CN219736261U

CN219736261U - 3D solder paste detection equipment

Info

Publication number: CN219736261U
Application number: CN202320856333.9U
Authority: CN
Inventors: 赵源; 郭峻杰; 张煜文; 王晓芳; 尚文文; 陈嘉彧
Original assignee: Xi'an Zhongke Longhua Precision Equipment Co ltd
Current assignee: Xi'an Zhongke Longhua Precision Equipment Co ltd
Priority date: 2023-04-17
Filing date: 2023-04-17
Publication date: 2023-09-22
Anticipated expiration: 2033-04-17

Abstract

The utility model discloses 3D solder paste detection equipment, which comprises an outer shell and an equipment main body arranged in the outer shell, wherein the equipment main body comprises a chassis frame assembly, a PCB board width automatic adjusting mechanism, a PCB transmission assembly, a first direction moving assembly, a second direction moving assembly, a machine vision assembly and a PCB clamping mechanism, wherein the PCB board width automatic adjusting mechanism is arranged on the chassis frame assembly and comprises a movable plate, a fixed plate and a driving mechanism; the PCB transmission assembly comprises a belt pulley running mechanism and a first driving motor; the PCB clamping mechanism is arranged on the movable plate and the fixed plate; the first direction moving assembly is arranged on the chassis frame assembly, and at least one end of the second direction moving assembly is connected to the first direction moving assembly and is provided with a machine vision assembly. The utility model increases the automatic plate width adjusting system, realizes the manual-automatic plate width adjusting function, conveniently, accurately and quickly completes the plate width adjustment, optimizes the structure of the servo system and the transmission system, and improves the motion stability of the whole machine.

Description

3D solder paste detection equipment

Technical Field

The utility model belongs to the technical field of solder paste detection, and particularly relates to 3D solder paste detection equipment.

Background

SPI (Solder Paste Inspection, solder paste detector), fully-known as full-automatic optical print quality detector, is a device that performs 2D and 3D combined optical detection monitoring on SMT (surface Mount technology) print quality based on optical principles, and after being used in an SMT printer, before a chip mounter, performs 2D or 3D automatic measurement (micrometer precision) on PCB (printed Circuit Board) printing. Therefore, the phenomenon of poor printing is found in time before the components are attached, and unqualified PCB products are avoided as much as possible, so that the PCB is a quality control means.

The component SMT mode replaces the traditional component jack mounting mode, so that the mounting density can be improved, the size of components can be reduced, and the mounting reliability is improved. The thickness of the soldering paste is generally between 0.12 and 0.15mm, the interval between components is very small, the accuracy of manual detection errors is below 50%, and the accuracy and the efficiency can not meet the production requirements.

Disclosure of Invention

In order to solve the problems in the prior art, the utility model provides 3D solder paste detection equipment. The technical problems to be solved by the utility model are realized by the following technical scheme:

the utility model provides 3D solder paste detection equipment, which comprises an outer shell and an equipment main body arranged in the outer shell, wherein the equipment main body comprises a chassis frame assembly, a PCB width automatic adjusting mechanism, a PCB transmission assembly, a first direction moving assembly, a second direction moving assembly, a machine vision assembly and a PCB clamping mechanism,

the PCB width automatic adjusting mechanism is arranged on the chassis frame assembly and comprises a movable plate, a fixed plate and a driving mechanism, wherein two ends of the fixed plate are respectively fixed to the chassis frame assembly, and the movable plate and the fixed plate are vertically arranged in parallel and can be close to or far away from the fixed plate under the action of the driving mechanism;

the PCB transmission assembly comprises a belt pulley running mechanism and a first driving motor connected to the belt pulley running mechanism, and the belt pulley running mechanism is arranged on the inner surfaces of the movable plate and the fixed plate and used for horizontally arranging the PCB to be detected to a designated position;

the PCB clamping mechanism is arranged on the movable plate and the fixed plate and used for clamping the PCB to be detected when the PCB to be detected reaches a specified position;

the first direction moving assembly is arranged in the longitudinal direction of the chassis frame assembly, the second direction moving assembly is arranged in the transverse direction of the chassis frame assembly, and at least one end of the second direction moving assembly is connected to the first direction moving assembly so as to move along the longitudinal direction along with the first direction moving assembly; the machine vision component is arranged on the second direction moving component and can move along the transverse direction along with the second direction moving component.

