CN219437409U

CN219437409U - Radiating device and control cabinet

Info

Publication number: CN219437409U
Application number: CN202223270644.1U
Authority: CN
Inventors: 郭腾飞
Original assignee: GD Midea Heating and Ventilating Equipment Co Ltd; Winone Elevator Co Ltd
Current assignee: GD Midea Heating and Ventilating Equipment Co Ltd; Winone Elevator Co Ltd
Priority date: 2022-12-05
Filing date: 2022-12-05
Publication date: 2023-07-28
Anticipated expiration: 2032-12-05

Abstract

The application relates to the technical field of control cabinets, and provides a heat abstractor and control cabinet, wherein, heat abstractor includes: the radiator is provided with a radiating air duct which extends along the first direction; the air flow driving piece is arranged on the radiator and used for providing air flow for the radiating air duct; and the heating device is arranged on the outer surface of the radiator. Through the technical scheme of this application, with air current driving piece and the device single tube that generates heat and radiator integration setting, not only can improve heat abstractor's radiating effect, can also improve the assembly efficiency of product to reduce the occupation space of product.

Description

Radiating device and control cabinet

Technical Field

The application relates to the technical field of control cabinets, in particular to a heat radiating device and a control cabinet.

Background

This section provides merely background information related to the present disclosure and is not necessarily prior art.

Currently, elevator control cabinets are often equipped with frequency converters that control the power control devices of the ac motor, mainly by varying the frequency of the operating power supply of the motor. The frequency converter mainly comprises a rectifying module (alternating current to direct current), a filtering module, an inversion module (direct current to alternating current), a control module, a driving module and the like.

The inversion unit mainly comprises an integrated IGBT (Insulated Gate Bipolar Transistor ) module and a single-tube IGBT module, wherein the integrated IGBT module is simple in installation process and quite expensive in cost, so that the single-tube IGBT module is usually selected for reducing the cost, and heat-generating devices such as an IGBT single tube of the single-tube IGBT module are large in heat productivity, so that the existing single-tube IGBT module is required to be provided with a complex heat-dissipating device, more parts and components of the product are caused, the whole assembly is complicated, and the occupied space is large.

Disclosure of Invention

The purpose of this application is at least to solve current heat abstractor assembly loaded down with trivial details, occupation space great technical problem. The aim is achieved by the following technical scheme:

a first aspect of the present application proposes a heat dissipating device, comprising: a heat sink having a heat dissipation air duct extending in a first direction; the air flow driving piece is arranged on the radiator and used for driving air flow to flow from the radiating air duct; and the heating device is arranged on the outer surface of the radiator.

According to the heat dissipating device, through with the integrated setting of air current driving piece and heating element on the radiator, wherein, the radiator has the heat dissipation wind channel that extends along first direction, the air current driving piece sets up on the radiator, can produce the air current when the air current driving piece operates, the air current flows along the heat dissipation wind channel, thereby take away the hot air current in the heat dissipation wind channel, thereby can realize carrying out quick radiating purpose to heating element, the radiating effect to heating element has not only been improved, and whole spare part is less, the assembly of being convenient for, product overall structure is compacter again simultaneously, still help reducing the occupation space of product.

In addition, the heat dissipating device according to the present application may further have the following additional technical features:

in some embodiments of the present application, an insulating spacer is disposed between the heat generating device and the heat sink.

In some embodiments of the present application, a heat conducting layer is disposed between the insulating spacer and the heat sink.

In some embodiments of the present application, the heat sink includes a fin-type heat sink, and the fin-type heat sink includes a plurality of heat dissipation fins disposed at intervals, and the heat dissipation air duct is formed between two adjacent heat dissipation fins.

In some embodiments of the present application, the heat dissipating device further comprises: the radiator is arranged on one side of the bottom plate and is fixedly connected with the bottom plate.

In some embodiments of the present application, the backplane comprises a circuit board; the heating device comprises an IGBT single tube, the IGBT single tube extends along a second direction perpendicular to the bottom plate, pins of the IGBT single tube are electrically connected with the circuit board, and the second direction is intersected with the first direction.

In some embodiments of the present application, the number of the IGBT single tubes is a plurality, and the plurality of IGBT single tubes are disposed at intervals along the first direction on the outer surface of the heat sink.

In some embodiments of the present application, the airflow driving member is disposed at one end of the radiator along the first direction; the air flow driving piece is provided with a first connecting hole, one end of the radiator is provided with a second connecting hole, and the fastening piece penetrates through the first connecting hole and the second connecting hole to enable the air flow driving piece to be fixedly connected with the radiator.

In some embodiments of the present application, the airflow driver comprises a fan.

The second aspect of the application also provides a control cabinet, which comprises a cabinet body with an accommodating space; and a heat dissipating device as set forth in any of the first aspects, the heat dissipating device being provided within the accommodating chamber.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:

fig. 1 schematically illustrates an assembled structure diagram of a heat sink according to an embodiment of the present utility model at one view angle;

FIG. 2 is an exploded view of the heat sink shown in FIG. 1;

fig. 3 schematically illustrates an assembled structure diagram of another view of a heat dissipating device according to an embodiment of the present utility model.

The reference numerals are as follows:

a heat sink 100;

a heat sink 10, an airflow driving member 20, a heat generating device 30, a bottom plate 40;

the heat dissipation air duct 11, the heat dissipation fins 12, the second connecting holes 13 and the first connecting holes 21;

the directions of the x axis and the y axis of the coordinate system in fig. 1 to 3 represent the first direction and the second direction, respectively.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "includes," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless an order of performance is explicitly stated. It should also be appreciated that additional or alternative steps may be used.

Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

For ease of description, spatially relative terms, such as "inner," "outer," "lower," "below," "upper," "above," and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "below … …" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used herein interpreted accordingly.

As shown in fig. 1 to 3, according to some embodiments of the present application, there is provided a heat dissipating device 100 including: a heat sink 10, an airflow driver 20, and a heat generating device 30. The radiator 10 is provided with a radiating air duct 11, and the radiating air duct 11 extends along a first direction; the airflow driving piece 20 is arranged on the radiator 10 and is used for driving airflow to flow from the radiating air duct; the heat generating device 30 is provided on the outer surface of the heat sink 10.

In this embodiment, the airflow driving member 20 and the heat generating device 30 are integrally disposed on the radiator 10, where the radiator 10 has a heat dissipation air channel 11 extending along the first direction, the airflow driving member 20 may be disposed at one end of the radiator 10 and is connected with the heat dissipation air channel 11, and may also be disposed in the heat dissipation air channel 11 when the heat dissipation air channel 11 is larger, and the airflow driving member 20 may generate airflow during operation, and the airflow flows along the heat dissipation air channel 11 to take away the hot airflow generated by the heat generating device 30 in the heat dissipation air channel 11, so as to achieve the purpose of fast heat dissipation of the heat generating device 30, thereby not only improving the heat dissipation effect of the heat generating device 30, but also reducing the number of integral parts, facilitating assembly, and simultaneously reducing the occupied space of the product.

According to some embodiments of the present application, an insulating spacer (not shown) is provided between the heat generating device 30 and the heat sink 10.

In the present embodiment, the insulating spacer is provided between the heat generating device 30 and the heat sink 10, so that the heat generating device 30 and the heat sink 10 are insulated, thereby preventing the heat generating device 30 and the heat sink 10 from being short-circuited due to electrical connection, and improving the operation stability and safety of the heat sink 100.

The insulating gasket is a ceramic gasket, which has not only insulation but also good temperature resistance, and helps to further improve the operation safety of the heat dissipating device 100. Of course, the insulating spacer may be a glass spacer, a polytetrafluoroethylene plate, or the like.

According to some embodiments of the present application, a heat conducting layer (not shown) is further provided between the insulating spacer and the heat sink 10.

In the present embodiment, by providing a heat conductive layer, such as heat conductive silicone grease or heat conductive adhesive, between the insulating spacer and the heat sink 10, the heat conductive performance between the heat generating device 30 and the heat sink 10 can be improved, and thus the heat dissipation effect on the heat generating device 30 when the air flows along the heat dissipation air duct 11 can be improved.

As shown in fig. 2 and 3, according to some embodiments of the present application, the heat sink 10 includes a fin type heat sink including a plurality of heat dissipation fins 12 disposed at intervals, and a heat dissipation air duct 11 is formed between two adjacent heat dissipation fins 12.

In the present embodiment, the number of the heat dissipation fins 12 is plural, and the number of the heat dissipation air channels 11 is plural, so that the number of the heat dissipation air channels 11 is increased, and the air flow generated when the air flow driving member 20 operates can flow from the plurality of heat dissipation air channels 11, thereby contributing to improving the heat dissipation effect on the heat generating device 30.

As shown in fig. 1 to 3, according to some embodiments of the present application, the heat dissipating device 100 further includes: the bottom plate 40, the radiator 10 is disposed on one side of the bottom plate 40, and is fixedly connected with the bottom plate 40.

In the present embodiment, the bottom plate 40 may be a plate for fixing the heat sink 10, or may be a circuit board, for example.

In one embodiment, the bottom plate 40 is a circuit board. The heating device 30 is an IGBT single tube, the IGBT single tube extends along a second direction perpendicular to the circuit board, and pins of the IGBT single tube are electrically connected to the circuit board. Wherein the second direction intersects the first direction.

Further, the number of IGBT single tubes is plural, and the plural IGBT single tubes are provided at intervals along the first direction on the outer surface of the radiator 10.

In this embodiment, the plurality of IGBT single tubes are disposed on the outer surface of the radiator 10, and each IGBT single tube extends along the second direction, and the second direction is perpendicular to the bottom plate 40, so that the occupied space of the IGBT single tube on the bottom plate 40 can be reduced, the product structure is more compact, and the product miniaturization design is facilitated. Specifically, the second direction is also perpendicular to the extending direction (i.e., the first direction) of the heat dissipation air duct 11.

In addition, the heat dissipating device 100 adopts a plurality of IGBT single tubes integrally provided to the driving board to form a single tube IGBT module, instead of an integrated IGBT module, so that the cost can be reduced.

It should be noted that, the IGBT module is a composite fully-controlled voltage-driven power semiconductor device composed of a BJT (Bipolar Junction Transistor, bipolar transistor) and a MOS (Metal Oxide Semiconductor, insulated gate field effect transistor). The IGBT module is a modularized semiconductor product formed by bridging and packaging an IGBT (insulated gate bipolar transistor chip) and a FWD (Freewheeling diode, a freewheel diode chip) through a specific circuit; the encapsulated IGBT module is directly applied to equipment such as a frequency converter.

Specifically, the circuit board is the drive plate, and the drive plate is as the circuit board carrier of IGBT module, and the integration is provided with drive control board and rectifier module on the drive plate, again through also integrated setting up a plurality of IGBT single tubes, radiator 10 and air current driver 20 on the drive plate, makes the driver have each item functions such as rectification, contravariant and drive control, has improved the integrated level of driver for wiring between each part of driver is succinct more, prevents the cable intertwine, and reduces automatically controlled subassembly occupation volume.

Illustratively, the heat dissipation fins 12 located at the outermost side of the heat sink 10 are U-shaped, and a plurality of parallel heat dissipation fins 12 are arranged in the heat dissipation fins along the interval, and a plurality of IGBT single tubes are arranged on the outer surface of the U-shaped heat dissipation fins 12 and are fixedly connected with the heat sink 10 through fasteners such as screws.

Specifically, the heat dissipation fins 12 located at the outermost side of the heat sink 10 are attached to the bottom plate 40, and are fixedly connected with the bottom plate 40 by fasteners such as screws, so that when the airflow driving member 20 blows or draws air to the heat dissipation air duct 11, pollutants such as dust can be prevented from directly blowing to the bottom plate 40, which is helpful for prolonging the service life of the bottom plate 40 and improving the running stability of the bottom plate 40.

As shown in fig. 1 to 3, according to some embodiments of the present application, a plurality of IGBT single tubes are disposed at intervals along a first direction on an outer surface of the heat sink 10.

In the present embodiment, the plurality of IGBT single tubes are provided on the outer surface of the radiator 10 at intervals along the first direction, so that the plurality of IGBT single tubes can radiate heat to the external environment, and the heat radiation efficiency of the plurality of IGBT single tubes can be improved.

By way of example, the IGBT single tubes can be arranged at equal intervals, so that the whole product is regular, and the attractive appearance of the product is improved.

As shown in fig. 1-3, according to some embodiments of the present application, an airflow driver 20 is disposed at one end of the heat sink 10 along the first direction.

By arranging the airflow driving member 20 at one end of the radiator 10, airflow can flow from one end to the other end of the heat dissipation air duct 11, and the heat exchange area of the airflow in the heat dissipation air duct 11 is increased, so that the heat dissipation efficiency of a plurality of IGBT single tubes is improved.

Specifically, the airflow driving member 20 has a first connection hole 21, and one end of the heat sink 10 has a second connection hole 13, and a fastener passes through the first connection hole 21 and the second connection hole 13 to fixedly connect the airflow driving member 20 with the heat sink 10.

