CN219497094U - Fingerprint module and electronic equipment - Google Patents

Abstract

The application provides a fingerprint module and electronic equipment, comprising a circuit board; the side wall of the outer cover is connected with the circuit board, and the outer cover and the circuit board together define a containing cavity, and a containing notch is formed in the side wall of the outer cover; the fingerprint identification chip is connected to the circuit board, one part of the fingerprint identification chip is positioned in the accommodating cavity, the other part of the fingerprint identification chip is positioned in the accommodating notch, and the projection of the fingerprint identification chip on the circuit board is completely covered by the projection of the outer cover on the circuit board. Through setting up the accommodation gap at the dustcoat of fingerprint module to when fingerprint identification chip installs in accommodating the intracavity, can partly hold in accommodating the gap, so, the overall dimension of dustcoat can be reduced as far as possible, the feasible fingerprint module can realize miniaturized design. And the projection of the fingerprint identification chip on the circuit board is completely covered by the projection of the outer cover on the circuit board, namely the fingerprint identification chip is exposed outside without extending out of the accommodating notch, and the outer cover can still effectively protect the fingerprint identification chip.

Description

Fingerprint module and electronic equipment

Technical Field

The application relates to the technical field of mobile terminals and fingerprint identification, in particular to a fingerprint module and electronic equipment.

Background

In order to realize a fingerprint identification function, an optical fingerprint module can be arranged under a display screen of an existing electronic product, such as a mobile terminal of a mobile phone, a tablet personal computer and the like, and fingerprint information can be identified through the optical fingerprint module.

The optical fingerprint module is used as a device capable of completing fingerprint identification below a display screen, has the advantages of being simple and convenient to operate, high in identification rate and free of affecting the screen ratio of equipment, and is widely paid attention to users. However, the optical fingerprint module has a large volume, and is difficult to adapt to the miniaturization trend of devices.

Disclosure of Invention

The application provides a fingerprint module and electronic equipment can reduce the overall dimension of fingerprint module.

In a first aspect, the present application provides a fingerprint module, comprising:

a circuit board;

the side wall of the outer cover is connected with the circuit board, and the outer cover and the circuit board define a containing cavity together, and a containing notch is formed in the side wall of the outer cover;

the fingerprint identification chip is connected to the circuit board, one part of the fingerprint identification chip is located in the accommodating cavity, the other part of the fingerprint identification chip is located in the accommodating notch, and the projection of the fingerprint identification chip on the circuit board is completely covered by the projection of the outer cover on the circuit board.

In a second aspect, the application further provides an electronic device, including a middle frame and the fingerprint module as described above, the fingerprint module is disposed on the middle frame.

The application provides fingerprint module and electronic equipment, through setting up the accommodation gap at the dustcoat of fingerprint module to when fingerprint identification chip installs in accommodating the intracavity, can partly hold in accommodating the breach, so, can guarantee to hold the intracavity and have enough installation space in, reduce the overall dimension of dustcoat as far as possible, make the fingerprint module can realize miniaturized design. In addition, the projection of the fingerprint identification chip on the circuit board is completely covered by the projection of the outer cover on the circuit board, namely the fingerprint identification chip is not stretched out of the accommodating notch and is exposed outside, but is completely covered by the outer cover, and the outer cover can still effectively protect the fingerprint identification chip. Therefore, the fingerprint module can realize miniaturized design, can effectively ensure that the fingerprint identification chip is not influenced by the outside, and can also improve the effective service life of the fingerprint identification chip.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which like reference numerals represent like parts throughout the following description.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a fingerprint module provided in an embodiment of the present application.

Fig. 3 is an exploded view of a fingerprint module provided in an embodiment of the present application.

Fig. 4 is a schematic diagram of a first internal structure of a fingerprint module according to an embodiment of the present application.

Fig. 5 is a schematic diagram of a second internal structure of the fingerprint module according to the embodiment of the present application.

Fig. 6 is a schematic diagram of a third internal structure of a fingerprint module according to an embodiment of the present application.

Fig. 7 is a schematic diagram of a fourth internal structure of a fingerprint module according to an embodiment of the disclosure.

Fig. 8 is a schematic diagram of a fifth internal structure of a fingerprint module according to an embodiment of the disclosure.

Fig. 9 is a top view of a housing of a fingerprint module according to an embodiment of the disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by a person skilled in the art without any inventive effort, are intended to be within the scope of the present application based on the embodiments herein.

The embodiment of the application provides a fingerprint module and electronic equipment, can reduce the overall dimension of fingerprint module. This will be described below with reference to the accompanying drawings.

It is to be understood that an "electronic device" (or simply "terminal") as used herein includes, but is not limited to, a device configured to receive/transmit communication signals via a wireline connection and/or via a wireless communication network, such as a cellular network, a wireless local area network, or the like. Examples of mobile terminals include, but are not limited to, cellular telephones and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. The mobile phone is the electronic equipment provided with the cellular communication module.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application. The electronic device 100 provided in the embodiment of the present application may be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device, and the mobile phone is taken as an example for illustration. As shown in fig. 1, the electronic device 100 may include a housing 10, a fingerprint module 20, and a display screen 30. The display screen 30 is disposed on the housing 10, and can be used for displaying images, and the fingerprint module 20 can be disposed below the display screen 30, so as to realize the functions of the fingerprint module 20 under the screen. In practical application, in the case that the fingerprint module 20 is disposed below the display screen 30, the display screen 30 is provided with a fingerprint identification area at a position opposite to the fingerprint module 20. For example, the display screen 30 may use an Organic Light-Emitting Diode (OLED) screen to display an image, when a finger of a user presses the finger in the fingerprint recognition area, the display screen 30 will illuminate the finger, then the fingerprint image pressed by the finger on the screen will pass through the display screen 30 and be captured and perceived by the fingerprint module 20 under the display screen 30, and by comparing the captured fingerprint image after preprocessing with the fingerprint image stored by the user before, a series of functions such as fingerprint unlocking and payment can be realized.

It should be noted that, in some alternative embodiments, the fingerprint module 20 may be disposed at other positions of the electronic device 100, for example, a lower area of the display side of the electronic device 100, or a non-display side of the electronic device 100, etc., as required. The specific location of the fingerprint module 20 in the terminal device in the embodiment of the present application may not be limited.

The casing 10 may be used as a main protection and support component of the electronic device 100, the casing 10 may include a middle frame 110 and a rear casing 120, the display screen 30 may be covered on one surface of the middle frame 110, and the rear casing 120 is provided on the other surface of the middle frame 110. For example, the display screen 30 and the rear case 120 may be covered on the opposite sides of the middle frame 110 by adhesion, welding, fastening, or the like. The fingerprint module 20 may be disposed in the middle frame 110, such as the fingerprint module 20 may be disposed between the display screen 30 and the middle frame 110, or the fingerprint module 20 may be disposed between the middle frame 110 and the rear case 120 and be capable of receiving light reflected from the fingerprint of the finger. For example, when the fingerprint module 20 is disposed between the middle frame 110 and the rear case 120, the middle frame 110 is provided with a through hole for light to pass through, and the fingerprint module 20 is disposed coaxially with the through hole, so that the fingerprint module 20 can receive light reflected from the fingerprint of the finger.

The rear case 120 may be a battery cover of the electronic device 100, and may be made of glass, metal, hard plastic, or other electrochromic materials. The rear case 120 has a certain structural strength, and is mainly used for protecting the electronic device 100. Accordingly, the middle frame 110 may be made of glass, metal, hard plastic, etc. The middle frame 110 also has a certain structural strength, and is mainly used for supporting and fixing the fingerprint module 20 and other functional devices installed between the middle frame 110 and the rear case 120. Such as a battery 50, motherboard 40, antenna, etc., of electronic device 100. Further, since the middle frame 110 and the rear case 120 are generally directly exposed to the external environment, the materials of the middle frame 110 and the rear case 120 may preferably have a certain performance of wear resistance, corrosion resistance, scratch resistance, etc., or the outer surfaces of the middle frame 110 and the rear case 120 (i.e., the outer surface of the electronic device 100) are coated with a layer of functional material for wear resistance, corrosion resistance, scratch resistance.

