CN219802919U - High-temperature-resistant circuit substrate - Google Patents
High-temperature-resistant circuit substrate Download PDFInfo
- Publication number
- CN219802919U CN219802919U CN202320735422.8U CN202320735422U CN219802919U CN 219802919 U CN219802919 U CN 219802919U CN 202320735422 U CN202320735422 U CN 202320735422U CN 219802919 U CN219802919 U CN 219802919U
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- China
- Prior art keywords
- circuit substrate
- substrate body
- fixing plate
- plate
- utility
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- 239000000758 substrate Substances 0.000 title claims abstract description 78
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-temperature-resistant circuit substrate, which comprises a circuit substrate body and a supporting and radiating assembly arranged on the circuit substrate, wherein the supporting and radiating assembly comprises a first fixing plate and a second fixing plate which are symmetrically arranged left and right, fixing blocks are arranged on the inner sides of the first fixing plate and the second fixing plate, fixing grooves matched with the end parts of the circuit substrate are formed in the fixing blocks, the circuit substrate body is arranged on the first fixing plate and the second fixing plate through the fixing grooves, a plurality of supporting plates are arranged on the lower surface of the circuit substrate body, the tops of the supporting plates are fixed on the circuit substrate body and are distributed at equal intervals along the length direction of the circuit substrate body, and radiating channels are formed between the circuit substrate body and the supporting plates in an enclosing mode. The utility model is provided with the heat dissipation channel and the cooling air channel, can improve the heat dissipation efficiency, and can discharge heat, so that heat is prevented from being accumulated on the back surface of the circuit substrate body, and the service life is prolonged.
Description
Technical Field
The utility model relates to the technical field of circuit substrates, in particular to a high-temperature-resistant circuit substrate.
Background
The substrate is a basic material for manufacturing a PCB, typically, the substrate is a copper clad laminate, and the single-sided and double-sided printed boards are manufactured by selectively performing hole processing, electroless copper plating, electrolytic copper plating, etching and the like on the substrate material-copper clad laminate. In the manufacture of the other type of multilayer printed board, an inner core thin copper-clad foil board is used as a substrate, and conductive pattern layers and prepregs are alternately laminated and bonded together at one time to form more than 3 layers of conductive pattern interlayer interconnection. It has the functions of conducting, insulating and supporting.
In the prior art, the application number is: the patent document of CN202021675218. X discloses a circuit substrate based on FSK wireless module, its structure includes plate body, through-hole, wiring district, circuit line rail, line hole, clearance area, FSK wireless module main part, processing module and connector, four corners at both ends face at the bottom of plate body top are provided with the through-hole respectively, plate body top middle part is provided with the wiring district, the inside circuit line rail that is provided with of wiring district.
According to the above, the circuit substrate in the prior art is fixed through the through holes on the four corners of the top and bottom end surfaces of the plate body, and the bottom surface of the circuit substrate is attached to the contact surface in such a way that heat dissipation is not facilitated, deformation of the circuit substrate is easily caused after long-term use, and the service life is reduced. Therefore, there is a need for an improvement in such a structure to overcome the above-mentioned drawbacks.
Disclosure of Invention
The utility model aims to provide a high-temperature-resistant circuit substrate, which is used for solving the problems that the conventional circuit substrate mounting mode is not beneficial to heat dissipation, the circuit substrate is easy to age after long-term use, and the service life is reduced.
The technical aim of the utility model is realized by the following technical scheme:
the utility model provides a high temperature resistant circuit substrate, its includes the circuit substrate body, still includes the support radiating component that sets up on the circuit substrate, support radiating component includes first fixed plate and the second fixed plate that bilateral symmetry set up, the inboard of first fixed plate and second fixed plate is equipped with the fixed block, open on the fixed block have with circuit substrate tip assorted fixed slot, the circuit substrate body passes through the fixed slot and installs on first fixed plate and second fixed plate, the lower surface of circuit substrate body is equipped with a plurality of backup pads, the backup pad adopts the heat conduction material to make, the top of backup pad is fixed on the circuit substrate body and is distributed along the length direction equidistance of circuit substrate body, enclose into the heat dissipation passageway between circuit substrate body and the backup pad, the circuit substrate body is the component of adopting pressureless carborundum to make.
