CN219470189U - Vacuum apparatus and vacuum apparatus component - Google Patents
Vacuum apparatus and vacuum apparatus component Download PDFInfo
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- CN219470189U CN219470189U CN202320911178.6U CN202320911178U CN219470189U CN 219470189 U CN219470189 U CN 219470189U CN 202320911178 U CN202320911178 U CN 202320911178U CN 219470189 U CN219470189 U CN 219470189U
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- 239000000463 material Substances 0.000 claims abstract description 175
- 238000009825 accumulation Methods 0.000 claims abstract description 91
- 238000000034 method Methods 0.000 claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 239000002245 particle Substances 0.000 claims abstract description 70
- 239000007787 solid Substances 0.000 claims abstract description 67
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 description 31
- 230000003071 parasitic effect Effects 0.000 description 31
- 239000011248 coating agent Substances 0.000 description 22
- 238000009417 prefabrication Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000005253 cladding Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000010431 corundum Substances 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002156 adsorbate Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Vacuum apparatus and vacuum apparatus components. The vacuum apparatus (100) comprises: a vacuum chamber (110) having a process region (111); a process treatment device (120) for the process treatment of a substrate (241) in a process treatment zone (111) by means of a process, wherein gaseous material (150) is emitted into the process treatment zone (111); and a preformed accumulation surface structure (230) having a plurality of uneven portions (231) for accumulating the gaseous material (150); wherein the plurality of irregularities (231) is provided by means of solid particles embedded in the structural material of the prefabricated accumulating surface structure (230) or by means of laser structuring of the structural material.
Description
Technical Field
Various embodiments relate to vacuum equipment and vacuum equipment components.
Background
Typically, one or more components of the vacuum facility that are exposed to the coating process performed therein, in which the substrate coating is handled, will also be coated, such that these components obtain a parasitic coating (also referred to as parasitic layer). Such parasitic coatings can adversely affect the vacuum facility, such as when components of the parasitic coating become detached, thereby interfering with the vacuum and/or coating process within the vacuum facility.
Typically, the surface of the parasitic cladding is cleaned periodically to remove the parasitic cladding, which is of course costly and can be associated with high costs. Conventional cleaning processes can also damage the associated components, thereby often replacing particularly small and/or sensitive components as a whole. Furthermore, the cleaning process can be associated with reduced downtime of the vacuum facility and reduced process efficiency.
Disclosure of Invention
It has been recognized according to various aspects that it would be advantageous to: the parasitic coating adheres as firmly as possible (also referred to as adhesion) and is thus incorporated into the vacuum system. This suppresses, for example, detachment of the constituent parts of the parasitic coating and thus adverse effects on the vacuum system due to the parasitic coating (also referred to as parasitic layer). Thus, the time interval between two cleaning processes may be enlarged, which reduces costs and/or increases process efficiency.
Intuitively, it has been recognized that: the adhesion of the parasitic coating may be improved, for example, by: the surface on which the parasitic cap is formed is roughened, for example, the surface is provided with unevenness. This facilitates the mechanical coupling (also referred to as form-fitting) of the parasitic cap to the surface irregularities. Recognizing in this context: conventional processes for roughening surfaces (e.g., sandblasting or pickling) are expensive and/or may cause damage. In contrast, according to various embodiments, roughening is performed by means of laser structuring or by means of coating with solid particles, which is inexpensive and gentle (e.g., less damaging).
According to various embodiments, an apparatus and method may be provided that improves adhesion between a surface and a material deposited on the surface (also referred to herein as a parasitic layer or accumulation).
According to various aspects, a prefabricated accumulating surface structure, its use and its prefabrication are provided, for example as a component of a more complex device to which parasitic layers can be attached.
According to a different aspect, the accumulation surface structure has a roughened surface (also referred to as accumulation surface) formed by means of the preform.
According to various aspects, a vacuum apparatus may be provided whose surface has a plurality of irregularities as a surface structure (also referred to as a structured surface) where gaseous material may adhere.
According to various aspects, a vacuum apparatus component (also referred to as a vacuum system component) and a method for prefabrication thereof may be provided, wherein the vacuum apparatus component has a surface structure at which gaseous material may accumulate or at which other materials may accumulate.
According to various aspects, a surface structure is provided that can be used within a vacuum apparatus to enhance the adhesion of gaseous materials thereto. According to various aspects, the surface structure may have a plurality of irregularities.
According to various aspects, the plurality of irregularities may be provided by means of a plurality of solid particles, which may be embedded in the structural material of the surface structure. Alternatively or additionally, the surface structure may be produced by means of a laser.
Drawings
Various embodiments are shown in the drawings and are explained in more detail below.
The drawings show
Figures 1 to 3 show schematically vacuum apparatuses according to different aspects,
fig. 4A to 4D schematically show vacuum equipment components according to different aspects, respectively, and
fig. 5 schematically illustrates a method for operating a vacuum apparatus according to various aspects.
