CN219552502U - Carrier for wafer test - Google Patents

Abstract

The utility model relates to the technical field of wafer testing, in particular to a carrier for wafer testing, which comprises a carrier disc, a wafer main body and a pressure disc pressed on the carrier disc, wherein the bottom of the wafer main body is provided with pin contacts, the top of the carrier disc is provided with a groove, a plurality of sliding plates A are respectively and slidably arranged on two sides of the central axis of the groove, a plurality of sliding plates B are respectively and elastically arranged on two sides of the inner part of the carrier disc, the corresponding sliding plates A and the opposite end surfaces of the sliding plates B form wedge-shaped fit, the top of each sliding plate A is respectively provided with a plurality of electrical connection points, the pin contacts at the bottom of the wafer main body are pressed on the corresponding electrical connection points below and form electrical connection, the carrier disc is provided with a plurality of groups of parallel vertical sliding plates, and the sliding plates formed at the opposite positions of two sides can restrict wafers with different specifications, so that the carrier disc testing device can be suitable for wafer testing with various specifications without frequent replacement, and the testing efficiency can be improved.

Description

Carrier for wafer test

Technical Field

The utility model relates to the technical field of wafer testing, in particular to a carrier for wafer testing.

Background

After the chip package is completed, the chip needs to be electrically tested in advance to ensure the quality of the chip. During testing, the chip is placed in the carrier. The carrier is provided with a contact module for carrying the pins of the chip and achieving electrical connection.

In the conventional carrier structure, the elastic contact is generally connected with an elastic element, which is a spring or a spring plate, so that when the chip pins are loaded on the elastic contact, a specific elasticity is provided to avoid damaging the chip pins when the chip is forced.

Because wafer specifications are different, the common carrier does not have universality, the common carrier is designed, the common carrier is often required to be configured with various specifications, and the carrier is required to be frequently replaced when different wafers are tested, so that troubles are brought to workers, and the carrier is frequently replaced, so that the wafer testing efficiency is also affected.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides a carrier for wafer test.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a carrier for wafer test, includes carrier disc, wafer main part and the pressure disk of cladding on the carrier disc, the bottom of wafer main part is provided with the pin contact, the recess is seted up at the top of carrier disc, the recess is in its axis both sides slidable mounting respectively has slide plate A a plurality ofly, slide plate A transversely interval arrangement, the length of each group slide plate A of same side reduces in proper order, the inside both sides at the carrier disc are respectively elastic mounting has slide plate B a plurality ofly, slide plate B vertical interval arrangement, the length of each slide plate B of same side increases in proper order, slide plate A and slide plate B one-to-one set up, and the relative terminal surface of slide plate A and slide plate B forms wedge cooperation, be provided with electric connection point a plurality ofly at each slide plate A's top respectively, the wafer main part is placed in the recess, and the pin contact pressure of wafer main part bottom contacts and forms electric connection on the electric connection point that the below corresponds.

In a preferred technical scheme, the middle position of the groove is provided with a convex block, and the convex block is elastically provided with a movable plate.

In a preferred technical scheme, a through groove is formed in the center of the protruding block, a spring B is placed in the through groove, and the top end of the spring B is fixedly connected with the movable plate.

In a preferred technical scheme, the carrier plate is provided with end plates along the upper edges of the notches on two sides of the grooves, and the inner side surfaces of the end plates are designed to be cambered surfaces.

In a preferred technical scheme, a plurality of transverse sliding holes for sliding of the sliding plate B are formed in the carrying disc, a spring A is arranged at the tail end of the sliding plate B, and the other end of the spring A is fixedly arranged on the end wall of the sliding hole.

In a preferred technical scheme, the carrier plate is further provided with fixing plates at two sides of the bottom of the groove, and the fixing plates are provided with electrical connection points.

The beneficial effects of the utility model are as follows: through the carrier structure that this scheme provided, solved current wafer test carrier and not possess the commonality, the staff need frequently change the carrier when testing the wafer, influence the problem of wafer test efficiency, this carrier structure's propose, set up a plurality of parallel vertical slide of group on the carrier plate, the slide that the relative position department of both sides formed can restrict by the wafer of different specifications to can be applicable to the wafer test of multiple specification, need not frequently change the carrier, reduce the work degree of difficulty, and can promote efficiency of software testing.

Drawings

Fig. 1 is a schematic view of a front view of a carrier according to the present utility model;

fig. 2 is a schematic top view of a carrier tray according to the present utility model.

In the figure: 1. a carrier plate; 2. a bump; 3. a movable plate; 4. a sliding plate A; 5. a sliding plate B; 6. a spring A; 7. a fixing plate; 8. an electrical connection point; 9. an end plate; 10. a wafer body; 11. a pin contact; 12. a groove; 13. a spring B; 14. and (3) pressing a plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

In this embodiment, referring to fig. 1-2, a carrier for wafer testing includes a carrier tray 1, a wafer main body 10, and a platen 14 pressed on the carrier tray 1, a pin contact 11 is provided at the bottom of the wafer main body 10, a groove 12 is provided at the top of the carrier tray 1, a bump 2 is provided at the middle position of the groove 12, a movable plate 3 is elastically mounted on the bump 2, a through groove is provided at the center of the bump 2, a spring B13 is placed in the through groove, and the top end of the spring B13 is fixedly connected with the movable plate 3. The movable plate 3 is designed to provide elastic buffering to avoid the damage to pins when the upper platen 14 applies pressure to the wafer body 10.

The recess 12 is in its axis both sides slidable mounting respectively has slide plate A4 a plurality of, and slide plate A4 transversely separates the arrangement, and the length of each group slide plate A4 of same side reduces in proper order, and the inside both sides of carrying tray 1 are respectively elastic mounting has slide plate B5 a plurality of, and as shown in figure 1, the inside of carrying tray 1 is offered a plurality of horizontal slide holes that are used for slide plate B5 to slide usefulness, and slide plate B5's end is provided with spring A6, and the other end fixed mounting of spring A6 is on the end wall of slide hole. The sliding plates B5 are vertically arranged at intervals, the lengths of the sliding plates B5 on the same side are sequentially increased, the sliding plates A4 and the sliding plates B5 are arranged in one-to-one correspondence, and the corresponding end faces of the sliding plates A4 and the sliding plates B5 form wedge-shaped fit.

When the upper sliding plate A4 is pressed downward, the sliding plate B5 adapted to the sliding plate A4 slides inward along the sliding hole and compresses the spring A6, so that the spring A6 has elastic potential energy, and the elastic potential energy can push back the sliding plate B5 and jack up the sliding plate A4 upward. The top of each sliding plate A4 is respectively provided with a plurality of electrical connection points 8, the chip body 10 is placed in the groove 12, and the pin contacts 11 at the bottom of the chip body 10 are pressed against the corresponding electrical connection points 8 below to form electrical connection.

It should be noted that, when the platen 14 fully presses the wafer main body 10 downward, the springs A6 and B13 are both in a compressed state, where the springs A6 and B13 cooperate to avoid damage to the electrode contact point caused by excessive pressure, and when the platen 14 is removed, the wafer main body 10 can also be sprung out under the resilience of the springs A6 and B13, so that the wafer main body 10 is convenient for a worker to take.

In addition, as can be seen from fig. 1, the carrier plate 1 is further provided with fixing plates 7 on both sides of the bottom of the groove 12, and the fixing plates 7 are provided with electrical connection points 8. The electrical connection point 8 on the sliding plate B5 can be lifted and slid, while the electrical connection point 8 on the outermost fixing plate 7 is at a fixed position, when the wafer body 10 is placed, according to the selected wafer specification, the pin contact 11 at the bottom is pressed on the electrical connection point 8 corresponding to the bottom, then the wafer body 10 is covered by the pressure plate 14, and finally the test purpose can be achieved by electrifying.

In the present embodiment, the number of the slide plates A4 is designed to be three, and the wafer bodies 10 having the second width and the fourth width are taken as an example corresponding to four groups of wafer bodies 10 having sequentially increased widths.

When the width of the wafer body 10 is the second specification, the wafer body 10 is pressed against the middle sliding plate A4, and the middle area of the wafer body 10 is pressed against the innermost sliding plate A4, and the middle area of the wafer body 10 is not provided with the pin contacts 11, so that the pin contacts 11 are not damaged, and no test interference is formed. And the innermost sliding plate A4 and the middle sliding plate A4 are stressed to keep synchronous lifting and sliding and have consistent sliding distance, so that the test result is not influenced. When the width of the wafer body 10 is the fourth specification, the wafer body 10 is directly pressed on the electrical connection points 8 on the fixing plates 7 at both sides, and the middle area of the wafer body 10 is pressed on the top of each sliding plate A4 in the middle, and the buffer pressure is only applied to the wafer body 10 with the specification by using the middle spring B13, but the bottom of the wafer body 10 with the specification is already fully contacted with the top of each sliding plate A4, which is equivalent to increasing the contact area, so the buffer pressure function can be also exerted, and the pin contact 11 can be protected.

The carrier plate 1 is provided with end plates 9 along the upper edges of the notches on the two sides of the groove 12, and the inner side surfaces of the end plates 9 are designed to be cambered surfaces. The design of the end plate 9 facilitates the embedding of the upper pressure plate 14 into the groove 12 and the stable pressing of the wafer body 10, ensuring the smooth test.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (6)

1. The utility model provides a carrier for wafer test, includes carrier disc (1), wafer main part (10) and covers pressure disk (14) on carrier disc (1), the bottom of wafer main part (10) is provided with pin contact (11), a serial communication port, recess (12) are seted up at the top of carrier disc (1), recess (12) are provided with sliding plate A (4) a plurality of in wherein axis both sides respectively in sliding fit, and sliding plate A (4) transversely interval arrangement, and the length of each group sliding plate A (4) of same side reduces in proper order, and the inside both sides at carrier disc (1) are a plurality of sliding plate B (5) respectively elastic mounting, and sliding plate B (5) vertical interval arrangement, and the length of each sliding plate B (5) of same side increases in proper order, and sliding plate A (4) and sliding plate B (5) relative terminal surface form wedge cooperation, are provided with electric connection point (8) a plurality of respectively at the top of each sliding plate A (4), wafer main part (10) place in recess (12) and form electric connection point (11) below the chip contact.

2. The carrier for wafer test according to claim 1, wherein a bump (2) is provided in a middle position of the recess (12), and a movable plate (3) is elastically mounted on the bump (2).

3. The carrier for wafer test according to claim 2, wherein the center of the bump (2) is provided with a through groove, a spring B (13) is placed in the through groove, and the top end of the spring B (13) is fixedly connected with the movable plate (3).

4. The carrier for wafer testing according to claim 1, wherein the carrier tray (1) is provided with end plates (9) along the upper edges of the notches on both sides of the grooves (12), and the inner side surfaces of the end plates (9) are designed to be cambered surfaces.

5. The carrier for wafer test according to claim 1, wherein a plurality of transverse sliding holes for sliding of the sliding plate B (5) are formed in the carrier tray (1), a spring a (6) is arranged at the tail end of the sliding plate B (5), and the other end of the spring a (6) is fixedly arranged on the end wall of the sliding hole.

6. The carrier for wafer testing according to claim 1, wherein the carrier tray (1) is further provided with fixing plates (7) at both sides of the bottom of the groove (12), and the fixing plates (7) are provided with electrical connection points (8).