In one embodiment of the present utility model, the first direction moving assembly includes a second driving motor, a first slide rail, a first screw, and a first slider, wherein,

the first sliding rail is arranged on the upper surface of one side of the chassis frame assembly along the longitudinal direction, the first sliding block is arranged inside the first sliding rail, and the first sliding block is connected to the second driving motor through the first lead screw and can move along the first sliding rail under the driving of the second driving motor;

one end of the second direction moving assembly is fixed to the first slider to move together with the first slider.

In one embodiment of the present utility model, the second direction moving assembly includes a cross bar, a second slide rail, a second screw, a second slider, and a third driving motor, wherein,

the cross bar spans over the chassis frame assembly in a transverse direction, one end of the cross bar is fixed to the first sliding block, and the other end of the cross bar is slidably connected to the upper surface of the chassis frame assembly;

the second sliding rail is arranged on the upper surface of the cross rod along the transverse direction, the second sliding block is arranged inside the second sliding rail, and the second sliding block is connected to the third driving motor through the second lead screw and can move along the second sliding rail under the driving of the third driving motor;

the third driving motor is arranged on the cross rod.

In one embodiment of the utility model, the machine vision assembly is secured to the second slider and includes an industrial camera and a polishing machine.

In one embodiment of the utility model, the driving mechanism of the automatic PCB width adjusting mechanism comprises a mounting plate, a stepping motor, a ball screw, a first smooth rod and a second smooth rod, wherein,

the mounting panel transversely install chassis frame assembly's upper surface and with the movable plate with the fixed plate parallel arrangement, step motor sets up on the mounting panel, ball screw's one end is connected to step motor and can rotate under step motor's drive, ball screw's the other end passes the movable plate and be connected to the fixed plate, and can drive the movable plate for the fixed plate removes, first feed beam with the first end of second feed beam is all fixed to the mounting panel, the other end passes respectively the movable plate and is connected to the fixed plate, and, first feed beam with the second feed beam parallel arrangement is in ball screw's both sides respectively.

In one embodiment of the present utility model, the PCB clamping mechanism includes a first cylinder follower, a second cylinder follower, a first cylinder, a second cylinder, a third cylinder, and a fourth cylinder, wherein,

the first cylinder and the second cylinder are arranged on the outer side of the movable plate, the third cylinder and the fourth cylinder are arranged on the outer side of the fixed plate, and the first cylinder follower plate is arranged on the inner side of the movable plate and can move up and down along the movable plate under the driving of the first cylinder and the second cylinder;

the second cylinder follower plate is arranged on the inner side of the fixed plate and can move up and down along the fixed plate under the driving of the third cylinder and the fourth cylinder.

In one embodiment of the utility model, a first baffle is arranged at the upper edge of the movable plate, and the first cylinder follower is positioned below the first baffle and can move towards the first baffle under the drive of the first cylinder and the second cylinder; the upper edge of the fixed plate is provided with a second baffle plate, and the second cylinder follower plate is positioned below the second baffle plate and can move towards the second baffle plate under the driving of the first cylinder and the second cylinder.

In one embodiment of the utility model, a circulation fan and a heat sink are provided on the outer housing.

In one embodiment of the present utility model, a liquid crystal display is further disposed on the outer housing, and the liquid crystal display is electrically connected to the machine vision assembly.

In one embodiment of the present utility model, an alarm is further provided on the outer case, and the alarm is electrically connected to the second driving motor and the third driving motor.

