CN219892170U

CN219892170U - Module

Info

Publication number: CN219892170U
Application number: CN202190000688.7U
Authority: CN
Inventors: 林翔太; 小川伸明; 浅野裕希; 上嶋孝纪; 北嶋宏通; 江口贵宏; 花冈邦俊
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2020-08-13
Filing date: 2021-07-27
Publication date: 2023-10-24
Anticipated expiration: 2031-07-27

Abstract

The present utility model relates to modules. The substrate has an upper main surface and a lower main surface arranged in the vertical direction. The metal member includes a plate-like portion provided on an upper main surface of the substrate and having a front main surface and a rear main surface aligned in a front-rear direction when viewed in the up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield member is provided on an upper surface of the sealing resin layer so as to be connected to an upper end of the plate-like portion. The plate-like portion is inclined with respect to the up-down direction such that an upper end of the plate-like portion is positioned forward of a lower end of the plate-like portion.

Description

Module

Technical Field

The present utility model relates to a module including a substrate on which electronic components are mounted.

Background

As an utility model related to a conventional module, for example, a high-frequency module described in patent document 1 is known. The high-frequency module includes a substrate, a surface-mounted element, a metal wall, a resin molded portion, and a metal thin film. The surface mounting element is mounted on the upper surface of the substrate. The metal wall extends upward from the upper surface of the substrate. The resin mold seals the metal wall and the surface mount element. The metal film covers an upper surface of the resin mold. The metal film is connected with the upper end of the metal wall. In such a high-frequency module, after the resin molded portion is formed, the upper surface of the resin molded portion is polished. Thereby, the upper end of the metal wall is exposed at the upper surface of the resin mold. Then, a metal thin film is formed on the upper surface of the resin molded portion by a thin film forming method. Whereby the metal film is connected to the upper end of the metal wall.

Patent document 1: japanese patent laid-open No. 2007-294965

However, in a module such as the high-frequency module described in patent document 1, there is a desire to more reliably connect the metal thin film and the upper end of the metal wall.

Disclosure of Invention

It is therefore an object of the present utility model to provide a module capable of connecting a metal member and a shield more reliably.

A module according to an embodiment of the present utility model includes: a substrate having an upper main surface and a lower main surface arranged in the vertical direction; a metal member including a plate-like portion provided on the upper main surface of the substrate and having a front main surface and a rear main surface arranged in a front-rear direction when viewed in a vertical direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed rearward of the metal member; a sealing resin layer provided on the upper main surface of the substrate, covering the metal member, the first electronic component, and the second electronic component, and having an upper surface; and a shield provided on the upper surface of the sealing resin layer so as to be connected to an upper end of the plate-like portion, wherein the plate-like portion is inclined with respect to the vertical direction so that the upper end of the plate-like portion is located rearward of a lower end of the plate-like portion, or the plate-like portion is inclined with respect to the vertical direction so that the upper end of the plate-like portion is located forward of the lower end of the plate-like portion.

The module according to the utility model enables a more reliable connection of the metal component and the shield.

Drawings

Fig. 1 is a perspective view of a module 10.

Fig. 2 is a top view of module 10.

Fig. 3 is a cross-sectional view of module 10 at A-A.

Fig. 4 is a cross-sectional view of module 10 at B-B.

Fig. 5 is a perspective view of the metal member 14.

Fig. 6 is a cross-sectional view of the leg portions 146a to 146 g.

Fig. 7 is a perspective view of the metal member 14 at the time of installation.

Fig. 8 is a cross-sectional view of the module 10 at the time of manufacture.

Fig. 9 is a cross-sectional view of the module 10 at the time of manufacture.

Fig. 10 is a photograph of the upper surface SU1 of the sealing resin layer 18 after grinding of the sealing resin layer 18.

Fig. 11 is a rear view of the metal member 14a according to the first modification.

Fig. 12 is a rear view of a metal member 14b according to a second modification.

Fig. 13 is a rear view of a metal member 14c according to a third modification.

Fig. 14 is a rear view of a metal member 14d according to a fourth modification.

Fig. 15 is a rear view of a metal member 14e according to a fifth modification.

Fig. 16 is a rear view of a metal member 14f according to a sixth modification.

Fig. 17 is a rear view of a metal member 14g according to a seventh modification.

Fig. 18 is a rear view of a metal member 14h according to an eighth modification.

Fig. 19 is a rear view of a metal member 14i according to a ninth modification.

Fig. 20 is a cross-sectional view of leg portions 146a to 146g of a metal member 14j according to a tenth modification.

Fig. 21 is a cross-sectional view of leg portions 146a to 146g of a metal member 14k according to an eleventh modification.

Fig. 22 is a cross-sectional view of the top surface 148 of the metal member 14l according to the twelfth modification in the center in the lateral direction.

Fig. 23 is a plan view of a metal member 14l according to a twelfth modification.

Fig. 24 is a plan view of the mounting electrode 122 a.

Fig. 25 is a plan view of the mounting electrode 122 b.

Fig. 26 is a rear view of the metal member 14m and the mounting electrode 122 a.

Fig. 27 is an external perspective view of the module 100.

Fig. 28 is a cross-sectional view at A-A of module 100.

Fig. 29 is a view of the metal member 14 connected to the ground conductor layer G2 via the mounting electrode 122 in the module 100.

Fig. 30 is a cross-sectional view at A-A of module 10 a.

Fig. 31 is a cross-sectional view at A-A of module 10 b.

Fig. 32 is a cross-sectional view at A-A of module 10 c.

Fig. 33 is a perspective view of the metal member 14 n.

Fig. 34 is a top view of the metal member 14.

Detailed Description

(embodiment)

[ Module Structure ]

The structure of the module 10 according to one embodiment of the present utility model will be described below with reference to the drawings. Fig. 1 is a perspective view of a module 10. In fig. 1, the interior of the module 10 is seen through. Fig. 2 is a top view of module 10. In fig. 2, the interior of the module 10 is seen through. Fig. 3 is a cross-sectional view of module 10 at A-A. Fig. 4 is a cross-sectional view of module 10 at B-B. Fig. 5 is a perspective view of the metal member 14. Fig. 6 is a cross-sectional view of the leg portions 146a to 146 g.

The direction of the module 10 will be described below. As shown in fig. 1, the base plate 12 of the module 10 has a plate shape. Therefore, the direction in which the upper main surface SU2 and the lower main surface SD2 of the substrate 12 are aligned is defined as the up-down direction. The direction in which the front main surface SF3 and the rear main surface SB3 of the plate-like portion 140 of the metal member 14 are aligned when viewed in the up-down direction is defined as the front-back direction. The direction orthogonal to the front-rear direction and the up-down direction is defined as the left-right direction. The vertical direction, the horizontal direction, and the front-rear direction are orthogonal to each other. However, the up-down direction, the left-right direction, and the front-rear direction may not coincide with the up-down direction, the left-right direction, and the front-rear direction in actual use of the module 10. In each of the drawings, the upper direction and the lower direction may be interchanged, the left direction and the right direction may be interchanged, and the front direction and the rear direction may be interchanged.

Hereinafter, definitions of terms in the present specification will be described. First, the positional relationship of the members in this specification is defined. X-Z are members or components that make up the module 10. In the present specification, X and Y aligned in the front-rear direction represent the following states. When X and Y are viewed in a direction perpendicular to the front-rear direction, both X and Y are arranged on an arbitrary straight line indicating the front-rear direction. In the present specification, X and Y aligned in the front-rear direction when viewed in the up-down direction represent the following states. When X and Y are viewed in the up-down direction, both X and Y are arranged on an arbitrary straight line indicating the front-back direction. In this case, when X and Y are viewed from a left-right direction different from the up-down direction, either one of X and Y may not be arranged on any straight line indicating the front-back direction. In addition, X and Y may be in contact. X and Y may also be separated. Z may also be present between X and Y. The definition also applies to directions other than the front-rear direction.

In the present specification, the following state is defined before X is arranged in Y. At least a part of X is disposed in a region through which Y passes when it moves in parallel in the forward direction. Therefore, X may fall within or protrude from the region through which Y moves in parallel in the forward direction. In this case, X and Y are aligned in the front-rear direction. The definition also applies to directions other than the front-rear direction.

In the present specification, X is arranged before Y when viewed in the left-right direction and means the following state. X and Y are arranged in the front-rear direction when viewed in the left-right direction, and a portion of X facing Y is arranged before Y when viewed in the left-right direction. In this definition, X and Y may not be aligned in the front-rear direction in three dimensions. The definition also applies to directions other than the front-rear direction.

In the present specification, the arrangement of X in front of Y means the following state. X is disposed in front of a plane passing through the front end of Y and orthogonal to the front-rear direction. In this case, X and Y may be arranged in the front-rear direction or may not be arranged. The definition also applies to directions other than the front-rear direction.

In the present specification, unless otherwise specified, each part of X is defined as follows. The front of X refers to the front half of X. The rear of X refers to the rear half of X. The left part of X refers to the left half of X. The right part of X refers to the right half of X. The upper part of X refers to the upper half of X. The lower part of X refers to the lower half of X. The front end of X means the front-direction end of X. The rear end of X means the end in the rear direction of X. The left end of X refers to the end of X in the left direction. The right end of X refers to the end of X in the right direction. The upper end of X means the end in the upward direction of X. The lower end of X means the end in the lower direction of X. The front end of X means the front end of X and its vicinity. The rear end of X means the rear end of X and its vicinity. The left end of X means the left end of X and its vicinity. The right end of X means the right end of X and its vicinity. The upper end of X means the upper end of X and its vicinity. The lower end of X means the lower end of X and its vicinity.

When any two members in the present specification are defined as X and Y, the relationship between any two members is as follows. In the present specification, the case where X is supported by Y includes the case where X is immovably attached (i.e., fixed) to Y and the case where X is immovably attached to Y. Further, the case where X is supported by Y includes both the case where X is directly attached to Y and the case where X is attached to Y via Z.

In the present specification, "X and Y are electrically connected" means that electrical conduction is performed between X and Y. Thus, X and Y may or may not be in contact. When X and Y are not in contact with each other, Z having conductivity is arranged between X and Y.

The module 10 is, for example, a high frequency module. The high frequency module is for example an analog front end module of a portable radio communication device. However, the module 10 is not limited to a high frequency module. As shown in fig. 1 to 4, the module 10 includes a substrate 12, a metal member 14, electronic components 16a to 16c, a sealing resin layer 18, and a shield 20.

The substrate 12 is, for example, a multilayer wiring substrate having a structure in which a plurality of insulator layers made of low-temperature co-fired ceramic, high-temperature co-fired ceramic, glass epoxy or the like are laminated. The substrate 12 has a plate shape. Therefore, the substrate 12 has an upper main surface SU2, a lower main surface SD2, a left surface SL2, a right surface SR2, a front surface SF2, and a rear surface SB2. The substrate 12 has a rectangular shape when viewed in the up-down direction. The circuit is provided on the upper main surface SU2, the lower main surface SD2, and the inside of the substrate 12 via the conductor layers. In the present embodiment, as shown in fig. 3 and 4, the substrate 12 includes a ground conductor layer G. The ground conductor layer G is provided inside the substrate 12. The ground potential is connected to the ground conductor layer G.

The metal member 14 is provided on the upper main surface SU2 of the substrate 12. The metal member 14 has a structure obtained by bending one metal plate. The metal member 14 is made of, for example, annealed copper. Further, brass, phosphor bronze, SUS, aluminum, or the like may be used instead of the tough pitch copper. The thickness of the metal member 14 is, for example, 50 μm. As shown in fig. 4 and 5, the metal member 14 includes a plate-like portion 140 and leg portions 146a to 146g. The plate-like portion 140 has a plate shape. The plate-like portion 140 has a front main surface SF3 and a rear main surface SB3. The front main surface SF3 and the rear main surface SB3 are aligned in the front-rear direction when viewed in the up-down direction. The plate 140 is provided on the upper main surface SU2 of the substrate 12. The plate 140 extends upward from the upper main surface SU2 of the substrate 12. However, as shown in fig. 3, the plate-like portion 140 is slightly inclined forward with respect to the up-down direction. Specifically, the plate-like portion 140 is inclined with respect to the up-down direction such that the upper end PU of the plate-like portion 140 is positioned forward of the lower end PD of the plate-like portion 140. Thus, the normal vector of the front main surface SF3 of the plate 140 has a component in a slightly downward direction. The normal vector of the rear main surface SB3 of the plate-like portion 140 has a component in a slightly upward direction.

