CN219494409U

CN219494409U - Semiconductor boiler waste heat recycling device

Info

Publication number: CN219494409U
Application number: CN202223481679.XU
Authority: CN
Inventors: 马林森
Original assignee: Hebei Gecheng Shenghong Electric Co ltd
Current assignee: Hebei Gecheng Shenghong Electric Co ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-08-08
Anticipated expiration: 2032-12-26

Abstract

The utility model relates to the technical field of semiconductor boilers and discloses a semiconductor boiler waste heat recycling device which comprises an outer frame, wherein a water inlet pipe is fixedly connected to the right side of the inner wall of the outer frame, a heating pipe is fixedly sleeved outside the water inlet pipe, a semiconductor heater is fixedly connected to the left side of the water inlet pipe, and a filter box chassis is sleeved at the bottom of the semiconductor heater through threads. This semiconductor boiler waste heat recycling device, through the blast pipe at outlet pipe top fixed connection, when the outside exhaust of water flow through outlet pipe after the semiconductor heater heating, the inside of inside air duct is discharged into to the vapor through the blast pipe to enter into outside air duct through inside air duct, enter into the inside of heating pipe along the connecting pipe through outside air duct's guide, preheat the inside water source of inlet tube, so that the vapor that is idle originally can heat the water source in advance, reduced the energy consumption of later stage heating water source.

Description

Semiconductor boiler waste heat recycling device

Technical Field

The utility model relates to the technical field of semiconductor boilers, in particular to a semiconductor boiler waste heat recycling device.

Background

The semiconductor electric boiler is one kind of electric boiler, and the semiconductor electric boiler is intermittent operation principle, namely the semiconductor electric boiler is in the heating state when the water supply temperature is less than upper limit temperature, and the semiconductor electric boiler is in the shut down heat preservation state when the water supply temperature reaches upper limit temperature. In the coldest days of the heating period, the heat value provided by the semiconductor electric boiler just meets or is smaller than the heat load required by a room, and the excessively high setting of the upper limit temperature value of the semiconductor electric boiler can cause that the actual water supply temperature of the semiconductor electric boiler is difficult to reach the upper limit temperature, so that the semiconductor electric boiler is in a 24-hour heating state, and the semiconductor electric boiler is usually used as the core of the semiconductor electric boiler.

In the conventional semiconductor boiler, the heat in the water vapor is in an idle state because the water vapor and the like generated when the water is heated are difficult to collect and utilize when the water source is heated, and impurities contained in the water source are accumulated in the semiconductor heater when the water source enters the semiconductor heater and can cause the efficiency of heating the semiconductor to be reduced, so we propose a semiconductor boiler waste heat recycling device.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a semiconductor boiler waste heat recycling device, which solves the problems in the background art.

The utility model provides the following technical scheme: the utility model provides a semiconductor boiler waste heat recycling device, includes the outside framework, the right side fixedly connected with inlet tube of outside framework inner wall, the outside fixedly connected with heating pipe of inlet tube, the left side fixedly connected with semiconductor heater of inlet tube, the bottom screw thread of semiconductor heater has cup jointed the filter cartridge chassis, the right side fixedly connected with outlet pipe at semiconductor heater top, the top fixedly connected with blast pipe of outlet pipe, the inside air duct of top fixedly connected with of blast pipe, the outside air duct of one end fixedly connected with of inside air duct, the main calandria of one end fixedly connected with comdenstion water of outside air duct, the top fixedly connected with connecting pipe of the main calandria of comdenstion water.

Preferably, a sealing door is arranged outside the outer frame body, and the outer air duct is positioned outside the outer frame body.

Preferably, the external heat insulation layer is fixedly sleeved at the position, outside the external frame, of the external air duct, and the internal heat insulation layer is fixedly sleeved at the position, inside the external frame, of the external air duct.

Preferably, the top of the connecting pipe is fixedly connected with the heating pipe, and the inside of the heating pipe is in a hollow state.

Preferably, one side of the heating pipe is fixedly connected with a condensate water auxiliary drain pipe, and the condensate water auxiliary drain pipe is fixedly connected with the condensate water main drain pipe.

Preferably, an inner ring is arranged in the filter box chassis, the inner ring is clamped in the semiconductor heater, and an electromagnetic valve is arranged outside the water inlet pipe.

Compared with the prior art, the utility model has the following beneficial effects:

1. this semiconductor boiler waste heat recycling device, through the blast pipe at outlet pipe top fixed connection, when the outside exhaust of water flow through outlet pipe after the semiconductor heater heating, the inside of inside air duct is discharged into to the vapor through the blast pipe to enter into outside air duct through inside air duct, enter into the inside of heating pipe along the connecting pipe through outside air duct's guide, preheat the inside water source of inlet tube, so that the vapor that is idle originally can heat the water source in advance, reduced the energy consumption of later stage heating water source.