Compared with the prior art, the utility model has the beneficial effects that:

the 3D solder paste detection equipment provided by the utility model is additionally provided with the automatic plate width adjusting system, so that the manual-automatic plate width adjusting function is realized, the plate width adjustment is conveniently, accurately and quickly completed, the servo system and transmission system structure is optimized, the movement stability of the whole machine is improved, and the solder paste identification precision of the 3D solder paste detection equipment is higher and can reach um level.

The present utility model will be described in further detail with reference to the accompanying drawings and examples.

Drawings

Fig. 1 is a schematic structural diagram of a 3D solder paste inspection apparatus according to an embodiment of the present utility model;

fig. 2 is a side view of a 3D solder paste inspection apparatus according to an embodiment of the present utility model;

fig. 3 is an external structural schematic diagram of a 3D solder paste inspection apparatus according to an embodiment of the present utility model;

fig. 4 is a schematic partial view of a 3D solder paste inspection apparatus according to an embodiment of the present utility model;

fig. 5 is a schematic partial view of another 3D solder paste inspection apparatus according to an embodiment of the present utility model.

Reference numerals illustrate:

1-a chassis frame assembly; 2-an automatic PCB width adjusting mechanism; 21-a movable plate; 22-fixing plates; 23-mounting plates; 24-step motor; 25-ball screw; 26-a first light bar; 27-a second light bar; 28-ball bearings; 29-a first sliding bearing; 210-a second sliding bearing; a 3-PCB transport assembly; 31-a pulley running mechanism; 4-a first direction moving component; 41-a second drive motor; 42-a first slide rail; 43-a first lead screw; 44-a first slider; 5-a second direction moving assembly; 51-a cross bar; 52-a second slide rail; 53-a second slider; 6-a machine vision component; 7-a PCB clamping mechanism; 71-a second cylinder follower; 72-a first cylinder; 73-a second cylinder; 74-a third cylinder; 75-fourth cylinder; 76-a first baffle; 77-a second baffle; 8-a PCB to be detected; 9-a circulation fan; 10-a heat radiation port; 11-a liquid crystal display; 12-an alarm; 13-cabinet door; 14-keyboard cabinet.

Detailed Description

In order to further illustrate the technical means and effects adopted by the utility model to achieve the preset aim, the following describes a 3D solder paste detection device according to the utility model in detail with reference to the accompanying drawings and the detailed description.

The foregoing and other features, aspects, and advantages of the present utility model will become more apparent from the following detailed description of the preferred embodiments when taken in conjunction with the accompanying drawings. The technical means and effects adopted by the present utility model to achieve the intended purpose can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are provided for reference and description only, and are not intended to limit the technical scheme of the present utility model.

It should be noted that in this document relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in an article or apparatus that comprises the element.

Referring to fig. 1 to 3, the 3D solder paste inspection apparatus of the present embodiment includes an outer housing and an apparatus main body disposed inside the outer housing, the apparatus main body including a chassis frame assembly 1, a PCB board width automatic adjustment mechanism 2, a PCB transmission assembly 3, a first direction movement assembly 4, a second direction movement assembly 5, a machine vision assembly 6, and a PCB clamping mechanism 7, wherein the PCB board width automatic adjustment mechanism 2 is disposed on the chassis frame assembly 1 and includes a movable plate 21, a fixed plate 22, and a driving mechanism, wherein both ends of the fixed plate 22 are respectively fixed to the chassis frame assembly 1, and the movable plate 21 and the fixed plate 22 are vertically disposed in parallel and can approach or separate from the fixed plate 22 under the action of the driving mechanism; the PCB transferring assembly 3 includes a pulley operating mechanism 31 and a first driving motor 32 connected to the pulley operating mechanism 31, the pulley operating mechanism 31 being provided on inner surfaces of the movable plate 21 and the fixed plate 22 for horizontally arranging the PCB board 8 to be inspected to a designated position; the PCB clamping mechanism 7 is arranged on the movable plate 21 and the fixed plate 22 and is used for clamping the PCB 8 to be detected when the PCB 8 to be detected reaches a specified position; the first direction moving assembly 4 is disposed in the longitudinal direction of the chassis frame assembly 1, the second direction moving assembly 5 is disposed in the lateral direction of the chassis frame assembly 1, and at least one end of the second direction moving assembly 5 is connected to the first direction moving assembly 4 to move along the longitudinal direction with the first direction moving assembly 4; the machine vision assembly 6 is provided on the second direction moving assembly 5 and is movable in the lateral direction with the second direction moving assembly 5.

Further, as shown in fig. 1, the first direction moving assembly 4 includes a second driving motor 41, a first slide rail 42, a first screw 43, and a first slider 44, wherein the first slide rail 42 is provided on one side upper surface of the chassis frame assembly 1 in the longitudinal direction, the first slider 44 is provided inside the first slide rail 42, and the first slider 44 is connected to the second driving motor 41 through the first screw 43 and is movable along the first slide rail 42 by the driving of the second driving motor 41; one end of the second direction moving assembly 5 is fixed to the first slider 44 to move together with the first slider 44.

Further, the second direction moving assembly 5 includes a cross bar 51, a second slide rail 52, a second screw, a second slider 53, and a third driving motor, wherein the cross bar 51 spans over the chassis frame assembly 1 in the lateral direction, and one end of the cross bar 51 is fixed to the first slider 44, and the other end is slidably connected to the upper surface of the chassis frame assembly 1; the second sliding rail 52 is arranged on the upper surface of the cross bar 51 along the transverse direction, the second sliding block 53 is arranged inside the second sliding rail 52, and the second sliding block 53 is connected to the third driving motor through a second lead screw and can move along the second sliding rail 52 under the driving of the third driving motor; the third drive motor is provided on the cross bar 51.

In the actual use process, according to the position of the PCB 8 to be detected, the second driving motor 41 is started, the second driving motor 41 drives the first lead screw 43 to rotate, and the first lead screw 43 further drives the first sliding block 44 to slide in the first sliding rail 42, so that the cross rod 51 is driven to move along the longitudinal direction; meanwhile, the second lead screw drives the second sliding block 53 to transversely move on the second sliding rail 52 under the driving of the third driving motor on the cross rod 51, and the machine vision component 6 is arranged on the second sliding block 53 of the second direction moving component 5, so that the machine vision component 6 can move to a specified position on a plane by utilizing the first direction moving component 4 and the second direction moving component 5.

The machine vision component of the embodiment comprises an industrial camera and a polishing machine, wherein the industrial camera is used for collecting image information of the surface of the PCB 8 to be detected, judging whether defects exist on the surface of the PCB through the image information, and the polishing machine is used for supplementing light when light is insufficient so as to obtain clear image information.

As described above, the PCB transferring assembly 3 of the present embodiment includes the pulley operating mechanism 31 and the first driving motor 32 connected to the pulley operating mechanism 31, the pulley operating mechanism 31 being provided at the inner surfaces of the movable plate 21 and the fixed plate 22 for horizontally arranging the PCB board 8 to be inspected to a designated position. Specifically, as shown in fig. 4, a set of completely symmetrical pulley operating mechanisms 31 are provided on the inner surfaces of the movable plate 21 and the fixed plate 22, respectively, and both sets of pulley operating mechanisms 31 are simultaneously connected to the first driving motor 32 through a driving shaft and are movable in the same direction by the driving of the first driving motor 32. In the actual use process, the PCB 8 to be detected is placed on the two groups of belt pulley running mechanisms 31 in parallel, the first driving motor 32 is started, and the PCB 8 to be detected can be horizontally arranged to the designated position through the simultaneous movement of the two groups of belt pulley running mechanisms 31.