The plate-like portion 140 has a rectangular shape when viewed in the front-rear direction. However, upper cutouts 142a, 142b and lower cutouts 144a to 144f are provided in the plate-like portion 140. Therefore, strictly speaking, the plate-like portion 140 has a shape different from the rectangular shape when viewed in the front-rear direction. Therefore, as shown in fig. 4, a line connecting the upper ends PU of the plate-like portions 140 in the left-right direction as viewed in the front-rear direction is defined as an upper edge LU. A line connecting the lower ends PD of the plate-like portions 140 in the left-right direction as viewed in the front-rear direction is defined as a lower side LD. The upper side LU is located farther from the substrate 12 than the lower side LD. In the present specification, the notch means a depression formed in the outer edge of the plate-like portion 140 by a part of the plate-like portion 140 being defective. The slit in the present specification includes, for example, a U-shaped defect extending from a side of a rectangular plate in a direction perpendicular to the side, and an L-shaped defect formed by removing corners of the rectangular plate. The notch may be a U-shaped defect with an angular edge.

The upper cutouts 142a, 142b extend in a downward direction from the upper edge LU. The upper cutouts 142a, 142b have a U-shape when viewed in the front-rear direction. That is, the upper cutouts 142a, 142b have a shape in which a rectangle having upper, lower, left and right sides and a semicircle protruding downward from the lower side of the rectangle are combined. The lower ends of the upper cutouts 142a, 142b are located above the center of the plate-like portion 140 in the up-down direction when viewed in the front-rear direction. The upper cutout 142a is located on the left side of the upper cutout 142 b. The length of the upper cutouts 142a, 142b in the up-down direction is, for example, half or less of the length of the plate-like portion 140 in the up-down direction. The width of the upper slits 142a, 142b in the lateral direction is 150 μm, for example.

The lower cutouts 144a to 144f extend upward from the lower side LD. The lower cutouts 144a to 144f have a U-shape upside down when viewed in the front-rear direction. That is, the lower cutouts 144a to 144f have a shape formed by combining a rectangle and a semicircle protruding upward from the upper side of the rectangle. The upper ends of the lower cutouts 144a to 144f are located below the center of the plate-like portion 140 in the up-down direction when viewed in the front-rear direction. The lower cutouts 144 a-144 f are aligned in sequence from left to right. The lower cutouts 144a to 144f are arranged at equal intervals in the left-right direction when viewed in the front-rear direction. The length of the lower cutouts 144a to 144f in the up-down direction is, for example, half or less of the length of the plate-like portion 140 in the up-down direction. The width of the lower incisions 144a to 144f in the lateral direction is 150 μm, for example.

Here, the positional relationship between the upper cutouts 142a, 142b and the lower cutouts 144a to 144f will be described. The upper cutouts 142a, 142b are offset from the lower cutouts 144a to 144f in the left-right direction when viewed in the up-down direction. The upper cutout 142a is located between the lower cutout 144b and the lower cutout 144c in the left-right direction as viewed in the up-down direction. The upper notch 142b is located between the lower notch 144d and the lower notch 144e in the left-right direction as viewed in the up-down direction. This suppresses the upper cuts 142a and 142b from approaching the lower cuts 144a to 144f too much. The shortest distance between the upper slits 142a, 142b and the lower slits 144a to 144f is 1.5 times or more the plate thickness of the plate-like portion 140 in the drawing. The shortest distance between the upper slits 142a, 142b and the lower slits 144a to 144f is more preferably 2 times or more the plate thickness of the plate-like portion 140.

All the leg portions 146a to 146g extend in the rear direction from the lower side LD. Accordingly, all of the leg portions 146a to 146g extend in the same direction with respect to the plate-like portion 140. As shown in fig. 6, the leg portions 146a to 146g are formed by bending a part of the metal member 14 in the rear direction. Therefore, as shown in fig. 3 and 6, the metal member 14 has an L-shape when viewed in the left-right direction. Here, the boundaries between the leg portions 146a to 146g and the plate-like portion 140 will be described. As shown in fig. 6, the plate-like portion 140 is a portion located before the virtual plane Sa including the rear main surface SB3 of the plate-like portion 140. On the other hand, the leg portions 146a to 146g are portions located behind the virtual plane Sa including the rear main surface SB3 of the plate-like portion 140. Accordingly, the leg portions 146a to 146g extend in the rear direction from the lower end portion of the plate-like portion 140.

The legs 146a to 146g are fixed to the upper main surface SU2 of the substrate 12. In more detail, as shown in fig. 5, the substrate 12 includes a mounting electrode 122. The mounting electrode 122 is a part of the upper main surface SU2 of the substrate 12. The mounting electrode 122 has a rectangular shape having long sides extending in the left-right direction when viewed in the up-down direction. Thus, the mounting electrode 122 is one electrode. The mounting electrode 122 is electrically connected to the ground conductor layer G. Accordingly, the mounting electrode 122 is connected to the ground potential. The leg portions 146a to 146g are fixed to the mounting electrode 122 by solders 200a to 200 g. Thereby, the metal member 14 is connected to the ground potential. The legs 146a to 146g and the mounting electrode 122 may be directly connected to each other without being in contact with each other via the solders 200a to 200g, or the legs 146a to 146g may be directly connected to the upper surface SU 1.

Next, with reference to fig. 6, the attachment of the leg portions 146a to 146g to the attachment electrode 122 will be described. As shown in fig. 3, the plate-like portion 140 is slightly inclined forward with respect to the up-down direction. Thus, the upper end PU of the plate-like portion 140 is located forward of the lower end PD of the plate-like portion 140. The inclination angle of the plate-like portion 140 with respect to the vertical direction is, for example, greater than 0 ° and 15 ° or less. Accordingly, all of the legs 146a to 146g extend from the lower edge LD in the rearward direction and are inclined with respect to the forward-rearward direction such that the rear ends of the legs 146a to 146g are positioned above the front ends of the legs 146a to 146 g. That is, as shown in fig. 6, the leg portions 146a to 146g extend in the upward and rearward direction from the lower end portion of the plate-like portion 140. Accordingly, the interval between the lower surfaces Sx of the legs 146a to 146g and the upper surface Sy of the mounting electrode 122 in the up-down direction increases with the forward direction. Solder 200a to 200g is provided between the lower surface Sx of the leg portions 146a to 146g and the upper surface Sy of the mounting electrode 122, respectively. As described above, the interval between the lower surfaces Sx of the legs 146a to 146g and the upper surface Sy of the mounting electrode 122 in the vertical direction increases with the backward direction, and thus the gap generated in the solders 200a to 200g is easily released from the solders 200a to 200g in the backward direction.

The leg portions 146a to 146g are formed by bending a part of the metal member 14. An inner surface of a portion of the metal member 14 bent into a circular arc shape is defined as an inner surface SI. The outer surface of the portion of the metal member 14 bent into the circular arc shape is defined as an outer surface SO. The inner surface SI and the outer surface SO have circular arc shapes when viewed in the left-right direction. However, the radius of curvature of the outer surface SO is larger than the radius of curvature of the inner surface SI. Thus, tensile stress is generated at the outer surface SO. Compressive stresses are generated at the inner surface SI.

The interval between the outer surface SO of the plate-like portion 140 and the upper surface Sy of the mounting electrode 122 becomes larger as going forward. Thus, the voids generated in the solders 200a to 200g are easily released from the solders 200a to 200g in the forward direction.

The metal member 14 is a member obtained by punching and bending a rolled metal plate. The rolling direction of the metal member 14 is the left-right direction. Therefore, a plurality of ribs (streaks) extending in the left-right direction, not shown, are formed on the surface of the metal member 14. Therefore, minute irregularities are formed on the surface of the metal member 14. When the leg portions 146a to 146g are formed by bending a part of the metal member 14, a plurality of ribs formed on the outer surface SO of the metal member 14 extend in the width direction of the ribs. Accordingly, the depth of the plurality of ribs formed on the outer surface SO of the metal member 14 becomes shallow. As a result, the surface roughness of the outer surface SO of the metal member 14 becomes smaller than that of the portion other than the outer surface SO in the plate-like portion 140. Thus, the solders 200a to 200g are easily wetted in the upward direction on the outer surface SO. In the present embodiment, the solders 200a to 200g are wetted to the vicinity of the upper end of the outer surface SO with respect to the solders 200a to 200 g. In addition, an oxide film may be formed on the surface of the metal member 14. In this case, the oxide film formed on the outer surface SO is broken due to the bending of the metal member 14. Thus, the tough pitch copper, brass, phosphor bronze, SUS, aluminum, etc., are exposed to the outer surface SO. The wettability of the solders 200a to 200g with respect to tough pitch copper, brass, phosphor bronze, SUS, aluminum, etc. is higher than the wettability of the solders 200a to 200g with respect to the oxide film. Thus, the solders 200a to 200g are further wetted on the outer surface SO. This suppresses the metal member 14 from falling down in the forward direction or the backward direction.

As shown in fig. 6, the rear end portions PB of the leg portions 146a to 146g have a shape in which the upper and lower ends protrude rearward from the center. Thus, the solders 200a to 200g are less likely to wet at the rear end portions PB of the leg portions 146a to 146 g.

Here, the positional relationship between the leg portions 146a to 146g and the lower cutouts 144a to 144f will be described. As shown in fig. 5, the leg 146a, the lower cutout 144a, the leg 146b, the lower cutout 144b, the leg 146c, the lower cutout 144c, the leg 146d, the lower cutout 144d, the leg 146e, the lower cutout 144e, the leg 146f, the lower cutout 144f, and the leg 146g are arranged in this order from left to right as viewed in the front-rear direction. The lower incisions 144 a-144 f have the same shape. Therefore, the leg portions 146a to 146g are arranged at equal intervals in the left-right direction when viewed in the front-rear direction. The legs 146 a-146 g have the same shape. Therefore, the lower cutouts 144a to 144f are arranged at equal intervals in the left-right direction when viewed in the front-rear direction.

The outer edges of the leg portions 146a to 146g are connected to the outer edges of the lower cutouts 144a to 144 f. Therefore, the lower cutouts 144a to 144f are located on at least one of the left and right sides of the leg portions 146a to 146 g. Accordingly, the leg portions 146a to 146g include leg portions 146b to 146f (first leg portions) located between the lower cutouts 144a to 144f in the left-right direction as viewed in the front-rear direction. The lower cutouts 144 a-144 f are located on the left and right sides of the legs 146 b-146 f. The leg portions 146a to 146g include a leg portion 146a (second leg portion) disposed at the left end portion of the lower side LD when viewed in the front-rear direction. The lower cutout 144a is located on the right side of the foot 146 a. The leg portions 146a to 146g include a leg portion 146g (second leg portion) disposed at the right end portion of the lower side LD when viewed in the front-rear direction. The lower cutout 144f is located to the left of the foot 146 g.

As shown in fig. 1 and 3, an electronic component 16a (first electronic component) is mounted on the upper main surface SU2 of the substrate 12. The mounting method of the electronic component 16a is, for example, mounting using solder. The electronic component 16a is a chip component such as a semiconductor element such as an IC or PA (power amplifier), a chip inductor, a chip capacitor, or a chip resistor. As shown in fig. 2, the electronic component 16a is disposed in front of the metal member 14. In the present embodiment, the electronic component 16a is disposed before the metal member 14. Therefore, the electronic component 16a overlaps the metal member 14 as viewed in the front-rear direction. The left end of the electronic component 16a is located to the right of the left end of the metal member 14. The right end of the electronic component 16a is located to the left of the right end of the metal member 14. The upper end of the electronic component 16a is located below the upper end of the metal member 14.

The electronic components 16b and 16c (second electronic components) are mounted on the upper main surface SU2 of the substrate 12. The mounting method of the electronic components 16b, 16c is, for example, mounting using solder. The electronic components 16b and 16c are chip components such as semiconductor elements such as ICs and PA (power amplifier), chip inductors, chip capacitors, and chip resistors. As shown in fig. 2, the electronic components 16b and 16c are disposed rearward of the metal member 14. In the present embodiment, the electronic components 16b and 16c are disposed behind the metal member 14. Therefore, the electronic components 16b, 16c overlap the metal member 14 when viewed in the front-rear direction. The left end of the electronic component 16b and the left end of the electronic component 16c are located rightward from the left end of the metal member 14. The right end of the electronic component 16b and the right end of the electronic component 16c are located to the left of the right end of the metal member 14. The upper end of the electronic component 16a is located below the upper end of the metal member 14.

As shown in fig. 1 and 3, the sealing resin layer 18 is provided on the upper main surface SU2 of the substrate 12. The sealing resin layer 18 covers the metal member 14 and the electronic components 16a to 16c. Thereby, the sealing resin layer 18 protects the metal member 14 and the electronic components 16a to 16c. The material of the sealing resin layer 18 is, for example, epoxy resin. The sealing resin layer 18 has a rectangular parallelepiped shape. Accordingly, the sealing resin layer 18 has an upper surface SU1, a lower surface SD1, a left surface SL1, a right surface SR1, a front surface SF1, and a rear surface SB1. The left end of the plate 140 is located on the left surface SL1 of the sealing resin layer 18. In the present embodiment, the left end of the plate-like portion 140 is exposed from the sealing resin layer 18 at the left surface SL1 of the sealing resin layer 18. The right end of the plate-like portion 140 is located on the right surface SR1 of the sealing resin layer 18. In the present embodiment, the right end of the plate-like portion 140 is exposed from the sealing resin layer 18 at the right surface SR1 of the sealing resin layer 18. The upper end PU of the plate-like portion 140 is located on the upper surface SU1 of the sealing resin layer 18. In the present embodiment, the upper end PU of the plate-like portion 140 is exposed from the sealing resin layer 18 on the upper surface SU1 of the sealing resin layer 18.

The shield 20 is provided on the upper surface SU1 of the sealing resin layer 18 so as to be connected to the upper end PU of the plate-like portion 140. In the present embodiment, the shield 20 covers the upper surface SU1, the left surface SL1, the right surface SR1, the front surface SF1, and the rear surface SB1 of the sealing resin layer 18, and the left surface SL2, the right surface SR2, the front surface SF2, and the rear surface SB2 of the substrate 12. In addition, the shield 20 is in contact with a portion of the plate-like portion 140 exposed from the sealing resin layer 18. The shield 20 is connected to the ground conductor layer G exposed from the rear surface SB2 of the substrate 12. Thereby, the shield 20 is connected to the ground potential. The shield 20 has a multi-layer construction. Specifically, the shield 20 includes an adhesion layer, a conductive layer, and a protective layer. The adhesion layer, the conductive layer and the protective layer are laminated in this order from the lower layer to the upper layer. The adhesive layer serves to improve the adhesive strength between the conductive layer and the sealing resin layer 18. The material of the adhesion layer is, for example, SUS (station Less Steel: stainless Steel). The conductive layer serves as a shield. The material of the conductive layer is, for example, a metal such as Cu, ag, al, or the like. The protective layer serves to prevent corrosion of the conductive layer. The material of the protective layer is, for example, SUS.

[ method of manufacturing Module ]

Next, a method of manufacturing the module 10 will be described with reference to the drawings. Fig. 7 is a perspective view of the metal member 14 at the time of installation. Fig. 8 and 9 are cross-sectional views of the module 10 during manufacture. Fig. 10 is a photograph of the upper surface SU1 of the sealing resin layer 18 after grinding of the sealing resin layer 18.

First, the electronic components 16a to 16c are mounted on the upper main surface SU2 of the substrate 12. Further, as shown in fig. 7, the metal member 14 is mounted on the substrate 12. Here, the metal member 14 at the time of manufacturing the module 10 will be described. The metal member 14 also has a top surface portion 148. The top surface portion 148 is located between the upper cutout 142a and the upper cutout 142b when viewed in the front-rear direction. The top surface portion 148 extends in the rear direction from the upper edge LU (see fig. 4). The top surface portion 148 is formed by bending a part of the metal member 14 in the rear direction. Top surface portion 148 is for mounting of metal component 14. Specifically, the top surface 148 is suctioned by a mounter. Then, the mounting machine moves the metal member 14, and the leg portions 146a to 146g are provided on the mounting electrode 122. Then, each of the leg portions 146a to 146g is fixed to the mounting electrode 122 by the solders 200a to 200 g. At this time, solder is applied to each of the leg portions 146a to 146g, and solder is also applied to the mounting electrode 122. In order to stabilize the ground potential, the solders 200a to 200g applied to the adjacent legs 146a to 146g may be integrated. In fig. 4, the solders 200a to 200g applied to the leg portions 146a to 146g are integrated. Thus, the legs 146a to 146g are fixed to the mounting electrode 122 as one electrode by the integrated solder.

Next, as shown in fig. 8, a sealing resin layer 18 is formed on the upper main surface SU2 of the substrate 12. At this time, the sealing resin layer 18 is formed such that the sealing resin layer 18 covers the entire upper main surface SU2 of the substrate 12. Specifically, the substrate 12 is disposed in a mold. Then, the molten resin (molten resin) is injected into the mold. At this time, the molten resin spreads over the entire upper main surface SU2 of the substrate 12 through the upper cutouts 142a, 142b and the lower cutouts 144a to 144 f. Then, the electronic components 16a to 16c and the metal member 14 are located in the sealing resin layer 18. That is, the electronic components 16a to 16c and the metal member 14 are not exposed from the sealing resin layer 18.

Next, the upper main surface SU of the sealing resin layer 18 is ground with a grinding tool. The grinding tool grinds the upper surface SU1 of the sealing resin layer 18 while moving in the rear direction with respect to the upper surface SU1 of the sealing resin layer 18, for example. Thus, the upper end of the plate-like portion 140 is exposed from the upper surface SU1 of the sealing resin layer 18. In grinding the upper surface SU1 of the sealing resin layer 18, the top surface portion 148 of the metal member 14 is ground. At this time, as shown in fig. 10, a protruding portion 160 is formed at the upper end PU of the plate-like portion 140. Specifically, the grinding tool is moved in the backward direction with respect to the sealing resin layer 18, and the sealing resin layer 18 is ground. Thereby, the protruding portion 160 extends in the rear direction from the upper end PU of the plate-like portion 140. The thickness of the protruding portion 160 is much smaller than the thickness of the plate-like portion 140. In addition, the upper end PU of the metal member 14 is cut by a grinding tool. Therefore, the surface roughness of the upper end PU of the plate-like portion 140 is larger than the surface roughness of the front main surface SF3 and the rear main surface SB3 of the plate-like portion 140.

Further, the substrate 12 and the sealing resin layer 18 are divided by cutting the substrate 12 and the sealing resin layer 18 in the up-down direction using a cutter. At this time, the left surface SL1, the right surface SR1, the front surface SF1, and the rear surface SB1 of the sealing resin layer 18 are formed. The left and right ends of the plate-like portion 140 are exposed from the left and right surfaces SL1 and SR1 of the sealing resin layer 18. The surface roughness of the left and right ends of the plate-like portion 140 is larger than the surface roughness of the front main surface SF3 and the rear main surface SB3 of the plate-like portion 140. In addition, protruding portions are formed at the left and right ends of the plate-like portion 140 in the same manner as the upper end of the plate-like portion 140.

Next, the shield 20 is formed on the upper surface SU1, the left surface SL1, the right surface SR1, the front surface SF1, and the rear surface SB1 of the sealing resin layer 18. Specifically, sputtering was performed three times to form an adhesion layer, a conductive layer, and a protective layer. As described above, the surface roughness of the upper, left, and right ends of the metal member 14 becomes larger than the surface roughness of the front main surface SF3 and the rear main surface SB3 of the plate-like portion 140. Therefore, the adhesion layer is adhered to the upper end, the left end, and the right end of the metal member 14 with high adhesion strength. Through the above steps, the module 10 is completed.

[ Effect ]

In the module 10, the metal member 14 and the shield 20 can be connected more reliably. Hereinafter, a module in which the plate-like portion is not inclined with respect to the vertical direction is defined as a module according to the comparative example. In the module according to the comparative example, the upper surface of the sealing resin layer was polished. After polishing of the sealing resin layer, the upper end of the plate-like portion is a plane orthogonal to the front main surface and the rear main surface of the plate-like portion.

On the other hand, the plate-like portion 140 is inclined with respect to the up-down direction such that the upper end PU of the plate-like portion 140 is positioned forward of the lower end PD of the plate-like portion 140. In the module 10, the upper surface SU1 of the sealing resin layer 18 is ground. After polishing of the sealing resin layer 18, the upper end PU of the plate-like portion 140 is a plane forming an acute angle with respect to the front main surface SF3 of the plate-like portion 140 and an obtuse angle with respect to the rear main surface SB 3. Therefore, the area of the upper end PU of the plate-like portion 140 of the module 10 becomes larger than that of the plate-like portion of the module according to the comparative example. As a result, in the module 10, the upper end PU of the plate-like portion 140 is in close contact with the shield 20. As described above, in the module 10, the metal member 14 and the shield 20 can be connected more reliably.

According to the module 10, it is easy to appropriately arrange the electronic components 16a to 16c according to the characteristics of the electronic components 16a to 16 c. More specifically, the electronic components 16a to 16c may generate magnetic fluxes like coils, for example. When the electronic components 16a to 16c generate magnetic fluxes, there are the following two cases. The first case is a case where magnetic flux generated by the electronic component is shielded in order to suppress the influence of the magnetic flux on the surrounding electronic component. The electronic components corresponding to the first case are, for example, SAW (Surface Acoustic Wave: surface acoustic wave) filters, LNA (Low Noise Amplifier: low noise amplifier), switches, and the like. The second case is a case where the magnetic flux generated by the electronic component is not shielded so that the characteristics of the electronic component are not deteriorated. The electronic component corresponding to the second case is, for example, a chip inductor. Accordingly, in the module 10, the plate-like portion 140 is slightly inclined forward with respect to the up-down direction. Accordingly, the plate-like portion 140 falls down in a direction approaching the electronic component 16 a. Thus, when the electronic component 16a generates magnetic flux, the magnetic flux is easily shielded by the plate-like portion 140. On the other hand, the plate-like portion 140 falls in a direction away from the electronic components 16b, 16 c. Thus, when the electronic components 16b and 16c generate magnetic fluxes, the magnetic fluxes are not easily shielded by the plate-like portion 140. In this way, according to the module 10, the electronic component corresponding to the first case is disposed in front of the metal member 14. The electronic component corresponding to the second case is disposed further rearward than the metal member 14. As a result, it is easy to appropriately arrange the electronic components 16a to 16c according to the characteristics of the electronic components 16a to 16 c.

In addition, in the electronic component corresponding to the second case, there are a vertical type inductor and a horizontal type inductor. The vertical inductor is an inductor in which a winding shaft extends in the up-down direction. When the electronic component corresponding to the second case is a vertical inductor, the vertical inductor can be disposed close to the metal member 14 while suppressing the metal member 14 from interfering with the magnetic flux generated by the vertical inductor. That is, the degree of freedom in arrangement of the vertical electronic component becomes high. The horizontal inductor is an inductor in which a winding axis extends in a direction orthogonal to the up-down direction. When the electronic component corresponding to the second case is a horizontal inductor, the distance between the plate-like portion 140 and the horizontal inductor in the case where the plate-like portion 140 is inclined forward with respect to the vertical direction is longer than the distance between the plate-like portion 140 and the horizontal inductor in the case where the plate-like portion 140 extends in the vertical direction. As a result, deterioration of the characteristics of the horizontal inductor can be suppressed.

In the module 10, the plate-like portion 140 is slightly inclined forward with respect to the up-down direction. Thereby, the pressure caused by the molten resin applied to the plate-like portion 140 is relaxed. As a result, the occurrence of cracks between the leg portions 146a to 146g and the solders 200a to 200g, or the breakage of the leg portions 146a to 146g and the solders 200a to 200g can be suppressed.

In the module 10, the voids generated in the solders 200a to 200g are easily released from the solders 200a to 200g in the rear direction. More specifically, all of the legs 146a to 146g extend from the lower edge LD in the rearward direction and are inclined with respect to the forward-rearward direction such that the rear ends of the legs 146a to 146g are located above the front ends of the legs 146a to 146 g. That is, as shown in fig. 6, the leg portions 146a to 146g extend in the upward and rearward direction from the lower end portion of the plate-like portion 140. Accordingly, the interval between the lower surfaces Sx of the legs 146a to 146g and the upper surface Sy of the mounting electrode 122 in the up-down direction increases with the forward direction. Solder 200a to 200g is provided between the lower surface Sx of the leg portions 146a to 146g and the upper surface Sy of the mounting electrode 122, respectively. As described above, the interval between the lower surfaces Sx of the legs 146a to 146g and the upper surface Sy of the mounting electrode 122 in the vertical direction increases with the backward direction, and thus the gap generated in the solders 200a to 200g is easily released from the solders 200a to 200g in the backward direction.

In the module 10, the portion of the metal member 14 fixed to the mounting electrode 122 by the solders 200a to 200g becomes wider. More specifically, the plate-like portion 140 is inclined with respect to the vertical direction such that the upper end PU of the plate-like portion 140 is positioned forward of the lower end PD of the plate-like portion 140. All of the legs 146a to 146g extend in the rear direction from the lower edge LD and are inclined with respect to the front-rear direction so that the rear ends of the legs 146a to 146g are located above the front ends of the legs 146a to 146 g. That is, as shown in fig. 6, the leg portions 146a to 146g are slightly inclined upward with respect to the front-rear direction. Therefore, in the metal member 14, a portion located within a distance from the mount electrode 122 where the solders 200a to 200g can wet and spread becomes wider. That is, a portion of the metal member 14 near the mounting electrode 122 becomes wider. As a result, the portion of the metal member 14 fixed to the mounting electrode 122 by the solders 200a to 200g becomes wider.

According to the module 10, the metal member 14 can be prevented from falling down when the sealing resin layer 18 is formed. More specifically, the plate-like portion 140 is provided with upper cutouts 142a, 142b extending downward from the upper edge LU. The plate-like portion 140 is provided with one or more lower cutouts 144a to 144f extending upward from the lower side LD. Thus, when the sealing resin layer 18 is formed, the molten resin passes through the upper cutouts 142a and 142b and the lower cutouts 144a to 144f, and spreads over the entire upper main surface SU2 of the substrate 12. Therefore, the vicinity of the upper edge LU and the vicinity of the lower edge LD of the plate-like portion 140 are less susceptible to pressure caused by the molten resin. This can prevent the plate-like portion 140 from falling down around the upper edge LU or prevent the plate-like portion 140 from falling down around the lower edge LD. As a result, according to the module 10, the metal member 14 can be prevented from falling down when the sealing resin layer 18 is formed.

According to the module 10, the legs 146a to 146g can be formed with high accuracy so that the angle of the legs 146a to 146g with respect to the plate-like portion 140 becomes a value close to the design value. Hereinafter, as shown in fig. 5 and 6, the boundary portion between the plate-like portion 140 and the leg portions 146a to 146g is defined as a boundary C. The leg portions 146a to 146g are formed by bending a part of the metal member 14. At this time, tensile stress is generated on the outer surface SO. Thus, the outer surface SO is stretched. On the other hand, compressive stress is generated on the inner surface SI. The inner surface SI is compressed. In the inner surface SI, the metal material where the compressive stress is lost is displaced in the left and right directions. Therefore, at the left end of the boundary C, the metal material protrudes in the left direction from the leg portions 146a to 146 g. At the right end of the boundary C, the metal material protrudes in the right direction from the leg portions 146a to 146 g. Accordingly, the outer edges of the legs 146 a-146 g are connected to the outer edges of the lower cutouts 144 a-144 g. Therefore, the metal material can protrude into the lower cutouts 144a to 144f. In this case, the protrusion of the metal material is not easily hindered. Therefore, it is not easy to prevent a part of the metal member 14 from being bent to form the leg portions 146a to 146 g. As a result, the legs 146a to 146g can be formed with high precision such that the angle of the legs 146a to 146g with respect to the plate-like portion 140 is close to the design value. Therefore, the solder adheres uniformly to the entire lower surfaces Sx of the leg portions 146a to 146 g. Thus, according to the module 10, the independence of the metal members 14 improves. The independence of the metal member 14 means that the metal member 14 is not easily fallen down even if the solder is melted when the metal member 14 is fixed by the solder.

According to the module 10, the legs 146b to 146f can be formed with high accuracy so that the angle of the legs 146b to 146f with respect to the plate-like portion 140 becomes a value close to the design value. More specifically, the leg portions 146a to 146g include leg portions 146b to 146f (first leg portions) located between the lower cutouts 144a to 144f in the left-right direction when viewed in the front-rear direction. The lower cutouts 144 a-144 f are located on the left and right sides of the legs 146 b-146 f. This makes it less likely to interfere with the protrusion of the metal material. Therefore, it is less likely to interfere with bending a part of the metal member 14 in order to form the leg portions 146b to 146 f. As a result, the legs 146b to 146f can be formed with high precision such that the angle of the legs 146b to 146f with respect to the plate-like portion 140 is close to the design value. Therefore, the solder adheres uniformly to the entire lower surfaces Sx of the leg portions 146b to 146 f. Thus, according to the module 10, the independence of the metal members 14 improves.

According to the module 10, the legs 146a and 146g can be formed with high accuracy so that the angles of the legs 146a and 146g with respect to the plate-like portion 140 are close to the design values. More specifically, the leg portions 146a to 146g include leg portions 146a, 146g disposed at the left and right end portions of the lower side LD when viewed in the front-rear direction. No metallic material is present on the left side of the foot 146 a. No metallic material is present on the right side of the foot 146g. This makes it less likely to interfere with bending a part of the metal member 14 to form the leg portions 146a and 146g. As a result, the legs 146a and 146g can be formed with high precision such that the angle of the legs 146a and 146g with respect to the plate-like portion 140 is close to the design value. Accordingly, the solder adheres uniformly to the entire lower surface Sx of the leg portions 146a, 146g. Thus, according to the module 10, the independence of the metal members 14 improves.

According to the module 10, the area where the electronic components 16a to 16c can be mounted on the upper main surface SU2 of the substrate 12 becomes large. The following will explain the modules according to the reference example. The metal member of the module according to the reference example includes a plurality of legs. The plurality of legs include a front leg portion extending in a forward direction from a lower edge of the plate-like portion, and a rear leg portion extending in a rearward direction from the lower edge of the plate-like portion. When the electronic component is mounted forward of the metal member, the electronic component needs to be mounted at a position separated from the front leg portion by a predetermined distance in the forward direction. Therefore, the electronic component cannot be mounted in the region of the total distance of the length from the metal member to the front leg portion and the predetermined distance. Similarly, in the case where the electronic component is mounted rearward of the metal member, the electronic component needs to be mounted at a position separated from the rear leg portion by a predetermined distance in the rearward direction. Therefore, the electronic component cannot be mounted in the region of the total distance from the length of the metal member to the rear leg portion and the predetermined distance.

On the other hand, in the module 10, the leg portions 146a to 146g extend in the rear direction from the lower edge LD of the plate-like portion 140. In this case, when the electronic components 16b and 16c are mounted rearward of the metal member 14, the electronic components 16b and 16c need to be mounted at positions separated from the leg portions 146a to 146g by a predetermined distance in the rearward direction. Therefore, the electronic components 16b and 16c cannot be mounted in the region of the total distance of the length from the metal member 14 to the leg portions 146a to 146g and the predetermined distance. On the other hand, when the electronic component 16a is mounted forward of the metal member 14, it is required to be mounted at a position separated from the plate-like portion 140 by a predetermined distance in the forward direction. Therefore, the electronic component 16a cannot be mounted in the region from the metal member 14 to the prescribed distance. Therefore, the area where the electronic components cannot be mounted in the module according to the reference example is wider than the area where the electronic components 16a to 16c cannot be mounted in the module 10, from the metal member to the length of the front leg portion. In other words, according to the module 10, the area where the electronic components 16a to 16c can be mounted on the upper main surface SU2 of the substrate 12 becomes large.

In addition, according to the module 10, the state of wetting of the solders 200a to 200g with respect to the legs 146a to 146g is nearly uniform. In more detail, the metal member 14 is generally formed by punching a metal plate. At this time, the shear surface and the fracture surface are formed adjacent to each other in the thickness direction of the metal member 14 at the outer edge of the metal member 14. In the module 10, the leg portions 146a to 146g extend in the rear direction from the lower edge LD of the plate-like portion 140. Therefore, the shearing surface is aligned with the position relationship of the fracture surface in the up-down direction at the rear ends of the leg portions 146a to 146 g. Thus, the wetting state of the solders 200a to 200g with respect to the leg portions 146a to 146g is nearly uniform.

In addition, according to the module 10, when the plate-like portion 140 is inclined at the time of forming the sealing resin layer 18, the area of the portion of the leg portions 146a to 146g peeled from the mounting electrode 122 becomes small. More specifically, in the module according to the above-described reference example, the plurality of legs include a front leg portion extending in the front direction from the lower edge of the plate-like portion, and a rear leg portion extending in the rear direction from the lower edge of the plate-like portion. In the module according to the reference example, the length of the portion of the metal member fixed to the mounting electrode in the front-rear direction is the sum of the length of the front leg portion in the front-rear direction and the length of the rear leg portion in the front-rear direction. For example, when the plate-like portion falls in the rear direction so as to rotate about the rear end of the rear leg portion, the front leg portion and the rear leg portion may be separated from the mounting electrode over the total length of the lengths of the front leg portion and the rear leg portion in the front-rear direction.

On the other hand, in the module 10, the leg portions 146a to 146g extend in the rear direction from the lower edge LD of the plate-like portion 140. Therefore, in the module 10, the length of the portion of the metal member 14 fixed to the mounting electrode 122 in the front-rear direction is the length of the leg portions 146a to 146g in the front-rear direction. Therefore, for example, when the plate-like portion 140 falls down in the rear direction so as to rotate about the rear ends of the leg portions 146a to 146g, the leg portions 146a to 146g may be separated from the mounting electrode 122 over the length of the leg portions 146a to 146g in the front-rear direction. The length of the legs 146a to 146g in the front-rear direction is shorter than the sum of the length of the front leg and the length of the rear leg in the front-rear direction of the module according to the reference example. Therefore, according to the module 10, when the plate-like portion 140 is inclined at the time of forming the sealing resin layer 18, the area of the portion of the leg portions 146a to 146g peeled from the mounting electrode 122 becomes small.

According to the module 10, the potential of the metal member 14 easily becomes uniform. More specifically, the legs 146a to 146g are arranged at equal intervals in the left-right direction when viewed in the front-rear direction. The legs 146a to 146g are connected to the ground potential via the mounting electrode 122. Thus, the metal member 14 is connected to the ground potential at portions arranged at equal intervals in the left-right direction when viewed in the front-rear direction. As a result, according to the module 10, the potential of the metal member 14 is easily made uniform.

According to the module 10, the self-alignment of the leg portions 146a to 146g is improved according to the metal member 14. More specifically, the legs 146a to 146g are arranged at equal intervals in the left-right direction when viewed in the front-rear direction. Thus, when the solder melts during the mounting of the metal member 14, the solder adhering to the leg portions 146a to 146g has a laterally symmetrical structure. When the solder is melted in the mounting of the metal member 14, the independence of the metal member 14 is ensured. As a result, the self-alignment of the leg portions 146a to 146g is improved according to the metal member 14. The self-alignment means that the legs 146a to 146g are held in an appropriate posture by the surface tension of the solders 200a to 200g when the solders are melted during the mounting of the metal member 14.

According to the module 10, the metal member 14 can be prevented from falling down when the sealing resin layer 18 is formed. More specifically, in the module 10, the lower cutouts 144a to 144f are arranged at equal intervals in the left-right direction when viewed in the front-rear direction. Thus, the vicinity of the lower edge LD of the plate-like portion 140 receives an even pressure by the molten resin. As a result, the plate-like portion 140 can be prevented from falling down due to the application of a large pressure to a specific portion in the vicinity of the lower edge LD of the plate-like portion 140.

According to the module 10, the processing of the metal member 14 is easy. More specifically, the shortest distance between the upper slits 142a, 142b and the lower slits 144a to 144f is 1.5 times or more the plate thickness of the plate-like portion 140. Thus, the upper cutouts 142a, 142b and the lower cutouts 144a to 144f are not too close. As a result, the punching process of the metal member 14 becomes easy.

In the module 10, the upper end of the plate-like portion 140 is in close contact with the shield 20. In more detail, the plate-like portion 140 is slightly inclined forward with respect to the up-down direction. Therefore, the upper end of the ground plate-like portion 140 of the sealing resin layer 18 is a plane formed by cutting the plate-like portion 140 obliquely. Therefore, the upper end of the plate-like portion 140 has a large area. As a result, in the module 10, the upper end of the plate-like portion 140 is easily brought into close contact with the shield 20.

In the module 10, the plate-like portion 140 is slightly inclined forward with respect to the up-down direction. Thus, as shown in fig. 6, the legs 146a to 146g are slightly inclined upward with respect to the front-rear direction. Therefore, in the metal member, a portion located within a wettable distance from the mount electrode 122 solders 200a to 200g becomes wider. In particular, the solders 200a to 200g are easily wetted to the outer surface SO. That is, a portion of the metal member 14 near the mounting electrode 122 becomes wider. As a result, the portion of the metal member 14 fixed to the mounting electrode 122 by the solders 200a to 200g becomes wider.

According to the module 10, the leg portions 146a to 146g and the top surface portion 148 can be formed with high accuracy. More specifically, the leg portions 146a to 146g are formed by bending a part of the metal member 14 in the rear direction. The top surface portion 148 is formed by bending a part of the metal member 14 in the rear direction. Thus, the leg portions 146a to 146g and the top surface portion 148 are formed by bending a part of the metal member 14 in the same direction. Accordingly, the leg portions 146a to 146g and the top surface portion 148 can be formed simultaneously. As a result, the legs 146a to 146g and the top surface 148 can be formed with high precision.

According to the module 10, the metal member 14 can be prevented from falling down when the sealing resin layer 18 is formed. More specifically, the plate-like portion 140 is provided with upper cutouts 142a, 142b. The metal member 14 includes leg portions 146a to 146g. Thereby, in the vicinity of the upper edge LU of the metal member 14, the pressure caused by the molten resin is reduced by the upper slits 142a, 142b. On the other hand, the vicinity of the lower edge LD of the metal member 14 is opposed to the pressure caused by the molten resin by the leg portions 146a to 146g. In this way, in the module 10, measures against the pressure caused by the molten resin are implemented near the upper side LU and near the lower side LD of the metal member 14. As a result, according to the module 10, the metal member 14 can be prevented from falling down when the sealing resin layer 18 is formed.

According to the module 10, the metal member 14 can be prevented from falling down when the sealing resin layer 18 is formed. More specifically, the metal member 14 includes legs 146 a-146 g. The legs 146a to 146g are fixed to the mounting electrode 122. Therefore, the lower portion of the metal member 14 is less likely to be elastically deformed than the upper portion of the metal member 14. When the molten resin applies pressure to the plate-like portion 140, the lower portion of the metal member 14 is not easily elastically deformed, and therefore the lower portion of the metal member 14 cannot release the pressure caused by the molten resin. Therefore, a large pressure is easily applied to the lower portion of the metal member 14. In this case, the leg portions 146a to 146g may be separated from the mounting electrode 122, and the metal member 14 may fall down. Therefore, the plate-like portion 140 is provided with lower cutouts 144a to 144f. Thus, a large pressure applied to the metal member 14 can be released through the lower incisions 144a to 144f. That is, it is possible to suppress the application of a large pressure to the lower portion of the metal member 14. Therefore, the metal member 14 can be prevented from falling down when the sealing resin layer 18 is formed.

Further, since the plate-like portion 140 is provided with the upper cutouts 142a, 142b, the total length of the upper ends of the metal members 14b in the lateral direction is short. Therefore, when the upper surface SU1 of the sealing resin layer 18 is ground, the amount of the ground metal member 14 becomes small. As a result, deterioration of the abrasive tool can be suppressed.

In the module 10, since the area of the mounting electrode 122 is large, the solders 200a to 200g on the mounting electrode 122 are positioned in the front, rear, left, and right of the leg portions 146a to 146 g. Thus, the solders 200a to 200g are easily wetted in the side face upward direction of the leg portions 146a to 146 g.

In the module 10, formation of voids under the outer surface SO can be suppressed. In more detail, the space below the outer surface SO is a space into which the molten resin does not easily enter. Thus, the solders 200a to 200g wet to the vicinity of the upper end of the outer surface SO. Thus, when the sealing resin layer 18 is formed, there is no void below the outer surface SO. As a result, in the module 10, formation of voids under the outer surface SO can be suppressed. By suppressing the formation of the void, the connection reliability of the metal member 14 and the mounting electrode 122 is improved.

In the module 10, the occurrence of voids in the solders 200a to 200g can be suppressed. A shear surface and a fracture surface are formed at the rear end portions of the leg portions 146a to 146 g. The surface roughness of the fracture surface is greater than the surface roughness of the shear surface. Therefore, if the solders 200a to 200g adhere to the fracture surface, voids are caused. Therefore, as shown in fig. 6, the rear end portions of the leg portions 146a to 146g have a shape in which the upper and lower ends protrude rearward from the center. Thus, the solders 200a to 200g are less likely to wet at the rear end portions of the leg portions 146a to 146 g. As a result, in the module 10, the occurrence of voids in the solders 200a to 200g can be suppressed.

In the module 10, the protruding portion 160 extends in the rear direction from the upper end PU of the plate-like portion 140. Accordingly, the protruding portion 160 extends from the plate-like portion 140 to be close to the electronic components 16b, 16c. The protruding portion 160 shields the electronic components 16b, 16c. As a result, the module 10 has high shielding properties with respect to the electronic components 16b, 16c.

In the module 10, the protruding portion 160 extends in the rear direction from the upper end PU of the plate-like portion 140. Thereby, the connection of the metal member 14 and the shield 20 also uses the protruding portion 160. Accordingly, the metal member 14 and the shield 20 are more reliably connected.

In the module 10, the protruding portion 160 extends in the rear direction from the upper end PU of the plate-like portion 140. This makes it easy to visually confirm the upper end PU of the plate 140. Therefore, the determination of the pass product and the fail product of the module 10 can be made before the shield 20 is formed.

In the module 10, the cleanability of the flux is improved. More specifically, after the metal member 14 is mounted on the mounting electrode 122, the substrate 12 and the metal member 14 are immersed in a tank containing a flux cleaning liquid. Thereby, the flux is washed. In this case, in order to improve the cleaning property of the flux, it is preferable that the flux cleaning liquid has high fluidity. Accordingly, the upper cutouts 142a, 142b and the lower cutouts 144a to 144g are provided in the plate-like portion 140. Thus, the flux cleaning liquid can pass through the upper cutouts 142a, 142b and the lower cutouts 144a to 144g. Thus, fluidity of the flux cleaning liquid is improved. As a result, in the module 10, the flux cleaning performance is improved. The flux cleaning liquid remaining in the curved portion of the top surface portion 148 flows out from the curved portion of the top surface portion 148 through the upper slits 142a and 142 b.

(first modification)

Hereinafter, the metal member 14a according to the first modification will be described with reference to the drawings. Fig. 11 is a rear view of the metal member 14a according to the first modification.

The metal member 14a differs from the metal member 14 in the number of undercuts. Specifically, 6 lower cutouts 144a to 144f are provided in the plate-like portion 140 in the metal member 14. On the other hand, in the metal member 14a, four lower cutouts 144b to 144e are provided in the plate-like portion 140. Other structures of the metal member 14a are the same as those of the metal member 14, and therefore description thereof is omitted.

(second modification)

Hereinafter, the metal member 14b according to the second modification will be described with reference to the drawings. Fig. 12 is a rear view of a metal member 14b according to a second modification.

The metal member 14b differs from the metal member 14a in the number of undercuts. Specifically, in the metal member 14a, four lower cutouts 144b to 144e are provided in the plate-like portion 140. On the other hand, in the metal member 14b, 6 lower cutouts 144a to 144f are provided in the plate-like portion 140.

The lower cutouts 144a to 144f include lower cutouts 144a (first lower cutouts) arranged at the left end portion of the lower side LD as viewed in the front-rear direction. The lower cutout 144a is an L-shaped defect formed by removing the lower left corner of the rectangular plate-shaped portion 140. Therefore, the lower cutout 144a has the same shape as the right half of the lower cutouts 144b to 144e. However, the lower cutout 144a may have a shape different from the right half of the lower cutouts 144b to 144e.

The lower cutouts 144a to 144f include lower cutouts 144f (first lower cutouts) arranged at the right end portion of the lower side LD as viewed in the front-rear direction. The lower cutout 144f is an L-shaped defect formed by removing the lower right corner of the rectangular plate-shaped portion 140. Therefore, the lower cutout 144f has the same shape as the left half portions of the lower cutouts 144b to 144 e. However, the lower cutout 144f may have a shape different from the left half portions of the lower cutouts 144b to 144 e. Other structures of the metal member 14b are the same as those of the metal member 14a, and therefore description thereof is omitted.

In the metal member 14b, since the lower cutout 144a is provided, the length of the left end of the metal member 14b in the up-down direction is short. Therefore, when the left surface SL1 of the sealing resin layer 18 is cut, the amount of the cut metal member 14b becomes small. As a result, the deterioration of the blade of the cutter can be suppressed. In addition, since the lower cutout 144f is provided in the metal member 14b, the length of the right end of the metal member 14b in the up-down direction is short. Therefore, when cutting the right surface SR1 of the sealing resin layer 18, the amount of the cut metal member 14b becomes small. As a result, the deterioration of the blade of the cutter can be suppressed.

(third modification)

The metal member 14c according to the third modification will be described below with reference to the drawings. Fig. 13 is a rear view of a metal member 14c according to a third modification.

The metal member 14c differs from the metal member 14a in the number of upper cutouts. Specifically, in the metal member 14a, two upper cutouts 142a, 142b are provided in the plate-like portion 140. On the other hand, in the metal member 14c, four upper cutouts 142a to 142d are provided in the plate-like portion 140. The upper cutout 142c is located on the left side of the upper cutout 142a as viewed in the front-rear direction. The upper cutout 142d is located on the right side of the upper cutout 142b as viewed in the front-rear direction. Other structures of the metal member 14c are the same as those of the metal member 14a, and therefore description thereof is omitted.

