CN219812406U - Heat dissipation mechanism for brushless controller system - Google Patents
Heat dissipation mechanism for brushless controller system Download PDFInfo
- Publication number
- CN219812406U CN219812406U CN202321065890.5U CN202321065890U CN219812406U CN 219812406 U CN219812406 U CN 219812406U CN 202321065890 U CN202321065890 U CN 202321065890U CN 219812406 U CN219812406 U CN 219812406U
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- CN
- China
- Prior art keywords
- pcb board
- shell
- silica gel
- refrigerating
- controller system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 14
- 230000007246 mechanism Effects 0.000 title claims abstract description 13
- 238000005057 refrigeration Methods 0.000 claims abstract description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000741 silica gel Substances 0.000 claims abstract description 19
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 9
- 239000005543 nano-size silicon particle Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 8
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation mechanism for a brushless controller system, which comprises a shell; the inside upper end position of shell is provided with the PCB board, the PCB board passes through bolt fixed mounting in the shell upper end, install a plurality of MOS pipes on the PCB board, the shell bottom is located PCB board below position and is provided with the refrigeration chamber, the refrigeration chamber passes through bolt fixed mounting in shell bottom position, the refrigeration intracavity portion has the semiconductor refrigeration piece through bolt fixed mounting, PCB board bottom is provided with the silica gel conducting strip, the silica gel conducting strip is glued in PCB board bottom and refrigeration chamber bottom position through the bonding glue. When the temperature of the PCB is higher, the semiconductor refrigerating piece is started through the switch, the refrigerating end of the semiconductor refrigerating piece can cool the inside of the refrigerating cavity, the silica gel heat conducting piece has a good heat conducting effect, heat can be guided to the refrigerating cavity, and the silica gel heat conducting piece cools the PCB through the refrigerating cavity.
Description
Technical Field
The utility model relates to the technical field of heat dissipation mechanisms, in particular to a heat dissipation mechanism for a brushless controller system.
Background
As electric products are increasingly popular in daily life, the brushless direct current motor is high in ignition speed, high in achievement and high in power-to-volume ratio, and portable, and the use time is the first choice of end users for a brushless lithium battery electric tool, so that a brushless controller is required to exert higher efficiency in a limited space; so that a relatively high requirement is placed on the heat dissipation design of the controller.
Chinese patent No. CN104349652a discloses a heat dissipating device for an electronic controller, which includes a housing having a hollow portion into which a working fluid for heat transfer and dissipation is filled. The prior art has lower refrigeration efficiency when in use, and can not achieve the effect of timely cooling when the temperature is higher, thereby influencing the use of the controller.
Disclosure of Invention
The utility model aims to provide a heat dissipation mechanism for a brushless controller system, which is used for solving the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a heat dissipation mechanism for a brushless controller system includes a housing; the inside upper end position of shell is provided with the PCB board, the PCB board passes through bolt fixed mounting in the shell upper end, install a plurality of MOS pipes on the PCB board, the shell bottom is located PCB board below position and is provided with the refrigeration chamber, the refrigeration chamber passes through bolt fixed mounting in shell bottom position, the refrigeration intracavity portion has the semiconductor refrigeration piece through bolt fixed mounting, PCB board bottom is provided with the silica gel conducting strip, the silica gel conducting strip is glued in PCB board bottom and refrigeration chamber bottom position through the bonding glue.
Preferably, the refrigerating cavity is internally provided with ventilation holes, and the ventilation holes penetrate through the refrigerating cavity.
Preferably, a self-cleaning layer is arranged on the outer side of the PCB, and the self-cleaning layer is a nano silicon paint layer.
Preferably, the upper end of the refrigerating cavity is provided with an upper aluminum-based heat conducting plate, and the upper end of the upper aluminum-based heat conducting plate passes through the refrigerating cavity to be in contact with the silica gel heat conducting sheet.
Preferably, the bottom end of the refrigerating cavity is provided with a bottom aluminum-based heat conducting plate, and the bottom aluminum-based heat conducting plate extends out of the refrigerating cavity.
Compared with the prior art, the utility model has the beneficial effects that:
1. when the temperature of the PCB is higher, the semiconductor refrigerating piece is started through the switch, the refrigerating end of the semiconductor refrigerating piece can cool the inside of the refrigerating cavity, the silica gel heat conducting piece has a good heat conducting effect, heat can be guided to the refrigerating cavity, and the silica gel heat conducting piece cools the PCB through the refrigerating cavity;
2. the air holes can balance the air pressure in the refrigerating cavity, so that the phenomenon that the internal air pressure is lower due to the fact that the internal temperature of the refrigerating cavity is reduced in the using process is avoided, and the refrigerating cavity is deformed;
3. the upper aluminum-based heat-conducting plate can increase the efficiency of cold-hot conversion, can rapidly guide the heat generated by the PCB to the refrigerating end of the semiconductor refrigerating sheet when in use, and can improve the cooling efficiency of the PCB;
4. the nano silicon coating layer used in the self-cleaning layer has the performance of being hydrophobic and being difficult to attach with dust, can keep the outer surface of the PCB clean for a long time, and can clean the PCB conveniently.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram of a refrigeration cavity according to the present utility model;
FIG. 3 is a schematic top view of the refrigeration cavity of the present utility model;
fig. 4 is a schematic side view of the refrigeration cavity of the present utility model.
