CN219851839U

CN219851839U - Chip pin bending equipment

Info

Publication number: CN219851839U
Application number: CN202321245984.0U
Authority: CN
Inventors: 王刚; 封鸣
Original assignee: Huisi Electronics Shanghai Co ltd
Current assignee: Huisi Electronics Shanghai Co ltd
Priority date: 2023-05-22
Filing date: 2023-05-22
Publication date: 2023-10-20
Anticipated expiration: 2033-05-22

Abstract

The utility model discloses chip pin bending equipment which is used for processing at least one pair of pins of a chip, the chip pin bending equipment comprises a bending mechanism, the bending mechanism comprises at least one mounting seat and at least one bending component, the mounting seat comprises a mounting body and at least one pair of limiting pieces, the bending component comprises a bending component, a driving and moving piece and at least one resetting piece, the bending component comprises at least one pair of bending pieces and a pair of pushing and moving pieces, each limiting piece is arranged on one side of one bending piece, the driving and moving piece is arranged to drive one pair of pushing and moving pieces to slide on the mounting body to be far away from each other, so that two bending pieces of each pair are far away from each other and press the processing parts of the pins to bend the processing parts based on the fact that the corresponding pair of pins are respectively abutted by the corresponding limiting pieces.

Description

Chip pin bending equipment

Technical Field

The utility model relates to the technical field of chip processing, in particular to chip pin bending equipment.

Background

To ensure that the chip can meet the process requirements during the plugging process, the pins of the chip are typically bent into the desired shape by mechanical means. When the chip is designed, two pins which are symmetrically distributed by taking the axis of the chip as a boundary line are required to be bent back locally.

At present, the bending operation of the chip pins is mostly finished manually, and the bending precision and the bending angle consistency are difficult to ensure because of larger errors in manual operation. When the pins of the chip are bent by using the bending equipment, two pins which are symmetrically distributed by taking the axis of the chip as a boundary line are taken as a pair, and the bending direction of the pins by the bending equipment is single, so that after one pin of at least one pair is bent by the bending equipment, the placing positions of the two pins in the pair need to be changed by turning over the chip, the other pin of the at least one pair can be locally bent by the bending equipment, and the paired pins are locally bent back to the bent chip. Obviously, the bending efficiency is very low, and the batch production requirement is difficult to meet.

Disclosure of Invention

The utility model has the advantages that the chip pin bending equipment is provided, pins of at least one pair of chips can be bent back at the same time, and compared with the prior art, the bending quality is higher.

The utility model has the advantages that the chip pin bending equipment is provided, pins of at least one pair of chips can be simultaneously bent back, the bending efficiency is effectively improved, and the requirement of mass production is met.

To achieve at least one of the above advantages, the present utility model provides a chip pin bending apparatus for processing at least one pair of pins of a chip, two pins of a pair being disposed at intervals, the chip pin bending apparatus including a bending mechanism, the bending mechanism including:

the mounting seat comprises a mounting body and at least one pair of limiting pieces, and the limiting pieces are mounted on the mounting body;

at least one bending member, the bending member comprising:

the bending assembly comprises at least one pair of bending pieces and a pair of pushing pieces, the logarithm of the limiting pieces is consistent with that of the bending pieces, each limiting piece is arranged on one side of one bending piece, the two bending pieces of one pair are arranged to be close to or far away from each other, when the distance between the two bending pieces of one pair is shortest, the horizontal distance between each bending piece and the corresponding limiting piece is matched with the size of a pin, the pin is defined as a processing part near the bending piece and corresponding to at least part of the bending pieces, one bending piece in each pair is correspondingly arranged on one pushing piece, the pushing piece is slidably arranged on the mounting body, and the pushing piece is arranged to drive the corresponding bending piece to move;

the driving and moving piece is arranged to drive a pair of pushing pieces to slide on the mounting body to be far away from each other, so that two bending pieces of each pair are far away from each other and press the processing parts of the pins to bend the processing parts based on the fact that the corresponding pins of the corresponding pair are respectively abutted by the corresponding limiting pieces;

at least one piece resets, reset the piece install in bend the subassembly, reset the piece can be in a pair of pass the piece drive at least a pair of bend piece is kept away from each other and takes place elastic deformation, and reset the piece can in bend the subassembly and reset when not receiving external force effect bend the subassembly.