The display screen 30 may include a display module, a circuit for performing a touch operation in response to the display module, and the like. The display screen 30 may be a screen using an Organic Light-Emitting Diode (OLED) for image display, or a screen using a liquid crystal display (Liquid Crystal Display LCD) for image display. The display screen 30 may be a flat screen, a hyperboloid screen, or a quadric screen in appearance, which is not limited in this embodiment.

It is understood that the electronic device 100 may further include a motherboard 40, the motherboard 40 may be disposed in the housing 10, and the motherboard 40 may be a main control circuit board of the electronic device 100. The motherboard 40 may have a processor integrated thereon, and may further have one or more of a headset interface, an acceleration sensor, a gyroscope, a motor, and other functional components integrated thereon. The processor on the motherboard 40 can control the display 30 and the fingerprint module 20.

A battery 50 may be disposed within the housing 10, and the battery 50 may be electrically connected to the motherboard 40 to enable the battery 50 to power the electronic device 100. The motherboard 40 may have a battery 50 management circuit disposed thereon. The battery 50 management circuit is used to distribute the voltage provided by the battery 50 to the various electronic devices in the electronic apparatus 100.

It should be noted that, in the related art, in order to meet the trend of miniaturization of devices, the size of the fingerprint module needs to be made smaller and smaller. In practical application, the size of the shell of the fingerprint module is easy to realize miniaturized design, but the fingerprint module further comprises a fingerprint identification chip and a plurality of capacitors, which all need to occupy the space of the shell, so that the shell in the related art cannot be made too small, and the miniaturized design of the fingerprint module is greatly limited.

Based on this, please refer to fig. 2 to 4, fig. 2 is a schematic structural diagram of the fingerprint module provided in the embodiment of the present application, fig. 3 is an exploded view of the fingerprint module provided in the embodiment of the present application, and fig. 4 is a schematic structural diagram of a first internal structure of the fingerprint module provided in the embodiment of the present application. The embodiment of the application provides a fingerprint module 20, which can realize miniaturized design. The fingerprint module 20 includes a circuit board 23, a housing 24, and a fingerprint identification chip 21. The side walls of the housing 24 are connected to the circuit board 23 to define a receiving cavity 241 together with the circuit board 23, and it is understood that the fingerprint recognition chip 21 and the capacitor can be received in the receiving cavity 241. Wherein the side wall of the housing 24 is provided with receiving notches 242. The fingerprint identification chip 21 is connected to the circuit board 23, a part of the fingerprint identification chip 21 is located in the accommodating cavity 241, another part of the fingerprint identification chip 21 is located in the accommodating notch 242, and the projection of the fingerprint identification chip 21 on the circuit board 23 is completely covered by the projection of the housing 24 on the circuit board 23, that is, the fingerprint identification chip 21 does not extend out of the accommodating notch 242.

This application sets up through the dustcoat 24 at fingerprint module 20 and holds breach 242 to when fingerprint identification chip 21 installs in holding chamber 241, can partly hold in holding breach 242, so, can guarantee to hold when having sufficient installation space in the chamber 241, reduce dustcoat 24's overall dimension as far as possible, make fingerprint module 20 can realize miniaturized design. In addition, the projection of the fingerprint identification chip 21 on the circuit board 23 is completely covered by the projection of the cover 24 on the circuit board 23, that is, the fingerprint identification chip 21 does not extend out of the accommodating notch 242, or the fingerprint identification chip 21 is not exposed, but is completely covered by the cover 24, and the cover 24 can still effectively protect the fingerprint identification chip 21. Thus, the fingerprint module 20 can realize miniaturized design, can effectively ensure that the fingerprint identification chip 21 is not influenced by the outside, and can also improve the effective service life of the fingerprint identification chip 21.

It can be understood that the fingerprint identification chip 21 is connected to the circuit board 23, and may be fixed on the circuit board 23 by gluing, and then electrically connected to the circuit board 23 through an electrical connector such as a wire or a lead, so as to realize conduction between the fingerprint identification chip 21 and the circuit board 23. The end of the circuit board 23 remote from the fingerprint recognition chip 21 may be further provided with a connector, which may be used to realize an electrical connection between the circuit board 23 and other components in the electronic device 100, such as the motherboard 40.

It should be noted that, in practical application, the circuit board 23 may be at least one of a flexible circuit board and a printed circuit board, and the type of the circuit board 23 is not specifically limited in the embodiment of the present application. For example, when the circuit board 23 is a flexible circuit board, in order to increase rigidity, a hard structural member such as a steel plate may be provided on a side of the circuit board 23 facing away from the housing 24, the steel plate being disposed opposite to the housing 24, so that the circuit board 23 may have sufficient strength in a region where the housing 24 is correspondingly housed.

Further, in order to achieve miniaturization of the housing 24 while ensuring a sufficient installation space inside the housing 24. Referring to fig. 4, the fingerprint recognition chip 21 may include a plurality of corner portions 211, and the sidewall of the housing 24 is provided with at least one receiving notch 242, wherein one receiving notch 242 receives only one corner portion 211, such as when the fingerprint recognition chip 21 has four corner portions 211, if the housing 24 is provided with only one receiving notch 242, the receiving notch 242 receives only one corner portion 211, and the remaining three corner portions 211 are all located in the receiving cavity 241 of the housing 24, and if the housing 24 is provided with two receiving notches 242, one receiving notch 242 receives one corner portion 211, and the remaining two corner portions 211 are located in the receiving cavity 241 of the housing 24. It will be appreciated that the accommodating notch 242 accommodates only one corner 211, so that the fingerprint identification chip 21 is prevented from being too much located in the accommodating notch 242, which results in the accommodating notch 242 being too large to reduce the structural strength of the housing 24.

For example, with continued reference to FIG. 4, the fingerprint recognition chip 21 may have a generally rectangular configuration. The fingerprint recognition chip 21 may include a first side 212, a second side 213, a third side 214, and a fourth side 215 connected end to end in sequence, where the first side 212 and the third side 214 are disposed opposite to each other, and the second side 213 and the fourth side 215 are disposed opposite to each other.

The housing 24 may also be generally rectangular in configuration. The outer cover 24 includes a first side wall 243, a second side wall 244, a third side wall 245, and a fourth side wall 246 connected end to end in sequence, the first side wall 243 and the third side wall 245 are disposed opposite to each other, and the second side wall 244 and the fourth side wall 246 are disposed opposite to each other.

The first side 212 is disposed at an acute angle with the first sidewall 243, and the first side 212 or an extension line of the first side 212 intersects the first sidewall 243 and the fourth sidewall 246, such that the first side 212, the first sidewall 243 and the fourth sidewall 246 together define a first mounting area 25 for mounting the capacitor 22 a. It will be appreciated that the capacitor 22a is located entirely within the first mounting region 25. In this way, the space defined by the first edge 212, the first side wall 243 and the fourth side wall 246 can be fully utilized, so that the size of the outer cover 24 can be made smaller, and enough space can still be provided for installing the capacitor, thereby improving the space utilization rate in the accommodating cavity 241.

The third side 214 is disposed at an acute angle to the third side 245, and the third side 214 or an extension of the third side 214 intersects the second side 244 and the third side 245 such that the third side 214, the second side 244 and the third side 245 together define the second mounting region 26 for mounting the capacitor 22 b. In this way, the space defined by the third side 214, the second side wall 244 and the third side wall 245 can be fully utilized, so that the size of the outer cover 24 can be made smaller, and enough space can still be provided for installing the capacitor, thereby improving the space utilization rate in the accommodating cavity 241.

Specifically, the angle formed by the first edge 212 and the first sidewall 243 may be between 8 degrees and 15 degrees, such as 8 degrees, 10 degrees, or 15 degrees. In this way, the outer dimensions of the housing 24 can be made small, and there can be enough space for mounting the fingerprint recognition chip 21 and the capacitor.

The angle formed by the third side 214 and the third side wall 245 may also be between 8 degrees and 15 degrees, such as 8 degrees, 10 degrees, or 15 degrees. In this way, the outer dimensions of the housing 24 can be made small, and there can be enough space for mounting the fingerprint recognition chip 21 and the capacitor.