2. This semiconductor boiler waste heat recycling device, through the filter box chassis that cup joints at semiconductor heater bottom internal thread, when the water source continuously heats through semiconductor heater, impurity in the water source enters into semiconductor heater's inside in step, and because semiconductor heater is in the vertical state, impurity in the water source is in the inside back of entering semiconductor heater, the sinking and in the inner ring on filter box chassis is accumulated, when this device need not the heating, can open the door, rotate the filter box chassis then, take out the filter box chassis, the impurity in the clearance can, from this, the efficiency of this device heating has been improved.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is an internal view of the outer housing of the present utility model;

FIG. 3 is an external view of the outer frame of the present utility model;

fig. 4 is a side view of the structure of the present utility model.

In the figure: 1. an outer frame; 2. sealing the door; 3. a water inlet pipe; 4. heating pipes; 5. a semiconductor heater; 6. a filter box chassis; 7. a water outlet pipe; 8. an exhaust pipe; 9. an internal airway; 10. an external airway; 11. an external insulation layer; 12. an internal insulation layer; 13. a condensed water main drain pipe; 14. a connecting pipe; 15. and a condensed water auxiliary drain pipe.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1, a semiconductor boiler waste heat recycling device comprises an outer frame 1, wherein the outer frame 1 is used as an outer shell of the device, which plays roles of protecting various groups of components and pipelines of a semiconductor boiler, improving the safety protection of the device, avoiding damage to human bodies caused by heated temperature, a water inlet pipe 3 is fixedly connected to the right side of the inner wall of the outer frame 1, the water inlet pipe 3 is used as a water inlet structure, an external water source is led into the semiconductor heater 5 for heating, the water supply efficiency of the device is improved, a heating pipe 4 is fixedly sleeved outside the water inlet pipe 3, the heating pipe 4 is used as a heating structure of the device, which plays roles of collecting water vapor to preheat the water inlet pipe 3, improving the utilization rate of the device to waste heat, the left side of the water inlet pipe 3 is fixedly connected with the semiconductor heater 5, the semiconductor heater 5 is used as the prior art, the detailed description is not needed, the filter box chassis 6 is sleeved at the bottom of the semiconductor heater 5 in a threaded manner, the filter box chassis 6 is used as the filter structure of the device, the filter box chassis 6 plays a role in accumulating the impurities settled in the semiconductor heater 5 and uniformly cleaning the impurities at the later stage, the heating efficiency of the semiconductor heater 5 is improved, the water outlet pipe 7 is fixedly connected to the right side of the top of the semiconductor heater 5, the water outlet pipe 7 is used as the water outlet structure of the device, the hot water is ensured to be externally discharged, the exhaust pipe 8 is fixedly connected to the top of the water outlet pipe 7, the exhaust pipe 8 is used as the guide structure of the device, the volume of the passage range of the exhaust pipe is used for enabling the water vapor to quickly enter the inside of the internal air guide pipe 9, the water vapor is prevented from flowing out outwards due to the excessively high water outlet speed, the speed of absorbing and transmitting the water vapor is improved, the top fixedly connected with inside air duct 9 of blast pipe 8, inside air duct 9 is as the guide structure of this device, it has played and has introduced outside air duct 10 inside and carry out the effect of conveying with the vapor, the speed of collecting vapor of this device has been improved, the one end fixedly connected with outside air duct 10 of inside air duct 9, outside air duct 10 is as the outside guide structure of this device, it is being avoided outside framework 1 inner space to be overcrowded, the aesthetic property of arranging inside this device has been improved, the one end fixedly connected with comdenstion water owner calandria 13 of outside air duct 10, comdenstion water owner calandria 13 is as the comdenstion water play water structure of this device, it has played the outside discharge of the water that condenses into with vapor transmission in-process, the top fixedly connected with connecting pipe 14 of comdenstion water owner calandria 13, connecting pipe 14 has played the inside vapor of guiding outside air duct 10 and has entered the inside effect of heating pipe 4.

