CN219458914U - Isolation AC-DC switching power supply heat dissipation assembly - Google Patents

Isolation AC-DC switching power supply heat dissipation assembly Download PDF

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Publication number
CN219458914U
CN219458914U CN202320506085.5U CN202320506085U CN219458914U CN 219458914 U CN219458914 U CN 219458914U CN 202320506085 U CN202320506085 U CN 202320506085U CN 219458914 U CN219458914 U CN 219458914U
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power supply
heat dissipation
bin
heat
switching power
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CN202320506085.5U
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Chinese (zh)
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臧其准
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Chenglian Power Supply Co ltd
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Chenglian Power Supply Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model relates to the technical field of switching power supplies, in particular to an isolated AC-DC switching power supply radiating component which comprises a power supply shell, wherein a radiating bin is arranged in the upper end of the power supply shell, an electric appliance bin is arranged in the lower end of the power supply shell, a refrigerating part groove is formed in the middle of a partition plate, and a semiconductor refrigerating part is arranged in the refrigerating part groove; one side of the inner side surface of the heat dissipation bin is provided with a heat dissipation fan, and the other three side surfaces of the inner side surface of the heat dissipation bin are provided with exhaust holes. The electric device is placed in the electric bin, generated heat can be absorbed by the semiconductor refrigerating piece and then dissipated in the heat dissipation bin, the heat dissipation fan in the heat dissipation bin transfers the heat to the outside of the power supply shell through the exhaust hole in the rotating process, the purpose of dissipating the heat of the electric device in the electric bin is achieved, the structure is simple, the electric device in the electric bin can be protected, the heat of the electric device can be dissipated, the structure is simple, and the service life of the electric device is prolonged.

