CN219678671U

CN219678671U - Bluetooth headset storehouse chip that charges

Info

Publication number: CN219678671U
Application number: CN202321210327.2U
Authority: CN
Inventors: 蔡锦标
Original assignee: Ko Star Development Co ltd
Current assignee: Ko Star Development Co ltd
Priority date: 2023-05-18
Filing date: 2023-05-18
Publication date: 2023-09-12
Anticipated expiration: 2033-05-18

Abstract

The utility model discloses a Bluetooth headset charging bin chip, and relates to the technical field of Bluetooth headsets. The utility model comprises a chip main body and pins, wherein the pins are welded on two opposite surfaces of the chip main body, the chip main body comprises a packaging shell, a contact plate and a PCB, the upper surface of the packaging shell is provided with an open slot, the open slot is communicated with the inside of the packaging shell, the contact plate is embedded in the open slot, the contact plate extends to the inside of the packaging shell, the PCB is embedded on the lower surface of the contact plate, and a plurality of heat conducting columns are embedded on the lower surface of the PCB. According to the utility model, through the heat conduction column and the heat dissipation groove structure, heat generated during the operation of the chip is conveniently and timely dissipated, the phenomenon that the temperature inside the chip is too high due to accumulation of heat is avoided, and the normal operation of the chip is ensured.

Description

Bluetooth headset storehouse chip that charges

Technical Field

The utility model belongs to the technical field of Bluetooth headphones, and particularly relates to a Bluetooth headphone charging bin chip.

Background

The Bluetooth headset is applied to a hands-free headset, so that a user can avoid the trouble of an annoying wire, can easily talk in various modes, a circuit board is arranged in the Bluetooth to control the serial functions of the Bluetooth headset, and a Bluetooth headset charging bin is a small-sized portable charging device.

Among the prior art, the installation environment of bluetooth headset storehouse chip that charges is comparatively sealed generally, and inconvenient later stage's heat dissipation leads to the heat to pile up easily, leads to the high temperature, influences the later stage's of chip use, and its mounting structure lacks safeguard function simultaneously, receives the damage easily when receiving the impact.

Disclosure of Invention

The utility model aims to provide a Bluetooth headset charging bin chip, which solves the problem of inconvenient heat dissipation in the prior art.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

the utility model relates to a Bluetooth headset charging bin chip, which comprises a chip main body and pins, wherein the pins are welded on two opposite surfaces of the chip main body, the chip main body comprises a packaging shell, a contact plate and a PCB (printed circuit board), an open slot is formed in the upper surface of the packaging shell and is communicated with the interior of the packaging shell, the contact plate is embedded in the open slot and extends to the interior of the packaging shell, the PCB is embedded on the lower surface of the contact plate, and a plurality of heat conducting columns are embedded on the lower surface of the PCB, so that heat generated during the chip working is conveniently and timely radiated, the phenomenon that the temperature in the chip is too high due to accumulation of the heat is avoided, and the normal operation of the chip is ensured.

Further, one end of the heat conduction column is connected with the bottom surface inside the packaging shell, a plurality of heat dissipation grooves are formed in two opposite surfaces of the packaging shell, and the heat dissipation grooves are communicated with the inside of the packaging shell.

Further, a plurality of support columns are welded on the lower surface of the packaging shell, support sleeves are respectively embedded at one ends of the support columns, and a bottom plate is welded on the lower surface of each support sleeve.

Further, sliding fit is provided between support column one end week side and the inside week side of support sleeve, two opposite surfaces in the support sleeve all are provided with the spacing groove.

Further, guide rods are embedded in the two limiting grooves, pressing plates are welded on the lower surfaces of the supporting columns, and two ends of each pressing plate extend to the inside of each limiting groove.

Further, two ends of the pressing plate are respectively in sliding fit with the two limiting grooves, one end of the guide rod penetrates through one surface of the pressing plate, and the peripheral side faces of the guide rod are in sliding fit with the pressing plate.

Further, the support spring is welded on the lower surface of the pressing plate, one end of the support spring is welded with the inner bottom surface of the support sleeve, so that the impact to the chip from the outside is buffered conveniently, the impact to the chip is reduced, the protection capability to the chip is improved, and the service life of the chip is guaranteed.

The utility model has the following beneficial effects:

1. according to the utility model, through the heat conduction column and the heat dissipation groove structure, heat generated during the operation of the chip is conveniently and timely dissipated, the phenomenon that the temperature inside the chip is too high due to accumulation of heat is avoided, and the normal operation of the chip is ensured.

2. According to the utility model, through the supporting columns and the supporting spring structures, the impact on the chip from the outside is conveniently buffered, the impact on the chip is reduced, the protection capability on the chip is improved, and the service life of the chip is ensured.

Of course, it is not necessary for any one product to practice the utility model to achieve all of the advantages set forth above at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a bluetooth headset charging bin chip according to the present utility model;

fig. 2 is a schematic diagram of a rear view structure of a charging bin chip of a bluetooth headset according to the present utility model;

fig. 3 is a schematic diagram of a front view structure of a charging bin chip of a bluetooth headset according to the present utility model;

fig. 4 is a schematic diagram of an internal structure of a bluetooth headset charging bin chip according to the present utility model;

fig. 5 is a schematic view showing an internal structure of the support sleeve according to the present utility model.

