CN219841918U - PCB thickness measuring device - Google Patents
PCB thickness measuring device Download PDFInfo
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- CN219841918U CN219841918U CN202320505096.1U CN202320505096U CN219841918U CN 219841918 U CN219841918 U CN 219841918U CN 202320505096 U CN202320505096 U CN 202320505096U CN 219841918 U CN219841918 U CN 219841918U
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- 230000007246 mechanism Effects 0.000 claims description 3
- 238000010330 laser marking Methods 0.000 claims 2
- 238000005259 measurement Methods 0.000 abstract description 38
- 238000012360 testing method Methods 0.000 abstract description 5
- 239000007795 chemical reaction product Substances 0.000 abstract description 4
- 230000001360 synchronised effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 15
- 239000000047 product Substances 0.000 description 11
- 238000013461 design Methods 0.000 description 10
- 238000005553 drilling Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012938 design process Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Length Measuring Devices By Optical Means (AREA)
Abstract
The utility model relates to a PCB thickness measuring device, which comprises an equipment frame, wherein a Y-axis electric rail and an X-axis electric rail are respectively arranged in the equipment frame, a code printing fixed support is fixedly connected to the top of the equipment frame, a measuring table top is fixedly connected to the top of the code printing fixed support, laser code printing devices are connected to the Y-axis electric rail and the X-axis electric rail in a sliding manner, an infrared ranging laser is fixedly arranged in the laser code printing devices, the Y-axis electric rail comprises a Y-axis movement rail and a first servo motor, and the X-axis electric rail comprises an X-axis movement rail and a second servo motor. This PCB board thickness measuring device, the demand of 10um is satisfied to measurement precision, and repetition precision satisfies 0.75um, can satisfy the demand of high-end product: by adopting a more accurate laser thickness gauge and matching with a fixed double-end synchronous test, high-precision measurement can be realized.
Description
Technical Field
The utility model relates to the technical field of PCB thickness measurement, in particular to a PCB thickness measurement device.
Background
With the development of the electronic industry, people put forward new requirements on the light weight of electronic products, which are not only tests on electronic components, but also put forward higher requirements on a motherboard PCB matched with the electronic components, and in order to match the high-density layout of the electronic components, the Pitch requirement of the PCB products is very high, so that the PCB is required to put forward a very harsh target on the uniformity of board bending, board warping and board thickness so as to adapt to the mounting requirements of the electronic components.
In order to ensure the assembly requirement of customers, monitoring equipment for plate thickness needs to be introduced in a plurality of links of design, processing and inspection so as to monitor the quality of products, wherein the measurement of the plate thickness has two main applications: 1. detecting the distribution and actual conditions of the plate thickness, searching variation, intercepting defective products and guiding front end improvement; 2. the measured data guide the back drilling to be used, and the accuracy control of the back drilling Stub is improved, but the conventional measurement means and methods have certain defects, the accuracy of the data and the measured density cannot meet the requirements, the data cannot really guide the production and promote the front end application to be improved, and the requirement of a new measurement method is particularly important.
Currently, there are two main types of plate thickness measurement in the PCB industry: 1. single-point infrared measurement: and (3) manually operating, namely placing the product on a table top, judging by naked eyes of a person, placing the region to be measured on an infrared point, finishing the measuring process once every time when pressing, repeating the process, and finally finishing the measuring process. The method has the advantages that the equipment is simpler, the operation flexibility is high, but the number of times of measurement is limited because of the personnel measurement mode, and the data quantity is relatively small; the manual positioning mode of personnel leads to lower positioning precision, and the actual plate thickness precision measured by the equipment is only about 1-2mi because of the design deficiency; because of the defects, the measured data cannot accurately correspond to the required hole sites, the measured error is larger than 1%, and the method cannot be applied to the deep drilling operation guidance and has a certain risk; the measured data are less, the plate thickness distribution of the whole plate surface cannot be accurately judged, and the improvement pushing of the front end is insufficient; 2. nine-point laser thickness measurement: the thickness measurement is carried out at three straight line positions fixed on the board surface through three fixed laser heads, the data is recorded as the measurement relative to a single point, the data measured by the method is more to a certain extent, and the automation degree is high, but because the measured positions are fixed, the data are relatively less, the limitation exists in reference, the method is generally only used for monitoring the changing direction of the board thickness and is not actually used as a data source for guiding design and rear end production, so the PCB board thickness measurement device is provided for solving the problems.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a PCB thickness measuring device which has the advantages of high measurement accuracy and the like, and solves the problem of low measurement accuracy of the traditional PCB thickness measuring method.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a PCB board thickness measuring device, includes the equipment frame, the inside of equipment frame is provided with Y axle electric rail and X axle electric rail respectively, the top fixedly connected with of equipment frame beats the sign indicating number fixed bolster, the top fixedly connected with of beating sign indicating number fixed bolster measures the mesa, sliding connection has laser to beat the sign indicating number ware on Y axle electric rail and the X axle electric rail, the inside fixed mounting of laser to beat the sign indicating number ware has infrared range finding laser.
