CN219536720U

CN219536720U - Heat dissipation device

Info

Publication number: CN219536720U
Application number: CN202320533213.5U
Authority: CN
Inventors: 占文州; 吴跃东; 吴业浩
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2023-03-17
Filing date: 2023-03-17
Publication date: 2023-08-15
Anticipated expiration: 2033-03-17

Abstract

The application relates to heat dissipation equipment. The heat dissipation equipment comprises a cooling module and a heat exchange module. The cooling module comprises a water cooling element, a first refrigerating part and a second refrigerating part, wherein a heat exchange channel is formed in the water cooling element, the first refrigerating part and the second refrigerating part are both provided with a refrigerating surface and a heating surface which are opposite to each other, the heating surfaces of the first refrigerating part and the second refrigerating part are both arranged towards the water cooling element, and the first refrigerating part and the second refrigerating part are both configured to be capable of conducting heat of the refrigerating surfaces to the heating surfaces. The heat exchange module comprises a heat dissipation assembly, a pipeline assembly and a power element, wherein the heat dissipation assembly is provided with a heat dissipation channel, the pipeline assembly is used for communicating the heat exchange channel with the heat dissipation channel, the power element is configured to be capable of driving a heat exchange medium to circularly flow between the heat exchange channel and the heat dissipation channel, and the heat dissipation assembly is configured to be capable of cooling the heat exchange medium in the heat dissipation channel. The heat dissipation equipment is high in heat dissipation performance and can meet the heat dissipation requirement of electronic equipment.

Description

Heat dissipation device

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to heat dissipation equipment.

Background

The use scenes of electronic equipment such as smart phones, tablet personal computers, palm game machines and the like in playing games, watching videos and the like are easy to generate excessive heat to raise the temperature due to the increase of the operation power, so that the operation performance or the service life of the electronic equipment is reduced. In order to avoid the excessive temperature of the electronic equipment, the electronic equipment is usually required to be cooled by adopting a cooling device in the use occasions such as playing games, watching videos and the like. However, the conventional heat dissipation device has insufficient heat dissipation performance, which is difficult to meet the heat dissipation requirement of the electronic device and affects the use experience of the user.

Disclosure of Invention

The embodiment of the utility model provides heat dissipation equipment, which aims to solve the problem of insufficient heat dissipation performance of the traditional heat dissipation equipment.

A heat dissipating device, comprising:

the cooling module comprises a water cooling element, a first refrigerating piece and a second refrigerating piece, wherein a heat exchange channel is arranged in the water cooling element, the first refrigerating piece and the second refrigerating piece are respectively provided with a refrigerating surface and a heating surface which are opposite to each other, the heating surfaces of the first refrigerating piece and the second refrigerating piece are respectively arranged towards the water cooling element, and the first refrigerating piece and the second refrigerating piece are respectively configured to be capable of conducting heat of the refrigerating surfaces to the heating surfaces; the method comprises the steps of,

the heat exchange module comprises a heat dissipation assembly, a pipeline assembly and a power element, wherein the heat dissipation assembly is provided with a heat dissipation channel, the pipeline assembly is used for communicating the heat dissipation channel with the heat dissipation channel, the power element is configured to drive heat exchange medium to circularly flow between the heat dissipation channel and the heat dissipation channel, and the heat dissipation assembly is configured to cool the heat exchange medium in the heat dissipation channel.

Above-mentioned firing equipment, with cooling module and heat exchange module separately set up and be linked together through the pipeline subassembly, heat exchange medium can absorb the heat of following first refrigeration piece and second refrigeration piece conduction in heat transfer passageway, and heat exchange module can cool off heat exchange medium, cooling module and heat exchange module cooperation realize the radiating effect jointly, promote radiating efficiency, also be favorable to compressing cooling module's volume and weight simultaneously, realize the heat dissipation through heat exchange medium also can make cooling module not produce hot-blast in the heat dissipation process, be favorable to promoting user's use experience. In addition, adopt two refrigeration spare in the cooling module, two refrigeration spare cooperate, can effectively promote radiating efficiency, also be favorable to reducing the manufacturing degree of difficulty and the manufacturing cost of semiconductor refrigeration piece in addition.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a cooling module in some embodiments;

FIG. 2 is a schematic diagram of a heat exchange module according to some embodiments;

FIG. 3 is an exploded view of a cooling module in some embodiments;

FIG. 4 is a schematic view of some embodiments of heat exchanger module components;

FIG. 5 is a schematic diagram of some embodiments of cooling module components;

FIG. 6 is a schematic diagram of a first refrigeration member and a second refrigeration member stacked in some embodiments;

FIG. 7 is a schematic view of a structure in which a water-cooling element, a heat-conducting metal sheet and a heat-conducting rubber pad are stacked in some embodiments;

FIG. 8 is an exploded view of a water cooled element in some embodiments;

fig. 9 is a schematic structural diagram of a heat dissipating assembly according to some embodiments.

Reference numerals:

11. a cooling module; 111. a water cooling element; 1111. a water-cooled head; 1112. a substrate; 1113. a runner block; 1114. a seal; 1115. a first interface; 1116. a second interface; 1117. a heat exchange channel; 112. a first cooling member; 1121. a first body; 1122. a first electrode; 113. a second cooling member; 1131. a second body; 1132. a second electrode; 1133. refrigerating the noodles; 1134. heating surface; 1135. a side surface; 114. a housing; 1141. a main body; 1142. a cover plate; 115. a connection assembly; 1151. a clamping jaw; 1152. a clamping part; 1153. a connection part; 1154. a receiving groove; 1155. a flexible pad; 1156. an elastic element; 116. a heat conducting rubber pad; 117. a heat conductive metal sheet; 118. a circuit board; 119. a heat insulating element; 12. a heat exchange module; 121. a heat dissipation assembly; 1211. a first water tank; 1212. a third interface; 1213. a fourth interface; 1214. a second water tank; 1215. a heat sink; 1216. a channel structure; 122. a power element; 123. a pipeline assembly; 1231. a first pipe; 1232. a second pipe; 1233. a third conduit; 125. a frame; 1251. a mounting groove; 126. a cover body; 1261. and (3) a vent hole.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Preferred embodiments of the present utility model are shown in the drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

As used herein, "terminal device" refers to a device capable of receiving and/or transmitting communication signals that includes, but is not limited to, devices connected via any one or several of the following connections:

(1) Via a wireline connection, such as via a public-switched telephone network (Public Switched Telephone Networks, PSTN), a digital subscriber line (Digital Subscriber Line, DSL), a digital cable, a direct cable connection;

(2) Via a wireless interface, such as a cellular network, a wireless local area network (Wireless Local Area Network, WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter.

A terminal device arranged to communicate over a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) Satellite phones or cellular phones;

(2) A personal communications system (Personal Communications System, PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities;

(3) A radiotelephone, pager, internet/intranet access, web browser, notepad, calendar, personal digital assistant (Personal Digital Assistant, PDA) equipped with a global positioning system (Global Positioning System, GPS) receiver;

(4) Conventional laptop and/or palmtop receivers;

(5) Conventional laptop and/or palmtop radiotelephone transceivers, and the like.

Referring to fig. 1, fig. 2, fig. 3 and fig. 4, fig. 1 is a schematic structural diagram of a cooling module 11 of a heat dissipating device according to some embodiments, fig. 2 is a schematic structural diagram of a heat exchanging module 12 of a heat dissipating device according to some embodiments, fig. 3 is an exploded schematic diagram of the cooling module 11 according to some embodiments, and fig. 4 is a schematic structural diagram of a part of elements of the heat exchanging module 12 according to some embodiments. The utility model provides heat dissipation equipment which can be used for dissipating heat of electronic equipment such as a smart phone, a tablet personal computer, a palm game machine and the like, for example, the heat dissipation equipment can be used for dissipating heat of use scenes of the electronic equipment such as playing games, watching videos and the like, so that performance degradation caused by overhigh temperature of the electronic equipment can be prevented or the service life of the electronic equipment can be prevented from being influenced. In some embodiments, the heat sink includes a cooling module 11 and a heat exchange module 12, the heat sink cools the electronic device through a heat exchange medium that is capable of circulating between the cooling module 11 and the heat exchange module 12 through a piping assembly 123 of the heat exchange module 12. The cooling module 11 is used for cooling the electronic device, for example, the cooling module 11 may be connected to the electronic device, and the heat exchange medium in the cooling module 11 can absorb heat generated by the electronic device, so as to cool the electronic device. The heat exchange module 12 can cool the heat exchange medium flowing into the heat exchange module 12 from the cooling module 11, and the cooling module 11 and the heat exchange module 12 cooperate together to realize heat dissipation of the electronic equipment. When the electronic device is cooled, the cooling module 11 may be connected to the electronic device, and the heat exchange module 12 may be disposed at a desk top, a ground, or the like, in other words, the heat dissipation device may dissipate heat of the electronic device through two separate modules.

