CN219700273U - Temperature control device and sub-low temperature therapeutic instrument - Google Patents

Abstract

The utility model relates to the technical field of medical equipment, in particular to a temperature control device, which comprises a plurality of semiconductors and a heat exchange part, wherein the semiconductors are electrically connected with a control device and can be controlled by the control device to be switched to a refrigerating or heating state; the heat exchange part comprises a groove body and a heat conduction cover plate, the groove body is provided with a bent liquid guide groove, one surface of the heat conduction cover plate is attached to a notch for sealing the liquid guide groove, and the other surface of the heat conduction cover plate is fixedly attached to the semiconductor; the liquid guide groove is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are respectively connected with the heat conduction pipeline of the cold and hot supply device. The utility model adopts semiconductor refrigeration and heating, has no mechanical action, does not generate vibration and noise, has small volume and light weight, and is convenient for transfer.

Description

Temperature control device and sub-low temperature therapeutic instrument

Technical Field

The utility model belongs to the technical field of medical appliances, and particularly relates to a temperature control device and a sub-low temperature therapeutic apparatus.

Background

The sub-cryotherapy apparatus is used for postoperative care and repair of severe patients after brain surgery clinically, and is suitable for patients who need local physical temperature reduction and local physical temperature rise and need to maintain body temperature.

At present, the sub-low temperature therapeutic apparatus adopts a compressor to refrigerate, and in the refrigerating process, as the compressor works mechanically, larger vibration and noise can be generated during working, the rest of patients and the work of medical staff are affected, and the safety risk is increased. In addition, the compressor has large volume and large weight, is inconvenient to transfer and is inconvenient to use.

Therefore, a new technology is needed to solve the problems of large vibration and noise and inconvenient transfer when the sub-low temperature therapeutic apparatus in the prior art is used.

Disclosure of Invention

The embodiment of the utility model provides a temperature control device and a sub-low temperature therapeutic apparatus, and aims to solve the problems that the sub-low temperature therapeutic apparatus in the prior art has larger vibration and noise when in use, and is inconvenient to transfer.

The embodiment of the utility model is realized as follows:

in a first aspect, the present utility model provides a temperature control device comprising:

the semiconductors are electrically connected with the control device and can be controlled by the control device to be switched to a refrigerating or heating state;

the heat exchange part is provided with a bent liquid guide groove and a heat conduction cover plate, one surface of the heat conduction cover plate is attached to and seals the notch of the liquid guide groove, and the other surface of the heat conduction cover plate is fixedly attached to the semiconductor;

the liquid guide groove is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are respectively connected with a heat conduction pipeline of the cold and hot supply device.

Still further, the drain groove is including the feed liquor section, linkage segment and the play liquid section that connect gradually, the feed liquor section with the inlet is connected, the play liquid section with the liquid outlet is connected, the feed liquor section with play liquid section sets up side by side.

Still further, one or more of the liquid inlet section, the liquid outlet section, and the connecting section are arranged in an S-shape.

Further, the plurality of semiconductors are divided into two rows, and the positions of the two rows of semiconductors correspond to the positions of the liquid inlet section and the liquid outlet section respectively.

Still further still include with the mounting that the heat conduction apron is fixed, be equipped with a plurality of shapes with the logical groove of semiconductor looks adaptation on the mounting, the semiconductor inlays and is in it is in to lead to the inslot and the semiconductor stretches out from leading to the groove with the laminating of heat conduction apron.

Still further, the heat exchange part also comprises a sealing structure, wherein the sealing structure is clamped between the heat conduction cover plate and the tank body, and the sealing structure is connected end to form a closed loop and surrounds the notch of the liquid guide tank.

Furthermore, the groove body is provided with a caulking groove for the sealing structure to be partially embedded in on one surface provided with the liquid guiding groove, and the shape of the caulking groove is matched with the shape of the sealing structure.

Further, the sealing structure comprises at least two layers of substructures, the substructures are connected end to form a closed loop, and each substructure surrounds the notch of the liquid guide groove layer by layer.