Further, the Y-axis electric rail comprises a Y-axis movement rail and a first servo motor.
Further, the X-axis electric rail comprises an X-axis movement rail and a second servo motor.
Further, a clamping mechanism for fixing the PCB is arranged on the measuring table.
Further, the measurement speed of the infrared ranging laser is 500 times/S.
Further, the number of the laser code printing device and the number of the infrared ranging lasers are two.
Further, the bottom of the equipment frame is connected with supporting legs in a threaded mode, and the number of the supporting legs is four.
Compared with the prior art, the utility model provides a PCB thickness measuring device, which comprises the following components
The beneficial effects are that:
1. the PCB thickness measuring device matches design data, and can select the whole coverage surface according to the customized measuring scheme required: the measured area is specified by the engineering department directly in the drawing when designing, the whole coverage area can be selected, and only the deep drilling area can be selected; the minimum unit for measurement can be set to be 0.5mm at the minimum, so that the plate thickness variation condition of the measurement areas at different positions can be fed back more accurately.
2. This PCB board thickness measuring device, according to drawing accurate positioning measurement station, really accomplish demand and actual zero error: the servo motor drives the measuring laser to accurately reach the designated position of the drawing, so that the actual demand and the measuring position are highly overlapped, and the measuring error caused by naked eye observation of personnel is avoided.
3. This PCB board thickness measuring device, the data of measuring can accurate match actual drawing position to present visual picture, not only can instruct the front end design but also can establish ties data and deep drilling equipment, direct guide production: the measurement data can generate a 9-color chart, so that the variation range of the plate thickness can be observed very intuitively, and is used for engineering designers to refer to the measurement data in the design process, and the stacking structure and the copper residue design can be adjusted conveniently; the measured data can be in one-to-one correspondence with the actual performance of the plate (laser coding), the data can be called when the deep drill is used, the depth of the deep drill is set according to the plate thickness, and compared with the previous macro-subarea, the deep drill of the subarea has higher guiding significance.
4. This PCB board thickness measuring device, the demand of 10um is satisfied to measurement precision, and repetition precision satisfies 0.75um, can satisfy the demand of high-end product: by adopting a more accurate laser thickness gauge and matching with a fixed double-end synchronous test, high-precision measurement can be realized.
Drawings
FIG. 1 is a perspective view of the structure of the present utility model;
FIG. 2 is a schematic diagram of the structure of the present utility model;
fig. 3 is a top view of the structure of the present utility model.
In the figure: 1 equipment frame, 2Y axle electric rail, 3X axle electric rail, 4 measuring table-board, 5 coding fixed bolster, 6 laser coding ware, 7 infrared range finding laser instrument.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, a PCB board thickness measuring apparatus in this embodiment includes an apparatus frame 1, a Y-axis electric rail 2 and an X-axis electric rail 3 are respectively disposed in the apparatus frame 1, a code printing fixing support 5 is fixedly connected to the top of the apparatus frame 1, a measuring table top 4 is fixedly connected to the top of the code printing fixing support 5, laser code printing devices 6 are slidingly connected to the Y-axis electric rail 2 and the X-axis electric rail 3, and an infrared ranging laser 7 is fixedly mounted in the laser code printing devices 6. According to the drawing, the measuring point is accurately positioned, so that the requirements and the actual zero error are really met: the servo motor drives the measuring laser to accurately reach the designated position of the drawing, so that the actual demand and the measuring position are highly overlapped, and the measuring error caused by naked eye observation of personnel is avoided; the measurement precision meets the requirement of 10um, the repetition precision meets the requirement of 0.75um, and the requirement of high-end products can be met: by adopting a more accurate laser thickness gauge and matching with a fixed double-end synchronous test, high-precision measurement can be realized.
The Y-axis electric rail 2 comprises a Y-axis movement rail and a first servo motor, the X-axis electric rail 3 comprises an X-axis movement rail and a second servo motor, a clamping mechanism used for fixing a PCB is arranged on the measuring table top 4, the measuring speed of the infrared ranging laser 7 is 500 times/S, the number of the laser code printer 6 and the number of the infrared ranging laser 7 are two, the bottom of the equipment frame 1 is in threaded connection with supporting legs, and the number of the supporting legs is four.