The utility model is further provided with: the thickness of first fixed plate and second fixed plate is greater than the thickness of circuit substrate body, the both ends of first fixed plate and second fixed plate all are equipped with the locating hole, locating hole and the reference column phase-match on the installation face for fix a position circuit substrate body.
The utility model is further provided with: the supporting plate is a member made of aluminum plates.
The utility model is further provided with: the first fixing plate and the second fixing plate are members made of pressureless silicon carbide.
The utility model is further provided with: the cooling air duct is arranged on the supporting plate, extends along the length direction of the supporting plate and penetrates through the supporting plate.
The utility model is further provided with: the first fixing plate and the second fixing plate are further provided with sinking grooves, the depth of each sinking groove is smaller than that of the first fixing plate and the second fixing plate, screw holes are formed in the bottoms of the sinking grooves, and fixing screws penetrate through the screw holes to install the first fixing plate and the second fixing plate on the contact surface.
Compared with the prior art, the utility model has the following beneficial effects:
1. the circuit board is provided with a support plate, the support plate is made of a heat conducting material, a cooling air channel is formed in the support plate, a circuit board main body is arranged on the support plate, a heat dissipation channel is formed between the circuit board main body and the support plate in a surrounding mode, heat generated during use is transferred to the support plate, air flows blow through the heat dissipation channel and the cooling air channel, heat on the support plate is taken away, and compared with the existing mode of attaching and mounting the circuit board main body and a contact surface, the heat dissipation efficiency can be improved, heat accumulation on the back surface of the circuit board main body is avoided, and therefore the service life is prolonged;
2. the circuit substrate body is a component made of pressureless silicon carbide, has good high temperature resistance, can work for a long time in a high temperature environment, can not deform or spontaneously ignite, and prolongs the service life and improves the safety.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic view of the assembly of the present utility model.
Fig. 3 is an assembled top view of the present utility model.
Fig. 4 is an assembled front view of the present utility model.
Number labels: the circuit substrate body 1, the first fixing plate 2, the second fixing plate 3, the fixing block 4, the supporting plate 5, the heat dissipation channel 6, the positioning hole 7, the sinking groove 8, the screw hole 9 and the cooling air duct 10
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 4, the circuit substrate with high temperature resistance provided by the utility model comprises a circuit substrate body 1 and further comprises a supporting and radiating component arranged on the circuit substrate body, wherein the supporting and radiating component comprises a first fixing plate 2 and a second fixing plate 3 which are symmetrically arranged left and right, fixing blocks 4 are arranged on the inner sides of the first fixing plate 2 and the second fixing plate 3, fixing grooves matched with the end parts of the circuit substrate are formed in the fixing blocks 4, the circuit substrate body 1 is arranged on the first fixing plate 2 and the second fixing plate 3 through the fixing grooves, a plurality of supporting plates 5 are arranged on the lower surface of the circuit substrate body 1, the tops of the supporting plates 5 are fixed on the circuit substrate body 1 and are distributed along the length direction of the circuit substrate body 1 at equal intervals, a radiating channel 6 is formed between the circuit substrate body 1 and the supporting plates 5, air current can circulate from the radiating channel 6, and heat generated in the use process of the circuit substrate can be discharged through the radiating channel 6, so that heat is prevented from being accumulated on the back surface of the circuit substrate body 1, and the service life is prolonged.
In this embodiment, the first fixing plate 2 and the second fixing plate 3 are members made of pressureless silicon carbide, the thickness of the first fixing plate 2 and the second fixing plate 3 is greater than that of the circuit substrate body 1, positioning holes 7 are formed at two ends of the first fixing plate 2 and the second fixing plate 3, and the positioning holes 7 are matched with positioning columns on the mounting surface and are used for positioning the circuit substrate body 1, so that the installation is convenient; the first fixing plate 2 and the second fixing plate 3 are further provided with a sinking groove 8, the depth of the sinking groove 8 is smaller than that of the first fixing plate 2 and the second fixing plate 3, the bottom of the sinking groove 8 is provided with a screw hole 9, and a fixing screw penetrates through the screw hole 9 to install the first fixing plate 2 and the second fixing plate 3 on a contact surface.