Referring to fig. 1 and 4 together, the driving mechanism of the PCB board width automatic adjusting mechanism 2 of the present embodiment includes a mounting plate 23, a stepping motor 24, a ball screw 25, a first feed bar 26 and a second feed bar 27, wherein the mounting plate 23 is transversely mounted on the upper surface of the chassis frame assembly 1 and is disposed parallel to the moving plate 21 and the fixed plate 22, the stepping motor 24 is disposed on the mounting plate 23, one end of the ball screw 25 is connected to the stepping motor 24 and can rotate under the driving of the stepping motor 24, the other end of the ball screw 25 passes through the moving plate 21 and is connected to the fixed plate 22 and can drive the moving plate 21 to move relative to the fixed plate 22, thereby enabling the distance between the moving plate 21 and the fixed plate 22 to be automatically adjusted according to the width of the PCB board 8 to be detected, the first feed bar 26 and the second feed bar 27 are both fixed to the mounting plate 23, the other ends respectively pass through the moving plate 21 and are connected to the fixed plate 22, and the first feed bar 26 and the second feed bar 27 are respectively disposed parallel to both sides of the ball screw 25, and the first feed bar 26 and the second feed bar 27 are used to keep the moving plate 21 moving when the moving plate 21 is kept in balance.

Preferably, the ball screw 25 is connected to the movable plate 21 through a ball bearing 28 such that the ball screw 25 can rotate relative to the movable plate 21, thereby converting the rotation of the ball screw 25 into horizontal movement of the movable plate 21. The first feed lever 26 is connected to the movable plate 21 through a first slide bearing 29, and the second feed lever 27 is connected to the movable plate 21 through a second slide bearing 210, so that the movable plate 21 can slide with respect to the first feed lever 26 and the second feed lever 27.

Further, referring to fig. 5, the PCB clamping mechanism 7 of the present embodiment includes a first cylinder follower plate (not shown in the drawings), a second cylinder follower plate 71, a first cylinder 72, a second cylinder 73, a third cylinder 74, and a fourth cylinder 75, wherein the first cylinder 72 and the second cylinder 73 are disposed outside the movable plate 21, the third cylinder 74 and the fourth cylinder 75 are disposed outside the fixed plate 22, and the first cylinder follower plate is disposed inside the movable plate 21 and is capable of moving up and down along the movable plate 21 by the driving of the first cylinder 72 and the second cylinder 73; the second cylinder follower 71 is provided inside the fixed plate 22 and is capable of moving up and down along the fixed plate 22 by the driving of the third cylinder 74 and the fourth cylinder 75. A first baffle 76 is provided at the upper edge of the movable plate 21, and a first cylinder follower is located below the first baffle 76 and is movable toward the first baffle 76 by the driving of the first cylinder 72 and the second cylinder 73; a second baffle 77 is provided at the upper edge of the fixed plate 22, and the second cylinder follower 71 is located below the second baffle 77 and is movable toward the second baffle 77 by the driving of the first cylinder 72 and the second cylinder 73.

Specifically, when the PCB board 8 to be inspected is horizontally moved to a designated position, that is, moved above the first and second cylinder follower plates 72 and 71 by the simultaneous movement of the two sets of pulley operating mechanisms 31, the first cylinder follower plate is slightly moved upward along the moving plate 21 by the driving of the first and second cylinders 72 and 73, and the second cylinder follower plate 71 is slightly upward along the fixed plate 22 by the driving of the third and fourth cylinders 74 and 75, so that one side of the PCB board 8 to be inspected is sandwiched between the first cylinder follower plate and the first baffle plate 76 above, and the other side of the PCB board 8 to be inspected is sandwiched between the second cylinder follower plate 73 and the second baffle plate 77 above, so that the subsequent machine vision assembly 6 performs image acquisition.

Further, the outer housing is provided with a circulation fan 9 and a heat dissipation port 10 for ventilation and heat dissipation during operation of the apparatus. The outer shell is also provided with a liquid crystal display 11, and the liquid crystal display 11 is electrically connected with the machine vision component 6, so that the image information of the PCB acquired by the machine vision component 6 can be acquired and displayed in real time.

The alarm 12 is further arranged on the outer shell, the alarm 12 is electrically connected with the second driving motor 41 and the third driving motor, and audible and visual alarm can be carried out when the second driving motor 41 and the third driving motor run abnormally.