In the figure: 1. a housing; 2. a MOS tube; 3. a PCB board; 4. a semiconductor refrigeration sheet; 5. a silica gel heat conductive sheet; 6. a refrigerating chamber; 7. an upper aluminum-based heat conducting plate; 8. ventilation holes; 9. a bottom aluminum-based heat conducting plate; 10. self-cleaning layer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, 2, 3 and 4, in an embodiment of the present utility model, a heat dissipation mechanism for a brushless controller system includes a housing 1; the inside upper end position of shell 1 is provided with PCB board 3, PCB board 3 passes through bolt fixed mounting in shell 1 upper end, install a plurality of MOS pipes 2 on the PCB board 3, shell 1 bottom is located PCB board 3 below position and is provided with refrigeration chamber 6, refrigeration chamber 6 passes through bolt fixed mounting in shell 1 bottom position, refrigeration chamber 6 is inside to have semiconductor refrigeration piece 4 through bolt fixed mounting, PCB board 3 bottom is provided with silica gel conducting strip 5, silica gel conducting strip 5 is pasted in PCB board 3 bottom and refrigeration chamber 6 bottom position through the bonding glue.
Further, the inside bleeder vent 8 that is provided with of refrigeration chamber 6, bleeder vent 8 run through refrigeration chamber 6, and the setting of bleeder vent 8 can balance the inside atmospheric pressure of refrigeration chamber 6, avoids in the in-process of using, and refrigeration chamber 6 inside temperature reduces and leads to inside atmospheric pressure lower for refrigeration chamber 6 takes place to warp.
Further, the self-cleaning layer 10 is arranged on the outer side of the PCB 3, the self-cleaning layer 10 is a nano silicon coating layer, the nano silicon coating layer used by the self-cleaning layer 10 has the performance of being hydrophobic and being difficult to attach with dust, the outer surface of the PCB 3 can be kept clean for a long time, and meanwhile the PCB 3 can be cleaned conveniently.
Further, the upper end of the refrigerating cavity 6 is provided with an upper aluminum-based heat conducting plate 7, the upper end of the upper aluminum-based heat conducting plate 7 passes through the refrigerating cavity 6 to be in contact with the silica gel heat conducting sheet 5, the upper aluminum-based heat conducting plate 7 can increase the efficiency of cold-hot conversion, heat generated by the PCB 3 during use can be quickly guided to the refrigerating end of the semiconductor refrigerating sheet 4, and the cooling efficiency of the PCB 3 can be improved.
Further, the bottom of the refrigerating cavity 6 is provided with the bottom aluminum-based heat-conducting plate 9, the bottom aluminum-based heat-conducting plate 9 stretches out of the refrigerating cavity 6, and the heat generated by the heating end of the semiconductor refrigerating sheet 4 can be rapidly conducted out through the arrangement of the bottom aluminum-based heat-conducting plate 9, so that the influence on the use of the semiconductor refrigerating sheet 4 due to the fact that the temperature of the heating end of the semiconductor refrigerating sheet 4 is higher during use is avoided.
The working principle and the using flow of the utility model are as follows: when the use, when the temperature of PCB board 3 is higher, open semiconductor refrigeration piece 4 through the switch, semiconductor refrigeration piece 4 refrigeration end will cool down to refrigerating chamber 6 inside, and silica gel conducting strip 5 has better heat conduction effect, can cool down both PCB board 3 to silica gel conducting strip 5 through refrigerating chamber 6 with heat direction refrigerating chamber 6.
Finally, it should be noted that: the above is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that the present utility model is described in detail with reference to the foregoing embodiments, and modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (5)
1. A heat dissipation mechanism for a brushless controller system, comprising a housing (1); the method is characterized in that: the utility model discloses a PCB board, including shell (1) and silica gel heat conduction piece, shell (1) inside upper end position is provided with PCB board (3), PCB board (3) are through bolt fixed mounting in shell (1) upper end, install a plurality of MOS pipes (2) on PCB board (3), shell (1) bottom is located PCB board (3) below position and is provided with refrigeration chamber (6), refrigeration chamber (6) are through bolt fixed mounting in shell (1) bottom position, the inside semiconductor refrigeration piece (4) that has through bolt fixed mounting in refrigeration chamber (6), PCB board (3) bottom is provided with silica gel heat conduction piece (5), silica gel heat conduction piece (5) are pasted in PCB board (3) bottom and refrigeration chamber (6) bottom position through the bonding glue.
2. The heat dissipation mechanism for a brushless controller system according to claim 1, wherein: an air vent (8) is formed in the refrigerating cavity (6), and the air vent (8) penetrates through the refrigerating cavity (6).
3. The heat dissipation mechanism for a brushless controller system according to claim 1, wherein: the PCB (3) is provided with a self-cleaning layer (10) on the outer side, and the self-cleaning layer (10) is a nano-silicon paint layer.
4. The heat dissipation mechanism for a brushless controller system according to claim 1, wherein: the upper end of the refrigerating cavity (6) is provided with an upper aluminum-based heat conducting plate (7), and the upper end of the upper aluminum-based heat conducting plate (7) passes through the refrigerating cavity (6) to be in contact with the silica gel heat conducting sheet (5).
5. The heat dissipation mechanism for a brushless controller system according to claim 1, wherein: the bottom end of the refrigerating cavity (6) is provided with a bottom end aluminum-based heat conducting plate (9), and the bottom end aluminum-based heat conducting plate (9) extends out of the refrigerating cavity (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321065890.5U CN219812406U (en) | 2023-05-06 | 2023-05-06 | Heat dissipation mechanism for brushless controller system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321065890.5U CN219812406U (en) | 2023-05-06 | 2023-05-06 | Heat dissipation mechanism for brushless controller system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219812406U true CN219812406U (en) | 2023-10-10 |
Family
ID=88212778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321065890.5U Active CN219812406U (en) | 2023-05-06 | 2023-05-06 | Heat dissipation mechanism for brushless controller system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219812406U (en) |
-
2023
- 2023-05-06 CN CN202321065890.5U patent/CN219812406U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |