CN219555101U - A modularization design circuit and bluetooth sound for bluetooth sound - Google Patents
A modularization design circuit and bluetooth sound for bluetooth sound Download PDFInfo
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- CN219555101U CN219555101U CN202222715022.9U CN202222715022U CN219555101U CN 219555101 U CN219555101 U CN 219555101U CN 202222715022 U CN202222715022 U CN 202222715022U CN 219555101 U CN219555101 U CN 219555101U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
The utility model relates to the field of circuit design, in particular to a modularized design circuit for a Bluetooth sound box and the Bluetooth sound box. The Bluetooth audio modularized circuit is designed, and a Bluetooth MCU module and a peripheral device are packaged into a module, wherein the peripheral device comprises a power supply module, a wireless radio frequency module, an input module and an output module; the Bluetooth MCU module is connected with the power supply module, the wireless radio frequency module, the input module and the output module in a wired mode respectively. Through the design of the modularized circuit, the interface is simplified, the data transmission is low in delay, stable in performance and high in reliability, the product development difficulty is low, the data processing delay is low, the product cost is reduced, and the modularized circuit is widely applied and can be applied to intelligent home, household appliances and outdoor equipment.
Description
Technical Field
The utility model relates to the field of circuit design, in particular to a modularized design circuit for a Bluetooth sound box and the Bluetooth sound box.
Background
The existing audio control technology utilizes an audio DSP processor and a power amplifier IC drive assembly network to establish an amplifier, amplifies the audio, and the transverse and traditional Bluetooth module technologies can carry out data transmission through serial port (SPI, IIC) control equipment. The system can be used as a master machine module and a slave machine module. The host mode is capable of searching for another bluetooth module and actively establishing a connection therewith. The slave mode cannot actively establish connection, and can only wait for the host to connect with itself.
Disclosure of Invention
In order to solve the problems, the utility model provides the following scheme:
in one aspect, the present utility model provides a modular design circuit for a bluetooth sound device, comprising:
bluetooth MCU module and peripheral device;
the peripheral device comprises a power supply module, a wireless radio frequency module, an input module and an output module;
the Bluetooth MCU module is connected with the power supply module, the wireless radio frequency module, the input module and the output module in a wired mode respectively, and the peripheral device and the Bluetooth MCU processor are packaged into a module.
Preferably, the bluetooth MCU module is an FBM5308 bluetooth chip.
Specifically, the power supply module comprises a USB power supply unit and a battery, wherein the USB power supply unit is a 5V direct current power supply, and the battery is a 3.7V battery.
Specifically, the wireless radio frequency module comprises a radio antenna, a Bluetooth antenna and an infrared input device.
Specifically, the input module comprises an earphone input unit, an optical fiber interface unit, a memory card input unit and an MIC input unit, and each unit of the input module is connected with the Bluetooth MCU module in a wired mode.
Specifically, the output module comprises a power amplifier output unit and a microphone interface unit, and the power amplifier output unit is an HT878T chip.
Specifically, the peripheral device further comprises a Bluetooth crystal oscillator, and the Bluetooth crystal oscillator is configured at 32 MHZ.
Specifically, the peripheral device further comprises a key, wherein the key consists of a resistor and a switch, and is connected to the FBM5308 Bluetooth chip.
Specifically, the peripheral device further comprises a display screen.
In one aspect, the utility model provides a bluetooth sound box, which comprises a sound box body and the modularized design circuit for the bluetooth sound box.
Through the Bluetooth sound modularized circuit design, the Bluetooth MCU module and the peripheral device are packaged into a module, wherein the peripheral device comprises a power supply module, a wireless radio frequency module, an input module and an output module; the Bluetooth MCU module is connected with the power supply module, the wireless radio frequency module, the input module and the output module in a wired mode respectively. Through the design of the modularized circuit, the interface is simplified, the data transmission is low in delay, stable in performance and high in reliability, the product development difficulty is low, the data processing delay is low, the product cost is reduced, and the modularized circuit is widely applied and can be applied to intelligent home, household appliances and outdoor equipment.
Drawings
Fig. 1 is a circuit diagram of peripheral circuit connections of an FBM5308 bluetooth chip;
fig. 2 is a circuit diagram of a power supply link of an FBM5308 bluetooth chip;
fig. 3 is a schematic diagram of an FBM5308 bluetooth chip pin;
fig. 4 is a circuit diagram of an earphone input unit;
FIG. 5 is a circuit diagram of a fiber interface unit;
FIG. 6 is a circuit diagram of a memory card input unit;
FIG. 7 is a circuit diagram of a MIC input unit;
FIG. 8 is a circuit diagram of a power amplifier output unit;
FIG. 9 is a key circuit diagram;
fig. 10 is a circuit diagram of a display screen.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be understood that in the present utility model, "plurality" means two or more. "and/or" is merely an association relationship describing an association object, and means that three relationships may exist, for example, and/or B may mean: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. "comprising A, B and C", "comprising A, B, C" means that all three of A, B, C comprise, "comprising A, B or C" means that one of the three comprises A, B, C, and "comprising A, B and/or C" means that any 1 or any 2 or 3 of the three comprises A, B, C.
The technical scheme of the utility model is described in detail below by specific examples. The following embodiments may be combined with each other, and some embodiments may not be repeated for the same or similar concepts or processes.
Example 1
The embodiment provides a modularization design circuit for bluetooth sound, includes:
bluetooth MCU module and peripheral device;
the peripheral device comprises a power supply module, a wireless radio frequency module, an input module and an output module;
the Bluetooth MCU module is connected with the power supply module, the wireless radio frequency module, the input module and the output module in a wired mode respectively, and the peripheral device and the Bluetooth MCU processor are packaged into a module.
It should be noted that, the bluetooth MCU module and the peripheral device are integrated into one module, so as to realize the multifunctional output technology and achieve the effects of low power consumption, low cost and low time delay. The power supply module supplies power to the integrated module. The wireless radio frequency module is provided with a microstrip antenna and is responsible for data receiving and transmitting. The input module is responsible for the input of earphone, optic fibre, memory etc., and the output module is responsible for the power amplifier output of audio frequency amplification. The modular circuit can be carried with a FreeRTOS system, performs multitasking, and comprises task management, time management, semaphore, message queue, memory management, recording function, software timer, coroutine and the like, so that the requirements of smaller systems can be basically met.
Preferably, the bluetooth MCU module is an FBM5308 bluetooth chip.
Fig. 1-3 are schematic layout diagrams of an FBM5308 bluetooth chip and its peripheral devices, where, in fig. 1, the FBM5308 bluetooth chip has a CONTROL SIGNAL CONTROL link, an AUDIO SIGNAL receiving and transmitting link, and a POWER SUPPLY link, where the POWER SUPPLY link is responsible for connecting the FBM5308 bluetooth chip with a POWER SUPPLY module, the SIGNAL CONTROL link is responsible for connecting the FBM5308 bluetooth chip with an infrared, a keyboard, and a display screen, the AUDIO SIGNAL receiving and transmitting link is responsible for connecting the FBM5308 bluetooth chip with an antenna, and the other links are responsible for connecting the FBM5308 bluetooth chip with an output module and an input module.
Fig. 2 shows a power supply voltage of the FBM5308 bluetooth chip to the peripheral device, wherein HT878T is a power amplifier unit in the peripheral device, the power supply voltage is 3.7V, and the power supply voltages of a display screen, a keyboard, an infrared unit and a microphone in the peripheral circuit are all 3.3V, which is shown in a connection pin diagram of each peripheral device and the FBM5308 bluetooth chip.
Fig. 3 is a circuit diagram of the peripheral devices connected to the respective pins of the FBM5308 bluetooth chip, wherein the microphone connection pins 19, 15, the infrared unit connection pin 34, the antenna connection pins 46 and 22, the power module connection pin 35, the display connection pins 5-11, the keyboard connection pin 42, the remote control receiving connection pin 25, and the power amplifier unit connection pin 17/18/28/31/35.
Specifically, the power supply module comprises a USB power supply unit and a battery, wherein the USB power supply unit is a 5V direct current power supply, and the battery is a 3.7V battery.
Fig. 2 shows a supply voltage of the FBM5308 bluetooth chip to the peripheral device, wherein HT878T is a power amplifier unit in the peripheral device, the supply voltage is 3.7V, the supply voltages of the display screen, the keyboard, the infrared unit and the microphone in the peripheral circuit are all 3.3V, the supply voltage of the battery is 3.7V, and the supply voltage of the usb power supply unit is 5V.