Furthermore, the inner and outer adjacent two layers of the substructures are connected into a whole through a plurality of connecting structures, the connecting structures are positioned between the inner and outer adjacent two layers of the substructures, and two ends of the connecting structures are respectively and fixedly connected with the two substructures.

Further, the liquid guide groove comprises at least two parallel groove sections;

the substructure at the innermost layer is also provided with a separating part which extends out and is positioned between the two parallel groove sections of the liquid guide groove, and the separating part is of a double-layer or multi-layer structure.

In a second aspect, the present utility model provides a sub-cryogenic therapeutic apparatus comprising a temperature control device as claimed in any one of the preceding claims, the control device and the cold and hot supply means.

The beneficial effects achieved by the utility model are as follows:

the utility model is provided with the heat exchange part and the semiconductor, adopts the semiconductor for refrigeration and heating, has no mechanical action, does not generate vibration and noise, and has small volume, light weight and convenient transfer. When cooling or heating, the liquid enters the heat exchange part through the liquid inlet, the semiconductor refrigerates or heats, the liquid is cooled or heated through heat exchange of the heat conduction cover plate in the flowing process, and the liquid is discharged from the liquid outlet and then is conveyed to a cold and hot supply device (such as a temperature regulating blanket or a temperature regulating cap) through the heat conduction pipeline, so that the temperature of a patient is locally reduced or raised.

Drawings

FIG. 1 is an exploded view of a temperature control device provided by the present utility model;

FIG. 2 is a schematic diagram of the structure of the tank body of the present utility model;

FIG. 3 is a schematic view of a seal structure of the present utility model;

fig. 4 is a schematic view of an embodiment of the utility model provided with two heat exchange portions.

Reference numerals:

100. a temperature control device;

10. a heat exchange part; 101. a tank body; 1011. a liquid guiding groove; 1011A, a liquid inlet section; 1011B, connection section; 1011C, a liquid outlet section; 1012. a liquid inlet; 1013. a liquid outlet; 1014. a caulking groove; 102. a thermally conductive cover plate;

20. a semiconductor;

30. a mounting member;

40. a sealing structure; 401. a first substructure; 402. a second substructure; 403. a connection structure; 404. a partition portion.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. Examples of the embodiments are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model. Furthermore, it should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the present utility model.

In the description of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "left," "right," "horizontal," "top," "bottom," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless specifically defined otherwise.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different structures of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

The utility model is provided with the heat exchange part and the semiconductor, adopts the semiconductor for refrigeration and heating, has no mechanical action, does not generate vibration and noise, and has small volume, light weight and convenient transfer. When cooling or heating, liquid enters the heat exchange part through the liquid inlet, semiconductor refrigeration or heating is carried out, the liquid is cooled or warmed through heat exchange carried out by the heat conducting cover plate in the flowing process, and after being discharged from the liquid outlet, the liquid is conveyed to the temperature regulating blanket or the temperature regulating cap through the pipeline, so that the temperature of a patient is locally lowered or warmed.

Example 1

Referring to fig. 1, the present embodiment provides a temperature control device 100, including:

the semiconductors 20 are electrically connected with the control device, and can be controlled by the control device to be switched to a refrigerating or heating state;

the heat exchange part 10, the heat exchange part 10 comprises a groove body 101 and a heat conduction cover plate 102, the groove body 101 is provided with a bent liquid guide groove 1011, one surface of the heat conduction cover plate 102 is attached to a notch of the closed liquid guide groove 1011, and the other surface is fixedly attached to the semiconductor 20;

the liquid guide groove 1011 is provided with a liquid inlet 1012 and a liquid outlet 1013, and the liquid inlet 1012 and the liquid outlet 1013 are respectively connected with a heat conduction pipeline of the cold and hot supply device.

In the present embodiment, the semiconductor 20 performs heat exchange with the heat exchange portion 10 through the heat conductive cover plate 102, so as to ensure that the temperature of the heat exchange medium (e.g., water) in the heat exchange portion 10 is kept within a desired range. The semiconductor 20 may be bonded to the heat conductive cover 102 on one side, and heat exchange is performed by one heat exchange portion 10, or the semiconductor 20 may be disposed between two heat exchange portions 10, and two opposite sides of the semiconductor 20 may be bonded to the heat conductive cover 102, or may be disposed in other manners.

Specifically, referring to fig. 2, a liquid guiding groove 1011 is arranged on one surface of the groove body 101, the surface is covered with a heat conducting cover plate 102, and the heat conducting cover plate 102 and the liquid guiding groove 1011 form a closed cavity together for heat exchange medium to flow. The heat conducting cover plate 102 is used for conducting heat, and can be made of metal materials or other materials with good heat conducting performance. The heat exchange medium flows through the liquid guide groove 1011 and contacts with the heat conducting cover plate 102, and exchanges heat with the semiconductor 20 through the heat conducting cover plate 102. The liquid guide groove 1011 is bent over the whole plane, and the contact area between the heat exchange medium and the heat conducting cover plate 102 is increased, so that the heat exchange effect is better.

Referring to fig. 2, the liquid inlet 1012 and the liquid outlet 1013 are provided at two ends of the liquid guide groove 1011, and the heat exchange medium flows in from the liquid inlet 1012 and flows out from the liquid outlet 1013 after heat exchange is completed.

The semiconductor 20 can be used for heating or refrigerating, the semiconductor 20 is used for heating or refrigerating, the control device is used for controlling and switching, no mechanical action is generated, vibration and noise are not generated, the size is small, the weight is light, and the transfer is convenient. The heat exchange medium is heated or cooled by heat transfer between the heat exchange medium and the heat exchange medium, the heat exchange medium subjected to heat exchange with the semiconductor 20 is discharged from the liquid outlet 1013 and is conveyed to a cold and hot supply device such as a temperature regulating blanket or a temperature regulating cap of a sub-low temperature therapeutic apparatus through a heat conducting pipeline, so that the temperature of a patient is locally reduced or increased. The number of the semiconductors 20 is a plurality, i.e., can be set to 1, 2, 3, 4 and even more according to circumstances, and the specific number is set according to actual demands. The control device may be a controller on the cryogenic treatment apparatus or other otherwise provided controller.

The heat exchange medium can be liquid or gas, so that the flow in the cavity is facilitated.

Based on the above structure, taking the heat exchange medium as the liquid as an example, the embodiment performs corresponding work according to the needs of the patient when working. If the patient needs to keep warm or raise temperature, the control device controls the semiconductor 20 to be switched to heat, the heat exchange part 10 transfers the heat generated by the semiconductor 20 to the liquid entering the heat exchange part 10, and the heated liquid provides heat for the patient in the sub-low temperature therapeutic apparatus to keep warm or raise temperature for the patient. On the contrary, if the patient needs to be cooled, the semiconductor 20 is controlled by the control device to cool, the heat of the liquid entering the tank 101 is absorbed through the heat exchange part 10, the liquid is cooled, and the cooled liquid absorbs heat to the patient in the sub-low temperature therapeutic apparatus, so that the patient is cooled. The semiconductor 20 has the advantages of no mechanical vibration and noise during operation, better use experience, small size, light weight and convenient transfer.

Referring to fig. 4, in another embodiment, two heat exchanging portions 10 are provided, and the heat conducting cover plates 102 of the two heat exchanging portions 10 are disposed opposite to each other, and each semiconductor 20 is located between the two heat exchanging portions 10. In this embodiment, two heat exchanging portions 10 are provided, and the two heat exchanging portions 10 are disposed opposite to each other with the heat conductive cover plate 102 facing the inside. The semiconductor 20 is disposed between the two heat exchanging portions 10, and opposite surfaces of the semiconductor 20 are respectively in contact with the heat conductive cover plates 102 of the two heat exchanging portions 10. The semiconductor 20 is respectively contacted with the heat exchange parts 10 at two sides to exchange heat, so that the contact area of heat exchange is increased, the heat exchange efficiency is improved, the waste of heat generated by the semiconductor 20 is avoided, and the utilization rate of the semiconductor 20 is improved.

Example two

Referring to the figure, on the basis of the first embodiment, the liquid guiding groove 1011 includes a liquid inlet section 1011A, a connecting section 1011B and a liquid outlet section 1011C which are sequentially connected, the liquid inlet section 1011A is connected with the liquid inlet 1012, the liquid outlet section 1011C is connected with the liquid outlet 1013, and the liquid inlet section 1011A and the liquid outlet section 1011C are arranged side by side.

In this embodiment, the liquid inlet section 1011A, the connecting section 1011B and the liquid outlet section 1011C are sequentially connected. The liquid inlet section 1011A is connected with the liquid inlet 1012, the heat exchange medium is led in from the liquid inlet 1012, then flows into the liquid outlet section 1011C through the heat exchange medium of the switching section, and the liquid outlet section 1011C is connected with the liquid outlet 1013 to lead out the heat exchange medium which completes the heat exchange. The general direction of the path formed by the liquid guide groove 1011 is a U-shaped path.

Specifically, referring to fig. 2, the liquid inlet section 1011A and the liquid outlet section 1011C are arranged side by side, the structure is simple, the processing is easy, the liquid inlet 1012 and the liquid outlet 1013 are arranged on the same side, and then the pipe joint connecting the liquid inlet 1012 and the liquid outlet 1013 is also on the same side, so that the installation space is saved, and the shielding is not easy to be caused around.

Example III

Referring to fig. 2, on the basis of the second embodiment, one or more of the liquid inlet section 1011A, the liquid outlet section 1011C and the connection section 1011B are arranged in an S shape.

In this embodiment, one or more S-shaped curves are respectively disposed in the liquid inlet section 1011A, the liquid outlet section 1011C and the connecting section 1011B, and when the distances between the two points are the same, the setting of the curves is favorable to increasing the length of the path, the more the curves are, the longer the length of the cavity is, and the longer the cavity is, so that the contact area between the heat conducting cover plate 102 and the heat exchanging medium is favorable to increasing, and the heat exchanging between the heat exchanging medium and the semiconductor 20 is more thorough. And the S-shaped bend is smoothly connected, so that the flow of the heat exchange medium is facilitated, and the heat exchange medium is not easy to be blocked.

In one embodiment, the liquid inlet section 1011A is arranged in an S shape and the liquid outlet section 1011C and the connecting section 1011B are arranged in a straight line.

In one embodiment, the liquid outlet section 1011C is arranged in an S shape and the liquid inlet section 1011A and the connecting section 1011B are arranged in a straight line.

In one embodiment, the connection sections 1011B are arranged in an S-shape and the liquid outlet sections 1011C and liquid inlet sections 1011A are arranged in a straight line.

Example IV

Referring to fig. 1, on the basis of the second embodiment, a plurality of semiconductors 20 are divided into two rows, and positions of the two rows of semiconductors 20 correspond to positions of the liquid inlet section 1011A and the liquid outlet section 1011C, respectively.

In this embodiment, the semiconductors 20 are arranged in two rows, wherein the position of one row of semiconductors 20 corresponds to the position of the liquid inlet section 1011A, and the position of the other row of semiconductors 20 corresponds to the position of the liquid outlet section 1011C.

If the semiconductor 20 is not provided with the liquid guide groove 1011 at the position, the semiconductor 20 cannot rapidly exchange heat with the heat exchange medium, and can only conduct heat to the position provided with the liquid guide groove 1011 through the heat conducting cover plate 102, and exchange heat with the heat exchange medium at the position, thereby having low heat exchange efficiency. The semiconductor 20 is arranged at a position corresponding to the arrangement position of the liquid guide groove 1011, so that heat exchange can be performed with the heat exchange medium in the liquid guide groove 1011 rapidly, and the heat exchange efficiency is improved.

