CN219785687U - Multi-station semiconductor chip positioning testing device - Google Patents
Multi-station semiconductor chip positioning testing device Download PDFInfo
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- CN219785687U CN219785687U CN202320942661.0U CN202320942661U CN219785687U CN 219785687 U CN219785687 U CN 219785687U CN 202320942661 U CN202320942661 U CN 202320942661U CN 219785687 U CN219785687 U CN 219785687U
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- semiconductor chip
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- pushing
- chip positioning
- motor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- 238000012360 testing method Methods 0.000 title claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 7
- 230000005540 biological transmission Effects 0.000 claims description 7
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 238000001514 detection method Methods 0.000 abstract description 15
- 238000007689 inspection Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a multi-station semiconductor chip positioning testing device, which relates to the technical field of semiconductor chip detection and aims to solve the technical problem that the semiconductor chips which are unqualified in inspection are inconvenient to reject in the prior art; the chip positioning testing device comprises a device base; the upper end of the equipment base is provided with a first conveying component, the upper end of the first conveying component is provided with a fixing frame, the inner side of the fixing frame is provided with a pushing component, one end of the pushing component is provided with a push plate, the upper end of the fixing frame is provided with a detection camera, the outer side of the first conveying component is provided with a material guiding component, and the upper end of the equipment base is provided with a second conveying component; the multi-station semiconductor chip positioning testing device drives the pushing plate to move through the pushing and pressing assembly, the semiconductor chip is pushed out through the pushing plate, and the semiconductor chip is discharged to the second conveying assembly through the arrangement of the material guiding assembly, so that the semiconductor chip which is unqualified in inspection is removed conveniently.
Description
Technical Field
The utility model belongs to the technical field of semiconductor chip detection, and particularly relates to a multi-station semiconductor chip positioning test device.
Background
Nowadays, semiconductor chips are commonly used in the electronic field, the semiconductor chips are etched and wired on a semiconductor sheet, and a semiconductor device capable of realizing a certain function is manufactured, and in the process of manufacturing and processing the semiconductor chips, detection processing is required for the semiconductor chips, and a semiconductor chip positioning test device is usually used.
At present, the utility model patent with the patent number of CN202121294963.9 discloses a multi-station detection device for chip detection, which comprises a bottom plate, a conveying unit and a grabbing unit; the middle part of the upper surface of the bottom plate is provided with a rotating unit; the conveying unit is arranged on the right side of the upper surface of the bottom plate; the grabbing unit comprises a motor III, a gear, a rack, a movable block and a mechanical claw, wherein the motor III is fixedly connected to the rotating unit, the input end of the motor III is electrically connected with the output end of an external power supply through an external control switch group, the rotating shaft of the motor III is fixedly connected with the gear, the movable block is in sliding connection with a through groove formed in the rotating unit, the rack is longitudinally and fixedly connected to the left side surface of the movable block, the rack is in meshed connection with the gear, and the mechanical claw is fixedly connected to the lower end of the movable block and can accurately convey chips to be tested to different testing stations for testing; the multi-station semiconductor chip positioning testing device can accurately send chips to be tested to different testing stations for testing, but is inconvenient to reject semiconductor chips which are unqualified in inspection in the using process.
Disclosure of Invention
(1) Technical problem to be solved
Aiming at the defects of the prior art, the utility model aims to provide a multi-station semiconductor chip positioning testing device which aims at solving the technical problem that the semiconductor chips which are unqualified in inspection are inconvenient to reject in the prior art.
(2) Technical proposal
In order to solve the technical problems, the utility model provides a multi-station semiconductor chip positioning testing device, which comprises an equipment base; the upper end of equipment base is provided with first conveying component, the upper end of first conveying component is provided with the mount, the mount is provided with two sets of, the inboard of mount is provided with bulldozes the subassembly, the one end that bulldozes the subassembly is provided with the push pedal, the upper end of mount is provided with detects the camera, the outside of first conveying component is provided with the guide subassembly, the upper end of equipment base is provided with the second conveying component, the second conveying component with first conveying component structure is the same, the bottom of equipment base is provided with the universal wheel.
When the multi-station semiconductor chip positioning testing device of the technical scheme is used, the first conveying assembly drives the semiconductor chip to move to the lower side of the detection camera, the detection camera is used for detecting the semiconductor chip, the pushing assembly drives the pushing plate to move, the pushing plate pushes the semiconductor chip out, the material guiding assembly is arranged to feed the semiconductor chip to the second conveying assembly, and the second conveying assembly is used for carrying out centralized processing on the unqualified semiconductor chip, so that the semiconductor chip which is unqualified in detection is removed conveniently.
Further, the inside of bulldozing the subassembly is including the rectangle groove, the rectangle groove set up in the inboard of mount, the outside fixed mounting of push pedal has the rectangle piece, the rectangle piece with rectangle groove sliding connection carries out the removal spacing processing to the push pedal through the sliding connection of rectangle piece and rectangle groove.