The external case is further provided with a cabinet door 13 and a keyboard cabinet 14, the cabinet door 13 being openable to check the operation of the apparatus main body inside the external case, the keyboard cabinet 14 being used for placing a keyboard, a mouse, etc. connected to the liquid crystal display 11 for parameter setting.

The operation process of the 3D solder paste detection apparatus of this embodiment is as follows:

the to-be-detected PCB 8 is placed on the two groups of belt pulley running mechanisms 31 in parallel, the first driving motor 32 is started, and the to-be-detected PCB 8 is horizontally conveyed to a designated position through the simultaneous movement of the two groups of belt pulley running mechanisms 31, namely, when the to-be-detected PCB is moved to the position above the first cylinder follower plate and the second cylinder follower plate 71, then the first cylinder follower plate slightly moves upwards along the moving plate 21 under the driving of the first cylinder 72 and the second cylinder 73, and the second cylinder follower plate 71 slightly moves upwards along the fixed plate 22 under the driving of the third cylinder 74 and the fourth cylinder 75, so that the to-be-detected PCB 8 is clamped up for image acquisition of the subsequent machine vision assembly 6. Then, according to the position of the PCB 8 to be detected, the machine vision assembly 6 is moved to a proper position above the PCB 8 to be detected by using the first direction moving assembly 4 and the second direction moving assembly 5, and then, the machine vision assembly 6 is used for collecting images of different positions of the PCB 8 to be detected and synchronously transmitting the images to the liquid crystal display 11, so that a technician can observe whether the surface of the PCB 8 is defective.

The foregoing is a further detailed description of the utility model in connection with the preferred embodiments, and it is not intended that the utility model be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the utility model, and these should be considered to be within the scope of the utility model.

Claims

1. The 3D solder paste detection device is characterized by comprising an outer shell and a device main body arranged in the outer shell, wherein the device main body comprises a chassis frame assembly (1), a PCB width automatic adjusting mechanism (2), a PCB transmission assembly (3), a first direction moving assembly (4), a second direction moving assembly (5), a machine vision assembly (6) and a PCB clamping mechanism (7),

the PCB width automatic regulating mechanism (2) is arranged on the chassis frame assembly (1) and comprises a movable plate (21), a fixed plate (22) and a driving mechanism, wherein two ends of the fixed plate (22) are respectively fixed to the chassis frame assembly (1), and the movable plate (21) and the fixed plate (22) are vertically arranged in parallel and can be close to or far away from the fixed plate (22) under the action of the driving mechanism;

the PCB transmission assembly (3) comprises a belt pulley running mechanism (31) and a first driving motor (32) connected to the belt pulley running mechanism (31), wherein the belt pulley running mechanism (31) is arranged on the inner surfaces of the movable plate (21) and the fixed plate (22) and is used for horizontally arranging the PCB (8) to be detected to a designated position;

the PCB clamping mechanism (7) is arranged on the movable plate (21) and the fixed plate (22) and is used for clamping the PCB (8) to be detected when the PCB (8) to be detected reaches a specified position;

the first direction moving assembly (4) is arranged in the longitudinal direction of the chassis frame assembly (1), the second direction moving assembly (5) is arranged in the transverse direction of the chassis frame assembly (1), and at least one end of the second direction moving assembly (5) is connected to the first direction moving assembly (4) so as to move along the longitudinal direction along with the first direction moving assembly (4); the machine vision assembly (6) is arranged on the second direction moving assembly (5) and can move along the transverse direction along with the second direction moving assembly (5).

2. 3D solder paste inspection apparatus according to claim 1, characterized in that the first direction movement assembly (4) comprises a second drive motor (41), a first slide rail (42), a first lead screw (43) and a first slider (44), wherein,

the first slide rail (42) is arranged on one side upper surface of the chassis frame assembly (1) along the longitudinal direction, the first slide block (44) is arranged inside the first slide rail (42), the first slide block (44) is connected to the second drive motor (41) through the first lead screw (43), and can move along the first slide rail (42) under the drive of the second drive motor (41);

one end of the second direction moving assembly (5) is fixed to the first slider (44) to move together with the first slider (44).