Further, in some embodiments, the cooling module 11 includes a water cooling element 111, a first cooling element 112, and a second cooling element 113. The water cooling element 111 is provided with a heat exchange passage 1117, and a heat exchange medium can flow in the heat exchange passage 1117. The first cooling element 112 and the second cooling element 113 may be semiconductor cooling plates (Thermoelectric Cooler, TEC), the first cooling element 112 and the second cooling element 113 each have a cooling surface 1133 and a heating surface 1134 that are opposite to each other, when the first cooling element 112 and the second cooling element 113 are in power-on operation, the temperature of the cooling surface 1133 is lower than the temperature of the heating surface 1134, and the first cooling element 112 and the second cooling element 113 can conduct heat on one side of the cooling surface 1133 to one side of the heating surface 1134. The heat generating surfaces 1134 of the first cooling element 112 and the second cooling element 113 are both disposed toward the water cooling element 111. It can be understood that when the cooling module 11 dissipates heat to the electronic device, the electronic device may be disposed on the cooling surface 1133 side of the first cooling element 112 and the second cooling element 113, and the first cooling element 112 and the second cooling element 113 can conduct the heat of the electronic device to the heat generating surface 1134 side and be absorbed by the cooling medium in the water cooling element 111, so as to achieve the cooling effect to the electronic device.

The heat exchange module 12 may include a heat dissipation assembly 121 and a power element 122, wherein the heat dissipation assembly 121 is provided with heat dissipation channels (not shown) in which heat exchange medium can flow. The heat exchange assembly piping assembly 123 is configured to communicate the heat exchange channel 1117 with the heat dissipation channel, the power element 122 is configured to drive the heat exchange medium to circulate between the heat exchange channel 1117 and the heat dissipation channel, and the heat dissipation assembly 121 is configured to cool the heat exchange medium in the heat dissipation channel. It can be understood that after the heat exchange medium in the heat exchange channel 1117 of the cooling module 11 absorbs heat of the electronic device, the heat exchange medium can flow into the heat dissipation channel of the heat dissipation assembly 121 through the pipeline assembly 123 under the action of the power element 122, and after being cooled by the heat dissipation assembly 121, the heat exchange medium flows back to the cooling module 11 through the pipeline assembly 123 again, so as to realize liquid circulation between the cooling module 11 and the heat exchange module 12, and dissipate heat of the electronic device.

Above-mentioned heat abstractor, with cooling module 11 and heat transfer module 12 separately set up and be linked together through pipeline subassembly 123, heat transfer medium can absorb the heat of following first refrigeration piece 112 and second refrigeration piece 113 conduction in heat transfer passageway 1117, and heat transfer module 12 can cool off heat transfer medium, cooling module 11 and heat transfer module 12 cooperate and realize the radiating effect to electronic equipment jointly, promote radiating efficiency, simultaneously also be favorable to compressing the volume and the weight that are used for carrying out refrigerated cooling module 11 to electronic equipment, realize the heat dissipation through heat transfer medium also can make cooling module 11 not produce hot-blast in the heat dissipation process, be favorable to promoting user's use experience. In addition, adopt two refrigeration spare in cooling module 11, two refrigeration spare cooperations, can effectively promote radiating efficiency, also be favorable to reducing the manufacturing degree of difficulty and the manufacturing cost of refrigeration spare in addition.

In some embodiments, the heat exchange medium includes, but is not limited to, any suitable medium with good heat absorption performance such as water or aqueous solution, and the heat exchange medium may also be an anti-freezing aqueous solvent, so as to reduce the risk that the heat exchange medium is difficult to flow due to excessive temperature, and improve the stability of the heat dissipation operation of the heat dissipation device.