Specifically, the wireless radio frequency module comprises a radio antenna, a Bluetooth antenna and an infrared input device.
As shown in fig. 3, the radio antenna is connected to the No. 22 pin fm_ant of the FBM5308 bluetooth chip, the bluetooth antenna is connected to the No. 46 pin RFIO of the FBM5308 bluetooth chip, and the infrared input device is connected to the No. 34 pin VDDIO of the FBM5308 bluetooth chip.
The radio antenna is formed by connecting an antenna ANT_MHF and a resistor R6 in series, and is connected to a No. 22 pin FM_ANT of the FBM5308 Bluetooth chip. The Bluetooth antenna consists of a resistor R32, a capacitor C1/C2, an inductor L4 and an antenna E1, and is connected to a No. 46 pin RFIO of the FBM5308 Bluetooth chip.
Specifically, the input module comprises an earphone input unit, an optical fiber interface unit, a memory card input unit and an MIC input unit, and each unit of the input module is connected with the Bluetooth MCU module in a wired manner.
As shown in fig. 4, the earphone input unit is composed of a NLJ-5P-PJ-305-SMD device, a resistor R4/R5 and a capacitor C20/C21, wherein after the resistor R4 and the capacitor C20 are connected in series, one end is connected with pin 5 of the NLJ-5P-PJ-305-SMD device, and the other end is connected with pin DACL of the 18 # pin of the FBM5308 bluetooth chip; after the resistor R5 and the capacitor C21 are connected in series, one end of the resistor R5 is connected with the pin 2 of the NLJ-5P-PJ-305-SMD device, and the other end of the resistor R5 is connected with the 17-pin DACR of the FBM5308 Bluetooth chip.
As shown in fig. 5, the optical fiber interface unit is composed of a TORX1471PL chip, a resistor R33/R39, a capacitor C14/C15, and ESD527V and TVS13 with polarity diodes, and is connected to the No. 34 pin VDDIO and No. 26 PES pin of the FBM5308 bluetooth chip.
As shown in fig. 6, the memory card input unit is composed of a TF2 device, a resistor R34 and a capacitor C17, wherein after the resistor R34 and the capacitor C17 are connected in series, one end is connected to the 34 # pin VDDIO of the FBM5308 bluetooth chip, the other end is grounded, the 3 # CMD pin of TF2 is connected to the 41 # pin CDCMD of the FBM5308 bluetooth chip, the 5 # pin CLK of TF2 is connected to the 40 # pin CDCLK of the FBM5308 bluetooth chip, and the 7 # pin DAT0 of TF2 is connected to the 39 # pin SDDAT of the FBM5308 bluetooth chip.
As shown in fig. 7, the MIC input unit is composed of two circuits of fig. 7, only one of which is shown in fig. 7, and the other circuit is not repeated as in the circuit of fig. 7. The MIC input unit comprises a resistor R3, a capacitor C13, a capacitor C19 and a capacitor CN1, wherein one end of the resistor R3 is connected with a No. 19 pin VDDAC of the FBM5308 Bluetooth chip, one end of the capacitor C13 is connected with a No. 15 pin MICIN of the FBM5308 Bluetooth chip, and the other MIC input unit is respectively connected with a No. 12 pin MICL and a No. 19 pin VDDAC of the FBM5308 Bluetooth chip.
Specifically, the output module comprises a power amplifier output unit and a microphone interface unit, and the power amplifier output unit is an HT878T chip.
As shown in fig. 8, only a significant part of the circuit composition diagram of the power amplifier output unit is shown, wherein the power amplifier output unit mainly comprises a chip HT878T and peripheral circuits thereof, a pin inl+ No. 7 of the chip HT878T is connected to a pin DACL No. 18 of the bluetooth chip of the FBM5308, a pin ABD No. 10 of the chip HT878T is connected to a pin DACR No. 17 of the bluetooth chip of the FBM5308, a pin PVDDL No. 19 of the chip HT878T is connected to a PVDD of the bluetooth chip of the FBM5308, a pin PVDDR No. 16 of the chip HT878T is connected to a PVDD of the bluetooth chip of the FBM5308, and a pin ENA No. 21 of the chip HT878T is connected to a pin PE3 No. 28 of the bluetooth chip of the FBM 5308.
