CN219392617U - Net safety computer heat abstractor for coping with high dust environment - Google Patents
Net safety computer heat abstractor for coping with high dust environment Download PDFInfo
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- CN219392617U CN219392617U CN202320820039.2U CN202320820039U CN219392617U CN 219392617 U CN219392617 U CN 219392617U CN 202320820039 U CN202320820039 U CN 202320820039U CN 219392617 U CN219392617 U CN 219392617U
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- heat
- heat conduction
- contact block
- outer shell
- conducting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a network computer heat dissipation device for coping with high dust environment, comprising: the heat-conducting device comprises an outer shell, a heat-conducting contact block, a heat-conducting pipe and a heat-radiating cover body; the heat dissipation cover body is assembled into the mounting groove body in a sealing way, so that the shell body forms a closed structure; the heat conduction contact block is of a cylindrical structure, one end of the heat conduction contact block is in contact with the surface of the heating element, and the other end of the heat conduction contact block is fixedly connected with the converging positions of the heat conduction pipes. The utility model provides a network computer heat dissipation device for a high-dust environment, which has the advantages of high heat dissipation efficiency and dust prevention and is very suitable for the high-dust environment.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation devices, and particularly relates to a network computer heat dissipation device for coping with a high-dust environment.
Background
The common network security computer is arranged in a machine room, the environment is good, and the air dust is less, so that the structure of the conventional network security computer meets the use requirement. However, in the environments such as subway stations, a large amount of dust and water vapor are generated during decoration construction, and when a common network safety computer is adopted and a fan is used for radiating heat, the fan can absorb a large amount of dust and water vapor, so that equipment is damaged.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model provides a network computer heat dissipation device for coping with high-dust environment, which can effectively solve the problems.
The technical scheme adopted by the utility model is as follows:
the utility model provides a network computer heat dissipation device for coping with high dust environment, comprising: the heat-conducting device comprises an outer shell (1), a heat-conducting contact block (2), a heat-conducting pipe (3) and a heat-radiating cover body (4);
the outer shell (1) comprises an outer shell top cover (1-1) and an outer shell bottom cover (1-2); the heat dissipation cover body (4) is assembled into the mounting groove body (1-3) in a sealing way, so that the outer shell body (1) forms a closed structure; the heat dissipation cover body (4) is of a two-layer structure, the upper layer is provided with a plurality of heat dissipation fins (4-1), the lower layer is sintered and provided with a plurality of heat conduction pipes (3), one end of each heat conduction pipe (3) is converged, and the other end of each heat conduction pipe is arranged in an outward radiation way;
a heating element (5) is arranged on the surface of the bottom cover (1-2) of the outer shell (1) in the inner cavity of the outer shell; the heat conduction contact block (2) is of a cylindrical structure, one end of the heat conduction contact block is in contact with the surface of the heating element (5), and the other end of the heat conduction contact block is fixedly connected with the converging positions of the heat conduction pipes (3).
Preferably, the number of the heat conduction contact blocks (2) is the same as the number of the heating elements (5), and each heating element (5) is correspondingly provided with one heat conduction contact block (2); each heat conduction contact block (2) is correspondingly provided with a group of radial heat conduction pipes (3).
Preferably, each set of radial heat pipes (3) comprises 3 heat pipes (3).
Preferably, the heat conduction contact block (2) comprises a bridge chip heat conduction contact block (2-1) and a CPU heat conduction contact block (2-2).
The network computer heat dissipation device for dealing with the high-dust environment has the following advantages:
the utility model provides a network computer heat dissipation device for a high-dust environment, which has the advantages of high heat dissipation efficiency and dust prevention and is very suitable for the high-dust environment.