According to an embodiment of the present utility model, a forming surface is formed on a side of each pair of bending members away from each other, the forming surfaces of the two bending members are bent and inclined in opposite directions and extend to form an included angle of an acute angle, and the forming surfaces are used for guiding the forming of the processing portion of the pin.

According to an embodiment of the present utility model, a joint surface is formed on a side of each pair of bending members away from each other, the joint surface is tangent to a curved portion of the molding surface, the molding surface corresponds to the processing portion of the pin when the corresponding pin is pressed by the bending members, and the processing portion of the pin is away from the joint surface and corresponds to one end of the corresponding limiting member.

According to an embodiment of the present utility model, a pair of pushing members are disposed opposite to each other and form an insertion space and a through hole communicating with the insertion space, two opposite sides of the insertion space formed by the pair of pushing members are disposed obliquely and define pressure surfaces, the driving member is capable of moving relative to the pushing members and moving into or out of the insertion space from the through hole, an included angle between a direction in which the pressure surfaces extend and a moving direction in which the driving member moves into the insertion space is an obtuse angle, and the driving member presses the pressure surfaces of the two pushing members to push the two pushing members away from each other during the process of entering the insertion space.

According to an embodiment of the present utility model, the mounting base further includes at least one pair of stoppers, the stoppers are mounted on the mounting body, each of the stoppers is spaced from one of the stoppers, and when the processing portion of the pin is bent by the bending member, the stoppers and the corresponding stoppers are abutted against both end portions of the processing portion.

According to an embodiment of the present utility model, the bending mechanism further includes a positioning element, the number of the positioning elements is identical to the number of the bending members, the positioning element is mounted on the mounting body, the two limiting elements of each pair are respectively located at two sides of the positioning element, and when each pair of pins of the chip is respectively and correspondingly located between the paired bending elements and the corresponding limiting elements, the positioning element is located between the two pins of each pair.

According to an embodiment of the present utility model, the bending members are provided with a plurality of pairs of bending members, the pressed surfaces of the pushing members of different bending members have different inclinations, and spaces formed by two bending members of different bending members and corresponding limiting members respectively correspond to two pins of different pairs of the chip positioned by the positioning members.

According to an embodiment of the present utility model, the die pin bending apparatus further includes a cutting assembly, where the cutting assembly is disposed at a station adjacent to the bending mechanism, the cutting assembly includes a cutting member and a supporting member, the cutting member is disposed opposite to the supporting member, and the cutting member is disposed to be movable relative to the supporting member to approach or separate from the supporting member, and the supporting member is configured to support the die, and the cutting member is movable relative to the supporting member to be close to the die supported by the supporting member to cut the die.

According to an embodiment of the present utility model, the die pin bending apparatus further includes a die holder assembly, the die holder assembly includes an upper die holder and a lower die holder, the upper die holder and the lower die holder are disposed opposite to each other in a die-locking manner, the mounting base and the supporting member are both mounted on the lower die holder, and the driving member and the cutting member are both mounted on the upper die holder, and each of the bending member and the cutting member is capable of processing the pin of the die when the upper die holder and the lower die holder are die-locked.

According to an embodiment of the present utility model, the die pin bending apparatus further includes a conveying mechanism mounted to the lower die holder, the conveying mechanism being adjacent to the supporting member and extending from an adjacent position of the position where the supporting member is located to a position adjacent to the mounting base, the conveying mechanism being configured to be capable of guiding the die from a position corresponding to the cutting assembly to a position corresponding to the bending mechanism or from a position corresponding to the bending mechanism to a position corresponding to the cutting assembly.

Drawings

Fig. 1 shows a schematic structural diagram of the chip pin bending apparatus according to the present utility model.

Fig. 2 shows a partial structural view of the chip pin bending apparatus according to the present utility model.

