling mechanism is used for placing a chip to be tested, the cooling mechanism (21) is used for cooling the IPT workpiece table (23), and the three-degree-of-freedom moving mechanism (22) is used for driving the cooling mechanism (21) to drive the IPT workpiece table (23) to horizontally move and/or horizontally rotate.
4. A chip low-temperature test device according to claim 3, wherein the three-degree-of-freedom moving mechanism (22) comprises an electric two-dimensional moving member (221) and an electric rotary workbench (222), the electric two-dimensional moving member (221) is arranged on the inner bottom wall of the kettle body (15), the electric rotary workbench (222) is arranged at the driving end of the electric two-dimensional moving member (221), the driving end of the electric rotary workbench (222) forms the driving end of the three-degree-of-freedom moving mechanism (22), the electric two-dimensional moving member (221) is used for driving the electric rotary workbench (222) to horizontally move, and the electric rotary workbench (222) is used for driving the cooling mechanism (21) to horizontally rotate the IPT workpiece table (23).
5. The chip low-temperature test device according to claim 4, wherein the cooling mechanism (21) comprises a bottom plate (211), a cooling plate (212), a TEC refrigerating plate (213) and a cover plate (214), the bottom plate (211) is horizontally arranged at the driving end of the electric rotary table (222), the cooling plate (212) is installed at the upper end of the bottom plate (211), the cooling flow channel is arranged in the cooling plate (212), the cooling liquid inlet (2121) and the cooling liquid outlet (2122) are all arranged on the side wall of the cooling plate (212), the cover plate (214) is arranged at the upper end of the cooling plate (212), the TEC refrigerating plate (213) is clamped between the cover plate (214) and the pit cooling plate, the refrigerating side of the TEC refrigerating plate (213) is upward, the heating side of the IPT table (23) is installed at the upper end of the cover plate (214), and the cooling plate (212) is used for cooling the heating side of the refrigerating plate (213).
6. The chip low temperature test apparatus according to claim 5, wherein a plurality of columns (2111) are protruded at an upper end of the base plate (211), and the cooling plate (212) is installed at an upper end of the plurality of columns (2111).
7. The chip low-temperature test device according to any one of claims 2 to 6, wherein two pipeline interfaces (151) are further arranged on the side wall of the kettle body (15), the two pipeline interfaces (151) are in one-to-one correspondence with a cooling liquid inlet (2121) and a cooling liquid outlet (2122) on the cooling mechanism (21), the cooling liquid inlet (2121) and the cooling liquid outlet (2122) are respectively communicated with one end, located in the kettle body (15), of the corresponding pipeline interfaces (151) through a hose (4), and a liquid outlet and a liquid return port of the cooling liquid circulation mechanism (3) are respectively communicated with one end, located outside the kettle body (15), of the corresponding pipeline interfaces (151).
8. The chip low-temperature test device according to claim 7, wherein the coolant used by the coolant circulation mechanism (3) is an antifreeze coolant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320668057.3U CN219978461U (en) | 2023-03-30 | 2023-03-30 | Chip low temperature testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320668057.3U CN219978461U (en) | 2023-03-30 | 2023-03-30 | Chip low temperature testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219978461U true CN219978461U (en) | 2023-11-07 |
Family
ID=88578140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320668057.3U Active CN219978461U (en) | 2023-03-30 | 2023-03-30 | Chip low temperature testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219978461U (en) |
-
2023
- 2023-03-30 CN CN202320668057.3U patent/CN219978461U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202141627U (en) | Low-temperature carrier gas cold-trapping and thermal-desorption device | |
| CN219978461U (en) | Chip low temperature testing device | |
| CN110953481A (en) | Low-cost multichannel thermal coupling energy-saving metal hydride hydrogen storage bottle activation system and process flow thereof | |
| CN205944129U (en) | Bridging device's scaling powder coating device | |
| US11230792B2 (en) | Vertical electroplating module and electroplating method for fan-out panel level chip | |
| CN219997236U (en) | Chip high-low temperature testing device | |
| CN111426942B (en) | Optimized chip temperature resistance testing device | |
| CN115074653B (en) | Hot-galvanize iron wire cooling passivating device | |
| CN208128727U (en) | A kind of cold plate temperature regulating device | |
| CN115754538A (en) | Ox horn aluminium electrolytic capacitor charge-discharge testing arrangement | |
| CN116613416A (en) | Container formula chemical power supply energy storage power station | |
| CN215572191U (en) | Industrial metallurgy cooling device with multistage cooling function | |
| CN211147970U (en) | Pressure testing machine for valve | |
| CN114201008A (en) | Heat dissipation device of big data internet server | |
| CN203249887U (en) | Electronic refrigeration-type hollow glass dew point test instrument | |
| CN221007378U (en) | Rubber seal ring low temperature resistance testing device | |
| CN220647851U (en) | Hydrogen bromide filling refrigerating device | |
| CN217464345U (en) | High-power LED composite aluminum substrate | |
| CN216525561U (en) | Dew point hygrometer water cooling plant that can detect water-cooling pipeline | |
| CN216845777U (en) | Cooling device is used in production of adjustable cooling efficiency's fluoride-free waterproofing agent | |
| CN213503948U (en) | Storage equipment for food and beverage batching storage | |
| CN217876576U (en) | Quick replacement device of coolant liquid | |
| CN220872316U (en) | Corrosion-resistant detection mechanism for manganese dioxide battery | |
| CN216288327U (en) | Semiconductor wafer cleaning equipment | |
| CN219416707U (en) | Cooling system test bench |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A chip low-temperature testing device Granted publication date: 20231107 Pledgee: Guanggu Branch of Wuhan Rural Commercial Bank Co.,Ltd. Pledgor: WUHAN SHENGWEIXIN TECHNOLOGY CO.,LTD. Registration number: Y2024980009867 |