According to the metal member 14c, upper cutouts 142c, 142d are provided in the plate-like portion 140. Thus, the vicinity of the upper edge LU of the plate-like portion 140 is less susceptible to pressure caused by the molten resin. As a result, the metal member 14c can be prevented from falling down when the sealing resin layer 18 is formed. In addition, the deterioration of the blade of the cutter can be suppressed for the same reason as the metal member 14 b.

(fourth modification)

The metal member 14d according to the fourth modification will be described below with reference to the drawings. Fig. 14 is a rear view of a metal member 14d according to a fourth modification.

The metal member 14d differs from the metal member 14a in the number of undercuts and the number of feet. Specifically, in the metal member 14a, four lower cutouts 144b to 144e are provided in the plate-like portion 140. On the other hand, in the metal member 14d, two lower cutouts 144b, 144e are provided in the plate-like portion 140. The upper cutouts 142a, 142b are disposed between the lower cutouts 144b, 144e in the left-right direction when viewed in the front-rear direction.

The metal member 14a includes 5 legs 146 b-146 f. On the other hand, the metal member 14d includes two legs 146b, 146f. Foot 146b is located to the left of lower cutout 144 b. Foot 146f is located to the right of lower cutout 144 e. Thus, the foot is not disposed between the lower cutout 144b and the lower cutout 144e in the left-right direction when viewed in the front-rear direction. Other structures of the metal member 14d are the same as those of the metal member 14a, and therefore description thereof is omitted.

According to the metal member 14d, no leg portion is disposed between the lower cutout 144b and the lower cutout 144e in the left-right direction when viewed in the front-rear direction. Therefore, the electronic component can be disposed in the vicinity of the plate-like portion 140 between the lower cutout 144b and the lower cutout 144e in the left-right direction as viewed in the front-rear direction. In addition, since the area of the metal member 14d becomes large, the shielding performance between the electronic component 16a and the electronic components 16b, 16c improves. This allows the electronic component 16a to approach the electronic components 16b and 16 c.

(fifth modification)

The metal member 14e according to the fifth modification will be described below with reference to the drawings. Fig. 15 is a rear view of a metal member 14e according to a fifth modification.

The metal member 14e differs from the metal member 14d in the number of upper cutouts. Specifically, in the metal member 14d, two upper cutouts 142a, 142b are provided in the plate-like portion 140. On the other hand, in the metal member 14e, four upper cutouts 142a to 142d are provided in the plate-like portion 140. Other structures of the metal member 14e are the same as those of the metal member 14d, and therefore description thereof is omitted.

(sixth modification)

Hereinafter, a metal member 14f according to a sixth modification will be described with reference to the drawings. Fig. 16 is a rear view of a metal member 14f according to a sixth modification.

The metal member 14f differs from the metal member 14a in that the plate-like portion 140 is provided with an undercut 144x in which an undercut 144c and an undercut 144d are connected together. Accordingly, the metallic member 14f does not include the foot 146d. In such a configuration, the upper cutouts 142a, 142b and the lower cutouts 144b, 144e, 144x are alternately arranged in the left-right direction. Thus, the upper cutouts 142a, 142b and the lower cutouts 144b, 144e, 144x are not easily aligned in the up-down direction. As a result, the strength of the metal member 14f increases. When the upper slits 142a, 142b and the lower slits 144b, 144e, 144x are alternately arranged in the left-right direction, the upper slits 142a, 142b and the lower slits 144b, 144e, 144x are uniformly distributed over the whole of the plate-like portion 140. As a result, the molten resin easily passes through the upper incisions 142a, 142b and the lower incisions 144b, 144e, 144x. As a result, the formation of the sealing resin layer 18 becomes easy.

(seventh modification)

The metal member 14g according to the seventh modification will be described below with reference to the drawings. Fig. 17 is a rear view of a metal member 14g according to a seventh modification.

The metal member 14g differs from the metal member 14a in that the plate-like portion 140 is provided with a lower cutout 144y formed by connecting the lower cutouts 144b to 144e in one piece. Therefore, the metal member 14g does not include the leg portions 146c to 146e. The lower cutout 144y is disposed between the leg 146b and the leg 146f in the left-right direction when viewed in the front-rear direction.

The lower cutout 144y is disposed between the leg 146b and the leg 146f in the left-right direction as viewed in the front-rear direction according to the metal member 14 g. Therefore, the width of the lower cutout 144y in the left-right direction is large. Therefore, the molten resin easily passes through the lower slit 144y. As a result, the formation of the sealing resin layer 18 becomes easy.

The metal member 14g can be used to arrange electronic components as follows. More specifically, the electronic components to be shielded are disposed near the leg portions 146b and 146 f. In addition, the electronic component is arranged to pass through the lower cutout 144y in the front-rear direction. That is, the metal member 14 overlaps the electronic component when viewed in the up-down direction. This can eliminate the distance between the metal member 14 and the electronic component.

(eighth modification)

The metal member 14h according to the eighth modification will be described below with reference to the drawings. Fig. 18 is a rear view of a metal member 14h according to an eighth modification.

The metal member 14h differs from the metal member 14b in the number of upper cutouts. In the metal member 14b, two upper cutouts 142a, 142b are provided in the plate-like portion 140. On the other hand, in the metal member 14h, four upper cutouts 142a to 142d are provided in the plate-like portion 140.

The upper cutouts 142a to 142d include upper cutouts 142c, 142d (first upper cutouts) arranged at the left end portion or the right end portion of the upper edge LU as viewed in the front-rear direction. The upper notch 142c is an L-shaped defect formed by removing the upper left corner of the rectangular plate-like portion 140. Accordingly, the upper cutout 142c has the same shape as the right half of the upper cutouts 142a, 142b.

The upper notch 142d is an L-shaped defect formed by removing the upper right corner of the rectangular plate-like portion 140. Accordingly, the upper cutout 142d has the same shape as the left half of the upper cutouts 142a, 142b. Other structures of the metal member 14h are the same as those of the metal member 14b, and therefore description thereof is omitted.

In the metal member 14h, since the upper cutout 142c is provided, the length of the left end of the metal member 14h in the up-down direction is short. Therefore, when the left surface SL1 of the sealing resin layer 18 is cut, the amount of the cut metal member 14h becomes small. As a result, the deterioration of the blade of the cutter can be suppressed. Further, since the upper cutout 142d is provided in the metal member 14h, the length of the right end of the metal member 14h in the up-down direction is short. Therefore, when cutting the right surface SR1 of the sealing resin layer 18, the amount of the cut metal member 14h becomes small. As a result, the deterioration of the blade of the cutter can be suppressed.

In addition, in the metal member 14h, the metal member 14h can be restrained from falling down. More specifically, the metal member 14h is provided with an upper cutout 142c and a lower cutout 144a. Similarly, the metal member 14h is provided with an upper cutout 142d and a lower cutout 144f. Thus, the difference between the pressure caused by the molten resin applied to the upper portion of the plate-like portion 140 and the pressure caused by the molten resin applied to the lower portion of the plate-like portion 140 becomes small. As a result, the metal member 14h can be prevented from falling down.

(ninth modification)

The metal member 14i according to the ninth modification will be described below with reference to the drawings. Fig. 19 is a rear view of a metal member 14i according to a ninth modification.

The metal member 14i differs from the metal member 14b in that the plate-like portion 140 is provided with an undercut 144y in which the undercut 144a and the undercut 144b are connected together, and in that the plate-like portion 140 is provided with an undercut 144z in which the undercut 144e and the undercut 144f are connected together. Accordingly, the metallic member 14i does not include the feet 146b, 146f. Therefore, the metal member 14i includes three leg portions 146c, 146d, 146e disposed near the center of the plate-like portion 140 in the lateral direction.

(tenth modification)

The metal member 14j according to the tenth modification will be described below with reference to the drawings. Fig. 20 is a cross-sectional view of leg portions 146a to 146g of a metal member 14j according to a tenth modification.

The metal member 14j differs from the metal member 14 in that it includes protrusions 150 a-150 g. The protrusions 150a to 150g are provided so as to correspond to the leg portions 146a to 146g, respectively. The protrusions 150a to 150g are provided at the upper end of the outer surface SO. The protrusions 150a to 150g protrude from the front main surface SF3 of the plate 140 in the forward direction. Thereby, excessive wetting of the solder in the upward direction is suppressed. The overall structure of the metal member 14k is the same as that of any one of the metal members 14, 14a to 14 i.

The self-alignment of the leg portions 146a to 146g is improved by the metal member 14 j. More specifically, in the metal member 14j, the solders 200a to 200g are less likely to wet the outer surface SO and the rear end portions of the leg portions 146a to 146 g. In this case, the leg portions 146a to 146g are fixed to the mounting electrode 122 by the solders 200a to 200g only on the lower surfaces Sx of the leg portions 146a to 146 g. In this case, the self-alignment of the legs 146a to 146g improves.

(eleventh modification)

The metal member 14k according to the eleventh modification will be described below with reference to the drawings. Fig. 21 is a cross-sectional view of leg portions 146a to 146g of a metal member 14k according to an eleventh modification.

The metal member 14k differs from the metal member 14 in that it includes recesses 152 a-152 g. The recesses 152a to 152g are provided so as to correspond to the leg portions 146a to 146g, respectively. Recesses 152a to 152g are provided at the upper end of the outer surface SO. The recesses 152a to 152g are recessed in the rear direction from the front main surface SF3 of the plate-like portion 140. Thereby, excessive wetting of the solder in the upward direction is suppressed. The overall structure of the metal member 14k is the same as that of any one of the metal members 14, 14a to 14 i.

The self-alignment of the leg portions 146a to 146g is improved by the metal member 14 k. More specifically, in the metal member 14k, the solders 200a to 200g are less likely to wet on the outer surface SO and the rear end portions of the leg portions 146a to 146 g. In this case, the leg portions 146a to 146g are fixed to the mounting electrode 122 by the solders 200a to 200g only on the lower surfaces Sx of the leg portions 146a to 146 g. In this case, the self-alignment of the legs 146a to 146g improves.

(twelfth modification)

The metal member 14l according to the twelfth modification will be described below with reference to the drawings. Fig. 22 is a cross-sectional view of the top surface 148 of the metal member 14l according to the twelfth modification in the center in the lateral direction. Fig. 23 is a plan view of a metal member 14l according to a twelfth modification.

The top surface portion 148 is formed by bending a part of the metal member 14l in the rear direction. At this time, the thickness of the portion where the metal member 14l is bent becomes thinner than the thickness of the plate-like portion 140. Thereby, grinding of the top surface portion 148 becomes easy. In addition, when the thickness of the portion where the metal member 14l is bent becomes thin, the top face portion 148 becomes easily displaced with respect to the plate-like portion 140. Therefore, when the metal member 14l is mounted on the substrate 12, the impact transmitted from the substrate 12 to the metal member 14l is absorbed by the top surface portion 148.

In addition, the thickness of the portion of the metal member 14l that is bent becomes thinner than the thickness of the plate-like portion 140. In other words, the thickness of the plate-like portion 140 is increased by an amount corresponding to the thickness of the portion of the metal member 14l that is bent being reduced. Accordingly, as shown in fig. 23, the molten resin flowing to the front main surface SF3 of the plate-like portion 140 flows in the left or right direction. That is, the molten resin flows toward the left and right ends of the plate-like portion 140.

(thirteenth modification)

The mounting electrode 122a according to the thirteenth modification will be described below with reference to the drawings. Fig. 24 is a plan view of the mounting electrode 122 a.

The mounting electrode 122a is different from the mounting electrode 122 in that 7 small electrodes 1221 to 1227 are included. The leg portions 146a to 146g of the metal member 14 are fixed to the small electrodes 1221 to 1227 by solders 200a to 200g, respectively. However, a part of the leg portions 146a to 146g may be fixed to a part of the small electrodes 1221 to 1227 by the solders 200a to 200 g. Thus, by dividing the mounting electrode 122a into 7 small electrodes 1221 to 1227, the self-alignment of the legs 146a to 146g improves.