When the embodiment is used, after the measuring product is fixed by furniture, the laser Mark head is started first, and the laser Mark A-01 (double-sided); starting laser thickness measurement, gradually measuring the whole plate surface by equipment according to the setting, simultaneously working the upper laser thickness measurement and the lower laser thickness measurement, ensuring the precision, setting a walking path according to the drawing, and uploading data to a PC end in real time; dividing the product into 278709 areas by software according to the size of the product and the size of the Cell, respectively adding measured data into corresponding grid frames, and marking the data into 9 color charts according to the difference of grid settings; the 9-color chart is that according to the requirements of products, the plate thickness difference is divided into 9 grades from a to i, wherein a is the difference of <0.5mil, and the color is dark green; b is a difference of more than or equal to 0.5mil and less than 1mil, and the color is light green; by analogy, h is the difference of more than or equal to 3.5mil and less than 4mil, and the color is light red; i is the difference of more than or equal to 4mil, and the color is dark red; the software marks the plate surface by using the 9-color chart according to the difference conditions measured by theory and practice to obtain a plate thickness distribution area chart which can be used by engineering personnel to promote the improvement of a design end; thus, the measurement work of the 1WPNL product is completed, and the above actions are repeated until the whole batch of product operation is completed; the measurement data are uploaded to a drilling machine through a system, and the uploaded data comprise plate thickness and coordinate information; the deep drilling machine table utilizes the data to carry out identification and partition operation, drill depths of different areas are respectively set, the drill depths are purposefully adjusted, the level of a Stub is ensured, and the whole deep drilling operation is completed.
The beneficial effects of the embodiment are as follows:
the PCB thickness measuring device matches design data, and can select the whole coverage surface according to the customized measuring scheme required: the measured area is specified by the engineering department directly in the drawing when designing, the whole coverage area can be selected, and only the deep drilling area can be selected; the minimum unit for measurement can be set to be 0.5mm cell at minimum, and the plate thickness variation conditions of the measurement areas at different positions can be fed back more accurately.
This PCB board thickness measuring device, according to drawing accurate positioning measurement station, really accomplish demand and actual zero error: the servo motor drives the measuring laser to accurately reach the designated position of the drawing, so that the actual demand and the measuring position are highly overlapped, and the measuring error caused by naked eye observation of personnel is avoided.
This PCB board thickness measuring device, the data of measuring can accurate match actual drawing position to present visual picture, not only can instruct the front end design but also can establish ties data and deep drilling equipment, direct guide production: the measurement data can generate a 9-color chart, so that the variation range of the plate thickness can be observed very intuitively, and is used for engineering designers to refer to the measurement data in the design process, and the stacking structure and the copper residue design can be adjusted conveniently; the measured data can be in one-to-one correspondence with the actual performance of the plate (laser coding), the data can be called when the deep drill is used, the depth of the deep drill is set according to the plate thickness, and compared with the previous macro-subarea, the deep drill of the subarea has higher guiding significance.
This PCB board thickness measuring device, the demand of 10um is satisfied to measurement precision, and repetition precision satisfies 0.75um, can satisfy the demand of high-end product: by adopting a more accurate laser thickness gauge and matching with a fixed double-end synchronous test, high-precision measurement can be realized.
The electrical components appearing herein are all electrically connected with the master controller and the power supply, the master controller can be a conventional known device for controlling a computer and the like, and the prior art of power connection is not described in detail herein.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a PCB board thickness measuring device, includes equipment frame (1), its characterized in that: the automatic marking device is characterized in that a Y-axis electric rail (2) and an X-axis electric rail (3) are respectively arranged in the equipment frame (1), a marking fixed support (5) is fixedly connected to the top of the equipment frame (1), a measuring table top (4) is fixedly connected to the top of the marking fixed support (5), a laser marking device (6) is connected to the Y-axis electric rail (2) and the X-axis electric rail (3) in a sliding mode, and an infrared ranging laser (7) is fixedly arranged in the laser marking device (6).
2. The apparatus of claim 1, wherein: the Y-axis electric rail (2) comprises a Y-axis movement rail and a first servo motor.
3. The apparatus of claim 1, wherein: the X-axis electric track (3) comprises an X-axis movement track and a second servo motor.
4. The apparatus of claim 1, wherein: the measuring table top (4) is provided with a clamping mechanism for fixing the PCB.
5. The apparatus of claim 1, wherein: the measuring speed of the infrared ranging laser (7) is 500 times/S.
6. The apparatus of claim 1, wherein: the number of the laser code printing devices (6) and the number of the infrared ranging lasers (7) are two.
7. The apparatus of claim 1, wherein: the bottom of the equipment frame (1) is connected with supporting legs in a threaded mode, and the number of the supporting legs is four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320505096.1U CN219841918U (en) | 2023-03-16 | 2023-03-16 | PCB thickness measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320505096.1U CN219841918U (en) | 2023-03-16 | 2023-03-16 | PCB thickness measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219841918U true CN219841918U (en) | 2023-10-17 |
Family
ID=88304624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320505096.1U Active CN219841918U (en) | 2023-03-16 | 2023-03-16 | PCB thickness measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219841918U (en) |
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2023
- 2023-03-16 CN CN202320505096.1U patent/CN219841918U/en active Active
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