Description

Isolation AC-DC switching power supply heat dissipation assembly
Technical Field
The utility model relates to a heat dissipation assembly of a switching power supply, in particular to a heat dissipation assembly of an isolated AC-DC switching power supply, and belongs to the technical field of switching power supplies.
Background
The electric devices in the traditional AC-DC switch power supply are directly exposed in the air, namely, in order to radiate heat to the greatest extent, but the tightness of the device cannot be ensured in the radiating process, so that air and dust enter the AC-DC switch power supply, the service life of the AC-DC switch power supply is seriously reduced, and the existing radiating structure radiates heat only through a simple metal sheet, so that the radiating effect is poor;
the Chinese patent publication No. CN 205454338U discloses a 'DC-DC combined AC-DC heat radiation structure', which comprises a DC-DC, an AC-DC, a metal heat conductor and a heat radiation device, wherein the DC-DC and the AC-DC are respectively arranged in two independent spaces formed by the metal heat conductor, at least one group of heat radiation devices are arranged outside the metal heat conductor, and heat generated by the DC-DC and the AC-DC is transmitted to the heat radiation devices through the metal heat conductor to radiate the heat, so that the heat radiation effect is poor and the service life of an electric device is influenced only through radiating through the heat radiation devices.
Accordingly, there is a need for an improved heat sink assembly for isolating AC-DC switching power supplies that addresses the above-described problems.
Disclosure of Invention
The utility model aims to provide an isolated AC-DC switching power supply, an electric device is placed in an electric bin, generated heat can be absorbed by a semiconductor refrigerating piece and then dissipated in a heat dissipation bin, a heat dissipation fan in the heat dissipation bin transfers the heat to the outside of a power supply shell through an exhaust hole in the rotating process, the purpose of dissipating the heat of the electric device in the electric bin is achieved, the structure is simple, the electric device in the electric bin can be protected, the heat of the electric device can be dissipated, the structure is simple, and the service life of the electric device is prolonged.
In order to achieve the above purpose, the main technical scheme adopted by the utility model comprises the following steps:
the utility model provides an keep apart AC-DC switching power supply cooling module, includes the power casing, the inside of power casing upper end has seted up the heat dissipation storehouse, the inside of power casing lower extreme has seted up the electrical apparatus storehouse, electrical apparatus storehouse with be provided with the baffle between the heat dissipation storehouse, the middle part of baffle has seted up the refrigeration spare groove, the refrigeration spare groove with electrical apparatus storehouse links to each other, the inside in refrigeration spare groove is fixed to be set up the semiconductor refrigeration spare;
a plurality of cooling fans are fixedly arranged on one side of the inner side surface of the cooling bin, cooling fan blades are arranged at the output end of the cooling fans, a plurality of evenly distributed exhaust holes are formed in the other three side surfaces of the inner side surface of the cooling bin, and the exhaust holes are communicated with the inner part of the cooling bin.
Preferably, the semiconductor refrigerating element comprises a refrigerating element heat absorbing surface and a refrigerating element heat radiating surface;
the refrigerating piece heat absorption surface is communicated with the electric appliance bin, and the refrigerating piece heat dissipation surface is communicated with the heat dissipation bin.
Preferably, the heat dissipation fan is electrically connected with an external power supply through a wire, and the heat dissipation fan is arranged above the semiconductor refrigerating piece.
Preferably, a plurality of air inlets are formed in one side surface of the heat dissipation bin, the air inlets correspond to the heat dissipation fans, and dustproof nets are fixedly arranged in the air inlets.
Preferably, the bottom of one end lateral surface of power casing is fixed and is provided with the wire connecting piece, the wire spread groove has been seted up on the wire connecting piece, a plurality of screw hole has been seted up on the wire connecting piece, the inside threaded connection of screw hole has fixing bolt, fixing bolt is used for fixed wire.
Preferably, an electrical bin sealing plate is fixedly arranged above the wire connecting piece at the port of the electrical bin.
Preferably, a casing fixing piece is fixedly arranged at the bottom of the outer side surface of one end of the power supply casing, the casing fixing piece corresponds to the wire connecting piece, and a plurality of casing assembly holes which are uniformly distributed are formed in the casing fixing piece.
Preferably, the bottom side of the power supply shell is provided with a plurality of evenly distributed magnets.
The utility model has at least the following beneficial effects:
1. the electric device is placed in the inside of electric appliance storehouse, and the heat of production can be absorbed by the semiconductor refrigeration piece, then looses in the inside of heat dissipation storehouse, and the inside heat dissipation fan of heat dissipation storehouse passes through the exhaust hole with the heat transfer to the outside of power casing at pivoted in-process, reaches the radiating purpose of electric appliance in the electric appliance storehouse, and simple structure both can protect the inside electric appliance of electric appliance storehouse, can dispel the heat to the electric appliance again, simple structure promotes the life of electric appliance.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
FIG. 1 is a block diagram of the first embodiment of the present utility model;
FIG. 2 is a diagram of a second embodiment of the present utility model;
FIG. 3 is a perspective view of the first embodiment of the present utility model;
FIG. 4 is a second perspective view of the present utility model;
fig. 5 is a top view of the present utility model.
In the figure, a 1-power supply shell, a 101-electric appliance bin, a 102-heat dissipation bin, a 103-refrigerating piece groove, a 106-vent hole, a 107-air inlet hole, a 108-partition plate, a 2-wire connecting piece, a 201-wire connecting groove, a 202-threaded hole, a 3-shell fixing piece, a 301-shell assembly hole, a 4-heat dissipation fan, a 401-heat dissipation fan blade, a 5-semiconductor refrigerating piece, a 6-electric appliance bin sealing plate, a 7-fixing bolt and an 8-magnet.
Detailed Description
The embodiments of the present application will be described in detail below with reference to the accompanying drawings and examples, so that the implementation process of how the technical means are applied to solve the technical problems and achieve the technical effects of the present application can be fully understood and implemented accordingly.
As shown in fig. 1-5, the heat dissipation component of an isolated AC-DC switching power supply provided in this embodiment includes a power supply housing 1, a heat dissipation bin 102 is provided in the upper end of the power supply housing 1, an electrical appliance bin 101 is provided in the lower end of the power supply housing 1, a partition plate 108 is provided between the electrical appliance bin 101 and the heat dissipation bin 102, a refrigerating element groove 103 is provided in the middle of the partition plate 108, the refrigerating element groove 103 is communicated with the electrical appliance bin 101, a semiconductor refrigerating element 5 is fixedly provided in the refrigerating element groove 103, a plurality of heat dissipation fans 4 are fixedly provided on one side of the inner side of the heat dissipation bin 102, heat dissipation fan 401 is provided at the output end of the heat dissipation fan 4, a plurality of evenly distributed air vents 106 are provided on the other three sides of the inner side of the heat dissipation bin 102, and the air vents 106 are communicated with the inner side of the heat dissipation bin 102;
the electric devices in the traditional AC-DC switch power supply are directly exposed in the air, namely, the heat dissipation is carried out to the greatest extent, but the tightness of the device cannot be ensured in the heat dissipation process, so that the air and dust enter the AC-DC switch power supply, and the service life of the AC-DC switch power supply is seriously reduced;
the utility model directly places the electric device in the electric bin 101, the heat generated by the electric device can be absorbed by the semiconductor refrigerating device 5 in the refrigerating device groove 103 and then dissipated in the heat dissipation bin 102, the heat dissipation fan 4 in the heat dissipation bin 102 transfers the heat in the heat dissipation bin 102 to the outside of the power supply shell 1 through the air exhaust hole 106 on the heat dissipation bin 102 in the rotating process, the purpose of dissipating the heat of the electric device in the electric bin 101 is achieved, the structure is simple, the electric device in the electric bin 101 can be protected, the heat of the electric device in the electric bin 101 can be dissipated, the structure is simple, and the service life of the electric device is prolonged.
Further, as shown in fig. 1, the semiconductor refrigeration piece 5 includes a refrigeration piece heat absorbing surface and a refrigeration piece heat dissipating surface, the refrigeration piece heat absorbing surface is communicated with the electrical bin 101, the refrigeration piece heat dissipating surface is communicated with the heat dissipating bin 102, the heat dissipating fan 4 is electrically connected with an external power supply through a wire, the heat dissipating fan 4 is arranged above the semiconductor refrigeration piece 5, the refrigeration piece heat absorbing surface on the semiconductor refrigeration piece 5 absorbs heat in the electrical bin 101 and dissipates the heat in the heat dissipating bin 102 through the refrigeration piece heat dissipating surface on the semiconductor refrigeration piece 5, and then dissipates the heat into air outside the power supply shell 1 under the action of the heat dissipating fan 4, so that the purpose of cooling is achieved, the structure is simple, and the heat dissipating effect is improved.
In addition, a plurality of air inlets 107 are formed in one side surface of the heat dissipation bin 102, the air inlets 107 correspond to the heat dissipation fans 4, dust screens are fixedly arranged in the air inlets 107, external air can be pumped into the heat dissipation bin 102 through the plurality of air inlets 107, circulation of the air is accelerated, and heat dissipation efficiency is improved.
Still further, as shown in fig. 3, the bottom of one end lateral surface of the power supply housing 1 is fixedly provided with a wire connecting piece 2, a wire connecting groove 201 is formed in the wire connecting piece 2, a plurality of threaded holes 202 are formed in the wire connecting piece 2, fixing bolts 7 are connected to the internal threads of the threaded holes 202, the fixing bolts 7 are used for fixing wires, the wires are prevented from being in the threaded holes 202, then the fixing bolts 7 are rotated to fix the wires, later wiring is facilitated, and convenience of use is improved.
Still further, as shown in fig. 3, an electrical bin sealing plate 6 is fixedly arranged at the port of the electrical bin 101 above the wire connecting piece 2, and after the electrical device is placed in the electrical bin 101, the electrical bin 101 is sealed by the electrical bin sealing plate 6, so that the tightness of the electrical bin 101 is improved, and the service life of the electrical device is prolonged;
the bottom of the outer side surface of one end of the power supply shell 1 is fixedly provided with a shell fixing piece 3, the shell fixing piece 3 corresponds to the wire connecting piece 2, the shell fixing piece 3 is provided with a plurality of uniformly distributed shell assembly holes 301, and the power supply shell 1 can be fixed through the shell fixing piece 3 on the power supply shell 1, so that the installation and the fixation are convenient;
simultaneously, the bottom side of power casing 1 is provided with a plurality of evenly distributed's magnet 8, can directly place power casing 1 on the metalwork, conveniently fixes power casing 1, promotes power casing 1's stability.
As shown in fig. 1 to 5, the principle of the heat dissipation assembly of the isolated AC-DC switching power supply provided in this embodiment is as follows:
the utility model directly places the electric device in the electric bin 101, the heat generated by the electric device can be absorbed by the semiconductor refrigerating device 5 in the refrigerating device groove 103 and then dissipated in the heat dissipation bin 102, the heat dissipation fan 4 in the heat dissipation bin 102 transfers the heat in the heat dissipation bin 102 to the outside of the power supply shell 1 through the air exhaust hole 106 on the heat dissipation bin 102 in the rotating process, the purpose of dissipating the heat of the electric device in the electric bin 101 is achieved, the structure is simple, the electric device in the electric bin 101 can be protected, the heat of the electric device in the electric bin 101 can be dissipated, the structure is simple, and the service life of the electric device is prolonged.
Certain terms are used throughout the description and claims to refer to particular components. Those of skill in the art will appreciate that a hardware manufacturer may refer to the same component by different names. The description and claims do not take the form of an element differentiated by name, but rather by functionality. As used throughout the specification and claims, the word "comprise" is an open-ended term, and thus should be interpreted to mean "include, but not limited to. By "substantially" is meant that within an acceptable error range, a person skilled in the art can solve the technical problem within a certain error range, substantially achieving the technical effect.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a product or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such product or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude that an additional identical element is present in a commodity or system comprising the element.
While the foregoing description illustrates and describes the preferred embodiments of the present utility model, it is to be understood that the utility model is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of numerous other combinations, modifications and environments and is capable of changes or modifications within the scope of the inventive concept as described herein, either as a result of the foregoing teachings or as a result of the knowledge or technology in the relevant art. And that modifications and variations which do not depart from the spirit and scope of the utility model are intended to be within the scope of the appended claims.