Detailed Description
In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the utility model may be practiced. In this regard, directional terminology, such as "upper," "lower," "front," "rear," etc., is used in connection with the orientation of the figure(s) being described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments can be utilized and structural or logical changes can be made without departing from the scope of the present utility model. It is to be understood that the features of the different exemplary embodiments described herein can be combined with one another as long as they are not specifically described otherwise. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present utility model is defined by the appended claims.
Herein, the term "accumulation" means the enrichment of one or more atoms and/or one or more molecules of a fluid (e.g., liquid and/or gas) at a solid surface, by which a solid accumulation (e.g., layer) is formed therefrom. The surface that forms an accumulation (e.g., layer) by means of accumulation may also be referred to herein as an accumulation surface. The material to be accumulated is present, for example, in the gas phase before the accumulation and in the solid phase after the accumulation, for example in the form of a layer (for example also referred to as parasitic layer, parasitic accumulation or accumulation coating).
"parasitic layer" may refer herein to an accumulation that is not desired to be formed during the layer formation process. A parasitic layer is understood to mean a layer of material (also referred to as coating material) which is formed on components of the vacuum system, while the substrate is coated with the same coating material.
Within the scope of the present specification, solid particles are understood to be particles having or formed from solids (intuitively granular structure), i.e. substances which exist in a solid aggregated state (where the substance may have a plurality of atoms and/or molecules). Solid particles may also be referred to simply as "particles". The solid particles may have an extension (intuitively particle size) of more than 5nm, for example more than 0.1 μm, for example less than 1 mm. Intuitively, the solid particles may form granules or powder. The expansion of the solid particles may be an average expansion thereof, e.g. an average over all solid particles and/or an average over each solid particle individually. The average expansion of the individual solid particles can intuitively correspond to the diameter of a sphere having a solid particle volume. For example, the solid particles may be present as a powder or granules.
A "vacuum equipment component" is herein understood to be a component (also referred to as a machine component) that can be used within a vacuum, for example, which is composed of metal and/or ceramic. For example, a vacuum apparatus component is understood to be one or more components in the form of a group of components which are contained in the vacuum apparatus and which are exposed to vacuum during operation of the vacuum apparatus, for example are arranged within a vacuum chamber. For example, substrate holders, transport equipment, chamber walls, process equipment, shields within a vacuum chamber, and the like may be referred to as vacuum equipment components.
A surface structure is herein understood to be a region of a body (e.g. a vacuum device component) provided with a three-dimensional structure, the unevenness of the surface structure providing the surface of the body. For example, the surface structure may have a plurality of irregularities which are arranged in a periodic pattern and which are produced by means of laser structuring. Alternatively, the irregularities may be irregularly arranged and/or created, for example when they are provided by means of solid particles. The surface structure is prefabricated therein before it is introduced into the vacuum chamber, so that the surface structure is not formed by means of a coating process performed in the vacuum chamber.
For example, the laser structured region may be discolored compared to other regions of the body, for example, due to heat input generated by processing (e.g., structuring) by a laser. For example, the surface structure produced by means of laser structuring may have microscopic differences from the mechanically produced surface structure, i.e. e.g. discoloration, residues of melted material and/or a uniform e.g. periodic pattern.
The prefabricated accumulating surface structure may for example have solid particles embedded in a so-called structural material, such as a metal, e.g. nickel. Embedding of the solid particles is performed, for example, by bringing the structural material at least partly and/or temporarily into a deformable state (e.g. melting) such that the solid particles may enter the structural material. As a result of the prefabrication, the solid particles may protrude from the structural material (e.g. without themselves being coated thereby). After embedding the solid particles, the structural material may harden, for example. The structural material may be present, for example, as a solid layer and may be temporarily melted for embedding the solid particles. However, the structural material may also be applied directly in liquid form as a layer, so that the structural material does not harden before the solid particles are embedded. For example, prefabricated accumulating surface structures, such as the unevenness thereof, cannot be manufactured by means of vacuum processes (e.g. chemical vapor deposition).
Fig. 1 illustrates a vacuum apparatus 100 according to various aspects. The vacuum apparatus 100 may have a vacuum chamber 110 in which a process zone 111 is provided, in which a substrate 241 may be processed, e.g. coated (also referred to as performing a coating process), as an exemplary coating process, e.g. by means of physical vapor deposition.
The vacuum apparatus 100 may have a process apparatus 120 designed to: the substrate 241 is subjected to a process in the process region 111. The process equipment 120 may be designed to: the substrate 241 is subjected to a process by means of a process, such as a cladding process, in which gaseous material 150 is emitted into the process zone 111. For example, the process plant 120 may be designed to: the vapor deposition process is performed as a coating process, i.e. for example Physical Vapor Deposition (PVD) and/or Chemical Vapor Deposition (CVD).