Example five

Referring to fig. 1, based on the first embodiment, the temperature control device 100 further includes a mounting member 30 fixed to the heat conducting cover plate 102, a plurality of through slots with shapes matched with the semiconductor 20 are formed in the mounting member 30, the semiconductor 20 is embedded in the through slots, and the semiconductor 20 extends out of the through slots to be attached to the heat conducting cover plate 102.

In the present embodiment, the mount 30 is used to connect the semiconductor 20 with the tank 101. Through grooves are formed in the mounting portion and used for fixing the semiconductors 20, and the shapes and the number of the through grooves are matched with those of the semiconductors 20. The mounting part is arranged on one surface of the heat conducting cover plate 102 facing the semiconductor 20, is fixedly connected with the heat conducting cover plate 102, the semiconductor 20 is embedded into the through groove, and one surface of the semiconductor 20 facing the heat conducting cover plate 102 extends out of the through groove to be attached to the heat conducting cover plate 102. The mounting member 30 provides a limit for the semiconductor 20, so that the position of the semiconductor 20 is prevented from moving in the moving process of the temperature control device 100, and the heat exchange with the heat conducting medium is affected, thereby reducing the heat exchange efficiency.

Specifically, referring to fig. 1, the mount 30 may be removably coupled to the thermally conductive cover plate 102. Connecting holes are formed in positions corresponding to the mounting piece 30 and the heat conducting cover plate 102, threaded holes corresponding to the connecting holes are formed in the groove body 101, bolts penetrate through the connecting holes in the mounting piece 30 and the heat conducting cover plate 102 and are screwed into the threaded holes, and the groove body 101, the heat conducting cover plate 102 and the mounting piece 30 are fixed together. At least two connecting holes are respectively arranged on the mounting piece 30 and the heat conduction cover plate 102, and are uniformly distributed along the outer edge of the mounting piece 30 or the heat conduction cover plate 102.

The threaded connection is convenient to disassemble and assemble, and is convenient to maintain and overhaul the temperature control device 100.

Example six

Referring to fig. 1 and 3, on the basis of the first embodiment, the heat exchange portion 10 further includes a sealing structure 40, where the sealing structure 40 is sandwiched between the heat conducting cover plate 102 and the tank 101, the sealing structure 40 is a closed structure connected end to end, and the sealing structure 40 surrounds the notch of the liquid guiding groove 1011 in the inner ring of the sealing structure 40.

In this embodiment, the sealing structure 40 is disposed between the heat-conducting cover plate 102 and the tank body 101, so as to avoid the heat exchange medium overflowing between the heat-conducting cover plate 102 and the tank body 101.

Specifically, the sealing structure 40 is a closed structure connected end to end, and has no open position, so that the heat exchange medium is prevented from overflowing from the open position. The sealing structure 40 is disposed around the outer circumference of the liquid guide groove 1011, and the portion where the liquid guide groove 1011 is disposed is enclosed in the inner circumference of the sealing structure 40.

The sealing structure 40 may be made of an elastic material, such as rubber, silica gel, etc., and the heat-conducting cover plate 102 and the tank body 101 are mutually extruded, so that the sealing structure 40 deforms to seal the gap between the heat-conducting cover plate 102 and the tank body 101.

Example seven

Referring to fig. 2, on the basis of the sixth embodiment, the groove 101 is provided with a caulking groove 1014 for partially embedding the sealing structure 40 on the side provided with the liquid guiding groove 1011, and the shape of the caulking groove 1014 is adapted to the shape of the sealing structure 40.

In this embodiment, a caulking groove 1014 adapted to the sealing structure 40 is disposed on a surface of the groove body 101 facing the heat exchange cover plate, the sealing structure 40 is embedded in the caulking groove 1014, and the caulking groove 1014 provides a limit for the sealing structure 40, so as to avoid the sealing failure caused by the deviation of the position of the sealing structure 40.