Specifically, the peripheral device further comprises a Bluetooth crystal oscillator, and the Bluetooth crystal oscillator is configured at 32 MHz.
Specifically, the peripheral device further comprises a key, wherein the key consists of a resistor and a switch, and is connected with the FBM5308 Bluetooth chip.
As shown in fig. 9, the key comprises two circuits, one is a PWRKEY key circuit and the other is an ADKEY key circuit, wherein both circuits are composed of a switch and a resistor, the PWRKEY key circuit is connected to pin 42 PWRKEY of the FBM5308 bluetooth chip, and the ADKEY key circuit is connected to pin 34 VDDIO and pin 24 PE7 of the FBM5308 bluetooth chip.
Specifically, the peripheral device further includes a display screen. As shown in fig. 10, the display screen is composed of LEDs and the like, and is connected to pins No. 5 to No. 11 of the FBM5308 bluetooth chip respectively.
Through the Bluetooth sound modularized circuit design, the Bluetooth MCU module and the peripheral device are packaged into a module, wherein the peripheral device comprises a power supply module, a wireless radio frequency module, an input module and an output module; the Bluetooth MCU module is connected with the power supply module, the wireless radio frequency module, the input module and the output module in a wired mode respectively. Through the design of the modularized circuit, the interface is simplified, the data transmission is low in delay, stable in performance and high in reliability, the product development difficulty is low, the data processing delay is low, the product cost is reduced, and the modularized circuit is widely applied and can be applied to intelligent home, household appliances and outdoor equipment.
Example two
The embodiment provides a bluetooth sound, including the stereo set body, still include as above be used for bluetooth sound's modularization design circuit.
This bluetooth sound's modularization design circuit includes:
bluetooth MCU module and peripheral device;
the peripheral device comprises a power supply module, a wireless radio frequency module, an input module and an output module;
the Bluetooth MCU module is connected with the power supply module, the wireless radio frequency module, the input module and the output module in a wired mode respectively, and the peripheral device and the Bluetooth MCU processor are packaged into a module.
It should be noted that, the bluetooth MCU module and the peripheral device are integrated into one module, so as to realize the multifunctional output technology and achieve the effects of low power consumption, low cost and low time delay. The power supply module supplies power to the integrated module. The wireless radio frequency module is provided with a microstrip antenna and is responsible for data receiving and transmitting. The input module is responsible for the input of earphone, optic fibre, memory etc., and the output module is responsible for the power amplifier output of audio frequency amplification. The modular circuit can be carried with a FreeRTOS system, performs multitasking, and comprises task management, time management, semaphore, message queue, memory management, recording function, software timer, coroutine and the like, so that the requirements of smaller systems can be basically met.
Preferably, the bluetooth MCU module is an FBM5308 bluetooth chip.
Fig. 1-3 are schematic layout diagrams of an FBM5308 bluetooth chip and its peripheral devices, where, in fig. 1, the FBM5308 bluetooth chip has a CONTROL SIGNAL CONTROL link, an AUDIO SIGNAL receiving and transmitting link, and a POWER SUPPLY link, where the POWER SUPPLY link is responsible for connecting the FBM5308 bluetooth chip with a POWER SUPPLY module, the SIGNAL CONTROL link is responsible for connecting the FBM5308 bluetooth chip with an infrared, a keyboard, and a display screen, the AUDIO SIGNAL receiving and transmitting link is responsible for connecting the FBM5308 bluetooth chip with an antenna, and the other links are responsible for connecting the FBM5308 bluetooth chip with an output module and an input module.
Fig. 2 shows a power supply voltage of the FBM5308 bluetooth chip to the peripheral device, wherein HT878T is a power amplifier unit in the peripheral device, the power supply voltage is 3.7V, and the power supply voltages of a display screen, a keyboard, an infrared unit and a microphone in the peripheral circuit are all 3.3V, which is shown in a connection pin diagram of each peripheral device and the FBM5308 bluetooth chip.
Fig. 3 is a circuit diagram of the peripheral devices connected to the respective pins of the FBM5308 bluetooth chip, wherein the microphone connection pins 19, 15, the infrared unit connection pin 34, the antenna connection pins 46 and 22, the power module connection pin 35, the display connection pins 5-11, the keyboard connection pin 42, the remote control receiving connection pin 25, and the power amplifier unit connection pin 17/18/28/31/35.