The first connecting holes 21 and the second connecting holes 13 are screw holes, the number of the first connecting holes 21 and the second connecting holes 13 is multiple and the first connecting holes 21 and the second connecting holes 13 are arranged in one-to-one correspondence, and fasteners such as screws penetrate through the first connecting holes 21 and the second connecting holes 13, so that the air flow driving piece 20 and the radiator 10 can be assembled quickly, the assembly efficiency of products is improved, and the assembly and the disassembly are convenient.

According to some embodiments of the present application, the airflow driver 20 comprises a fan.

In this embodiment, the fan includes a housing, a fan blade disposed in the housing, and a motor connected to the fan blade, and the motor can drive the fan blade to rotate when running, so as to generate an air flow; the housing is adapted to the size of one end of the heat sink 10 in the first direction, and the peripheral side of the housing is provided with a first connection hole 21. The fan has simple structure and easy assembly, and is beneficial to reducing the production cost of products.

As shown in fig. 1 to 3, according to some embodiments of the present application, the number of heat sinks 10 is plural, the plural heat sinks 10 are parallel and spaced on at least one side of the bottom plate 40, and each heat sink 10 is provided with plural IGBT single tubes at intervals.

According to some embodiments of the present application, the heat dissipating device 100 further includes a connecting member fixedly connected to the plurality of heat sinks 10 and fixedly connected to the bottom plate 40.

In this embodiment, by providing the connecting member fixedly connected to the plurality of heat sinks 10, when assembling the product, the plurality of heat sinks 10 can be assembled to the connecting member first, and then the connecting member is assembled with the bottom plate 40, thereby further improving the assembly efficiency of the product.

According to some embodiments of the present application, the two ends of the radiator 10 in the length direction are provided with the airflow driving members 20, one of the two airflow driving members 20 is configured to blow air to the heat dissipation air duct 11, and the other is configured to draw air from the heat dissipation air duct 11, so that the heat dissipation efficiency of the heat dissipation device 100 can be further improved.

According to some embodiments of the present application, the present application also proposes a control cabinet comprising a cabinet body and a heat dissipating device 100 as in any of the first aspects. The cabinet body is provided with an accommodating space, and the heat dissipation device 100 is provided with an accommodating cavity.

The control cabinet provided in this embodiment, for example, an elevator control cabinet, includes the heat dissipating device 100 according to any one of the first embodiment, and therefore has the technical effects of any one of the above embodiments, which are not described in detail herein.

The foregoing is merely a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the technical scope of the present application should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat sink, comprising:

a heat sink having a heat dissipation air duct extending in a first direction;

the air flow driving piece is arranged on the radiator and used for driving air flow to flow from the radiating air duct;

and the heating device is arranged on the outer surface of the radiator.

2. The heat dissipating device of claim 1, wherein an insulating spacer is disposed between said heat generating element and said heat sink.

3. The heat sink of claim 2, wherein a thermally conductive layer is disposed between the insulating spacer and the heat sink.

4. A heat sink according to any one of claims 1-3, wherein the heat sink comprises a fin-type heat sink comprising a plurality of heat dissipation fins arranged at intervals, the heat dissipation air duct being formed between two adjacent heat dissipation fins.

5. A heat sink according to any one of claims 1-3, further comprising: the radiator is arranged on one side of the bottom plate and is fixedly connected with the bottom plate.

6. The heat sink of claim 5, wherein the base plate comprises a circuit board;

the heating device comprises an IGBT single tube, the IGBT single tube extends along a second direction perpendicular to the bottom plate, pins of the IGBT single tube are electrically connected with the circuit board, and the second direction is intersected with the first direction.

7. The heat dissipating device of claim 6, wherein the number of IGBT single tubes is a plurality, the plurality of IGBT single tubes being disposed on an outer surface of the heat sink at intervals along the first direction.

8. A heat sink according to any one of claims 1-3, wherein the airflow driving member is provided at one end of the heat sink in the first direction;

the air flow driving piece is provided with a first connecting hole, one end of the radiator is provided with a second connecting hole, and the fastening piece penetrates through the first connecting hole and the second connecting hole to enable the air flow driving piece to be fixedly connected with the radiator.

9. A heat sink according to any one of claims 1-3, wherein the airflow driver comprises a fan.

10. A control cabinet, characterized by comprising:

the cabinet body is provided with a containing cavity; and

the heat dissipating device of any of claims 1-9, disposed within the receiving cavity.