Further, the inside of bulldozing the subassembly including first motor, first motor set up in the outside of mount, the output of first motor is provided with the threaded rod, the threaded rod with the mount rotates to be connected, starts first motor and drives the threaded rod and rotate, carries out drive processing to the threaded rod.
Further, the inside of bulldozing the subassembly includes the thread groove, the thread groove set up in the inboard of rectangle piece, the thread groove with the threaded rod transmission is connected, drives the push pedal through the transmission connection of threaded rod and thread groove and removes.
Further, the inside of first conveying component is including the carriage, the carriage set up in the upper end of equipment base, the outside of carriage is provided with the second motor, fixes the position of second motor through the setting of carriage.
Further, the inside of first conveying component is including belt group, belt group set up in the output of second motor, belt group with the carriage rotates to be connected, drives the belt group through the second motor and rotates, drives the semiconductor chip through the belt group and removes to the below that detects the camera.
Further, the inside of guide subassembly is including fixed baffle, fixed baffle set up in the outside of carriage, the baffle box has been seted up to the inboard of fixed baffle, carries out the unloading to second conveying assembly department through the setting of baffle box to the semiconductor chip.
(3) Advantageous effects
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the multi-station semiconductor chip positioning testing device, the first motor is started to drive the threaded rod to rotate, the push plate is driven to move through the transmission connection of the threaded rod and the threaded groove, the push plate is subjected to movement limiting treatment through the sliding connection of the rectangular block and the rectangular groove, the semiconductor chip is pushed out through the push plate, and the semiconductor chip is fed to the second conveying assembly through the arrangement of the guide groove, so that the semiconductor chip which is unqualified in inspection is removed conveniently;
2. according to the multi-station semiconductor chip positioning testing device, the position of the second motor is fixed through the arrangement of the conveying frame, the belt group is driven to rotate through the second motor, the semiconductor chip is driven to move to the position below the detection camera through the belt group, the detection camera is used for detecting the semiconductor chip, and the second conveying assembly is used for carrying out centralized processing on unqualified semiconductor chips, so that the detection processing of the semiconductor chip is realized.
Drawings
FIG. 1 is a schematic view of a three-dimensional structure of an embodiment of the present utility model;
FIG. 2 is a schematic view of an expanded structure of an embodiment of the present utility model;
FIG. 3 is a schematic cross-sectional perspective view of an embodiment of the present utility model;
fig. 4 is a schematic cross-sectional perspective view of an embodiment of the present utility model.
The marks in the drawings are: 1. an equipment base; 2. a first transport assembly; 3. a fixing frame; 4. a pushing assembly; 5. a push plate; 6. detecting a camera; 7. a material guiding component; 8. a second transport assembly; 9. a universal wheel; 10. rectangular grooves; 11. rectangular blocks; 12. a first motor; 13. a threaded rod; 14. a thread groove; 15. a carriage; 16. a second motor; 17. pi Daizu; 18. fixing the guide plate; 19. and a guide groove.
Detailed Description
The specific embodiment is used for a multi-station semiconductor chip positioning test device, the three-dimensional structure schematic diagram of which is shown in fig. 1, the unfolding structure schematic diagram of which is shown in fig. 2, and the chip positioning test device comprises a device base 1; the upper end of equipment base 1 is provided with first conveying component 2, the upper end of first conveying component 2 is provided with mount 3, mount 3 is provided with two sets of, the inboard of mount 3 is provided with bulldozes subassembly 4, the one end of bulldozing subassembly 4 is provided with push pedal 5, the upper end of mount 3 is provided with detects camera 6, the outside of first conveying component 2 is provided with guide subassembly 7, the upper end of equipment base 1 is provided with second conveying component 8, second conveying component 8 with first conveying component 2 structure is the same, the bottom of equipment base 1 is provided with universal wheel 9.
For the present embodiment, the shape structure of the device base 1 is set according to practical application situations, for example, the device base 1 may be a rectangular structure, an arc structure, a polygonal structure, or the like.
The inside of bulldozing subassembly 4 is including rectangular groove 10, rectangular groove 10 set up in the inboard of mount 3, the outside fixed mounting of push pedal 5 has rectangular piece 11, rectangular piece 11 with rectangular groove 10 sliding connection carries out removal spacing processing to push pedal 5 through the sliding connection of rectangular piece 11 and rectangular groove 10, the inside of bulldozing subassembly 4 is including first motor 12, first motor 12 set up in the outside of mount 3, the output of first motor 12 is provided with threaded rod 13, threaded rod 13 with mount 3 rotates to be connected, starts first motor 12 and drives threaded rod 13 and rotate, carries out drive processing to threaded rod 13.