Reference is made herein to a gaseous material by means of which a substrate is coated (then also referred to as coating material) such that a coating process is performed. It will be appreciated that: the description therefor may also be applied to gaseous materials released from the substrate during substrate processing.
For example, the process plant 120 may be designed to: the gaseous material 150 is produced, for example, by converting a coating material (e.g., solid and/or liquid) into a gaseous material state (e.g., atomization). For example, gaseous materials may be introduced into the process equipment 120 via gas lines, atomized or vaporized in a vacuum chamber.
By means of a process treatment, a layer may be formed on the substrate 241 by means of the gaseous material 150. Additionally, the gaseous material 150 does not contact the substrate, but rather interacts with and adheres to, e.g., accumulates, components of the vacuum apparatus 100. Thereby, for example, a parasitic layer may be formed within the vacuum apparatus 100.
According to various aspects, the vacuum apparatus 100 may additionally have a prefabricated accumulating surface structure 230. The preformed accumulation surface structure 230 may have a plurality of irregularities 231. Each of the plurality of uneven portions 231 may be designed to: promoting the adhesion of the gaseous material 150 at the accumulation surface structure 230. In other words, due to the plurality of uneven portions 231, adhesion of accumulated materials, which may then also be referred to as parasitic layers, may be promoted.
According to various aspects, the accumulation surface structure 230 can provide a surface of the vacuum apparatus component 200 of the vacuum apparatus 100, such as within the vacuum apparatus 100, that is exposed to the gaseous material.
According to various aspects, the vacuum apparatus component 200 may have, for example, a shielding apparatus 201. For example, the shielding 201 may be designed to: the sections of the vacuum chamber 110 are shielded from gaseous materials. For example, a shielded region 112 can be formed in the vacuum chamber 110 by means of the shielding device 201, in which region the build-up by means of the coating of gaseous material, i.e. the gaseous material, is suppressed. For example, the shielded region 112 may be located behind the shielding 201 with respect to the emission direction of the gaseous material.
According to various aspects, the shielding 201 may have an accumulating surface structure 230. For example, the surface of the shielding 201 may have an uneven portion of the accumulating surface structure 230 at least in sections. For example, the shielding 201 may be aligned such that the accumulation surface structure 230 (e.g., an uneven portion thereof) is aligned toward a source for emitting gaseous material. Thus, for example, the path between the accumulation surface structure 230 and the gaseous material may be reduced, whereby the amount of the gaseous material or the amount of the constituent parts of the gaseous material attached as parasitic layers at the accumulation surface structure 230 may be increased.
Fig. 2 shows a vacuum apparatus 100 according to various aspects, wherein the vacuum apparatus 100 has a substrate carrying apparatus 240 for carrying a substrate 241.
According to various aspects, the substrate carrier apparatus 240 may have an accumulation surface structure 230. This is achieved, for example: the accumulation surface structure 230 may accumulate gaseous material in a region of the substrate carrying apparatus 240 where the accumulation surface structure 230 is present. The gaseous material or components thereof may, for example, adhere better at the accumulating surface structure 230 than other, e.g. smooth, surfaces within the vacuum apparatus 100. Thus, for example, the substrate carrying apparatus 240 may be reused more frequently.
For example, the accumulation surface structure 230 of the substrate carrying apparatus 240 may be disposed such that it (e.g., an uneven portion thereof) is aligned in a direction of the emitted gaseous material (e.g., in the emission direction) such that the gaseous material or component well impinges the accumulation surface structure 230, and then may be adhered at the accumulation surface structure 230. For example, the substrate carrying apparatus 240 may be a vacuum apparatus component 200.
According to various aspects, the substrate carrying apparatus 240 may have a substrate accommodating region 242 for accommodating the substrate 241. The accumulation surface structure 230 may be adjacent to the substrate receiving area 242. For example, the accumulation surface structure 230 may at least partially bound the accumulation surface structure 230, e.g., completely bound it. For example, the accumulation surface structure 230 may be disposed in an area that is not covered by and/or not covered by the substrate 241. Thus, the accumulation surface structure 230 may enable improved adhesion of gaseous material or components thereof in this region.
According to various aspects, the substrate carrier device 240 may be configured as a transport device, such as a substrate transport device. The transport device can be designed, for example, for: substrate 241 is transported, i.e., moved, in one direction 242. The transport device may be designed for: substrate 241 is transported into process zone 111 and/or through process zone 111 and/or out of process zone 111. For example, the transport device may be designed to: the substrate 241 is transported during the blowing of the substrate process. For example, the transport device may have one or more transport rollers. For example, the vacuum apparatus 100 may have one or more transport rails along which the transport apparatus may move, for example by means of one or more transport rollers.