Specifically, the power supply module comprises a USB power supply unit and a battery, wherein the USB power supply unit is a 5V direct current power supply, and the battery is a 3.7V battery.
Fig. 2 shows a supply voltage of the FBM5308 bluetooth chip to the peripheral device, wherein HT878T is a power amplifier unit in the peripheral device, the supply voltage is 3.7V, the supply voltages of the display screen, the keyboard, the infrared unit and the microphone in the peripheral circuit are all 3.3V, the supply voltage of the battery is 3.7V, and the supply voltage of the usb power supply unit is 5V.
Specifically, the wireless radio frequency module comprises a radio antenna, a Bluetooth antenna and an infrared input device.
As shown in fig. 3, the radio antenna is connected to the No. 22 pin fm_ant of the FBM5308 bluetooth chip, the bluetooth antenna is connected to the No. 46 pin RFIO of the FBM5308 bluetooth chip, and the infrared input device is connected to the No. 34 pin VDDIO of the FBM5308 bluetooth chip.
The radio antenna is formed by connecting an antenna ANT_MHF and a resistor R6 in series, and is connected to a No. 22 pin FM_ANT of the FBM5308 Bluetooth chip. The Bluetooth antenna consists of a resistor R32, a capacitor C1/C2, an inductor L4 and an antenna E1, and is connected to a No. 46 pin RFIO of the FBM5308 Bluetooth chip.
Specifically, the input module comprises an earphone input unit, an optical fiber interface unit, a memory card input unit and an MIC input unit, and each unit of the input module is connected with the Bluetooth MCU module in a wired manner.
As shown in fig. 4, the earphone input unit is composed of a NLJ-5P-PJ-305-SMD device, a resistor R4/R5 and a capacitor C20/C21, wherein after the resistor R4 and the capacitor C20 are connected in series, one end is connected with pin 5 of the NLJ-5P-PJ-305-SMD device, and the other end is connected with pin DACL of the 18 # pin of the FBM5308 bluetooth chip; after the resistor R5 and the capacitor C21 are connected in series, one end of the resistor R5 is connected with the pin 2 of the NLJ-5P-PJ-305-SMD device, and the other end of the resistor R5 is connected with the 17-pin DACR of the FBM5308 Bluetooth chip.
As shown in fig. 5, the optical fiber interface unit is composed of a TORX1471PL chip, a resistor R33/R39, a capacitor C14/C15, and ESD527V and TVS13 with polarity diodes, and is connected to the No. 34 pin VDDIO and No. 26 PES pin of the FBM5308 bluetooth chip.
As shown in fig. 6, the memory card input unit is composed of a TF2 device, a resistor R34 and a capacitor C17, wherein after the resistor R34 and the capacitor C17 are connected in series, one end is connected to the 34 # pin VDDIO of the FBM5308 bluetooth chip, the other end is grounded, the 3 # CMD pin of TF2 is connected to the 41 # pin CDCMD of the FBM5308 bluetooth chip, the 5 # pin CLK of TF2 is connected to the 40 # pin CDCLK of the FBM5308 bluetooth chip, and the 7 # pin DAT0 of TF2 is connected to the 39 # pin SDDAT of the FBM5308 bluetooth chip.
As shown in fig. 7, the MIC input unit is composed of two circuits of fig. 7, only one of which is shown in fig. 7, and the other circuit is not repeated as in the circuit of fig. 7. The MIC input unit comprises a resistor R3, a capacitor C13, a capacitor C19 and a capacitor CN1, wherein one end of the resistor R3 is connected with a No. 19 pin VDDAC of the FBM5308 Bluetooth chip, one end of the capacitor C13 is connected with a No. 15 pin MICIN of the FBM5308 Bluetooth chip, and the other MIC input unit is respectively connected with a No. 12 pin MICL and a No. 19 pin VDDAC of the FBM5308 Bluetooth chip.
Specifically, the output module comprises a power amplifier output unit and a microphone interface unit, and the power amplifier output unit is an HT878T chip.