3. The 3D solder paste inspection apparatus according to claim 2, wherein the second direction moving assembly (5) comprises a cross bar (51), a second slide rail (52), a second lead screw, a second slider (53) and a third driving motor, wherein,

the cross bar (51) spans over the chassis frame assembly (1) in a transverse direction, and one end of the cross bar (51) is fixed to the first slider (44) and the other end is slidably connected to an upper surface of the chassis frame assembly (1);

the second sliding rail (52) is arranged on the upper surface of the cross rod (51) along the transverse direction, the second sliding block (53) is arranged inside the second sliding rail (52), and the second sliding block (53) is connected to the third driving motor through the second lead screw and can move along the second sliding rail (52) under the driving of the third driving motor;

the third driving motor is arranged on the cross rod (51).

4. A 3D solder paste inspection apparatus according to claim 3, wherein the machine vision assembly is fixed on the second slider (53) and comprises an industrial camera and a polisher.

5. The 3D solder paste inspection apparatus according to claim 3, wherein the driving mechanism of the automatic PCB board width adjusting mechanism (2) comprises a mounting plate (23), a stepping motor (24), a ball screw (25), a first feed bar (26) and a second feed bar (27), wherein,

the mounting plate (23) is transversely mounted on the upper surface of the chassis frame assembly (1) and is parallel to the movable plate (21) and the fixed plate (22), the stepping motor (24) is arranged on the mounting plate (23), one end of the ball screw (25) is connected to the stepping motor (24) and can rotate under the driving of the stepping motor (24), the other end of the ball screw (25) passes through the movable plate (21) and is connected to the fixed plate (22), the movable plate (21) can be driven to move relative to the fixed plate (22), first ends of the first light bar (26) and the second light bar (27) are fixed to the mounting plate (23), the other ends of the first light bar (26) and the second light bar (27) respectively pass through the movable plate (21) and are connected to the fixed plate (22), and the first light bar (26) and the second light bar (27) are respectively parallel to two sides of the ball screw (25).

6. The 3D solder paste inspection apparatus according to claim 5, wherein the PCB clamping mechanism (7) comprises a first cylinder follower plate, a second cylinder follower plate (71), a first cylinder (72), a second cylinder (73), a third cylinder (74) and a fourth cylinder (75), wherein,

the first air cylinder (72) and the second air cylinder (73) are arranged on the outer side of the movable plate (21), the third air cylinder (74) and the fourth air cylinder (75) are arranged on the outer side of the fixed plate (22), and the first air cylinder follower plate is arranged on the inner side of the movable plate (21) and can move up and down along the movable plate (21) under the driving of the first air cylinder (72) and the second air cylinder (73);

the second cylinder follower plate (71) is provided inside the fixed plate (22) and is movable up and down along the fixed plate (22) by the drive of the third cylinder (74) and the fourth cylinder (75).

7. The 3D solder paste inspection apparatus according to claim 6, wherein a first baffle (76) is provided at an upper edge of the movable plate (21), the first cylinder follower plate being located below the first baffle (76) and being movable toward the first baffle (76) by the driving of the first cylinder (72) and the second cylinder (73); a second baffle plate (77) is arranged at the upper edge of the fixed plate (22), and the second cylinder follower plate (71) is positioned below the second baffle plate (77) and can move towards the second baffle plate (77) under the driving of the first cylinder (72) and the second cylinder (73).

8. 3D solder paste inspection apparatus according to claim 1, characterized in that a circulation fan (9) and a heat sink (10) are provided on the outer housing.

9. The 3D solder paste inspection apparatus according to claim 1, wherein a liquid crystal display (11) is further provided on the outer housing, the liquid crystal display (11) being electrically connected to the machine vision assembly (6).

10. A 3D solder paste inspection apparatus according to claim 3, wherein an alarm (12) is further provided on the outer housing, the alarm (12) being electrically connected to the second drive motor (41) and the third drive motor.