Fig. 3 shows a vacuum apparatus 100 according to various aspects, in which a vacuum chamber 110 of the vacuum apparatus 100 has one or more chamber walls 113 bounding the vacuum chamber 110.
According to various aspects, one or more or all of the one or more chamber walls 113 may each have a surface section with a corresponding accumulating surface structure, e.g. covered by means of the accumulating surface structure. For example, one or more or all of the one or more chamber walls 113, e.g., surfaces thereof, may each be a vacuum apparatus component 200. This is achieved, for example: the gaseous material or components thereof may accumulate within the vacuum chamber 110 at the respective accumulation surface structures 230 and adhere better at the accumulation surface structures than at other, e.g., smoother, surfaces of the vacuum chamber walls.
As previously mentioned, the vacuum apparatus component 200, for example the surface thereof, may be provided by means of the accumulation surface structure 230, for example by means of an uneven portion of the accumulation surface structure 230.
According to various aspects, the accumulation surface structure 230 may have a plurality of uneven portions 231. The uneven portions of the plurality of uneven portions 231 may be, for example, depressions and/or protrusions. The irregularities of the plurality of irregularities 231 may be regularly, e.g. self-organized, and/or irregularly, e.g. in another section, at least in one section of the accumulation surface structure 230.
According to various aspects, the unevenness of the plurality of unevenness 231 may be provided by means of a plurality of solid particles. Alternatively or additionally, the unevenness of the plurality of unevenness 231 may be provided by means of a laser structuring of the surface of the vacuum device component 200. For example, it is thereby possible to provide the surface structure on very thin components, for example having a thickness of less than 0.1 mm. For example, a surface structure may thereby be provided on the temperature sensitive component.
Fig. 4A and 4B respectively show a vacuum apparatus component 200 according to various aspects, wherein a plurality of irregularities 231 are provided by means of a plurality of solid particles 232. Examples of solid particles have: diamond, such as industrial diamond, and/or particles with crystals (e.g., alumina crystals), and/or particles with corundum.
According to various aspects, the vacuum apparatus component 200 can also have a structural material 233. According to various aspects, the solid particles of the plurality of solid particles 232 may be embedded in a structural material 233 (e.g., a coating composed of structural material) of the vacuum apparatus component 200, as shown in fig. 4A. For example, a respective first section of each solid particle of the plurality of solid particles 232 may be embedded in the structural material 233, e.g., disposed within the structural material 233, in contact with the structural material 233, and/or into the structural material 233. For example, a respective second section of each solid particle of the plurality of solid particles 232 may be disposed outside the structural material 233 of the vacuum apparatus component 200, e.g., protruding from the structural material 233 and/or spaced from the structural material 233.
The solid particles may be exposed immediately after the accumulation surface structure 230 is prefabricated. If the accumulating surface structure has been exposed to a gaseous material (e.g. a coating process in a vacuum chamber), the solid particles may be in contact with a parasitic coating formed by means of the gaseous material.
For example, the structural material 233 may be disposed (e.g., applied) on a surface of the vacuum apparatus component 200, for example, in a layer. For example, the structural material may be an attachment material designed to: a plurality of solid particles 232 are attached at the vacuum apparatus component. In other embodiments, the structural material 233 may be an integral part of the vacuum apparatus component.
For example, the structural material 233 may be a metallic material. For example, the structural material 233 may have one or more metals, such as metals in the form of alloys. For example, the structural material 233 may have nickel, for example, be composed of nickel. For example, the structural material 233 may be selected such that the melting temperature is lower than the process temperature typically used for the vacuum apparatus 100.
Fig. 4C and 4D respectively show a vacuum apparatus component 200 according to different aspects, wherein a plurality of irregularities 231 are provided by means of laser structuring of the surface of the vacuum apparatus component 200.
For example, the laser structuring may be performed independently of the geometry of the object to be structured, i.e. the surface structure may be applied in every arbitrary geometry, for example the shape of the object. For example, laser structuring implementation: solid particles (also simply referred to as granules) may be discarded.
For example, the laser structuring may be performed by means of an ultra short pulse laser. This can be achieved in that: a self-organizing structure is created on the surface of the vacuum apparatus component 200.
For example, to this end, the laser beam may be moved over the surface of the vacuum apparatus component 200, for example using a scanner system. During this movement, the plurality of irregularities 231 may be formed of a structural material within the surface. One or more geometric dimensions of the plurality of irregularities 231 may be related to one or more laser parameters, i.e. for example the energy density of the laser beam, the pulse overlap, the line overlap and/or the number of processing steps performed in total. For example, at energy densities of the laser beam below the stripping threshold of the laser structured material of the vacuum device component, self-organizing and periodic surface structures are structured corresponding to orders of magnitude of the laser beam wavelength. For example, the alignment of the surface structures may be related to the polarization of the laser beam. For example, an increase with a geometric expansion of one or more microns may be formed by increasing the energy density, pulse overlap, line overlap, and/or the number of processing steps. For example, the depth of the formed recess may be increased by increasing the energy input by means of a laser.
For example, the surface of the vacuum apparatus component 200 may be coated with the structural material 233 prior to laser structuring. This is achieved, for example: the structural material 233 is coated. For example, the structural material 233 may be adapted to a gaseous material. Thus, for example, the adhesion between gaseous materials or components thereof may be improved.
According to various aspects, the vacuum apparatus component 200 can also have a mounting structure 220 (e.g., having one or more form-fitting contours, i.e., threads, for example). For example, the mounting structure 220 may be designed to: the vacuum apparatus part 200 is installed in the vacuum apparatus 100. For example, the mounting structure 220 may be designed to: the vacuum equipment component 200 is coupled with another vacuum equipment component.
According to various aspects, vacuum apparatus components 200 within vacuum apparatus 100 may also be at least partially co-parasitically coated during processing of substrate 241. This is shown by way of example in fig. 4A to 4D. Thereby, the parasitic layer 210 may be formed over the plurality of uneven portions. For example, the parasitic layer 210 may differ from the vacuum apparatus component 200 in chemical composition. For example, the material of the parasitic layer 210 may be different from the structural material and/or the solid particles, e.g., in terms of chemical composition.
In one embodiment, the exemplary vacuum apparatus component 200 may have a preformed accumulation surface structure 230 with a plurality of irregularities 231, according to various aspects. As previously described, the irregularities in the plurality of irregularities 231 may be provided by means of a plurality of solid particles embedded in the vacuum apparatus component 200 and/or by means of laser structuring.
Fig. 5 schematically illustrates a method 500 for operating a vacuum apparatus, for example, in accordance with various aspects. The method 500 may include performing a process 510 on a substrate. For example, the substrate may be processed in a vacuum process. For example, the gaseous material may be emitted into a vacuum during a process treatment. For example, the process may be forming a layer on the substrate, such as by means of a gaseous material. For example, the process may have, for example, physical vapor deposition and/or chemical vapor deposition.
In a different aspect, the method 500 may also have: at least a portion of the gaseous material is accumulated 520. For example, at least a portion of the gaseous material may be collected by means of a prefabricated accumulating surface structure. For example, in accumulation, the accumulation material and the material may be different from each other. As mentioned above, the preformed accumulation surface structure may have a plurality of uneven portions, for example in the form of depressions and/or protrusions. For example, the plurality of irregularities may be provided by means of a plurality of solid particles embedded in the accumulation surface and/or by laser structuring. For example, the structural material may be structured by means of a laser. For example, a plurality of solid particles may be embedded in the structural material.
For example, the method 500 may optionally further have: the accumulated material formed by the accumulation (which forms a parasitic layer) is removed from the accumulation surface. Alternatively or additionally, the accumulation surface covered by the accumulation material can be replaced with another accumulation surface, for example, in which the associated component is replaced. The replacement or cleaning may be performed, for example, after a predetermined number of processes, or once the layer on the accumulation surface reaches a predetermined total layer thickness. For example, replacement and/or cleaning may be performed before the plurality of uneven portions are superimposed by one or more layers formed thereon and thereby smoothed.
For example, the method 500 may optionally also have a preformed accumulating surface structure.
In some embodiments, the preformed accumulating surface structure may have: a plurality of solid particles are embedded in the structural material (also known as prefabricated) to create a plurality of irregularities. For example, the prefabrication (e.g., embedding) may occur outside of a vacuum, such as at atmospheric pressure. For example, the prefabrication may have: the vacuum equipment components are coated with a structural material. For example, a plurality of solid particles may be embedded in at least a portion of the melted structural material. The structural material may then solidify (e.g., solidify and/or cool) to secure the plurality of solid particles, e.g., in a form-fitting manner. For example, a plurality of solid particles may be introduced into the structural material such that a respective section of each of the plurality of solid particles protrudes from the structural material without the structural material (e.g., the solid particles are exposed or coated with a parasitic layer).
In other embodiments, prefabrication of the accumulating surface structure may have: the plurality of irregularities are formed by means of laser structuring, for example of a structured material, or by means of the same. Alternatively, the vacuum equipment components may be coated with a structural material for this purpose. When structured by a laser, the irregularities are integrally (e.g., in one piece) connected to each other.
For example, the method 500 may also have: a vacuum apparatus component having an accumulation surface structure is installed in the vacuum chamber. Alternatively or additionally, the method 500 may also have: a vacuum apparatus component having an accumulating surface structure is mounted at or formed on a substrate carrier by means of which a substrate can be transported in vacuum.