As shown in connection with fig. 3 and 5, in some embodiments, the first cooling element 112 and the second cooling element 113 are disposed side by side, e.g., the first cooling element 112 and the second cooling element 113 each include a side surface 1135 connected to a cooling surface 1133 and a heating surface 1134, and the side surfaces 1135 of the first cooling element 112 and the second cooling element 113 are disposed opposite each other. In the present embodiment, the cooling surfaces 1133 of the first cooling element 112 and the second cooling element 113 may be flush with each other, and the heating surfaces 1134 may also be flush with each other, which is beneficial to compressing the volume of the cooling module 11 and facilitating the assembly of the cooling module 11. The first refrigerating piece 112 and the second refrigerating piece 113 which are arranged side by side are arranged to cool the electronic equipment cooperatively, so that the heat transmission efficiency between the electronic equipment and the water cooling element 111 is improved, and the heat dissipation efficiency of the cooling module 11 to the electronic equipment is improved. Meanwhile, the size of a single refrigerating piece can be reduced, the design and the manufacture of the refrigerating piece are facilitated, and the manufacturing cost of the refrigerating piece is also reduced.

In some embodiments, the first cooling element 112 and the second cooling element 113 are disposed side by side, and the first cooling element 112 and the second cooling element 113 are both stacked with the water cooling element 111, and the heat generating surfaces 1134 of the first cooling element 112 and the second cooling element 113 can be attached to the surface of the water cooling element 111. Therefore, the contact area and the heat conduction efficiency between the water cooling element 111 and the refrigerating piece are improved, and the heat dissipation performance of the cooling module 11 is further improved.

In other embodiments, as shown in fig. 1 and 6, the first cooling element 112, the second cooling element 113, and the water cooling element 111 are stacked in sequence, and the heat generating surface 1134 of the first cooling element 112 is disposed opposite to the cooling surface 1133 of the second cooling element 113. The first cooling element 112 can conduct heat of the electronic device to the second cooling element 113, and the second cooling element 113 can conduct heat to the water cooling element 111. In the embodiment shown in fig. 6, the dimensions of the first and second cooling elements 112, 113 may be adapted to the dimensions of the water cooling element 111. The adoption of two overlapped refrigerating pieces to cooperatively cool the electronic equipment can improve the heat transmission efficiency between the electronic equipment and the water cooling element 111, is also beneficial to improving the heat radiation performance of the cooling module 11 on the electronic equipment, and can also increase the volume of a single refrigerating piece and improve the running power of each refrigerating piece.

In some embodiments, when two refrigeration pieces are stacked, a heat-conducting adhesive (not shown) may be further disposed between the first refrigeration piece 112 and the second refrigeration piece 113, and the heat-generating surface 1134 of the first refrigeration piece 112 and the refrigeration surface 1133 of the second refrigeration piece 113 are both adhered to the heat-conducting adhesive, and the heat-conducting adhesive may be a material such as heat-conducting silica gel with good heat-conducting performance, which is beneficial to further improving heat transmission efficiency between the first refrigeration piece 112 and the second refrigeration piece 113 and reducing risk of damage of the refrigeration pieces due to too high temperature difference.

As shown in fig. 3, 5 and 7, in some embodiments, the cooling module 11 may further include a housing 114 and a connection assembly 115, where the water cooling element 111, the first cooling element 112, the second cooling element 113 and the connection assembly 115 are all disposed on the housing 114. The connection assembly 115 is configured to connect the housing 114 to the electronic device, so as to improve structural stability between the cooling module 11 and the electronic device when the cooling module 11 dissipates heat from the electronic device, thereby maintaining stability of heat dissipation of the cooling module 11 to the electronic device.

In a side embodiment, the connection assembly 115 includes two clamping jaws 1151, the clamping jaws 1151 include a clamping portion 1152 and a connecting portion 1153 that are connected to each other, the clamping portions 1152 of the two clamping jaws 1151 are disposed opposite each other, and the connecting portions 1153 of the two clamping jaws 1151 are slidably connected to the uniform housing 114. The two connecting portions 1153 can slide relative to the housing 114 toward and away from each other, thereby moving the two clamping portions 1152 toward and away from each other to clamp or release the electronic device. When the cooling module 11 dissipates heat of the electronic device, the two clamping portions 1152 can clamp two opposite sides of the electronic device, so as to connect the housing 114 to a side of the electronic device facing away from the display surface, so that the cooling module 11 is convenient for cooling the electronic device.