As shown in fig. 8, only a significant part of the circuit composition diagram of the power amplifier output unit is shown, wherein the power amplifier output unit mainly comprises a chip HT878T and peripheral circuits thereof, a pin inl+ No. 7 of the chip HT878T is connected to a pin DACL No. 18 of the bluetooth chip of the FBM5308, a pin ABD No. 10 of the chip HT878T is connected to a pin DACR No. 17 of the bluetooth chip of the FBM5308, a pin PVDDL No. 19 of the chip HT878T is connected to a PVDD of the bluetooth chip of the FBM5308, a pin PVDDR No. 16 of the chip HT878T is connected to a PVDD of the bluetooth chip of the FBM5308, and a pin ENA No. 21 of the chip HT878T is connected to a pin PE3 No. 28 of the bluetooth chip of the FBM 5308.
Specifically, the peripheral device further comprises a Bluetooth crystal oscillator, and the Bluetooth crystal oscillator is configured at 32 MHz.
Specifically, the peripheral device further comprises a key, wherein the key consists of a resistor and a switch, and is connected with the FBM5308 Bluetooth chip.
As shown in fig. 9, the key comprises two circuits, one is a PWRKEY key circuit and the other is an ADKEY key circuit, wherein both circuits are composed of a switch and a resistor, the PWRKEY key circuit is connected to pin 42 PWRKEY of the FBM5308 bluetooth chip, and the ADKEY key circuit is connected to pin 34 VDDIO and pin 24 PE7 of the FBM5308 bluetooth chip.
Specifically, the peripheral device further includes a display screen. As shown in fig. 10, the display screen is composed of LEDs and the like, and is connected to pins No. 5 to No. 11 of the FBM5308 bluetooth chip respectively.
Through the Bluetooth sound modularized circuit design, the Bluetooth MCU module and the peripheral device are packaged into a module, wherein the peripheral device comprises a power supply module, a wireless radio frequency module, an input module and an output module; the Bluetooth MCU module is connected with the power supply module, the wireless radio frequency module, the input module and the output module in a wired mode respectively. Through the design of the modularized circuit, the interface is simplified, the data transmission is low in delay, stable in performance and high in reliability, the product development difficulty is low, the data processing delay is low, the product cost is reduced, and the modularized circuit is widely applied and can be applied to intelligent home, household appliances and outdoor equipment.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.
Claims (8)
1. A modular design circuit for a bluetooth sound device, comprising:
bluetooth MCU module and peripheral device;
the peripheral device comprises a power supply module, a wireless radio frequency module, an input module and an output module;
the Bluetooth MCU module is respectively connected with the power supply module, the wireless radio frequency module, the input module and the output module in a wired way, and the peripheral device and the Bluetooth MCU processor are packaged into a module;
the Bluetooth MCU module is an FBM5308 Bluetooth chip;
the input module comprises an earphone input unit, an optical fiber interface unit, a memory card input unit and an MIC input unit, and each unit of the input module is connected with the Bluetooth MCU module in a wired mode.
2. The modular design circuit for bluetooth sound equipment of claim 1, wherein the power supply module comprises a USB power supply unit and a battery, the USB power supply unit is a 5V dc power supply, and the battery is a 3.7V battery.
3. The modular design circuit for a bluetooth sound device of claim 1, wherein the wireless radio frequency module comprises a radio antenna, a bluetooth antenna, and an infrared input device.
4. The modular design circuit for bluetooth sound according to claim 1, wherein the output module comprises a power amplifier output unit and a microphone interface unit, the power amplifier output unit being an HT878T chip.
5. A modular design circuit for a bluetooth sound device according to claim 1, wherein the peripheral device further comprises a bluetooth crystal configured at 32 MHZ.
6. The modular design circuit for a bluetooth sound device of claim 1, wherein the peripheral device further comprises a key, the key comprising a resistor and a switch, the key being connected to the FBM5308 bluetooth chip.
7. A modular design circuit for a bluetooth sound device as in claim 1, wherein the peripheral device further comprises a display screen.
8. A bluetooth sound comprising a sound body, further comprising a modular design circuit for a bluetooth sound box according to any of claims 1-7.
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| CN202222715022.9U CN219555101U (en) | 2022-10-11 | 2022-10-11 | A modularization design circuit and bluetooth sound for bluetooth sound |
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| CN202222715022.9U CN219555101U (en) | 2022-10-11 | 2022-10-11 | A modularization design circuit and bluetooth sound for bluetooth sound |
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