For example, three capacitors 22a may be mounted in the first mounting region 25, and the capacitors 22a may be arranged in a manner that is adaptively arranged according to the size of the space formed by the first mounting region 25, such as, as shown in the figure, the first mounting region 25 has a substantially triangular shape, and the capacitors near the region may be arranged laterally due to the small area near the included angle of the minimum angle of the triangle. Since the area of the included angle far from the minimum angle of the triangle is large, the capacitance near the area can be arranged vertically.

Three capacitors 22b may also be mounted in the second mounting region 26, and the capacitors 22b may be arranged in a manner that is adaptively arranged according to the size of the space formed by the second mounting region 26, such as, for example, as shown in the figure, the second mounting region 26 has a substantially triangular shape, and the capacitors near the region may be arranged laterally due to the small area near the included angle of the minimum angle of the triangle. Since the area of the included angle far from the minimum angle of the triangle is large, the capacitance near the area can be arranged vertically.

It should be understood that the description of the number of capacitors in this application is merely illustrative, and not limiting, and the specific number of capacitors may be selected according to the actual situation, which is not limited herein. Wherein the capacitor can filter noise of the high frequency signal.

It will be further understood that, in the embodiments of the present application, terms related to orientation, such as "transverse" and "vertical" are all used as references to states of parts in the drawings, and when the states of the parts are changed, the reference directions of the orientations are changed correspondingly.

In order to further reduce the external dimension of the housing 24, refer to fig. 5, and fig. 5 is a schematic diagram illustrating a second internal structure of the fingerprint module according to the embodiment of the present application. The first side wall 243, the second side wall 244, the third side wall 245 and the fourth side wall 246 are provided with accommodating notches, the corner 211a formed by the first edge 212 and the second edge 213 is accommodated in the accommodating notch 242a of the first side wall 243, the corner 211b formed by the second edge 213 and the third edge 214 is accommodated in the accommodating notch 242b of the second side wall 244, the corner 211c formed by the third edge 214 and the fourth edge 215 is accommodated in the accommodating notch 242c of the third side wall 245, and the corner 211d formed by the fourth edge 215 and the first edge 212 is accommodated in the accommodating notch 242d of the fourth side wall 246.

Specifically, with continued reference to fig. 5, the first side wall 243 is provided with a receiving notch 242a, the second side wall 244 is provided with a receiving notch 242b, the third side wall 245 is provided with a receiving notch 242c, the fourth side wall 246 is provided with a receiving notch 242d, the first side 212 and the second side 213 are formed with a corner portion 211a, the corner portion 211a is received in the receiving notch 242a of the first side wall 243, the second side 213 and the third side 214 are formed with a corner portion 211b, the corner portion 211b is received in the receiving notch 242b of the second side wall 244, the third side 214 and the fourth side 215 are formed with a corner portion 211c, the corner portion 211c is received in the receiving notch 242c of the third side wall 245, the fourth side 215 and the first side 212 are formed with a corner portion 211d, and the corner portion 211d is received in the receiving notch 242d of the fourth side wall 246. In this way, the dimensions of the housing 24 can be minimized while still providing sufficient space for the first mounting region 25 and the second mounting region 26 to mount the capacitor.

Of course, in some embodiments, only one receiving notch may be provided on one side wall, for example, referring to fig. 4, only the receiving notch 242b is provided on the second side wall 244, and the corner 211b formed by the second edge 213 and the third edge 214 is received in the receiving notch 242b of the second side wall 244.

In some embodiments, a receiving notch may be disposed on each of two adjacent sidewalls, for example, refer to fig. 6, and fig. 6 is a schematic diagram of a third internal structure of the fingerprint module according to the embodiment of the present application. The third side wall 245 is provided with a receiving notch 242c, the corner 211c formed by the third side 214 and the fourth side 215 is received in the receiving notch 242c of the third side wall 245, the fourth side wall 246 is provided with a receiving notch 242d, and the corner 211d formed by the fourth side 215 and the first side 212 is received in the receiving notch 242d of the fourth side wall 246.

In some embodiments, a receiving notch may be disposed on each of two opposite sidewalls, for example, refer to fig. 7, and fig. 7 is a schematic diagram of a fourth internal structure of the fingerprint module according to the embodiment of the present application. The second side wall 244 is provided with a receiving notch 242b, the corner 211b formed by the second side 213 and the third side 214 is received in the receiving notch 242b of the second side wall 244, the fourth side wall 246 is provided with a receiving notch 242d, and the corner 211d formed by the fourth side 215 and the first side 212 is received in the receiving notch 242d of the fourth side wall 246.

In some embodiments, a receiving notch may be disposed on each of the three sidewalls, for example, refer to fig. 8, and fig. 8 is a schematic diagram of a fifth internal structure of the fingerprint module according to the embodiment of the present application. The second side wall 244 is provided with a receiving notch 242b, the corner 211b formed by the second side 213 and the third side 214 is received in the receiving notch 242b of the second side wall 244, the third side wall 245 is provided with a receiving notch 242c, the corner 211c formed by the third side 214 and the fourth side 215 is received in the receiving notch 242c of the third side wall 245, the fourth side wall 246 is provided with a receiving notch 242d, and the corner 211d formed by the fourth side 215 and the first side 212 is received in the receiving notch 242d of the fourth side wall 246.

It should be noted that, due to the accommodating gap 242, impurities such as dust easily enter the accommodating cavity 241 from the accommodating gap 242, which affects the normal operation of the components in the accommodating cavity 241. Based on this, the fingerprint module 20 may further include a sealing portion disposed on the accommodating notch 242 to seal the accommodating notch 242. For example, the seal may be a sealant. Illustratively, after the fingerprint module 20 is assembled, the accommodating notch 242 may be sealed, and the adhesive medium is disposed in the accommodating notch 242. In particular, the bonding medium may be glue. The glue may include, but is not limited to, any of epoxy adhesives, anaerobic glues, ultraviolet light curing adhesives, hot melt adhesives, pressure sensitive adhesives, latex adhesives. By filling the accommodating notch 242 with glue, foreign matters such as external water and dust can be prevented from entering the accommodating cavity 241 in the outer cover 24 through the accommodating notch 242, and normal operation of components in the accommodating cavity 241 is affected.

It can be understood that the fingerprint identification chip 21 may be an optical fingerprint identification chip, that is, an optical fingerprint sensor, and specifically, the fingerprint identification chip 21 may utilize a photoelectric conversion function of a photoelectric device to perform photoelectric conversion on a received optical signal, convert light reflected by a fingerprint into electrical signals in a proportional relationship with a fingerprint image, and the electrical signals are preprocessed by a processor on the electronic device 100 and reduced to the fingerprint image for fingerprint comparison and identification.

It will be further appreciated that, in order to facilitate projecting the light reflected by the fingerprint onto the fingerprint recognition chip 21, the fingerprint module 20 may further include a lens 27, and the lens 27 may be configured to collect the light reflected by the fingerprint and project the collected light onto the fingerprint recognition chip 21, where it will be appreciated that the fingerprint recognition chip 21 is in the direction of the optical axis of the lens 27.

Specifically, the lens 27, as an optical structure for transmitting light, may be provided with 1 lens or a plurality of lenses therein, for example, 2 lenses, 3 lenses, 4 lenses, and the like. The lens 27 may project the captured fingerprint image onto the fingerprint recognition chip 21 using principles of pinhole imaging.

The lens may be at least one of a plastic lens and a glass lens, and the specific type of the lens in the embodiments of the present application may not be limited.

Optionally, the lens 27 may further include an optical filter, which may be disposed in the accommodating cavity 241 and located at the bottom of the lens. The filter may be used to filter stray light and improve the quality of the image captured by the lens 27.

Alternatively, the filter may be made by a process of plating a special film on the glass.

In which the housing 24 is used as a main supporting portion of the lens 27, for example, referring to fig. 2 and 3, the housing 24 may include a first sidewall 243, a second sidewall 244, a third sidewall 245, and a fourth sidewall 246 connected end to end, where the first sidewall 243 and the third sidewall 245 are disposed opposite to each other, and the second sidewall 244 and the fourth sidewall 246 are disposed opposite to each other. The housing 24 further includes a top wall 247, the top wall 247 being connected to the first, second, third and fourth side walls 243, 244, 245 and 246, the top wall 247 being disposed opposite the circuit board 23, the first, second, third, fourth and fourth side walls 243, 244, 245 and 246 of the housing 24 together defining a receiving cavity 241 when the first, second, third and fourth side walls 243, 244, 245 and 246 of the housing 24 are connected to the circuit board 23.