In some embodiments, the housing 114 includes a main body 1141 and a cover plate 1142 that are connected to each other, the water cooling element 111, the first cooling element 112, and the second cooling element 113 are all accommodated in a space enclosed by the main body 1141 and the cover plate 1142, the connecting portion 1153 is slidably connected to two ends of the cover plate 1142, a portion of the connecting portion 1153 is accommodated in a cavity formed at two ends of the cover plate 1142, the connecting portion 1153 may be opposite to at least a portion of the first cooling element 112 and/or the second cooling element 113, and at least a portion of the clamping portion 1152 is disposed on a side of the cover plate 1142 facing away from the main body 1141. So set up, be favorable to optimizing the structure of cooling module 11, compression cooling module 11's volume, apron 1142 also can play the guard action to clamping jaw 1151 simultaneously, promotes clamping jaw 1151 and housing 114's connection stability.

In some embodiments, the connection assembly 115 further includes a flexible pad 1155 disposed on a side opposite to the clamping portion 1152, where the flexible pads 1155 of the two clamping jaws 1151 are disposed opposite to each other, and when the clamping portion 1152 clamps the electronic device, the flexible pads 1155 contact the electronic device, which is beneficial to improving connection stability between the electronic device and the clamping jaws 1151 and reducing risk of damage to the electronic device. The flexible pad 1155 includes, but is not limited to, any suitable flexible element such as a silicone pad.

In some embodiments, the connection assembly 115 further includes two resilient elements 1156, the resilient elements 1156 including, but not limited to, springs. The two elastic elements 1156 are both connected to the cover 1142, and the two elastic elements 1156 are respectively connected to the connection portions 1153 of the clamping jaw 1151, when the clamping jaw 1151 clamps an electronic device, the elastic restoring force of the elastic elements 1156 can enable the clamping jaw 1151 to clamp the electronic device, so as to improve the connection stability between the electronic device and the clamping jaw 1151, and meanwhile, the clamping jaw 1151 is also beneficial to clamping electronic devices with different sizes, so that the cooling module 11 can be suitable for electronic devices with different sizes or different models. In some embodiments, four elastic elements 1156 of the connection assembly 115 may be provided, and each two elastic elements 1156 are connected to one connecting portion 1153, so as to further improve the clamping force of the clamping jaw 1151 on the electronic device, thereby improving the connection stability between the electronic device and the clamping jaw 1151.

Referring to fig. 5, in some embodiments, each connecting portion 1153 is provided with two receiving grooves 1154 spaced apart, and each elastic member 1156 is received in one receiving groove 1154. The first refrigerating element 112 includes a first body 1121 and a first electrode 1122 connected to the first body 1121, and the second refrigerating element 113 includes a second body 1131 and a second electrode 1132 connected to the second body 1131, and the second electrode 1132 are respectively embedded in one accommodating groove 1154. By such arrangement, the structural design of the cooling module 11 can be optimized, the volume of the cooling module 11 can be compressed, and meanwhile, the connecting portion 1153 can also protect the first electrode 1122 and the second electrode 1132, and the risk that the first electrode 1122 and the second electrode 1132 interfere with the connecting portion 1153 can be reduced. It will be appreciated that in some embodiments, the first and second cooling elements 112, 113 may each include two electrodes, positive and negative, with one of the electrodes of the first and second cooling elements 112, 113 being embedded within the receiving pocket 1154.

Referring to fig. 3 and 8, in some embodiments, the water cooling element 111 includes a water cooling head 1111 and a sealing member 1114, the water cooling head 1111 and the sealing member 1114 are connected to each other and enclose a heat exchange channel 1117, for example, the water cooling head 1111 and the sealing member 1114 may be sealed and connected by 3M glue, so as to reduce the risk of leakage of the cooling module 11. The water cooling head 1111 is overlapped with the first cooling member 112 and/or the second cooling member 113, and the first cooling member 112 and/or the second cooling member 113 can be attached to a side of the water cooling head 1111 facing away from the sealing member 1114, so as to effectively conduct heat to the water cooling head 1111.

In some embodiments, the water cooling head 1111 includes a base plate 1112 and a plurality of runner blocks 1113 disposed on a side of the base plate 1112 facing the sealing member 1114, the plurality of runner blocks 1113 are sequentially disposed at intervals, and the first cooling member 112 and the second cooling member 113 are disposed on a side of the base plate 1112 facing away from the sealing member 1114. The seal 1114, the base plate 1112, and the adjacent two runner blocks 1113 form a runner therebetween, and the plurality of runners communicate with each other to form a heat exchange channel 1117. The plurality of runner blocks 1113 are arranged to form the heat exchange channel 1117, so that the contact area of the heat exchange medium and the water cooling element 111 can be increased, the heat exchange medium can fully absorb heat conducted from the electronic equipment to the water cooling element 111, and the heat dissipation performance of the cooling module 11 to the electronic equipment is improved.

In some embodiments, the substrate 1112 and the runner block 1113 may be integrally formed, and the materials of the substrate 1112 and the runner block 1113 include, but are not limited to, metal materials such as aluminum with good heat conductivity, so that the heat transfer efficiency between the substrate 1112 and the runner block 1113 is improved, and the heat transfer efficiency between the cooling element and the heat exchange channel 1117 is also improved, thereby improving the heat dissipation performance of the heat exchange module 12 on the electronic device. In some embodiments, the seal 1114 is further provided with a first port 1115 and a second port 1116, each of the first port 1115 and the second port 1116 being in communication with the conduit assembly 123 and the heat exchange channel 1117, the heat exchange medium being capable of flowing from the first port 1115 into the heat exchange channel 1117 through the conduit assembly 123, out of the heat exchange channel 1117 through the second port 1116 after absorbing heat generated by the electronic device, and into the heat exchange module 12 through the conduit assembly 123.

As shown in connection with fig. 1 and 3, in some embodiments, the cooling module 11 further includes a thermal conductive rubber pad 116, the thermal conductive rubber pad 116 including, but not limited to, any suitable flexible deformation capable and good thermal conductive element such as a silicone rubber pad. The heat conduction rubber pad 116 is arranged on one side of the first refrigerating piece 112 and one side of the second refrigerating piece 113, which are opposite to the water cooling element 111, when the cooling module 11 is connected to the electronic equipment, the heat conduction rubber pad 116 can be in back contact with the back surface of the display surface of the electronic equipment, the heat conduction rubber pad 116 can adapt to the back surface of the electronic equipment, and the heat conduction rubber pad is in close contact with the electronic equipment, so that the heat conduction efficiency is improved.

In some embodiments, the heat-conducting rubber pad 116 may be substantially rectangular, and the length of the heat-conducting rubber pad 116 may be less than or equal to 60mm, i.e. the length of the heat-conducting rubber pad 116 is less than the size of the back of the electronic device, which is beneficial to reducing the risk that the heat-conducting rubber pad 116 extends to the electronic device or to the edge of the electronic device, thereby reducing the risk that a gap is generated between the heat-conducting rubber pad 116 and the electronic device, and further reducing the risk that condensed water is generated due to contact of air with the heat-conducting rubber pad 116, and improving the safety performance and the use experience of the cooling module 11. In some embodiments, the hardness of the thermal pad 116 is greater than or equal to 55A (shore hardness) and less than or equal to 65A, for example, the hardness of the thermal pad 116 may be 60A. So set up, heat conduction cushion 116 has enough flexibility deformation can be in order to closely laminate in electronic equipment, is favorable to reducing the risk that produces the clearance between heat conduction cushion 116 and the electronic equipment to further reduce the risk that heat conduction cushion 116 produced the condensate, heat conduction cushion 116 also can not be too soft simultaneously, is favorable to the manufacturing and the assembly of heat conduction cushion 116.

In some embodiments, the cooling module 11 may further include a heat conductive metal sheet 117, where the heat conductive metal sheet 117 includes, but is not limited to, a metal sheet with good heat conductivity such as an aluminum sheet. The heat conducting metal sheet 117 is connected to the cover plate 1142, and the heat conducting rubber pad 116 may be disposed on a side of the heat conducting metal sheet 117 facing away from the first cooling element 112, and the first cooling element 112 may be attached to the heat conducting metal sheet 117, or the first cooling element 112 and the second cooling element 113 may both be attached to the heat conducting metal sheet 117. The heat conducting metal sheet 117 is arranged, so that heat conduction efficiency between the heat conducting rubber pad 116 and the refrigerating sheet is improved, and heat dissipation performance of the cooling module 11 to the electronic equipment is further improved. In some embodiments, the cover 1142 is hollow, and the heat conductive metal sheet 117 is embedded in the hollow space of the cover 1142, which is beneficial to improving the heat dissipation effect on the electronic device and reducing the weight of the heat conductive metal sheet 117, thereby reducing the weight of the cooling module 11.

As shown in fig. 2 and 4, in some embodiments, the heat exchange module 12 further includes a fan (not shown) opposite to the heat dissipation component 121, where the fan is configured to dissipate heat from the heat dissipation component 121, that is, the cooling medium in the heat dissipation channel, and the fan may take away heat from the heat dissipation component 121 through the air flow.

In some embodiments, the heat exchange module 12 may further include a frame 125 and a cover 126, where the heat dissipation assembly 121, the power element 122 and the fan are all disposed on the frame 125, and the cover 126 is covered on the frame 125 to enhance the aesthetic property of the heat exchange module 12. In some embodiments, the heat dissipation assembly 121 and the power element 122 are both disposed in the accommodating space of the frame 125, the frame 125 is further provided with a mounting groove 1251 opposite to the heat dissipation assembly 121, and the fan is disposed in the mounting groove 1251. In some embodiments, the cover 126 may further have a plurality of ventilation holes 1261 spaced apart from each other at a position corresponding to the mounting slot 1251, so that the fan can drive air to flow to dissipate heat from the heat dissipation component 121.

Referring to fig. 9, in some embodiments, the heat dissipation assembly 121 includes a first water tank 1211, a second water tank 1214, a plurality of sets of heat dissipation fins 1215 and a plurality of hollow channel structures 1216, the plurality of sets of heat dissipation fins 1215 are disposed at intervals, two ends of each set of heat dissipation fins 1215 are respectively connected to the first water tank 1211 and the second water tank 1214, and each adjacent two sets of heat dissipation fins 1215 are connected to one channel structure 1216. Each channel structure 1216 has a channel formed therein, and the channels communicate with each other through the hollow space of the water tank to constitute a heat dissipation channel. The first water tank 1211 is provided with a third interface 1212 and a fourth interface 1213, the third interface 1212 and the fourth interface 1213 can be communicated with a heat dissipation channel through a hollow space of the first water tank 1211, and the third interface 1212 and the fourth interface 1213 are also communicated with the pipeline assembly 123. It will be appreciated that after passing through the pipe assembly 123, the cooling medium flowing from the cooling module 11 may flow from the third port 1212 into the first water tank 1211, pass through a portion of the channel structure 1216, flow into the second water tank 1214, further flow from the second water tank 1214 into another portion of the channel structure 1216, and then flow out of the heat dissipation assembly 121 from the fourth port 1213 through the first water tank 1211, and flow into the cooling module 11 through the pipe assembly 123. The heat exchange medium and heat dissipation assembly 121 contact area can be improved by arranging the plurality of pipeline structures, so that heat dissipation efficiency is improved, the heat dissipation fins 1215 are arranged on two sides of each channel structure 1216, and the heat dissipation fins 1215 can absorb heat of the cooling medium in the channel structure 1216 and dissipate the heat, so that the heat dissipation area of the heat dissipation assembly 121 is improved, and the heat dissipation efficiency of the heat exchange module 12 is further improved.

In some embodiments, the power element 122 includes, but is not limited to, any suitable component such as a water pump, so long as the heat exchange medium is capable of being forced to circulate between the cooling module 11 and the heat exchange module 12. In some embodiments, conduit assembly 123 includes a first conduit 1231, a second conduit 1232, and a third conduit 1233, with two ends of first conduit 1231 communicating with first interface 1115 and third interface 1212, respectively, two ends of second conduit 1232 communicating with fourth interface 1213 and power element 122, respectively, and a segment of third conduit 1233 communicating with power element 122 and second interface 1116, respectively. It will be appreciated that after absorbing heat in the heat exchange channel 1117, the heat exchange medium can flow from the first interface 1115 to the third interface 1212 through the first pipe 1231 and flow from the third interface 1212 into the heat dissipation channel, after being cooled by the heat exchange module 12 in the heat dissipation channel, the heat exchange medium flows out of the heat dissipation assembly 121 through the fourth interface 1213 and flows to the power element 122 through the second pipe 1232, and is pumped by the power element 122 and flows to the second interface 1116 through the third pipe 1233, and flows from the second interface 1116 into the heat exchange channel 1117, thereby realizing the liquid circulation process of the heat exchange module 12 and the cooling module 11.