Fig. 3 shows a perspective view of the chip pin bending apparatus of the present utility model before a partial structural movement.

Fig. 4 is a perspective view showing a partial structure of the chip pin bending apparatus according to the present utility model after movement.

Fig. 5 is a partial structural cross-sectional view showing a chip pin bending apparatus according to the present utility model.

Fig. 6 shows a bottom view of the structure of the chip pin bending apparatus according to the present utility model.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the utility model. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the utility model defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the utility model.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present utility model.

It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.

Referring to fig. 1 to 2, a chip pin bending apparatus according to a preferred embodiment of the present utility model for processing at least one pair of pins of a chip, two of the pins of a pair being spaced apart, will be described in detail below.

The chip pin bending device comprises a bending mechanism 100, wherein the bending mechanism 100 comprises at least one mounting seat 10, the mounting seat 10 comprises a mounting body 11 and at least one pair of limiting pieces 12, and the limiting pieces 12 are mounted on the mounting body 11.

Referring to fig. 3 to 4, the bending mechanism 100 includes at least one bending member 20, the bending member 20 includes a bending assembly 21, the bending assembly 21 includes at least one pair of bending members 211, and the number of pairs of the limiting members 12 is consistent with the number of pairs of the bending members 211. Each of the limiting members 12 is disposed at one side of one of the press bending members 211, and a pair of two of the press bending members 211 are disposed to be able to approach or separate from each other. When the distance between the two press bending pieces 211 of a pair is shortest, the horizontal distance between each press bending piece 211 and the corresponding limiting piece 12 is matched with the size of the pin. The portion of the pin located near the limiting member 12 and corresponding to at least part of the bending member 211 is defined as a processing portion.

The two press-bending pieces 211 of a pair can be separated from each other to press the processed portions of the pins to bend the processed portions based on the pins of the corresponding pair being respectively abutted by the corresponding stopper 12.

The bending assembly 21 further includes a pair of pusher shoes 212, wherein one of the press bending pieces 211 in each pair is correspondingly mounted on one pusher shoe 212, the pusher shoe 212 is slidably mounted on the mounting body 11, and the pusher shoe 212 is configured to drive the corresponding press bending piece 211 to move.

The bending member 20 further includes a driving member 22, where the driving member 22 is configured to drive a pair of pushing members 212 to slide on the mounting body 11 so as to be away from each other, so that two bending members 211 of each pair are away from each other to cooperate with the corresponding limiting members 12 to bend the processing portions of the corresponding pair of pins back to each other, and compared with the prior art, the bending efficiency is higher while the bending quality is ensured.

Referring to fig. 5, a pair of pusher shoes 212 are disposed opposite each other and define a socket 21201 and a through hole 21202 communicating with socket 21201. A pair of pusher shoes 212 are disposed obliquely to opposite sides of the insertion space 21201 and each define a pressed surface 21203. The driver 22 can be moved relative to the pusher 212 to move into and out of the insertion space 21201 via the opening 21202. The included angle between the extending direction of the pressure-receiving surface 21203 toward the through hole 21202 and the moving direction of the driving member 22 into the insertion space 21201 is an obtuse angle. In the process of entering the plugging space 21201, the driving member 22 presses the pressed surfaces 21203 of the two pushing members 212 to push the two pushing members 212 away from each other, so that the two bending members 211 of each pair synchronously move and cooperate with the corresponding limiting members 12 to bend the processing parts of the pins of the corresponding pair back.

It should be noted that the driving member 22 can push the pushing member 212 to move to different degrees, so as to control the degree to which the processing portion of the pin is bent, so as to achieve bending of the pin of the chip to different degrees.

Referring to fig. 5, further, the bending member 20 includes at least one restoring member 23, the restoring member 23 is mounted on the bending assembly 21, the restoring member 23 can be elastically deformed when the pushing member 212 drives the at least one pair of bending members 211 to move away from each other, and the restoring member 23 can restore the bending assembly 21 when the bending assembly 21 is not affected by external force.

Preferably, the restoring element 23 is embodied as a spring.