Referring to fig. 2-4, a sealing door 2 is provided on the outside of the outer frame 1, the sealing door 2 has the effect of sealing the outer frame 1, so that when the device needs to clean impurities inside the semiconductor heater 5, the filter box chassis 6 can be quickly taken out, the outer air duct 10 is positioned outside the outer frame 1, the outer heat insulation layer 11 is fixedly sleeved at the position, which is positioned outside the outer frame 1, of the outer heat insulation layer 11 and the inner heat insulation layer 12 are used as heat insulation structures of the device, the inside of the heat insulation structure is filled with rock wool to ensure that heat of water vapor inside the outer air duct 10 cannot be lost, the inner heat insulation layer 12 is fixedly sleeved at the position, which is positioned inside the outer frame 1, of the outer air duct 10, the top and the heating pipe 4 fixed connection of connecting pipe 14, the inside of heating pipe 4 is hollow state, the inside of heating pipe 4 is hollow, be used for collecting the vapor and concentrate preheating to the outside of inlet tube 3, the effect of preheating has been improved, one side fixedly connected with comdenstion water auxiliary drain pipe 15 of heating pipe 4, the auxiliary drain pipe 15 of comdenstion water has played the effect of carrying out external discharge with the inside comdenstion water of heating pipe 4, the auxiliary drain pipe 15 of comdenstion water and the main calandria 13 fixed connection of comdenstion water, the inside of straining box chassis 6 is equipped with the inner ring, the inner ring is used for storing impurity, and the inner ring joint is in the inside of semiconductor heater 5, the externally mounted of inlet tube 3 has the solenoid valve.

Working principle: when the device is used, when a water source needs to be heated, firstly, the electromagnetic valve arranged outside the water inlet pipe 3 is opened, so that the water source enters the semiconductor heater 5 through the water inlet pipe 3, after the water source enters the semiconductor heater 5, impurities in the water source sink into the inner ring of the filter box chassis 6, then the semiconductor heater 5 is started to heat the water source, the water source flows through the semiconductor heater 5 and then enters the inside of the water outlet pipe 7 and is discharged from the water outlet pipe 7, in the hot water discharging process, water vapor enters the inside of the inner air guide pipe 9 through the exhaust pipe 8 and enters the inside of the outer air guide pipe 10 through the inner air guide pipe 9, returns to the inside of the outer frame 1 through the guide of the outer air guide pipe 10, and enters the inside of the heating pipe 4 through the connecting pipe 14, the water vapor is filled into the heating pipe 4, so that the heating pipe 4 is wrapped outside the water inlet pipe 3, the water source inside the water inlet pipe 3 is preheated, the produced condensed water enters the inside of the main drain pipe 13 and is discharged outside when the water vapor enters the inside of the heating pipe 4 and is discharged outside, and the condensed water vapor enters the inside of the auxiliary drain pipe 13 after entering the inside of the preheating pipe 3, and enters the inside of the auxiliary drain pipe 15.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Meanwhile, in the drawings of the present utility model, the filling pattern is only for distinguishing the layers, and is not limited in any way.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor boiler waste heat recycling device, includes outside framework (1), its characterized in that: the utility model discloses a solar water heater, including outer framework (1) inner wall, right side fixedly connected with inlet tube (3) of outer framework (1), the outside fixedly connected with heating pipe (4) of inlet tube (3), the left side fixedly connected with semiconductor heater (5) of inlet tube (3), the bottom screw thread of semiconductor heater (5) has cup jointed and has been strained box chassis (6), the right side fixedly connected with outlet pipe (7) at semiconductor heater (5) top, the top fixedly connected with blast pipe (8) of outlet pipe (7), the inside air duct (9) of top fixedly connected with of blast pipe (8), the one end fixedly connected with outside air duct (10) of inside air duct (9), the one end fixedly connected with comdenstion water owner calandria (13) of outside air duct (10), the top fixedly connected with connecting pipe (14) of comdenstion water owner calandria (13).

2. The semiconductor boiler waste heat recycling device according to claim 1, wherein: the outside of the outer frame body (1) is provided with a sealing door (2), and the outer air duct (10) is positioned outside the outer frame body (1).

3. The semiconductor boiler waste heat recycling device according to claim 1, wherein: the external air duct (10) is fixedly sleeved with the external heat insulation layer (11) at the position outside the external frame body (1), and the external air duct (10) is fixedly sleeved with the internal heat insulation layer (12) at the position inside the external frame body (1).

4. The semiconductor boiler waste heat recycling device according to claim 1, wherein: the top of the connecting pipe (14) is fixedly connected with the heating pipe (4), and the inside of the heating pipe (4) is in a hollow state.

5. The semiconductor boiler waste heat recycling device according to claim 1, wherein: one side of the heating pipe (4) is fixedly connected with a condensate water auxiliary drain pipe (15), and the condensate water auxiliary drain pipe (15) is fixedly connected with a condensate water main drain pipe (13).

6. The semiconductor boiler waste heat recycling device according to claim 1, wherein: the inside of filter cartridge chassis (6) is equipped with the inner ring, and the inner ring joint is in the inside of semiconductor heater (5), the solenoid valve is installed to the outside of inlet tube (3).