Of course, the element structure of the heat dissipating device is not limited to the above description, for example, the cooling module 11 may further include a circuit board 118 for controlling the first cooling element 112 and the second cooling element 113, a heat insulating element 119 for separating the circuit board 118 from the water cooling element 111, and the heat insulating element 119 includes, but is not limited to, foam with good heat insulating performance, and can prevent heat from being conducted to the circuit board 118 to damage the circuit board 118 or heat from being conducted to the housing 114 to raise the temperature of the housing 114 to affect the use experience. Other components can be adopted for the components, so long as the corresponding functions can be realized, and the description is omitted here.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. A heat dissipating device, comprising:

2. The heat dissipating apparatus of claim 1, wherein the first cooling element and the second cooling element each comprise a side surface connected to the cooling surface and the heating surface, the first cooling element being disposed side by side with the second cooling element, the side surfaces of the first cooling element and the second cooling element being disposed opposite one another.

3. The heat sink apparatus of claim 2, wherein the first and second cooling elements are stacked with the water cooling element, respectively.

4. The heat dissipating device of claim 1, wherein the first cooling element, the second cooling element, and the water cooling element are stacked in sequence, and a heating surface of the first cooling element is disposed opposite to a cooling surface of the second cooling element.

5. The heat dissipating device of claim 4 wherein a heat conductive adhesive is further disposed between the first cooling element and the second cooling element, and the heating surface of the first cooling element and the cooling surface of the second cooling element are both bonded to the heat conductive adhesive.

6. The heat sink of claim 1, wherein the cooling module further comprises a housing and a connection assembly, the water cooling element, the first cooling element, the second cooling element, and the connection assembly are all disposed on the housing, the connection assembly being configured to enable connection of the housing to an electronic device.

7. The heat dissipating apparatus of claim 6, wherein the connecting assembly comprises two clamping jaws and four elastic members, the clamping jaws comprise clamping portions and connecting portions that are connected to each other, the clamping portions of the two clamping jaws are disposed opposite to each other, the connecting portions of the two clamping jaws are slidably connected to the housing, the four elastic members are connected to the housing, and the four elastic members are connected to the connecting portions of the two clamping jaws in pairs.

8. The heat dissipating device of claim 7, wherein the first cooling element comprises a first body and a first electrode connected to the first body, the second cooling element comprises a second body and a second electrode connected to the second body, the connecting portion is provided with two spaced accommodating grooves, the elastic elements are respectively accommodated in one of the accommodating grooves, and the first electrode and the second electrode are respectively embedded in one of the accommodating grooves.

9. The heat dissipating device of claim 1, wherein the water cooling element comprises a water cooling head and a sealing member, the water cooling head and the sealing member are connected to each other and enclose to form the heat exchanging channel, and the water cooling head is stacked with the first cooling member and/or the second cooling member.

10. The heat dissipating apparatus of claim 9, wherein the water cooling head comprises a base plate and a plurality of flow channel blocks disposed on a side of the base plate facing the sealing member, the plurality of flow channel blocks are disposed at intervals in sequence, the first cooling member and the second cooling member are disposed on a side of the base plate facing away from the sealing member, one flow channel is formed between the sealing member, the base plate and two adjacent flow channel blocks, and the plurality of flow channels are mutually communicated to form the heat exchanging channel.

11. The heat sink apparatus of claim 1, wherein the heat exchange module further comprises a fan opposite the heat sink assembly and configured to dissipate heat from the heat sink assembly.

12. The heat dissipating device of claim 1, wherein the cooling module further comprises a thermal pad disposed on a side of the first cooling element and the second cooling element facing away from the water cooling element, the thermal pad being configured to contact the electronic device, and the thermal pad having a length of less than or equal to 60mm.

13. The heat dissipating device of claim 1, wherein the cooling module further comprises a thermal pad disposed on a side of the first cooling element and the second cooling element facing away from the water cooling element, the thermal pad being configured to contact the electronic device, and the thermal pad having a hardness greater than or equal to 55A and less than or equal to 65A.