Claims (8)

1. The utility model provides an keep apart AC-DC switching power supply cooling module, includes power casing (1), its characterized in that, cooling bin (102) have been seted up to the inside of power casing (1) upper end, electrical apparatus storehouse (101) have been seted up to the inside of power casing (1) lower extreme, electrical apparatus storehouse (101) with be provided with baffle (108) between cooling bin (102), refrigeration spare groove (103) have been seted up at the middle part of baffle (108), refrigeration spare groove (103) with electrical apparatus storehouse (101) are linked together, the inside in refrigeration spare groove (103) is fixed to be set up semiconductor refrigeration spare (5);
one side of heat dissipation storehouse (102) medial surface is fixed and is provided with a plurality of cooling fan (4), the output of cooling fan (4) is provided with heat dissipation fan blade (401), a plurality of evenly distributed's exhaust hole (106) have all been seted up to the other three side of heat dissipation storehouse (102) medial surface, exhaust hole (106) with the inside of heat dissipation storehouse (102) is linked together.
2. An isolated AC-DC switching power supply heat sink assembly as defined in claim 1, wherein: the semiconductor refrigerating piece (5) comprises a refrigerating piece heat absorption surface and a refrigerating piece heat dissipation surface;
the refrigerating piece heat absorption surface is communicated with the electric appliance bin (101), and the refrigerating piece heat dissipation surface is communicated with the heat dissipation bin (102).
3. An isolated AC-DC switching power supply heat sink assembly as defined in claim 1, wherein: the heat dissipation fan (4) is electrically connected with an external power supply through a wire, and the heat dissipation fan (4) is arranged above the semiconductor refrigerating piece (5).
4. An isolated AC-DC switching power supply heat sink assembly as defined in claim 1, wherein: a plurality of air inlets (107) are formed in one side face of the heat dissipation bin (102), the air inlets (107) correspond to the heat dissipation fan (4), and dustproof screens are fixedly arranged in the air inlets (107).
5. An isolated AC-DC switching power supply heat sink assembly as defined in claim 1, wherein: the power supply is characterized in that a wire connecting piece (2) is fixedly arranged at the bottom of the outer side face of one end of the power supply shell (1), a wire connecting groove (201) is formed in the wire connecting piece (2), a plurality of threaded holes (202) are formed in the wire connecting piece (2), fixing bolts (7) are connected with the inner threads of the threaded holes (202), and the fixing bolts (7) are used for fixing wires.
6. An isolated AC-DC switching power supply heat sink assembly as defined in claim 1, wherein: an electrical bin sealing plate (6) is fixedly arranged above the wire connecting piece (2) at the port of the electrical bin (101).
7. The isolated AC-DC switching power supply heat sink assembly of claim 6, wherein: the power supply is characterized in that a shell fixing piece (3) is fixedly arranged at the bottom of the outer side face of one end of the power supply shell (1), the shell fixing piece (3) corresponds to the wire connecting piece (2), and a plurality of shell assembly holes (301) which are uniformly distributed are formed in the shell fixing piece (3).
8. An isolated AC-DC switching power supply heat sink assembly as defined in claim 1, wherein: the bottom side of the power supply shell (1) is provided with a plurality of evenly distributed magnets (8).
CN202320506085.5U 2023-03-16 2023-03-16 Isolation AC-DC switching power supply heat dissipation assembly Active CN219458914U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320506085.5U CN219458914U (en) 2023-03-16 2023-03-16 Isolation AC-DC switching power supply heat dissipation assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320506085.5U CN219458914U (en) 2023-03-16 2023-03-16 Isolation AC-DC switching power supply heat dissipation assembly

Publications (1)

Publication Number Publication Date
CN219458914U true CN219458914U (en) 2023-08-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320506085.5U Active CN219458914U (en) 2023-03-16 2023-03-16 Isolation AC-DC switching power supply heat dissipation assembly

Country Status (1)

Country Link
CN (1) CN219458914U (en)

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