In this embodiment, the circuit substrate body 1 is a member made of pressureless silicon carbide, most of the existing circuit substrates are made of organic glass materials, deformation is easy to occur at high temperature, and even spontaneous combustion can occur under the condition that a large amount of heat cannot be removed even if the existing circuit substrates are subjected to high-temperature weather or work for a long time, while the circuit substrate body 1 provided by the utility model is made of pressureless silicon carbide, has good high temperature resistance, can work for a long time in a high-temperature environment, also cannot deform or spontaneously combust, and service life and safety are improved.
In this embodiment, the support plate 5 is made of a heat conducting material, the specific support plate 5 is made of an aluminum plate, the support plate 5 is provided with a cooling air duct 10, the cooling air duct 10 extends along the length direction of the support plate 5 and penetrates through the support plate 5, heat of the circuit substrate main body 1 is transferred to the heat dissipation plate, and air flows through the surface of the support plate 5 to take away the heat, so that the temperature of the circuit substrate main body is reduced.
The application process and principle of the utility model are as follows: be equipped with backup pad 5, be equipped with circuit substrate main part in the backup pad 5, enclose into heat dissipation channel 6 between circuit substrate main part 1 and the backup pad 5, on the heat transfer to backup pad 5 that produces during the use, the air current blows through heat dissipation channel 6 and cooling wind channel 10, takes away the heat in the backup pad 5, compares with current mode with circuit substrate main part and contact surface laminating installation, can improve radiating efficiency.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "inner", "outer", "left", "right", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in place when the inventive product is used, or are directions or positional relationships conventionally understood by those skilled in the art, are merely for convenience of describing the present utility model and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance. In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, terms such as "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. In this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a list of elements is included, and may include other elements not expressly listed.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a high temperature resistant circuit substrate, its includes the circuit substrate body, its characterized in that still includes the support radiating component that sets up on the circuit substrate, support radiating component includes first fixed plate and the second fixed plate that bilateral symmetry set up, the inboard of first fixed plate and second fixed plate is equipped with the fixed block, open on the fixed block have with circuit substrate tip assorted fixed slot, the circuit substrate body passes through the fixed slot and installs on first fixed plate and second fixed plate, the lower surface of circuit substrate body is equipped with a plurality of backup pads, the backup pad adopts the heat conduction material to make, the top of backup pad is fixed on the circuit substrate body and is distributed along the length direction equidistance of circuit substrate body, enclose into the heat dissipation passageway between circuit substrate body and the backup pad, the circuit substrate body is the component that adopts pressureless carborundum to make.
2. The circuit substrate of claim 1, wherein the first and second fixing plates have a thickness greater than that of the circuit substrate body, and positioning holes are formed at both ends of the first and second fixing plates, and the positioning holes are matched with positioning posts on the mounting surface for positioning the circuit substrate body.
3. The circuit substrate of claim 1, wherein the support plate is a member made of aluminum plate.
4. The circuit substrate of claim 1, wherein the first and second mounting plates are each a member made of pressureless silicon carbide.
5. The circuit substrate of claim 1, wherein the support plate is provided with a cooling air duct extending along a length direction of the support plate and penetrating the support plate.
6. The circuit substrate of claim 1, wherein the first and second fixing plates are further provided with a countersink, the countersink has a depth smaller than that of the first and second fixing plates, the bottom of the countersink is provided with a screw hole, and the fixing screw passes through the screw hole to mount the first and second fixing plates on the contact surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320735422.8U CN219802919U (en) | 2023-04-06 | 2023-04-06 | High-temperature-resistant circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320735422.8U CN219802919U (en) | 2023-04-06 | 2023-04-06 | High-temperature-resistant circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219802919U true CN219802919U (en) | 2023-10-03 |
Family
ID=88178291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320735422.8U Active CN219802919U (en) | 2023-04-06 | 2023-04-06 | High-temperature-resistant circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219802919U (en) |
-
2023
- 2023-04-06 CN CN202320735422.8U patent/CN219802919U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |