CN219958133U - Cabinet heat radiation module and cabinet - Google Patents
Cabinet heat radiation module and cabinet Download PDFInfo
- Publication number
- CN219958133U CN219958133U CN202320174851.2U CN202320174851U CN219958133U CN 219958133 U CN219958133 U CN 219958133U CN 202320174851 U CN202320174851 U CN 202320174851U CN 219958133 U CN219958133 U CN 219958133U
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- chassis
- hole
- mounting frame
- mounting
- fan
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- 230000005855 radiation Effects 0.000 title description 4
- 230000017525 heat dissipation Effects 0.000 claims abstract description 38
- 238000001816 cooling Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 230000035939 shock Effects 0.000 claims description 7
- 238000009825 accumulation Methods 0.000 abstract description 5
- 239000006185 dispersion Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000011435 rock Substances 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a case radiating module and a case, and relates to the technical field of electronic equipment; the mounting frame is provided with a mounting hole, one side of the mounting frame is provided with a through hole matched with a pin on the chassis, and the other side of the mounting frame is provided with a connecting piece for connecting with the side wall of the chassis; the fan is detachably arranged in the mounting hole. The fan sets up in the mounting hole of mounting bracket, the one end of mounting bracket is established on the pin of quick-witted incasement through the through-hole cover and is met with the quick-witted case, accomplish after the other end of mounting bracket and the detachable connection of quick-witted case heat dissipation module and quick-witted case, the fan follows the mounting bracket setting in the quick-witted case, when each part of quick-witted incasement moves, the fan follows the radiator of quick-witted incasement together operation, the produced wind direction of fan is the same with the produced wind direction of radiator, thereby promote the heat dispersion of quick-witted case, avoid appearing quick-witted incasement temperature accumulation, the phenomenon that the part of quick-witted incasement damaged because of the temperature exceeds standard.
Description
Technical Field
The utility model relates to the technical field of electronic equipment, in particular to a case cooling module and a case.
Background
The heat is generated in the high-speed running process of the processor, the main board and other components in the computer case, and the heat is timely dissipated by arranging a radiator in the computer case, so that the high-temperature damage of the components such as the processor, the main board and the like caused by heat accumulation is avoided.
At present, because the requirements of people on the display card carried by the case are continuously improved, the heat generated by the high-performance display card in the operation process is large, the heat generated by the parts such as the display card, the main board and the like in the case is difficult to timely dissipate out of the case by the radiator in the case, and when the computer is used for a long time, the phenomenon that the parts in the case cannot dissipate heat in place, so that the temperature in the case is accumulated and the parts in the case are damaged due to the fact that the temperature exceeds the standard is easy to occur.
Disclosure of Invention
The utility model aims to provide a case radiating module which is used for solving the technical problem that a radiator in a case in the prior art is difficult to timely radiate heat generated by components such as a display card, a main board and the like out of the case.
The utility model provides a case heat radiation module, comprising: a mounting rack and a fan; the mounting frame is provided with a mounting hole, one end of the mounting frame is provided with a through hole matched with a pin on the chassis, and the other end of the mounting frame is provided with a connecting piece used for being connected with the side wall of the chassis; the fan is detachably arranged in the mounting hole.
Further, one end of the connecting piece is rotatably connected with the mounting frame; the other end of the mounting frame is provided with a U-shaped hole; the aperture of the U-shaped hole is matched with the outer diameter of the case rivet.
Further, the chassis heat dissipation module further comprises a limiting piece; the limiting parts are detachably arranged at two ends of the mounting frame; the limiting piece comprises a main body and a limiting block protruding outwards from the main body, the limiting block is arranged on the main body and protrudes outwards towards one side away from the mounting rack, and a first connecting hole is formed in the main body; and the two ends of the mounting frame are provided with second connecting holes.
Further, a handle is arranged at the top of the main body; the limiting block is arranged at the top of the main body; the second connecting hole is arranged at the bottom of the main body.
Further, an auxiliary connecting hole is formed in one end, provided with the through hole, of the mounting frame; the auxiliary connecting hole is arranged on one side of the through hole, and is matched with the I-shaped nail for the chassis.
Further, a third connecting hole is formed in the mounting frame; the fan is connected with the third connecting hole through a connecting nail.
Further, the mounting holes are multiple; the mounting holes are arranged at intervals along the length direction of the mounting frame.
Further, the connecting nails are shock absorption glue nails.
The utility model also aims at providing a case which comprises a case body, a main board, a radiator and a case radiating module; the shell comprises a first side wall and a second side wall which are arranged in parallel; the main board is arranged in the shell; one end of the radiator is arranged on the first side wall, and the other end of the radiator is arranged on the second side wall; the through hole of the case radiating module is sleeved on the pin of the first side wall, and the connecting piece of the case radiating module is detachably connected with the second side wall; the air outlet direction of the fan of the chassis heat dissipation module is the same as the air outlet direction of the radiator.
Further, the chassis heat dissipation module is disposed between the motherboard and the heat sink.
The beneficial effects are that:
the utility model provides a case heat radiation module, comprising: a mounting rack and a fan; the mounting frame is provided with a mounting hole, one side of the mounting frame is provided with a through hole matched with a pin on the chassis, and the other side of the mounting frame is provided with a connecting piece for connecting with the side wall of the chassis; the fan is detachably arranged in the mounting hole.
Specifically, when using, set up the fan in the mounting hole of mounting bracket, the one end of mounting bracket is established on the pin of quick-witted incasement through the through-hole cover and is met with the quick-witted case, accomplish after the other end of mounting bracket and the detachable connection of quick-witted case heat dissipation module and quick-witted case, the fan follows the mounting bracket setting in the quick-witted case, when each part of quick-witted incasement moves, the fan follows the radiator of quick-witted incasement and together moves, the produced wind direction of fan is the same with the produced wind direction of radiator, thereby strengthen the air flow speed of quick-witted incasement, and then promote the heat dispersion of quick-witted incasement, avoid appearing the incasement temperature accumulation, the phenomenon that the part of quick-witted incasement damaged because of the temperature exceeds standard.
The utility model also aims to provide a case, which comprises a case, a main board, a radiator and the case radiating module, wherein the case radiating module has the advantages compared with the prior art, and the description is omitted here.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a mounting frame of a chassis heat dissipation module according to an embodiment of the present utility model;
FIG. 2 is an enlarged view of FIG. 1 at A;
fig. 3 is a schematic structural diagram 1 of a chassis according to an embodiment of the present utility model;
FIG. 4 is an enlarged view of FIG. 3 at B;
fig. 5 is a schematic structural diagram 2 of a chassis according to an embodiment of the present utility model;
FIG. 6 is an enlarged view of FIG. 5 at C;
fig. 7 is a schematic structural diagram 3 of a chassis according to an embodiment of the present utility model.
Icon:
100-mounting rack;
110-mounting holes; 120-through holes;
130-a connector; 131-U-shaped holes;
200-fans;
300-limiting piece;
310-body; 320-limiting blocks; 330-handle
400-chassis;
410-a housing; 420-a main board; 430-pins; 440-i-pin.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model will now be described in further detail with reference to specific examples thereof in connection with the accompanying drawings.
As shown in fig. 1 to 3, the chassis heat dissipation module provided in this embodiment includes a mounting frame 100 and a fan 200; the mounting frame 100 is provided with a mounting hole 110, one end of the mounting frame 100 is provided with a through hole 120 matched with a pin 430 on the chassis 400, and the other end is provided with a connecting piece 130 used for connecting with the side wall of the chassis 400; the fan 200 is detachably disposed in the mounting hole 110.
In this embodiment, the fan 200 is disposed in the mounting hole 110 of the mounting bracket 100, one end of the mounting bracket 100 is sleeved on the pin 430 in the chassis 400 through the through hole 120 and is connected with the chassis 400, the other end of the mounting bracket 100 is detachably connected with the chassis 400 to complete the connection of the chassis heat dissipation module and the chassis 400, the fan 200 is disposed in the chassis 400 along with the mounting bracket 100, when each component in the chassis 400 runs, the fan 200 runs along with the radiator in the chassis 400, the wind direction generated by the fan 200 is the same as the wind direction generated by the radiator, thereby enhancing the air flow speed in the chassis 400, improving the heat dissipation capability of the chassis 400, avoiding the phenomenon that the temperature in the chassis 400 accumulates and the components in the chassis 400 are damaged due to the temperature exceeding standard.
The chassis heat dissipation module and the chassis 400 are connected through the pins 430 on the chassis 400, so the position of the chassis heat dissipation module can be adjusted according to different needs, and since various components such as the display card and the main board 420 are often arranged in the chassis 400, when a single component generates heat more obviously, the chassis heat dissipation module provided in this embodiment can be arranged beside the component with the most serious heat, so that the air outlet or air inlet of the fan 200 in the chassis heat dissipation module is opposite to the heating component, and when the chassis 400 is used, the chassis heat dissipation module can perform heat dissipation on the component with the serious heat.
In addition, specifically, when the chassis heat dissipation module is installed, the air outlet direction of the fan 200 should be the same as the air outlet direction of the radiator in the chassis 400, so that when the chassis 400 is running, the fan 200 can strengthen the wind speed and the wind quantity of the wind generated by the radiator, if the air outlet directions of the fan 200 and the radiator are opposite, the air outlet directions of the fan 200 and the radiator are very easy to cancel each other, the chassis 400 cannot be effectively dissipated, the heat accumulation in the chassis 400 is more serious, and the components in the chassis 400 are damaged due to excessive heat accumulation and overhigh temperature.
In the present embodiment, one end of the connection member 130 is rotatably connected to the mounting frame 100; the other end of the mounting frame 100 is provided with a U-shaped hole 131; the U-shaped hole 131 has a diameter matching the outer diameter of the case 400 with rivets.
Specifically, the end of connecting piece 130 is inserted and is equipped with the swivel hole, the downthehole pivot that sets up, connecting piece 130 can revolute the axle, the pivot sets up on mounting bracket 100, so that connecting piece 130 can rotate along the tie point of pivot and mounting bracket 100, the front end of connecting piece 130 sets up U-shaped hole 131, when installing mounting bracket 100 in quick-witted case 400, after connecting piece 400 is connected on the pin 430 of machine incasement 400 through the cover of through-hole 120 to one end of mounting bracket 100, the other end of mounting bracket 100 is put into machine case 400, make mounting hole 110 on the mounting bracket 100 and radiator's position relatively back, swivel connecting piece 130, make the U-shaped hole 131 of the front end of connecting piece 130 detain on the rivet on machine case 400, thereby make mounting bracket 100 in the position fixing of machine case 400, need not to set up connection structures such as screw, pin hole on machine case 400, avoid destroying the structure of machine case 400, after the equal installation of each lateral wall of machine case 400 is accomplished, connecting piece 130 detains and the top of connecting piece 130 is the lateral wall of machine case 400, this lateral wall covers connecting piece 130, make the connecting piece 130's top cover, make the mounting bracket 130 and the position of radiator upwards shake, thereby can's position change takes place at the machine case 400 when shaking, the connecting piece 130 is difficult to take place, and the place at the excessive position is rocked in machine case 100.
In this embodiment, the chassis heat dissipation module further includes a limiting member 300; the limiting pieces 300 are detachably arranged at two ends of the mounting frame 100; the limiting piece 300 comprises a main body 310 and a limiting block 320 protruding out of the main body 310, wherein the limiting block 320 is arranged on the main body 310 and protrudes outwards towards one side far away from the mounting frame 100, and a first connecting hole is formed in the main body 310; the mounting frame 100 is provided at both ends with second coupling holes.
The locating part 300 accessible joint, mode such as screw connection are connected with mounting bracket 100, specifically, in this embodiment, all be provided with the screw hole on locating part 300 and the mounting bracket 100, locating part 300 is connected through the mode that the screw was screwed with mounting bracket 100, stopper 320 sets up the side at locating part 300, after the connection, the lateral wall of stopper 320 evagination mounting bracket 100, because the edge of each lateral wall of quick-witted case 400 has the boss in order to set up the screw hole and be connected with other lateral walls, the top surface and the bottom surface looks butt of boss of stopper 320, the mounting bracket 100 can't take place fore-and-aft displacement with stopper 320 under the shelter from of boss, thereby realize the fore-and-aft spacing to mounting bracket 100, avoid mounting bracket 100 to rock from top to bottom in machine case 400.
As an embodiment, the mounting frame 100 and the limiting member 300 may be connected in an inserting manner, specifically, two sides of the mounting frame 100 may be provided with slots with notches facing upwards, the limiting member 300 is inserted into the slots, and the limiting member 320 is disposed at the top of the limiting member 300 and abuts against a boss on a side wall of the chassis 400, so as to realize connection between the mounting frame 100 and the limiting member 300, and realize longitudinal limiting of the mounting frame 100 of the limiting member 300.
In this embodiment, the top of the body 310 is provided with a handle 330; the limiting block 320 is disposed at the top of the main body 310; the second connection hole is provided at the bottom of the body 310.
Specifically, in this embodiment, the limiting member 300 is a plate-shaped limiting member 300, when the mounting frame 100 is mounted, since the connection part is located at the bottom of the main body 310, and the handle 330 is disposed at the top of the main body 310, when the handle 330 is pushed by hand, the main body 310 is slightly deformed, and the handle 330 can be pushed to the direction of the mounting frame 100 to deform the main body 310, so that the limiting member 300 moves towards the direction of the mounting frame 100, when the mounting frame 100 is completely placed in the chassis 400, the handle 330 is released to reset the main body 310, and the main body 310 is restored, so that the limiting member 320 is inserted to the bottom of the boss and is abutted against the bottom surface of the boss, and further limiting of the mounting frame 100 is realized.
In this embodiment, the end of the mounting frame 100 provided with the through hole 120 is further provided with an auxiliary connection hole; the auxiliary connection hole is disposed at one side of the through hole 120, and is adapted to the case 400 with the tee 440.
When the size of the components in the case 400 is smaller, the position of the mounting frame 100 can be adjusted, so that the fan 200 on the mounting frame 100 is closer to the heating component in the case 400 to radiate the heat of the heating component, when the pin 430 is not matched with the through hole 120 on the mounting position of the mounting frame 100, the auxiliary connecting hole can be matched and connected with the i-shaped nail 440 on the case 400, as shown in fig. 6, specifically, after the mounting frame 100 is placed and fixed in the case 400, the i-shaped nail 440 passes through the auxiliary connecting hole and is screwed, so that the mounting frame 100 is fixed in the case 400, thereby realizing the connection between the mounting frame 100 and the case 400.
In this embodiment, the mounting bracket 100 is provided with a third connection hole; the fan 200 is connected to the third connection hole by a connection pin.
After the fan 200 is inserted into the mounting hole 110, the fan 200 passes through the third connection hole through the connection pin provided on the fan 200 and is connected with the fan 200, so that the fan 200 is firmly arranged in the mounting hole 110, and the connection between the fan 200 and the mounting frame 100 is realized.
Wherein, the third connecting holes can be a plurality of, and a plurality of third connecting holes are enclosed beside the mounting hole 110, and each third connecting hole can be internally provided with a connecting nail to connect the fan 200, thereby enhancing the connection stability of the fan 200 and the mounting frame 100.
In the present embodiment, there are a plurality of mounting holes 110; the plurality of mounting holes 110 are spaced apart along the length of the mounting frame 100.
The plurality of mounting holes 110 are arranged at intervals along the length direction of the mounting frame 100, and the fan 200 can be mounted in the mounting hole 110 opposite to the position of the heating component according to the situation that the positions of the heating components in different chassis 400 are different, and the fan 200 can be omitted at the part without the heating phenomenon, so that the cost is saved, and the waste is avoided.
Specifically, in the present embodiment, four third connecting holes are disposed outside each mounting hole 110, and the four third connecting holes are uniformly disposed outside the mounting holes 110, and after the fan 200 is disposed in the mounting holes 110, four connecting nails are respectively connected with the fan 200 through the third connecting holes at four corners of the fan 200, so that the connection is very stable.
In this embodiment, the connecting nails are shock absorbing glue nails.
Fan 200 is connected with mounting bracket 100 through shock attenuation glue nail, glue the nail at the shock attenuation and be the rubber material, make shock attenuation glue nail itself have excellent elasticity, screw fan 200 back on mounting bracket 100, connect comparatively firm, and, when machine case 400 rocks, vibrations, because shock attenuation glue nail itself has certain elasticity, can great degree absorb vibrations, avoid fan 200 to take place to rock owing to receiving vibrations, lead to fan 200 to drop from mounting bracket 100 when machine case 400 outside receives vibrations and rocks, cause machine case cooling module unable use.
As shown in fig. 3 to 7, the chassis 400 provided in this embodiment includes a chassis 410, a motherboard 420, a radiator, and a chassis heat dissipation module provided; the casing 410 includes a first side wall and a second side wall disposed in parallel; the main board 420 is disposed in the housing 410; one end of the radiator is arranged on the first side wall, and the other end of the radiator is arranged on the second side wall; the through hole 120 of the case heat dissipation module is sleeved on the pin 430 of the first side wall, and the connecting piece 130 of the case heat dissipation module is detachably connected with the second side wall; the air outlet direction of the fan 200 of the chassis heat dissipation module is the same as the air outlet direction of the radiator.
The fan 200 of the case cooling module is arranged in the mounting hole 110 of the case cooling module, one end of the mounting frame 100 of the case cooling module is sleeved on the pin 430 in the case 400 through the through hole 120 and is connected with the case 400, the other end of the mounting frame 100 is detachably connected with the case 400, then the connection of the case cooling module and the case 400 is completed, the fan 200 is arranged in the case 400 along with the mounting frame 100, when all components in the case 400 run, the fan 200 runs along with the radiator in the case 400, and as the wind direction generated by the fan 200 is the same as the wind direction generated by the radiator, the flow speed and the wind quantity of the wind generated by the radiator can be further enhanced by the fan 200, so that the air flow speed in the case 400 is enhanced, the heat dissipation capacity of the case 400 is further improved, the phenomenon that the temperature in the case 400 is accumulated and the components in the case 400 are damaged due to the temperature exceeding standard is avoided.
In this embodiment, the chassis heat dissipation module is disposed between the motherboard 420 and the heat sink.
Because the main board 420 in the chassis 400 is often a part with serious heat generation, and the position of the radiator is a fixed position, the chassis heat dissipation module is arranged between the radiator and the main board 420, so that heat dissipation can be performed on the main board 420 in a short distance, and excellent heat dissipation can be realized on the main board 420.
In this embodiment, the chassis heat dissipation module should be as close to the heat generating components such as the motherboard 420 as possible because the sizes of the motherboard 420 in each chassis 400 may be different, and in this embodiment, the length of the components of the chassis 400 is shorter, as shown in fig. 3, when the heat dissipation is performed for the structure with the shorter length of the components in the chassis 400, the chassis heat dissipation module should be as close to the heat generating components in the chassis 400 as possible and far away from the heat sink.
In addition, as an embodiment, when radiating heat from a chassis 400 structure having a long component length in the chassis 400, as shown in fig. 5, the chassis radiating module may be provided adjacent to the radiator.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced with equivalents; such modifications and substitutions do not depart from the spirit of the technical solutions according to the embodiments of the present utility model.
Claims (9)
1. The utility model provides a quick-witted case heat dissipation module which characterized in that includes: a mounting frame (100) and a fan (200);
the mounting frame (100) is provided with a mounting hole (110), one end of the mounting frame (100) is provided with a through hole (120) matched with a pin on the chassis, and the other end of the mounting frame is provided with a connecting piece (130) used for being connected with the side wall of the chassis;
the fan (200) is detachably arranged in the mounting hole (110);
one end of the connecting piece (130) is rotatably connected with the mounting frame (100);
the other end of the mounting frame (100) is provided with a U-shaped hole (131);
the aperture of the U-shaped hole (131) is matched with the outer diameter of the case rivet.
2. The chassis heat dissipation module of claim 1, further comprising a stop (300);
the limiting pieces (300) are detachably arranged at two ends of the mounting frame (100);
the limiting piece (300) comprises a main body (310) and a limiting block (320) protruding outwards from the main body (310), the limiting block (320) is arranged on the main body (310) and protrudes outwards towards one side away from the mounting frame (100), and a first connecting hole is formed in the main body (310);
and second connecting holes are formed in two ends of the mounting frame (100).
3. The chassis heat dissipation module of claim 2, wherein a handle (330) is provided on top of the main body (310);
the limiting block (320) is arranged at the top of the main body (310);
the second connection hole is provided at the bottom of the main body (310).
4. The chassis heat dissipation module according to claim 1, wherein an auxiliary connection hole is further provided at one end of the mounting bracket (100) provided with the through hole (120);
the auxiliary connecting hole is arranged on one side of the through hole (120), and is matched with the I-shaped nail for the chassis.
5. The chassis heat dissipation module according to any one of claims 1-4, wherein the mounting bracket (100) is provided with a third connection hole;
the fan (200) is connected with the third connecting hole through a connecting nail.
6. The chassis heat dissipation module of claim 5, wherein the mounting holes (110) are plural;
the plurality of mounting holes (110) are arranged at intervals along the length direction of the mounting frame (100).
7. The chassis heat sink module of claim 6, wherein the connection pins are shock absorbing glue pins.
8. A chassis characterized by comprising a chassis (410), a motherboard (420), a radiator, and the chassis heat dissipation module of any one of claims 1-7;
the housing (410) includes a first side wall and a second side wall disposed in parallel;
the main board (420) is arranged in the shell (410);
one end of the radiator is arranged on the first side wall, and the other end of the radiator is arranged on the second side wall;
the through hole (120) of the case cooling module is sleeved on the pin (430) of the first side wall, and the connecting piece (130) of the case cooling module is detachably connected with the second side wall;
the air outlet direction of a fan (200) of the chassis heat dissipation module is the same as the air outlet direction of the radiator.
9. The chassis of claim 8, wherein the chassis heat dissipation module is disposed between the motherboard (420) and the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320174851.2U CN219958133U (en) | 2023-02-09 | 2023-02-09 | Cabinet heat radiation module and cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320174851.2U CN219958133U (en) | 2023-02-09 | 2023-02-09 | Cabinet heat radiation module and cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219958133U true CN219958133U (en) | 2023-11-03 |
Family
ID=88548135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320174851.2U Active CN219958133U (en) | 2023-02-09 | 2023-02-09 | Cabinet heat radiation module and cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219958133U (en) |
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2023
- 2023-02-09 CN CN202320174851.2U patent/CN219958133U/en active Active
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