In the drawings, the list of components represented by the various numbers is as follows:

1. a chip main body; 2. a package housing; 3. pins; 4. a contact plate; 5. a PCB board; 6. a heat conducting column; 7. a heat sink; 8. a support column; 9. a support sleeve; 10. a bottom plate; 11. a limit groove; 12. a guide rod; 13. a pressing plate; 14. a support spring; 15. an open slot.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "upper," "middle," "outer," "inner," and the like indicate an orientation or a positional relationship, and are merely for convenience of describing the present utility model and simplifying the description, but do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Embodiment one:

referring to fig. 1-5, the utility model discloses a bluetooth headset charging bin chip, which comprises a chip main body 1 and pins 3, wherein the pins 3 are welded on two opposite surfaces of the chip main body 1, the chip main body 1 comprises a packaging shell 2, a contact plate 4 and a PCB (printed circuit board) 5, an open slot 15 is arranged on the upper surface of the packaging shell 2, the open slot 15 is communicated with the inside of the packaging shell 2, the contact plate 4 is embedded in the open slot 15, the contact plate 4 extends to the inside of the packaging shell 2, the PCB 5 is embedded on the lower surface of the contact plate 4, a plurality of heat-conducting columns 6 are embedded on the lower surface of the PCB 5, so that heat generated during the chip working is conveniently and timely dissipated, the chip internal temperature is prevented from being excessively high due to accumulation of the heat, the normal operation of the chip is ensured, one end of the heat-conducting columns 6 is connected with the internal bottom surface of the packaging shell 2, a plurality of heat-dissipating grooves 7 are respectively arranged on two opposite surfaces of the packaging shell 2, and the heat-dissipating grooves 7 are communicated with the inside of the packaging shell 2.

The lower surface welding of encapsulation shell 2 has a plurality of support columns 8, and support sleeve 9 has all been inlayed to support column 8 one end, and support sleeve 9 lower surface welding has bottom plate 10, and sliding fit between support column 8 one end week side and the inside week side of support sleeve 9, and two inside opposite surfaces of support sleeve 9 all are provided with spacing groove 11.

Guide rods 12 are embedded in the two limiting grooves 11, pressing plates 13 are welded on the lower surfaces of the supporting columns 8, two ends of each pressing plate 13 extend into the two limiting grooves 11 respectively, two ends of each pressing plate 13 are in sliding fit with the two limiting grooves 11 respectively, one ends of each guide rod 12 penetrate through one surface of each pressing plate 13, and the peripheral side faces of the two guide rods 12 are in sliding fit with the pressing plates 13.

The supporting spring 14 is welded on the lower surface of the pressing plate 13, one end of the supporting spring 14 is welded with the inner bottom surface of the supporting sleeve 9, so that impact to the chip from the outside is buffered conveniently, the impact to the chip is reduced, the protection capability to the chip is improved, and the service life of the chip is guaranteed.

Embodiment two:

referring to fig. 1-5, the utility model discloses a charging bin chip of a bluetooth headset, which comprises the following steps: through the structures of the heat conducting column 6 and the heat radiating groove 7, heat generated during the operation of the chip is conveniently and timely radiated, the phenomenon that the temperature inside the chip is too high due to accumulation of heat is avoided, and the normal operation of the chip is ensured; through support column 8 and supporting spring 14 structure, conveniently cushion the impact to the chip from the external world, reduce the impact to the chip production, improve the protective capability to the chip, guarantee the life of chip.

In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the utility model disclosed above are intended only to assist in the explanation of the utility model. The preferred embodiments are not exhaustive or to limit the utility model to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best understand and utilize the utility model. The utility model is limited only by the claims and the full scope and equivalents thereof.

Claims

1. The utility model provides a bluetooth headset storehouse chip that charges, includes chip main part (1) and pin (3), its characterized in that: pin (3) welding is at two opposite surfaces of chip main part (1), chip main part (1) are including encapsulation shell (2), contact plate (4) and PCB board (5), encapsulation shell (2) upper surface is provided with open slot (15), open slot (15) are linked together with encapsulation shell (2) inside, contact plate (4) dress is inlayed inside open slot (15), contact plate (4) extend to encapsulation shell (2) inside, PCB board (5) dress is inlayed at contact plate (4) lower surface, PCB board (5) lower surface dress has inlayed a plurality of heat conduction post (6).

2. The Bluetooth headset charging bin chip according to claim 1, wherein one end of the heat conducting column (6) is connected with the inner bottom surface of the packaging shell (2), a plurality of heat radiating grooves (7) are formed in two opposite surfaces of the packaging shell (2), and the heat radiating grooves (7) are communicated with the inner portion of the packaging shell (2).

3. The Bluetooth headset charging bin chip according to claim 1, wherein a plurality of support columns (8) are welded on the lower surface of the packaging shell (2), support sleeves (9) are embedded at one ends of the support columns (8), and a bottom plate (10) is welded on the lower surface of the support sleeves (9).

4. A bluetooth headset storehouse chip that charges according to claim 3, characterized in that, sliding fit between support column (8) one end week side and the inside week side of support sleeve (9), two opposite surfaces in support sleeve (9) are provided with spacing groove (11) respectively.

5. The Bluetooth headset charging bin chip according to claim 4, wherein guide rods (12) are embedded in the two limiting grooves (11), pressing plates (13) are welded on the lower surfaces of the supporting columns (8), and two ends of each pressing plate (13) extend into the two limiting grooves (11) respectively.

6. The Bluetooth headset charging bin chip according to claim 5, wherein two ends of the pressing plate (13) are respectively in sliding fit with two limiting grooves (11), one ends of two guide rods (12) penetrate through one surface of the pressing plate (13), and the peripheral side surfaces of the two guide rods (12) are in sliding fit with the pressing plate (13).

7. The Bluetooth headset charging bin chip according to claim 6, wherein a supporting spring (14) is welded on the lower surface of the pressing plate (13), and one end of the supporting spring (14) is welded with the inner bottom surface of the supporting sleeve (9).