Preferably, two restoring members 23 are provided, and one end of each restoring member 23 is connected to one pusher 212 and the other end is connected to the mounting body 11. When at least one pair of bending members 211 are far away from each other, each pushing member 212 moves close to a portion of the mounting body 11 on the same side thereof and compresses the corresponding restoring member 23, thereby storing energy for restoring the bending assembly 21.

Referring to fig. 2, a forming surface 21101 is formed on a side of each pair of press bending members 211 away from each other, and the forming surfaces 21101 of the two press bending members 211 are bent and inclined toward each other and extend to form an acute angle. The molding surface 21101 is used for guiding the processing part of the pin to be molded, so that the inclination of the processing part after bending is consistent with the molding surface 21101, and the bending quality is improved.

Preferably, a joint surface 21102 is formed on a side of each pair of the press bending members 211 away from each other, and the joint surface 21102 is tangential to a curved portion of the forming surface 21101. When the press bending piece 211 applies pressure to the corresponding pin, the molding surface 21101 corresponds to the processing portion of the pin, the engagement surface 21102 corresponds to one end of the processing portion of the pin, which is far away from the corresponding limiting piece 12, so as to increase the contact surface of the press bending piece 211 when bending the pin, facilitate bending and prevent the pin from being crushed due to stress concentration during bending.

Referring to fig. 2 to 4, the mounting base 10 further includes at least one pair of stoppers 13, the stoppers 13 are mounted on the mounting body 11, and each of the stoppers 13 is spaced apart from one of the stoppers 12. When the processing portion of the pin is bent by the press bending member 211, the stopper 13 and the corresponding stopper 12 are abutted together at both end portions of the processing portion to assist in bending the pin into a predetermined shape.

Referring to fig. 5, the mounting body 11 has at least one sliding structure 1101, the bending assembly 21 is slidably mounted to the sliding structure 1101, and the sliding structure 1101 is used for guiding the bending assembly 21 to move.

Preferably, the sliding structure 1101 is implemented as a through hole, and the mounting body 11 further has an opening 1102, which communicates with the through hole 21202, and which communicates with the through hole, and the opening 1102 has a size larger than that of the driving member 22, so that the driving member 22 enters the through hole through the opening 1102 to push the pusher member 212 in the through hole to move.

Referring to fig. 2 to 5, the bending mechanism 100 further includes a positioning member 30, and the number of positioning members 30 is identical to the number of bending members 20. The positioning members 30 are mounted on the mounting body 11, and the two limiting members 12 of each pair are respectively located at two sides of the positioning members 30. When each pair of pins of the chip is respectively and correspondingly placed between the pair of bending members 211 and the corresponding limiting member 12, the positioning member 30 is located between two pins of each pair, and the positioning member 30 is used for positioning the chip so as to perform bending subsequently.

In an embodiment, one bending member 20 is provided, the bending members 211 are provided with a plurality of pairs, and the spaces formed by two bending members 211 in different pairs and the corresponding limiting members 12 respectively correspond to two pins in different pairs of the chip after being positioned by the positioning member 30. When the pair of pushing members 212 are driven to move away from each other, the pins of the chip can be bent back by the corresponding pairs of bending members 211 at the same bending angle, so as to bend all the pins simultaneously.

Preferably, the bending members 20 are provided with a plurality of pairs of bending pieces 211, the pressed surfaces 21203 of the pushing pieces 212 of different bending members 20 have different inclinations, and spaces formed by two bending pieces 211 in different bending members 20 and corresponding limiting pieces 12 respectively correspond to two pins of different pairs of the chip positioned by the positioning pieces 30. When the pushing members 212 of the bending members 20 are driven to move away from each other, the pins of the chip of the plurality of pairs can be bent back to each other by the corresponding pairs of bending members 211 at different bending angles, so that the pins of different pairs can be bent in a targeted manner.

Referring to fig. 1 and 6, the die pin bending apparatus further includes a cutting assembly 200, where the cutting assembly 200 is disposed at a station adjacent to the bending mechanism 100. The cutting assembly 200 includes a cutting member 210 and a supporting member 220, the cutting member 210 being disposed opposite the supporting member 220, and the cutting member 210 being disposed to be movable with respect to the supporting member 220 to approach or separate from the supporting member 220. The supporting member 220 is configured to support the chip, and the cutting member 210 can move relatively to the supporting member 220 to be close to the chip supported by the supporting member 220, so as to cut the pins, so as to ensure that the chip after bending meets the processing requirement.

Referring to fig. 1, the supporting member 220 has a receiving space 22001 and an interface 22002 communicating with the receiving space 22001, when the chip is carried by the supporting member 220, a portion of the leads are located in a direction in which the receiving space 22001 extends toward the interface 22002, a size of the interface 22002 is not smaller than a size of the cut portion of the leads, and the receiving space 22001 is used for collecting the cut leads.

Referring to fig. 1 to 2, the cutting assembly 200 further includes a pair of stoppers 230, the pair of stoppers 230 are spaced apart from the supporter 220, a distance between the pair of stoppers 230 matches a distance between two pins spaced farthest from the chip, and the stoppers 230 are used for positioning the chip to ensure that the pin cutting operation can be smoothly performed.

Referring to fig. 1 to 2, the die pin bending apparatus further includes a die holder assembly 300, the die holder assembly 300 includes an upper die holder 310 and a lower die holder 320, and the upper die holder 310 and the lower die holder 320 are disposed opposite to each other in a die-clamping manner. The mounting base 10 and the supporting member 220 are both mounted to the lower die holder 320, and the driving member 22 and the cutting member 210 are both mounted to the upper die holder 310. When the upper die holder 310 and the lower die holder 320 are clamped, each of the bending member 20 and the cutting assembly 200 can process the pin of the chip, so as to improve the processing efficiency.

Referring to fig. 1, the die pin bending apparatus further includes a conveying mechanism 400, where the conveying mechanism 400 is mounted on the lower die holder 320, and the conveying mechanism 400 is adjacent to the supporting member 220 and extends from a position adjacent to the position where the supporting member 220 is located to a position adjacent to the mounting base 10. The transfer mechanism 400 is provided to guide the chips from the position corresponding to the cutting unit 200 to the position corresponding to the bending mechanism 100 or from the position corresponding to the bending mechanism 100 to the position corresponding to the cutting unit 200, thereby realizing continuous processing.

Preferably, the transfer mechanism 400 is implemented to include, but is not limited to, a rail cylinder.

The working method of the chip pin bending equipment is provided, and comprises the following steps:

the driving member 22 moves relative to the bending assembly 21 to approach, the driving member 22 drives the pair of pushing members 212 to communicate and separate from each other, at least one pair of bending members 211 correspondingly connected with the pair of pushing members 212 synchronously separate from each other, at this time, the at least one pair of bending members 211 applies pressure to the corresponding pair of pins and enables the processing part of the pin to be bent based on the contact between the pin and the corresponding limiting member 12, so as to realize at least one pair of pins facing away from the partially bent chip at the same time, and at the same time, the resetting member 23 is elastically deformed under the action of the movement of the bending assembly 21;

when the driving member 22 moves away from the bending assembly 21, the pair of pushing members 212 are elastically acted by the resetting member 23 to approach each other, so as to reset the pins of the subsequent chip.

Preferably, the working method of the chip pin bending equipment comprises the following steps:

before or after the leads of the chip are bent by the bending member 20, the cutting member 210 moves to approach the supporting member 220 to cut the leads of the chip supported by the supporting member 220.

the upper die holder 310 moves relative to the lower die holder 320 to clamp the dies, so as to drive the driving member 22 to move close to the bending assembly 21, and the cutting member 210 moves close to the supporting member 220, so that a plurality of chips can simultaneously perform bending and cutting operations respectively;

the transfer mechanism 400 moves to move the chips from the position corresponding to the bending mechanism 100 to the position corresponding to the cutting assembly 200 or from the position corresponding to the cutting assembly 200 to the position corresponding to the bending mechanism 100 to realize continuous processing.