The top wall 247 is provided with a through hole that communicates to the accommodation chamber 241. In order to facilitate the installation of the lens 27, the housing 24 further includes a lens mounting portion 248, the lens mounting portion 248 is protruding outside the top wall 247, the lens mounting portion 248 is provided with a lens mounting hole, the lens mounting hole is communicated with the through hole and coaxially arranged, and the lens 27 is mounted in the lens mounting hole. In this way, by providing the lens mounting portion 248 protruding outside the top wall 247, other places of the housing 24 can be made flatter, such as the thickness of the housing 24 can be made thinner, and there is also a mounting space in which the lens 27 can be mounted. To achieve miniaturization of the fingerprint module 20.

The lens 27 may be adhered to the lens mounting hole by an adhesive medium such as glue or an adhesive tape, or may be fixed to the lens mounting hole by a fixing member such as a buckle. It will be appreciated that the center of the fingerprint recognition chip 21 is in the direction of the optical axis of the lens 27. In this way, the fingerprint reflected light rays passing through the lens 27 can be projected onto the fingerprint recognition chip 21.

Referring to fig. 9, fig. 9 is a top view of an outer cover of a fingerprint module according to an embodiment of the disclosure. In order to further achieve a miniaturized design of the housing 24, the distance between the first side wall 243 and the second side wall 244 may be reduced as much as possible on the first side wall 243 and the third side wall 245 which are disposed opposite to each other, while considering that the lens mounting portion 248 is cylindrical, a position of a minimum distance is provided between the first side wall 243 and the lens mounting portion 248, and a position of a minimum distance is also provided between the third side wall 245 and the lens mounting portion 248, which position, if made too thin, affects the overall strength of the housing 24. Based on this, the first sidewall 243 of the housing 24 may include a first arc portion 2431 and a first straight portion 2432, where the first arc portion 2431 and the first straight portion 2432 are connected, and the first arc portion 2431 is disposed coaxially with the lens mounting portion 248, that is, the first arc portion 2431 is located at the minimum distance. The third sidewall 245 may include a second arc portion 2451 and a second straight portion 2452, where the second arc portion 2451 is connected to the second straight portion 2452, and the second arc portion 2451 is disposed coaxially with the lens mounting portion 248, that is, the second arc portion 2451 is located at the minimum distance. It will be appreciated that the first and second arcuate portions 2431 and 2451 are outwardly convex, and that the minimum distance is configured to be sufficiently thick, so that the overall strength of the outer cover 24 is still ensured while minimizing the distance between the first and third sidewalls 243 and 245.

It will be appreciated that the housing 24 may serve as a connecting member for mounting and connecting the fingerprint module 20 to the center 110. Referring to fig. 2, in order to facilitate the installation and positioning of the fingerprint module 20 on the middle frame 110, the top wall 247 of the housing 24 is provided with a connecting groove 2471, the connecting groove 2471 is located on the side of the lens mounting portion 248, and the connecting groove 2471 is used for connecting with a connecting post on the middle frame 110 of the electronic device 100. For example, when the fingerprint module 20 is required to be mounted and positioned on the middle frame 110, the connecting groove 2471 of the outer cover 24 can be aligned with the connecting post on the middle frame 110, so that the connecting post can be plugged into the connecting groove 2471 to fix the fingerprint module 20.

Wherein, in order to make the outer cover 24 and the middle frame 110 fit more tightly, it is understood that the top wall 247 of the outer cover 24 includes a first fitting surface 2472 facing the middle frame 110, the middle frame 110 includes a second fitting surface facing the first fitting surface 2472, and when the connecting post of the middle frame 110 is inserted into the connecting slot 2471 of the outer cover 24, the first fitting surface 2472 and the second fitting surface fit each other. It can be further appreciated that the middle frame 110 is provided with a via hole, and the lens mounting portion 248 is disposed through the via hole, so as to prevent the lens mounting portion 248 from interfering with the middle frame 110, and enable the light reflected by the fingerprint to be projected onto the lens 27 of the lens mounting portion 248.