Example eight

Referring to fig. 3, on the basis of the sixth embodiment, the sealing structure 40 includes at least two sub-structures, the sub-structures are connected end to form a closed loop, and each sub-structure surrounds the notch of the liquid guide groove 1011 layer by layer.

In the present embodiment, the sealing structure 40 is a double-layer sealing structure 40 including a two-layer substructure. The two substructures are a first substructures 401 and a second substructures 402 respectively, the first substructures 401 and the second substructures 402 are connected end to form a closed loop, the first substructures 401 and the second substructures 402 are identical in shape, and the size of the first substructures 401 is larger than that of the second substructures 402. The second substructure 402 is arranged in the inner ring of the first substructure 401, and the two substructures form a double-layer seal, so that the sealing effect is better.

Example nine

On the basis of the eighth embodiment, the inner and outer adjacent two-layer substructures are connected into a whole through a plurality of connecting structures 403, the connecting structures 403 are located between the inner and outer adjacent two-layer substructures, and two ends of the connecting structures are respectively and fixedly connected with the two-layer substructures.

In this embodiment, a certain gap is formed between the first substructure 401 and the second substructure 402, and a plurality of connection structures 403 are disposed in the gap to connect the first substructure 401 and the second substructure 402 together.

The connecting piece can only set up one, connects first substructure 401 and second substructure 402, is convenient for accomodate, avoids losing, also conveniently takes. The connection members may be provided in two, three or more numbers, uniformly arranged along the shape of the first and second substructures 401 and 402. The connecting pieces uniformly distributed play a role in resembling reinforcing ribs, and support is provided for the first substructure 401 and the second substructure 402 respectively, so that the first substructure 401 and the second substructure 402 are more stable, relative displacement between the first substructure 401 and the second substructure 402 is avoided, and the sealing effect is prevented from being influenced by deflection or extrusion between the first substructure 401 and the second substructure 402 during assembly.

Examples ten

Referring to fig. 1 to 3, on the basis of the eighth embodiment, the liquid guide groove 1011 includes at least two parallel groove sections; the substructure at the innermost layer is further provided with a partition 404 extending between two parallel groove sections of the liquid guide groove 1011, and the partition 404 has a double-layer or multi-layer structure.

In this embodiment, the liquid guide groove 1011 includes at least two parallel groove sections, and the number of groove sections may be two, three, or other numbers, and the number of groove sections specifically set is based on the actual requirement. The second structure extends out of the partition part 404, and the partition part 404 is arranged between two parallel groove sections to form shielding for the two parallel groove sections, so that heat exchange media in the adjacent groove sections are prevented from flowing mutually after overflowing from the liquid guide groove 1011, and the heat exchange effect is prevented from being influenced.

Specifically, when two parallel groove sections are provided, the two parallel groove sections may be the liquid outlet section 1011C and the liquid inlet section 1011A in the second embodiment. The general direction of the path formed by the liquid guide groove 1011 is a U-shaped path. The first substructure 401 and the second substructure 402 enclose the liquid guide trough 1011, i.e. the outer perimeter of the U-shaped path, and the second substructure 402 extends beyond the partition 404 into the U-shaped recess.

The partition 404 prevents the heat exchange medium in the front stage of the liquid guide tank 1011, which has not sufficiently exchanged heat, from flowing with the medium in the rear stage of the liquid guide tank 1011, which has sufficiently exchanged heat, thereby causing the temperature of the heat transfer medium finally flowing out of the liquid outlet 1013 to be unstable.

Example eleven

Referring to fig. 1 to 4, the present embodiment provides a sub-cryogenic therapeutic apparatus, which includes the above-mentioned temperature control device 100, control device and cold and hot supply device.

In this embodiment, the sub-low temperature therapeutic apparatus includes a water pump, a water tank, a temperature blanket or a temperature regulating cap, and the above-described temperature control device 100, control device, and cold and hot supply means. The water outlet end of the water tank, the water pump, the temperature control device 100, the cold and hot supply device and the water inlet end of the water tank are sequentially connected in series through pipelines to form a water circulation system.