According to various aspects, a preformed one of the accumulation surface structures having a plurality of irregularities may be used to accumulate gaseous material in a vacuum. The gaseous material may be emitted into the vacuum while the substrate is processed by the in-vacuum process. The plurality of irregularities may be provided by means of solid particles and/or by means of laser structuring. For example, solid particles may be embedded in the structural material of the accumulated surface structure. For example, the plurality of irregularities may be provided by means of laser structuring of the structural material.
In one example, in addition to the desired substrate coating, other components, i.e., for example, covers, protectors, functional components, etc., can also be coated jointly in the interior of the chamber with the parasitic layer using different techniques when coating in a vacuum installation. Such contamination can lead to flaking, and/or other undesirable dust within the vacuum facility.
It has been recognized that: the member is coated with a roughened surface, whereby good adhesion of the substrate coating at the member is achieved, and the occurrence of adverse effects by the parasitic layer can be reduced.
Conventionally, the component may be rough sprayed and/or pickled to produce a rough surface. The roughened surface can be structured and roughened by means of material detachment. Both of these methods can be expensive. For example, a component, in particular when its wall is thin, may warp during the coarse spraying process and then must be straightened if necessary, as long as this is entirely possible. For example, the pickling process may be difficult to control, so that reproducibility is not necessarily ensured.
In various embodiments, provided herein are apparatus and methods that enable roughening of a component using various techniques to thereby improve adhesion of a substrate layer at the component, and at the same time reduce disadvantages associated with rough spray processes and/or acid wash processes. For example, it is thus possible to realize: the thin-walled and/or sensitive component is roughened nondestructively. For example, costs can thus be saved.
According to one example, the roughened surface may be produced by means of a coating, for example by means of a microcoating. For this purpose, particles can be used which are fixed at the surface, for example by means of a structural material. For example, the particles may be composed of a vacuum compatible material, such as ceramic. For example, the particles may be crystals, such as alumina crystals (Al 2 O 3 ) Diamond, such as industrial diamond, and/or corundum materials, applied and immobilized on a surface in the form of a composite with nickel base. Thus, the adhesion properties of the surface of the material for deposition may be improved, which may also be referred to as an increase in adhesion basis. For example, the roughness of the surface may be controlled by varying one or more process parameters. For example, due to low process temperatures (e.g., below 100 ℃), the surface may have other materials in addition to steel, such as aluminum, GRP (glass fiber reinforced plastics), and polymers.
According to another example, the roughened surface may be produced by means of laser structuring. For this purpose, for example, a plurality of sections of the laser melt surface can be used in a targeted manner. The structure of the surface can be modified to roughen it, thereby increasing the adhesion properties of the surface to the deposited material.
Different examples relating to the above description and what is shown in the drawings are described below.
Example 1 is a vacuum apparatus, which may include: a vacuum chamber having a process treatment region; a process treatment apparatus for performing a process treatment on a substrate in a process treatment area by means of a process in which a gaseous material is emitted into the process treatment area; and an (e.g. prefabricated) accumulation surface structure having a plurality of uneven portions, e.g. in the form of recesses and/or protrusions, for accumulating gaseous material; wherein the plurality of irregularities are provided by means of solid particles, which may be embedded in the structural material of the (e.g. prefabricated) accumulated surface structure, for example, and/or by means of laser structuring of the structural material. For example, the irregularities formed by means of laser structuring of the structural material can be integrally connected to one another.
Example 2 is the vacuum apparatus of example 1, wherein the gaseous material may be formed within the vacuum chamber and/or may be introduced into the vacuum chamber.
Example 3 is the vacuum apparatus of example 1 or 2, wherein the (e.g., prefabricated) accumulation surface structure is at least temporarily adjacent to or disposed in the process treatment area during operation of the vacuum apparatus.
Example 4 is the vacuum apparatus according to any one of examples 1 to 3, further optionally having: a substrate carrying device for carrying a substrate disposed in the process processing region; wherein the substrate carrying device has a (e.g. prefabricated) accumulating surface structure.
Example 5 is the vacuum apparatus of example 4, wherein the substrate carrying apparatus may optionally have a substrate receiving area for receiving a substrate, wherein the substrate receiving area is bounded by an (e.g., prefabricated) accumulation surface structure.
Example 6 is the vacuum apparatus according to example 4 or 5, wherein the substrate carrying apparatus may have a substrate carrier for carrying the substrate; and wherein, for example, the substrate carrier has an (e.g., prefabricated) accumulation surface structure.
Example 7 is the vacuum apparatus of any one of examples 4-6, wherein the substrate carrying apparatus is designed as a transport apparatus for transporting substrates in (e.g., within) and/or through a process processing area.
Example 8 is the vacuum apparatus according to example 7, wherein the transport apparatus has a substrate carrier for carrying the substrate and a plurality of transport rollers for transporting the substrate carrier.
Example 9 is the vacuum apparatus of any one of examples 1-8, wherein the vacuum chamber (e.g., one or more chamber walls) has an (e.g., prefabricated) accumulation surface structure.
Example 10 is the vacuum apparatus of example 9, wherein the vacuum chamber has a shielding apparatus mounted therein, the shielding apparatus having a (e.g., prefabricated) accumulating surface structure.
Example 11 is a vacuum apparatus component, which may include: an (e.g. prefabricated) accumulation surface structure, e.g. of a vacuum apparatus according to any of examples 1 to 10, the accumulation surface structure having a plurality of non-planar portions, e.g. in the form of recesses and/or protrusions, for accumulating gaseous material generated when a substrate is subjected to a process, wherein the plurality of non-planar portions are provided by means of e.g. solid particles embedded in a structural material of the (e.g. prefabricated) accumulation surface structure, and/or wherein the plurality of non-planar portions are provided by means of laser structuring of the structural material; an accumulation portion (also referred to as a material of the accumulation portion) formed by accumulating a gaseous material and coated with a plurality of uneven portions; wherein the structural material has a different chemical composition and/or melting temperature than the (e.g., accumulated and/or gaseous) material.
Example 12 is the vacuum apparatus component according to example 11, the vacuum apparatus component having a mounting structure (e.g., in a vacuum chamber or a transport apparatus) for mounting the vacuum apparatus component.
Example 13 is a method, for example, for operating a vacuum apparatus according to any one of examples 1 to 12, wherein the method may include: processing the substrate in a vacuum process such that the gaseous material is emitted into the vacuum; accumulating at least a portion of the gaseous material at a (e.g. prefabricated) accumulating surface structure (e.g. which is coated with gaseous material) having a plurality of uneven portions (which are e.g. exposed to the gaseous material or coated by means thereof), e.g. in the form of recesses and/or protrusions; wherein the plurality of irregularities are provided by means of solid particles embedded in the structural material of the (e.g. prefabricated) accumulated surface structure, and/or wherein the plurality of irregularities are provided by means of laser structuring of the structural material.
Example 14 is the method according to example 13, the method may optionally further have: the accumulation surface structure of the accumulation section cladding for replacement with an additional (e.g., prefabricated) accumulation surface structure of the same design as the (e.g., prefabricated) accumulation surface structure, or is removed from the (e.g., prefabricated) accumulation surface structure (e.g., from the accumulation surface) from the accumulation section (also referred to as accumulated material) produced by the accumulation.
Example 15 is the method of example 13 or 14, optionally further comprising: embedding solid particles into the structural material, for example, outside vacuum and/or at atmospheric pressure; wherein the embedding of the solid particles is performed by: i.e. solid particles are introduced into the at least partially (i.e. partially or completely) melted structural material.
Example 16 is the method of any one of examples 13 to 15, which may further optionally include: forming a layer from the structural material, for example, under vacuum and/or atmospheric pressure; and the unevenness is formed by embedding particles of solid material into the layer or by laser structuring of the structural material.
Example 17 is the method of any one of examples 13 to 16, which may further optionally include: a vacuum apparatus component having an (e.g. prefabricated) accumulation surface structure is mounted in a vacuum chamber providing vacuum and/or at a substrate carrier by means of which the substrate is transported in vacuum.
Example 18 is the use of an (e.g. prefabricated) accumulation surface in vacuum for accumulating gaseous material (then also referred to as a collection of gaseous material) at a plurality of non-planar portions, which are emitted into the vacuum when the substrate is processed, wherein the plurality of non-planar portions are provided by means of solid particles embedded in the structural material of the (e.g. prefabricated) accumulation surface structure or by means of laser structuring of the structural material.
Example 19 is the article of any one of examples 1 to 18, wherein the structural material is metallic and/or has nickel.
Example 20 is the article of any one of examples 1 to 19, wherein the solid particles have a higher melting temperature than the structural material; and/or wherein the solid particles have or consist of (e.g. oxidized) ceramic, such as corundum or diamond.
Example 21 is the article of any one of examples 1 to 20, wherein the build-up (accumulated material) is different from the structural material, e.g., its chemical composition and/or melting temperature.
Example 22 is the article of any one of examples 1 to 21, wherein the treatment process has: physical vapor deposition is performed in which the substrate is coated, for example, with gaseous material.
Example 23 is the article of any one of examples 1 to 22, wherein the plurality of irregularities are free of buildup (accumulated material) arising from accumulation when the (e.g., prefabricated) accumulation surface structure is installed in the vacuum chamber.
Example 24 is the article of any one of examples 1 to 23, wherein an accumulation (accumulated material) resulting from the accumulation is adjacent to the structural material.
Example 25 is the article of any one of examples 1 to 24, wherein the buildup (accumulated material) has at least one component of a layer material and/or a target material.