This embodiment is for multistation semiconductor chip location testing arrangement, and its section three-dimensional structure schematic diagram is shown as fig. 3, and its section three-dimensional structure schematic diagram is shown as fig. 4, bulldoze the inside of subassembly 4 including thread groove 14, thread groove 14 set up in the inboard of rectangular piece 11, thread groove 14 with threaded rod 13 transmission is connected, drives push pedal 5 through the transmission connection of threaded rod 13 and thread groove 14 and removes, the inside of first conveying subassembly 2 is including carriage 15, carriage 15 set up in the upper end of equipment base 1, the outside of carriage 15 is provided with second motor 16, fixes the position of second motor 16 through the setting of carriage 15.
Meanwhile, the first conveying component 2 comprises a belt group 17, the belt group 17 is arranged at the output end of the second motor 16, the belt group 17 is rotationally connected with the conveying frame 15, the belt group 17 is driven to rotate through the second motor 16, the belt group 17 drives the semiconductor chip to move to the lower side of the detection camera 6, the guide component 7 comprises a fixed guide plate 18, the fixed guide plate 18 is arranged at the outer side of the conveying frame 15, a guide groove 19 is formed in the inner side of the fixed guide plate 18, and the semiconductor chip is fed to the second conveying component 8 through the arrangement of the guide groove 19.
When the multi-station semiconductor chip positioning testing device of the technical scheme is used, the position of the second motor 16 is fixed through the arrangement of the conveying frame 15, the belt group 17 is driven to rotate through the second motor 16, the semiconductor chip is driven to move to the lower side of the detection camera 6 through the belt group 17, the detection camera 6 is used for detecting the semiconductor chip, the first motor 12 is started to drive the threaded rod 13 to rotate, the push plate 5 is driven to move through the transmission connection of the threaded rod 13 and the thread groove 14, the push plate 5 is used for moving and limiting the semiconductor chip through the sliding connection of the rectangular block 11 and the rectangular groove 10, the semiconductor chip is pushed out through the push plate 5, the semiconductor chip is fed to the position of the second conveying assembly 8 through the arrangement of the guide groove 19, and the unqualified semiconductor chip is subjected to centralized processing through the second conveying assembly 8, so that the unqualified semiconductor chip is conveniently inspected and rejected.
Claims (7)
1. A multi-station semiconductor chip positioning test device comprises a device base; the device is characterized in that a first conveying assembly is arranged at the upper end of the device base, a fixing frame is arranged at the upper end of the first conveying assembly, two groups of fixing frames are arranged, pushing assemblies are arranged on the inner sides of the fixing frames, pushing plates are arranged at one ends of the pushing assemblies, detecting cameras are arranged at the upper ends of the fixing frames, a material guiding assembly is arranged on the outer sides of the first conveying assembly, a second conveying assembly is arranged at the upper end of the device base, the second conveying assembly is identical to the first conveying assembly in structure, and universal wheels are arranged at the bottom ends of the device base.
2. The multi-station semiconductor chip positioning test device according to claim 1, wherein the pushing assembly comprises a rectangular groove inside, the rectangular groove is formed in the inner side of the fixing frame, a rectangular block is fixedly mounted on the outer side of the pushing plate, and the rectangular block is in sliding connection with the rectangular groove.
3. The multi-station semiconductor chip positioning test device according to claim 2, wherein the pushing assembly comprises a first motor, the first motor is arranged on the outer side of the fixing frame, a threaded rod is arranged at the output end of the first motor, and the threaded rod is rotatably connected with the fixing frame.
4. A multi-station semiconductor chip positioning test device according to claim 3, wherein the interior of the pushing component comprises a thread groove, the thread groove is formed on the inner side of the rectangular block, and the thread groove is in transmission connection with the threaded rod.
5. The multi-station semiconductor chip positioning test device according to claim 1, wherein the first conveying assembly comprises a conveying frame, the conveying frame is arranged at the upper end of the equipment base, and a second motor is arranged on the outer side of the conveying frame.
6. The multi-station semiconductor chip positioning test device according to claim 5, wherein the first conveying assembly comprises a belt set inside, the belt set is arranged at the output end of the second motor, and the belt set is rotatably connected with the conveying frame.
7. The multi-station semiconductor chip positioning test device according to claim 6, wherein the material guiding assembly comprises a fixed guide plate, the fixed guide plate is arranged on the outer side of the conveying frame, and a material guiding groove is formed in the inner side of the fixed guide plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320942661.0U CN219785687U (en) | 2023-04-17 | 2023-04-17 | Multi-station semiconductor chip positioning testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320942661.0U CN219785687U (en) | 2023-04-17 | 2023-04-17 | Multi-station semiconductor chip positioning testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219785687U true CN219785687U (en) | 2023-10-03 |
Family
ID=88150603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320942661.0U Active CN219785687U (en) | 2023-04-17 | 2023-04-17 | Multi-station semiconductor chip positioning testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219785687U (en) |
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2023
- 2023-04-17 CN CN202320942661.0U patent/CN219785687U/en active Active
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