In addition, by dividing the mounting electrode 122a into 7 small electrodes 1221 to 1227, no solder 200a to 200g exists between the small electrodes 1221 to 1227. Therefore, according to the mounting electrode 122a, the solders 200a to 200g for fixing the metal member 14 can be reduced. In addition, since the area of the mounting electrode 122a becomes small, the degree of freedom in designing the substrate 12 becomes high. In addition, when unnecessary small electrodes are present among the small electrodes 1221 to 1227, the unnecessary small electrodes may be eliminated. In this case, the electronic component can be disposed in the vicinity of the region from which the unnecessary small electrode is eliminated. That is, the degree of freedom in arrangement of the electronic components becomes high. Further, the number of small electrodes is not limited to 7. The number of the small electrodes may be plural.

(fourteenth modification)

The mounting electrode 122b according to the fourteenth modification will be described below with reference to the drawings. Fig. 25 is a plan view of the mounting electrode 122b.

The mounting electrode 122b is different from the mounting electrode 122 in the shape of the rear side. The mounting electrode 122 has a rectangular shape when viewed in the up-down direction. Therefore, the rear side of the mounting electrode 122 is a straight line. On the other hand, the rear side of the mounting electrode 122b has a saw-tooth shape. Thus, the mounting electrode 122b has the same shape as the metal member 14 when viewed in the up-down direction. Therefore, the lower end PD of the plate-like portion 140 of the metal member and the leg portions 146a to 146g are fixed to the mounting electrode 122b by the solders 200a to 200g. Since the area of the mounting electrode 122b is large, the solders 200a to 200g on the mounting electrode 122b are positioned in the front, rear, left, and right of the leg portions 146a to 146 g. Thus, the solders 200a to 200g are easily wetted in the side face upward direction of the leg portions 146a to 146 g.

(fifteenth modification)

The metal member 14m according to the fifteenth modification will be described below with reference to the drawings. Fig. 26 is a rear view of the metal member 14m and the mounting electrode 122 a.

The metal member 14m is different from the metal member 14 in the length of the lower cutouts 144a to 144f in the up-down direction. More specifically, in the metal member 14m, the length of the lower cutouts 144a to 144f in the up-down direction is about the thickness of the leg portions 146a to 146 g. In this way, the lower cutouts 144a to 144f may be formed by the thicknesses of the leg portions 146a to 146 g. In this case, the leg portions 146a to 146g are fixed to the small electrodes 1221 to 1227 of the mounting electrode 122a by solders 200a to 200g, respectively. When the thickness of the small electrodes 1221 to 1227 of the mounting electrode 122a increases, it can be considered that the length of the lower cutouts 144a to 144f in the up-down direction increases. As a result, the formation of the sealing resin layer 18 becomes easy.

(modification of Module 10)

A module 100 according to a modification of the module 10 will be described below with reference to the drawings. Fig. 27 is an external perspective view of the module 100. Fig. 28 is a cross-sectional view at A-A of module 100. Fig. 29 is a view of the metal member 14 connected to the ground conductor layer G2 via the mounting electrode 122. In the module 100, the same components as those of the module 10 shown in fig. 1 are denoted by the same reference numerals, and the description thereof is omitted.

The module 100 differs from the module 10 in the configuration of the electronic components. Specifically, as shown in fig. 27, the module 100 includes four electronic components (electronic components 16a2 to 16d 2). As shown in fig. 28, the electronic components 16a2 to 16d2 are arranged in the front-rear direction. As shown in fig. 27 and 28, the electronic components 16a2 and 16b2 are located forward of the metal member 14. The electronic component 16a2 and the electronic component 16b2 are electrically connected to each other. Specifically, as shown in fig. 28, the electronic component 16a2 is connected to the signal conductor layer SC1 through the via hole v 11. The electronic component 16b2 is connected to the signal conductor layer SC1 via the via hole v 12. In this way, the electronic component 16a2 and the electronic component 16b2 are electrically connected via the signal conductor layer SC 1.

As shown in fig. 27 and 28, the electronic components 16c2 and 16d2 are located rearward of the metal member 14. The electronic component 16c2 and the electronic component 16d2 are electrically connected to each other. Specifically, as shown in fig. 28, the electronic component 16c2 is connected to the signal conductor layer SC2 via the via hole v 21. The electronic component 16b2 is connected to the signal conductor layer SC2 via the via hole v 22. In this way, the electronic component 16c2 and the electronic component 16d2 are electrically connected via the signal conductor layer SC 2.

As shown in fig. 28 and 29, in the module 100, the metal member 14 is connected to the ground conductor layer G2 via the mounting electrode 122. More specifically, as shown in fig. 29, the leg portions 146a to 146g of the metal member 14 are fixed to the mounting electrode 122 by solders 200a to 200g, respectively. The mounting electrode 122 is electrically connected to the ground conductor layer G2 through the via holes v1 to v 7. The via holes v1 to v7 are provided in the substrate 12. As described above, the metal member 14 is connected to the ground conductor layer G2 via the solders 200a to 200G, the mounting electrode 122, and the via holes v1 to v 7.

As shown in fig. 29, the via holes v1 to v7 are provided at equal intervals in the left-right direction. The interval between the adjacent via holes v1 to v7 is, for example, 1/2 or 1/4 of the wavelength of a signal transmitted through a signal conductor layer (not shown) of the substrate 12. The via holes v1 to v7 are connected to the ground conductor layer G2. In this case, the via holes v1 to v7 can shield signals propagating through the substrate 12. Specifically, when the via holes v1 to v7 are provided at intervals of 1/2 or 1/4 of the wavelength of the signal, the via holes v1 to v7 are located at the portions of nodes in the composite wave (i.e., standing wave) that become the incident wave of the signal and the reflected wave of the signal. Thus, standing waves with respect to the input signal are less likely to occur in the substrate 12. As a result, signals propagating through the substrate 12 can be shielded by the via holes v1 to v 7.

The shielding property of the metal member 14 provided with the via holes v1 to v7 will be described in detail below. In the module 100, for example, as shown in fig. 28, there is a possibility that the interference wave IW1 is generated from the signal conductor layer SC 1. At this time, as shown in fig. 28, the interference wave IW1 generated from the signal conductor layer SC1 may enter in the rear direction.

If the through holes v1 to v7 are not provided below the metal member 14, there is a possibility that the interference wave IW1 passes below the metal member 14.

On the other hand, when the via holes v1 to v7 are provided below the metal member 14, the interference wave IW1 is shielded by the via holes v1 to v7 as shown in fig. 28. Therefore, the possibility that the interference wave IW1 passes under the metal member 14 is low.

Similarly, as shown in fig. 28, there is a possibility that the interference wave IW2 is generated from the signal conductor layer SC 2. At this time, as shown in fig. 28, when the via holes v1 to v7 are provided below the metal member 14, the interference wave IW2 is shielded by the via holes v1 to v 7. Therefore, the possibility that the interference wave IW1 passes under the metal member 14 is low.

The via holes provided in the module 100 are not limited to the via holes v1 to v7, and may be changed within the scope of the gist thereof. Specifically, the structure of the via hole may be changed according to the shape of the metal member 14 and the shape of the mounting electrode 122. For example, the ground surfaces (surfaces contacting the solders 200a to 200 g) of the leg portions 146a to 146g may be brought close to the distances between the via holes v1 to v 7. This shortens the distance between the ground plane of the leg portions 146a to 146G and the ground conductor layer G2. In this case, the characteristic impedance of the module 100 decreases. Therefore, noise generated in the module 100 is easily guided to the ground conductor layer G2. The approach of the ground plane of the leg portions 146a to 146g to the via holes v1 to v7 is, for example, a method of reducing the thickness of the solders 200a to 200 g.

The number of the via holes provided in the module 100 is not limited to 7.

The via holes v1 to v7 may not be arranged at equal intervals.

(Structure of Module 10 a)

The structure of the module 10a will be described below with reference to the drawings. Fig. 30 is a cross-sectional view at A-A of module 10 a.

The module 10a differs from the module 10 in the configuration of the upper main face SU2 of the substrate 12. More specifically, the upper main surface SU2 of the substrate 12 has a first upper main surface SU2-1 and a second upper main surface SU2-2. A step ST is formed at the boundary of the first upper main surface portion SU2-1 and the second upper main surface portion SU2-2. Thus, the first upper main surface portion SU2-1 is located above the second upper main surface portion SU2-2. Specifically, the substrate 12 includes an inner conductor layer 300 disposed inside the substrate 12. The first upper main surface SU2-1 overlaps the inner conductor layer 300 when viewed in the vertical direction, and is thus located above the second upper main surface SU2-2.

The metal member 14 is inclined with respect to the up-down direction by a step ST formed at the boundary of the first upper main surface portion SU2-1 and the second upper main surface portion SU2-2. More specifically, the legs 146 a-146 g include a first portion 1461 that includes the front ends of the legs 146 a-146 g, and a second portion 1462 that includes the rear ends of the legs 146 a-146 g. The leg portions 146a to 146g are inclined with respect to the vertical direction such that the upper end of the plate-like portion 140 is positioned forward of the lower end of the plate-like portion 140 when viewed in the vertical direction, by the first portion 1461 overlapping the second upper main surface portion SU2-2 and the second portion 1462 overlapping the first upper main surface portion SU 2-1.

According to the module 10a, the same operational effects as those of the module 10 can be achieved. In addition, according to the module 10a, the independence of the metal member 14 at the time of installation of the metal member 14 is improved. More specifically, as shown in fig. 7, the top surface portion 148 extends in the rear direction from the upper end portion of the plate-like portion 140. Therefore, when the metal member 14 is mounted, the plate-like portion 140 is intended to fall down in the rear direction due to the weight of the top surface portion 148.

Thus, the first portion 1461 overlaps the second upper main surface portion SU2-2, and the second portion 1462 overlaps the first upper main surface portion SU2-1, as viewed in the up-down direction. Thus, the plate-like portion 140 is inclined with respect to the vertical direction such that the upper end of the plate-like portion 140 is positioned forward of the lower end of the plate-like portion 140. As a result, the metal member 14 can be prevented from falling down in the rear direction when the metal member 14 is mounted. That is, the independence of the metal member 14 at the time of mounting the metal member 14 is improved.

(Structure of Module 10 b)

The structure of the module 10b will be described below with reference to the drawings. Fig. 31 is a cross-sectional view at A-A of module 10 b.

The module 10b differs from the module 10a in the configuration of the substrate 12. In more detail, the substrate 12 further includes a resist layer 302 disposed on the first upper main surface portion SU2-1 and not disposed on the second upper main surface portion SU 2-2. Thus, the first upper main surface portion SU2-1 is located above the second upper main surface portion SU 2-2. Other structures of the module 10b are the same as those of the module 10a, and therefore, description thereof is omitted. The module 10b can function and effect the same as the module 10 a.

(Structure of Module 10 c)

The structure of the module 10c will be described below with reference to the drawings. Fig. 32 is a cross-sectional view at A-A of module 10 c.

The module 10c differs from the module 10a in the configuration of the substrate 12. More specifically, a concave portion 310 recessed downward is provided in the upper main surface SU2 of the substrate 12. The second upper main surface portion SU2-2 is an inner surface of the concave portion 310. Thus, the first upper main surface portion SU2-1 is located above the second upper main surface portion SU 2-2. Other structures of the module 10c are the same as those of the module 10a, and therefore, description thereof is omitted. The module 10c can function and effect the same as the module 10 a.

In the modules 10a to 10c, wires joined by wires may be used to adjust the inclination of the step ST.

(sixteenth modification)

The metal member 14n according to the sixteenth modification will be described below with reference to the drawings. Fig. 33 is a perspective view of the metal member 14 n.