It should be noted that the outer cover 24 may be at least one of a plastic outer cover 24 and a metal outer cover 24, and the material of the outer cover 24 may not be limited in the embodiments of the present application.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.

In the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features.

The fingerprint module and the electronic device provided by the embodiments of the present application are described in detail, and specific examples are applied to illustrate the principles and embodiments of the present application, where the descriptions of the above embodiments are only used to help understand the method and core ideas of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims (10)

1. A fingerprint module, comprising:

a circuit board;

the side wall of the outer cover is connected with the circuit board, and the outer cover and the circuit board define a containing cavity together, and a containing notch is formed in the side wall of the outer cover; and

the fingerprint identification chip is connected to the circuit board, one part of the fingerprint identification chip is located in the accommodating cavity, the other part of the fingerprint identification chip is located in the accommodating notch, and the projection of the fingerprint identification chip on the circuit board is completely covered by the projection of the outer cover on the circuit board.

2. The fingerprint module of claim 1, wherein the fingerprint identification chip includes a plurality of corners, and the sidewall of the housing is provided with at least one receiving notch, one receiving notch receiving one of the corners.

3. The fingerprint module of claim 2, wherein the fingerprint identification chip comprises a first edge, a second edge, a third edge and a fourth edge which are connected end to end in sequence, the first edge and the third edge are oppositely arranged, and the second edge and the fourth edge are oppositely arranged;

the outer cover comprises a first side wall, a second side wall, a third side wall and a fourth side wall which are sequentially connected end to end, wherein the first side wall and the third side wall are oppositely arranged, and the second side wall and the fourth side wall are oppositely arranged;

the first side and the first side wall are arranged at an acute angle, and the first side or an extension line of the first side intersects the first side wall and the fourth side wall, so that the first side, the first side wall and the fourth side wall together define a first mounting area for mounting the capacitor.

4. A fingerprint module according to claim 3, wherein the third side is disposed at an acute angle to the third side wall, and wherein the third side or an extension of the third side intersects the second side wall and the third side wall such that the third side, the second side wall and the third side wall together define a second mounting area for mounting a capacitor.

5. The fingerprint module of claim 3, wherein the first side wall, the second side wall, the third side wall, and the fourth side wall are each provided with a receiving notch, the corners formed by the first side and the second side are received in the receiving notch of the first side wall, the corners formed by the second side and the third side are received in the receiving notch of the second side wall, the corners formed by the third side and the fourth side are received in the receiving notch of the third side wall, and the corners formed by the fourth side and the first side are received in the receiving notch of the fourth side wall.

6. The fingerprint module of any one of claims 1-5, further comprising a seal disposed in the receiving indentation to seal the receiving indentation.

7. A fingerprint module according to claim 3, wherein the housing comprises:

the top wall is connected with the first side wall, the second side wall, the third side wall and the fourth side wall, the top wall is arranged opposite to the circuit board, the top wall is provided with a through hole, and the through hole is communicated to the accommodating cavity;

the lens mounting part is convexly arranged on the outer side of the top wall, and is provided with a lens mounting hole which is communicated with the through hole and is coaxially arranged;

the fingerprint module further comprises a lens, and the lens is installed in the lens installation hole.

8. The fingerprint module of claim 7, wherein the first sidewall includes a first arc portion and a first straight portion, the first arc portion and the first straight portion are connected, and the first arc portion is coaxially disposed with the lens mounting portion; and/or the number of the groups of groups,

the third side wall comprises a second arc-shaped part and a second straight line part, the second arc-shaped part is connected with the second straight line part, and the second arc-shaped part and the lens installation part are coaxially arranged.

9. The fingerprint module of claim 7, wherein the top wall is provided with a connecting groove, the connecting groove is located at one side where the lens mounting part is located, and the connecting groove is used for connecting with a connecting post on a middle frame of the electronic device.

10. An electronic device, comprising a middle frame and the fingerprint module according to any one of claims 1-9, wherein the fingerprint module is disposed on the middle frame.