It will be appreciated by persons skilled in the art that the embodiments of the utility model described above and shown in the drawings are by way of example only and are not limiting. The advantages of the present utility model have been fully and effectively realized. The functional and structural principles of the present utility model have been shown and described in the examples and embodiments of the utility model may be modified or practiced without departing from the principles described.

Claims

1. Chip pin equipment of bending for process at least a pair of pin of a chip, a pair of two the pin interval sets up, its characterized in that, chip pin equipment of bending includes a mechanism of bending, the mechanism of bending includes:

at least one bending member, the bending member comprising:

2. The die pin bending apparatus according to claim 1, wherein a pair of said press bending members each have a molding surface formed on a side thereof away from each other, said molding surfaces of both said press bending members being curved and inclined toward each other and extending to form an acute angle, said molding surfaces being adapted to guide said molding of said processed portion of said pin.

3. The die pin bending apparatus according to claim 2, wherein one side of each pair of the press bending members away from each other forms an engagement surface, the engagement surface being tangent to a curved portion of the molding surface, the molding surface corresponding to the processed portion of the pin when the press bending members press the corresponding pin, the processed portion of the pin of the engagement surface being away from one end of the corresponding stopper.

4. A chip pin bending apparatus according to any one of claims 1 to 3, wherein a pair of pusher shoes are disposed opposite to each other and form an insertion space and a through hole communicating with the insertion space, two opposite sides of the insertion space formed by the pair of pusher shoes are disposed obliquely and each define a pressing surface, the driving member is movable relative to the pusher shoes to move into or out of the insertion space from the through hole, an included angle between a direction in which the pressing surface extends and a moving direction in which the driving member moves into the insertion space is an obtuse angle, and the driving member presses the pressing surfaces of the two pusher shoes to push the two pusher shoes away from each other during entering the insertion space.

5. The die pin bending apparatus according to claim 4, wherein the mounting base further comprises at least one pair of stoppers, the stoppers are mounted on the mounting body, each of the stoppers is spaced from one of the stoppers, and when the processing portion of the pin is bent by the press bending member, the stoppers and the corresponding stoppers are abutted together at both ends of the processing portion.

6. The die pin bending apparatus according to claim 5, wherein the bending mechanism further comprises a positioning member, the number of the positioning members is identical to the number of the bending members, the positioning member is mounted on the mounting body, the two limiting members of each pair are respectively located on both sides of the positioning member, and the positioning member is located between the two pins of each pair when the pins of each pair of the die are respectively placed between the pair of the bending members and the corresponding limiting members.

7. The die pin bending apparatus according to claim 6, wherein a plurality of bending members are provided, the press bending pieces are provided in a pair, the pressed faces of the pusher pieces of different bending members are different in inclination, and spaces formed by two of the press bending pieces of different bending members and the corresponding stoppers respectively correspond to two of the pins of different pairs of the die after the die is positioned by the positioning pieces.

8. The die pin bending apparatus of claim 1, further comprising a cutoff assembly disposed at a station adjacent to the bending mechanism, the cutoff assembly comprising a cutoff member disposed opposite the support member and movable relative to the support member toward and away from the support member, the support member being configured to support the die, the cutoff member being movable relative to the support member toward the die supported by the support member to cut the die.

9. The die pin bending apparatus of claim 8, further comprising a die holder assembly including an upper die holder and a lower die holder, the upper die holder and the lower die holder being clampingly opposed, the mounting base and the support each being mounted to the lower die holder, the displacement member and the cutoff member each being mounted to the upper die holder, each of the bending member and the cutoff member being capable of processing the pin of one of the dies when the upper die holder and the lower die holder are clamped.

10. The die pin bending apparatus of claim 9, further comprising a transfer mechanism mounted to the die holder, the transfer mechanism adjacent to the support and extending from a position adjacent to the position where the support is located to a position adjacent to the mount, the transfer mechanism being configured to guide the die from a position corresponding to the severing assembly to a position corresponding to the bending mechanism or from a position corresponding to the bending mechanism to a position corresponding to the severing assembly.