The metal member 14n differs from the metal member 14 in that the leg portions 146a to 146g extend in the forward direction from the lower edge LD of the plate-like portion 140. Other structures of the metal member 14n are the same as those of the metal member 14, and therefore description thereof is omitted.

(seventeenth modification)

The metal member 14o according to the seventeenth modification will be described below with reference to the drawings. Fig. 34 is a top view of the metal member 14 o.

The metal member 14o differs from the metal member 14 in that the leg portions 146a, 146c, 146e, 146g extend in the rear direction from the lower edge LD of the plate-like portion 140, and the leg portions 146b, 146d, 146f extend in the front direction from the lower edge LD of the plate-like portion 140. Other structures of the metal member 14n are the same as those of the metal member 14, and therefore description thereof is omitted.

(other embodiments)

The module according to the present utility model is not limited to the modules 10, 10a to 10c, 100 according to the above-described embodiments, and can be modified within the scope of the gist thereof.

The structures of the metal members 14, 14a to 14o and the structures of the mounting electrodes 122, 122a, 122b may be arbitrarily combined with the modules 10, 10a to 10c, 100.

The plate-like portion 140 may be inclined with respect to the vertical direction so that the upper end PU of the plate-like portion 140 is located rearward of the lower end PD of the plate-like portion 140. In this case, one or more legs may extend in the front direction from the lower edge LD, and may be inclined with respect to the front-rear direction so that the front ends of the legs are positioned above the rear ends of the legs.

The substrate 12 may have a shape other than a rectangular shape when viewed in the vertical direction.

The number of electronic components 16a to 16c is not limited to three.

Further, the plate-like portion 140 may be provided with one or more upper cutouts and one or more lower cutouts.

The leg portion may not be adjacent to the lower cutout in the left-right direction. Therefore, the leg portion and the lower cutout can be separated in the left-right direction.

Further, the plurality of leg portions all extend in the rear direction from the lower edge LD of the plate-like portion 140. However, all of the plurality of leg portions may extend in the forward direction from the lower side of the plate-like portion 140. Further, some of the plurality of legs may extend in the rear direction from the lower side of the plate-like portion 140, and the rest of the plurality of legs may extend in the front direction from the lower side of the plate-like portion 140.

The shortest distance between the upper notch and the lower notch may be shorter than 1.5 times the plate thickness of the plate-like portion.

The left end of the plate 140 may not be located on the left surface SL1 of the sealing resin layer 18. The right end of the plate-like portion 140 may not be located on the right surface SR1 of the sealing resin layer 18. The upper end PU of the plate-like portion 140 may not be located on the upper surface SU1 of the sealing resin layer 18. Further, the upper end of the plate-like portion 140 may be located on the upper surface SU1 of the sealing resin layer 18, whereby the upper end of the plate-like portion 140 is electrically connected to the shield 20, and the left end of the plate-like portion 140 is not located on the left surface SL1 of the sealing resin layer 18, and the right end of the plate-like portion 140 is not located on the right surface SR1 of the sealing resin layer 18.

The modules 10, 10a to 10c, 100 may not include the shield 20.

Further, the shield 20 may cover at least the upper surface SU1 of the sealing resin layer 18. Therefore, the shield 20 may not cover part or all of the left surface SL1, the right surface SR1, the front surface SF1, and the rear surface SB1 of the sealing resin layer 18, for example.

However, the outer edge of the substrate 12 may not overlap with the outer edge of the sealing resin layer 18 when viewed in the vertical direction. That is, the front surface SF1 of the sealing resin layer 18 may be located before the front surface SF2 of the substrate 12. The rear surface SB1 of the sealing resin layer 18 may be located further rearward than the rear surface SB2 of the substrate 12. The left surface SL1 of the sealing resin layer 18 may be positioned to the left of the left surface SL2 of the substrate 12. The right surface SR1 of the sealing resin layer 18 may be positioned right of the right surface SR2 of the substrate 12.

The electronic components 16a to 16c may not protrude from the metal member 14 in the left or right direction when viewed in the front-rear direction. However, a part of the electronic components 16a to 16c may protrude from the metal member 14 in the left or right direction when viewed in the front-rear direction.

The area of the top surface 148 may be larger than the area of each of the leg portions 146a to 146g. This makes it easy to attach the metal member 14 by the mounter. In addition, the center of gravity of the metal member 14 is located above and in front. Thereby, the metal member 14 is slightly inclined forward. The legs 146a to 146g support the inclination of the metal member 14. Thus, the legs 146a to 146g are slightly immersed in the solders 200a to 200 g. As a result, the solders 200a to 200g are more reliably attached to the leg portions 146a to 146g. Thus, the metal member 14 is more reliably fixed to the mounting electrode 122. In the metal member 14 including the top surface portion 148, a distance from the lower end of the metal member 14 to the vertical direction of the center of gravity of the metal member 14 is, for example, 4/5 or less of the height of the metal member 14 in the vertical direction. Thereby, the independence of the metal member 14 improves.

In the metal member 14 including the top surface portion 148, the center of gravity of the metal member 14 is located rearward of the plate-like portion 140 and forward of the rear ends of the leg portions 146a to 146g in the front-rear direction. Thus, even if the plate-like portion 140 is slightly inclined forward, the center of gravity of the metal member 14 is located near the center of the metal member 14 in the front-rear direction. As a result, the independence of the metal member 14 improves.

Further, for example, the top surface portion 148 does not overlap the electronic component 16c having the highest height in the up-down direction among the electronic components 16a to 16c when viewed in the up-down direction.

Further, the top surface portion 148 is formed by bending a part of the metal member 14 in the rear direction. Accordingly, the top surface portion 148 extends from the plate-like portion 140 in the same direction as the leg portions 146a to 146 g. However, the top surface portion 148 may also be formed by bending a portion of the metal member 14 in the forward direction. That is, the top surface portion 148 may extend from the plate-like portion 140 in a direction opposite to the direction in which the leg portions 146a to 146g extend from the plate-like portion 140. However, from the standpoint of increasing the area in which the electronic components 16a to 16c can be mounted on the upper main surface SU2 of the substrate 12, the top surface portion 148 may extend from the plate-like portion 140 in the same direction as the direction in which the leg portions 146a to 146g extend from the plate-like portion. When the top surface portion 148 and the leg portions 146a to 146g extend in the same direction from the plate-like portion 140, the leg portions 146a to 146g and the top surface portion 148 can be formed simultaneously. In this case, since the number of times of bending the metal member 14 is one, the leg portions 146a to 146g and the top surface portion 148 can be formed with high accuracy. Further, since the number of times of bending the metal member 14 is one, the manufacturing cost of the metal member 14 is reduced.

In the module 10, as shown in fig. 6, the solders 200a to 200g are wetted on the outer surface SO, and the solders 200a to 200g are not wetted on the rear end portions of the legs 146a to 146g. However, the solders 200a to 200g may not wet on the outer surface SO.

The protruding portion 160 may extend from the upper end PU of the plate-like portion 140 in the forward direction.

The metal members 14, 14a to 14n may include one or more leg portions. The metal member 14 may include two or more legs.

The legs 146a to 146g are fixed to the mounting electrodes 122, 122a, and 122b by solder. However, instead of the solder, for example, a resin adhesive containing a metal filler such as Cu or Ag may be used. That is, the leg portions 146a to 146g may be fixed to the mounting electrodes 122, 122a, 122b by using a conductive member such as solder or a resin adhesive.

Description of the reference numerals

10. 10 a-10 c, 100. Substrate; 14. 14 a-14 o. 16a to 16c. Sealing the resin layer; a shield; 122. 122a, 122b. Plate-like portion; 142 a-142 d. 144 a-144 f, 144 x-144 z. 146 a-146 g. 1461. the first part; 1462. a second part; 148. top surface portion; 150 a-150 g. 152 a-152 g. Protrusion; 200 a-200 g. 1221-1227. Inner conductor layer; a resist layer; recess; boundary; a ground conductor layer; LD. the following; LU. the upper edge; SI. the inner surface; SO. the outer surface; sa. imaginary plane; ST. steps.

Claims

1. A module, comprising:

a substrate having an upper main surface and a lower main surface arranged in the vertical direction;

a metal member including a plate-like portion provided on the upper main surface of the substrate and having a front main surface and a rear main surface arranged in a front-rear direction when viewed in a vertical direction;

a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member;

a second electronic component mounted on the upper main surface of the substrate and disposed rearward of the metal member;

a sealing resin layer provided on the upper main surface of the substrate, covering the metal member, the first electronic component, and the second electronic component, and having an upper surface; and

a shield member provided on the upper surface of the sealing resin layer so as to be connected to an upper end of the plate-like portion,

the plate-like portion is inclined with respect to the vertical direction such that an upper end of the plate-like portion is located rearward of a lower end of the plate-like portion, or such that an upper end of the plate-like portion is located forward of the lower end of the plate-like portion.

2. The module of claim 1, wherein the module is further configured to,

a line connecting lower ends of the plate-like portions in the left-right direction is defined as a lower edge when viewed in the front-rear direction,

the metal member further includes one or more legs extending from the lower edge in a forward or rearward direction.

3. The module of claim 2, wherein the module is further configured to,

the plate-like portion is inclined with respect to the vertical direction such that an upper end of the plate-like portion is located rearward of a lower end of the plate-like portion, and the one or more leg portions all extend forward from the lower edge, and are inclined with respect to the longitudinal direction such that a front end of the leg portion is located upward of a rear end of the leg portion.

4. The module of claim 2, wherein the module is further configured to,

the plate-like portion is inclined with respect to the vertical direction such that an upper end of the plate-like portion is located forward of a lower end of the plate-like portion, and the one or more leg portions all extend rearward from the lower edge, and are inclined with respect to the longitudinal direction such that a rear end of the leg portion is located upward of a front end of the leg portion.

5. The module according to any one of claims 1 to 4, wherein,

The left end of the plate-like portion is located on the left surface of the sealing resin layer,

the right end of the plate-like portion is located on the right surface of the sealing resin layer,

the upper end of the plate-like portion is located on the upper surface of the sealing resin layer.

6. The module according to any one of claims 1 to 4, wherein,

the metal member includes a plurality of the feet,

the substrate includes a mounting electrode that is a portion of an upper main surface of the substrate,

the plurality of leg portions are fixed to the mounting electrode by a conductive member.

7. The module of claim 6, wherein the module is further configured to,

the mounting electrode comprises a plurality of small electrodes,

the plurality of leg portions are fixed to the plurality of small electrodes by conductive members, respectively.

8. The module of claim 6, wherein the module is further configured to,

the mounting electrode is an electrode which,

the plurality of leg portions are fixed to one electrode, that is, the mounting electrode, by an integrated conductive member.

9. The module according to any one of claims 2 to 4, wherein,

the one or more feet extend in a rearward direction from the lower edge,

the upper main surface of the substrate is provided with a first upper main surface part and a second upper main surface part,

The first upper main surface portion is located above the second upper main surface portion,

the foot includes a first portion including a front end of the foot and a second portion including a rear end of the foot,

the first portion overlaps the second upper main surface portion and the second portion overlaps the first upper main surface portion when viewed in the vertical direction, whereby the plate-like portion is inclined with respect to the vertical direction so that the upper end of the plate-like portion is located forward of the lower end of the plate-like portion.

10. The module of claim 9, wherein the module is further configured to,

the substrate further includes a resist layer disposed on the first upper main surface portion but not on the second upper main surface portion.

11. The module of claim 9, wherein the module is further configured to,

the substrate includes an inner conductor layer disposed inside the substrate,

the first upper main surface portion overlaps the inner conductor layer when viewed in the vertical direction, and is thus located above the second upper main surface portion.

12. The module of claim 9, wherein the module is further configured to,

a concave portion recessed downward is provided on the upper main surface of the substrate,

The second upper main surface is an inner surface of the concave portion.