Example 26 is the article of any one of examples 1 to 25, wherein the plurality of irregularities are devoid of a material for forming the gaseous material. For example, the plurality of uneven portions may be devoid of a material layer, the material layer being formed by means of a gaseous material, for example based on a gaseous material. For example, the plurality of uneven portions do not have a material layer, which is formed by means of, e.g. based on, the target material.
Example 27 is the article of any one of examples 1 to 26, wherein the coating of the plurality of uneven portions is formed as an accumulation portion by means of accumulation of the gaseous material, the accumulation portion having, for example, a chemical composition different from that of the uneven portions. For example, the chemical composition of the coating may be different from the chemical composition of the solid particles.
Example 28 is the article of any one of examples 1 to 27, wherein the unevenness of the plurality of unevenness is irregular or self-organizing.
Example 29 is the article of any one of examples 1 to 28, wherein the plurality of irregularities are provided in the form of recesses and/or protrusions.
Example 30 is the article of any one of examples 1 to 29, wherein the accumulation and/or parasitic layer has or is composed of an adsorbate of a gaseous material.
Example 31 is the article of any one of examples 1 to 30, wherein the accumulation has adsorption and/or absorption of gaseous material.
Example 32 is the article of any one of examples 1 to 31, wherein the plurality of irregularities are formed by deformation (e.g., melting) and/or hardening (e.g., curing) of the structural material. The deformation can be carried out, for example, by means of a laser and/or by means of embedding solid particles in the structural material.
Example 33 is the article of any one of examples 1 to 32, wherein the plurality of irregularities (e.g., in operation) are adjacent to the process treatment area and/or are exposed to the gaseous material.
Example 34 is the article of any one of examples 1 to 33, wherein the structural material has a different chemical composition and/or melting temperature than the (e.g., accumulated and/or gaseous) material.
Claims (14)
1. A vacuum apparatus (100), characterized by comprising:
a vacuum chamber (110) having a process field (111);
process treatment equipment (120) for performing a process treatment of a substrate (241) in the process treatment zone (111) by means of a process, wherein gaseous material (150) is emitted into the process treatment zone (111); and
a preformed accumulation surface structure (230) having a plurality of uneven portions (231) for accumulating the gaseous material (150) at the uneven portions;
wherein the plurality of irregularities (231) is provided by means of solid particles embedded in a structural material of the preformed accumulation surface structure (230) or by means of laser structuring of the structural material.
2. The vacuum apparatus (100) according to claim 1, further comprising:
a substrate carrying device (240) for carrying the substrate (241) disposed in the process region (111);
wherein the substrate carrying device (240) has the accumulation surface structure prefabricated.
3. The vacuum apparatus (100) of claim 2, wherein the substrate carrying apparatus (240) has a substrate receiving area for receiving the substrate (241), the substrate receiving area being delimited by the preformed accumulating surface structure.
4. A vacuum apparatus (100) according to claim 2 or 3, wherein the substrate carrying apparatus has a substrate carrier for carrying the substrate; and in that the substrate carrier has the accumulation surface structure.
5. Vacuum apparatus (100) according to claim 4, characterized in that the substrate carrying apparatus is designed as a transport apparatus for transporting the substrate to and/or through the process treatment area, wherein the transport apparatus has the substrate carrier for carrying the substrate and a plurality of transport rollers for transporting the substrate carrier.
6. The vacuum apparatus (100) of claim 1, wherein the structural material is a metal.
7. The vacuum apparatus (100) of claim 1, wherein the structural material comprises nickel.
8. The vacuum apparatus (100) of claim 1, wherein the vacuum chamber (110) has the accumulation surface structure (230) prefabricated.
9. The vacuum apparatus (100) of claim 1, wherein the vacuum chamber (110) has a shielding apparatus (201) mounted therein, the shielding apparatus having the accumulation surface structure (230) prefabricated.
10. The vacuum apparatus (100) of claim 1, wherein the solid particles are of or consist of a ceramic.
11. The vacuum apparatus (100) of claim 1, wherein the solid particles have or consist of diamond.
12. The vacuum apparatus (100) of claim 1, wherein the structural material has a different chemical composition than the gaseous material.
13. A vacuum apparatus component (200), comprising:
a preformed accumulation surface structure (230) having a plurality of uneven portions (231) for accumulating gaseous material (150) generated when a process treatment is performed on a substrate (241) at the uneven portions;
wherein the plurality of irregularities (231) are provided by means of solid particles (232) embedded in a structural material of the preformed accumulation surface structure (230) or by means of laser structuring of the structural material;
an accumulation portion formed by accumulating the gaseous material (150) and through which the plurality of uneven portions (231) are coated;
wherein the structural material has a different chemical composition and/or melting temperature than the accumulation.
14. The vacuum apparatus component (200) of claim 13, further comprising a mounting structure (220) for mounting the vacuum apparatus component (200).
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