The water tank is internally provided with a heat exchange medium, the heat exchange medium is pumped into the temperature control device 100 through a water pump, the heat exchange medium exchanges heat between the temperature control device 100 and the semiconductor 20 in the temperature control device 100, and the semiconductor 20 refrigerates or heats the temperature control medium. The heat exchange medium after refrigeration or heating is introduced into a cold and hot supply device (such as a temperature-regulating blanket or a temperature-regulating cap), and heat exchange is carried out between the heat exchange medium and the cold and hot supply device, so that the cold and hot supply device is refrigerated and heated to reach the temperature required by treatment.

The sub-low temperature therapeutic apparatus adopts the semiconductor 20 for refrigeration and heating, has no mechanical action, does not generate vibration and noise, has small volume and light weight, and is convenient for moving the therapeutic apparatus.

In the description of the present specification, reference to the terms "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the foregoing description of the preferred embodiment of the utility model is provided for the purpose of illustration only, and is not intended to limit the utility model to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims (11)

1. A temperature control device, comprising:

the semiconductors are electrically connected with the control device and can be controlled by the control device to be switched to a refrigerating or heating state;

the heat exchange part comprises a groove body and a heat conduction cover plate, wherein the groove body is provided with a bent liquid guide groove, one surface of the heat conduction cover plate is attached to and seals a notch of the liquid guide groove, and the other surface of the heat conduction cover plate is fixedly attached to the semiconductor;

the liquid guide groove is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are respectively connected with a heat conduction pipeline of the cold and hot supply device.

2. The temperature control device of claim 1, wherein the liquid guide groove comprises a liquid inlet section, a connecting section and a liquid outlet section which are sequentially connected, the liquid inlet section is connected with the liquid inlet, the liquid outlet section is connected with the liquid outlet, and the liquid inlet section and the liquid outlet section are arranged side by side.

3. The temperature control device of claim 2, wherein one or more of the inlet section, the outlet section, and the connecting section are arranged in an S-shape.

4. The temperature control device according to claim 2, wherein the plurality of semiconductors are divided into two rows, and positions of the two rows of semiconductors correspond to positions of the liquid inlet section and the liquid outlet section, respectively.

5. The temperature control device according to claim 1, further comprising a mounting piece fixed with the heat conducting cover plate, wherein the mounting piece is provided with a plurality of through grooves with shapes matched with the semiconductors, the semiconductors are embedded in the through grooves, and the semiconductors extend out of the through grooves to be attached to the heat conducting cover plate.

6. The temperature control device of claim 1, wherein the heat exchange portion further comprises a sealing structure sandwiched between the thermally conductive cover plate and the tank body, the sealing structure being joined end-to-end in a closed loop and surrounding the slot opening of the liquid guide tank.

7. The temperature control device according to claim 6, wherein the groove body is provided with a caulking groove for the sealing structure to be partially inserted in on a side provided with the liquid guiding groove, and a shape of the caulking groove is adapted to a shape of the sealing structure.

8. The temperature control device of claim 6, wherein the sealing structure comprises at least two sub-structures, the sub-structures being connected end-to-end in a closed loop, each sub-structure surrounding the slot of the liquid guide slot layer-by-layer.

9. The temperature control device according to claim 8, wherein the inner and outer adjacent two layers of the substructures are connected into a whole through a plurality of connecting structures, the connecting structures are positioned between the inner and outer adjacent two layers of the substructures, and two ends of the connecting structures are respectively and fixedly connected with the two substructures.

10. The temperature control device of claim 9, wherein the liquid guide trough comprises at least two side-by-side trough sections;

the substructure at the innermost layer is also provided with a separating part which extends out and is positioned between the two parallel groove sections of the liquid guide groove, and the separating part is of a double-layer or multi-layer structure.

11. A sub-cryogenic therapeutic apparatus comprising a temperature control device according to any one of claims 1 to 10, the control device and the cold and hot supply means.