Drawings
FIG. 1 is a perspective view of a heat dissipating device for a network computer in a high dust environment according to the present utility model;
FIG. 2 is an exploded view of the heat dissipating device of the Internet-mounted computer in a use state for handling high dust environment;
FIG. 3 is a diagram showing a positional relationship between a heat dissipating device and a heat generating component of a computer installed on a network for handling high dust environments;
FIG. 4 is a diagram showing another positional relationship between a heat dissipating device and a heat generating component of a computer installed on a network for handling high dust environments;
FIG. 5 is a bottom view of a heat dissipating device for a laptop computer for handling high dust environments according to the present utility model;
fig. 6 is a top view of a heat dissipating device for a web-mounted computer, which is provided by the utility model and is suitable for high dust environment.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
The utility model provides a network computer heat dissipation device for a high-dust environment, which has the advantages of high heat dissipation efficiency and dust prevention and is very suitable for the high-dust environment.
As shown in fig. 1 to 6, the heat dissipating device for a web-mounted computer which is suitable for a high dust environment comprises: the heat-conducting device comprises an outer shell 1, a heat-conducting contact block 2, a heat-conducting pipe 3 and a heat-radiating cover body 4;
the outer shell 1 comprises an outer shell top cover 1-1 and an outer shell bottom cover 1-2; the top cover 1-1 of the outer shell is provided with a mounting groove body 1-3, and the heat dissipation cover body 4 is assembled in the mounting groove body 1-3 in a sealing way, so that the outer shell 1 forms a closed structure to realize a dustproof effect; the heat radiation cover body 4 is of a two-layer structure, the upper layer is provided with a plurality of heat radiation fins 4-1 for enhancing the heat radiation effect, the lower layer is sintered and provided with a plurality of heat conduction pipes 3, and one end of each heat conduction pipe 3 is converged, and the other end is outwards arranged in a radiation manner;
the surface of the bottom cover 1-2 of the outer shell of the inner cavity of the outer shell 1 is provided with a heating element 5; the heating element 5 is a main heating element in the computer, including but not limited to a bridge chip 5-1 and a CPU5-2.
The heat conduction contact block 2 is of a cylindrical structure, one end of the heat conduction contact block is in contact with the surface of the heating element 5, and the end face of the heat conduction contact block 2 is connected with the surface of the heating element 5 by curable heat conduction glue; the other end of the heat conduction contact block 2 is fixedly connected with the converging position of each heat conduction pipe 3.
In practical application, the number of the heat conduction contact blocks 2 is the same as the number of the heating elements 5, and each heating element 5 is correspondingly provided with one heat conduction contact block 2; each heat conduction contact block 2 is correspondingly provided with a group of radial heat conduction pipes 3. Each set of radial heat pipes 3 may comprise 3 heat pipes 3.
As a specific embodiment, when the heating element 5 is the bridge chip 5-1 and the CPU5-2, the two heat conductive contact blocks 2 are correspondingly arranged, and are respectively: bridge chip heat conduction contact block 2-1 and CPU heat conduction contact block 2-2.
One end of the bridge chip heat conduction contact block 2-1 is connected with the bridge chip 5-1 through curable heat conduction glue, and the other end of the bridge chip heat conduction contact block is positioned at the converging position of a group of heat conduction pipes 3 of the heat dissipation upper cover 4 and assembled with the heat dissipation upper cover 4 through screws; similarly, one end of the CPU heat conduction contact block 2-2 is connected with the CPU5-2 through curable heat conduction glue, and the other end is positioned at the convergence position of the other group of heat conduction pipes 3 of the heat dissipation upper cover 4 and assembled with the heat dissipation upper cover 4 through screws.
When the heat dissipation device of the network-mounted computer, which is used for dealing with a high dust environment, is assembled with a fully-closed case, a bridge chip heat conduction contact block 2-1 and a CPU heat conduction contact block 2-2 are respectively contacted with a bridge chip 5-1 and a CPU5-2 of a network-mounted computer main board, heat is conducted onto a heat dissipation cover body 4 by three sintering heat conduction pipes 3, and is dissipated to the outside of the case through the heat dissipation cover body 4, and dust cannot enter equipment due to no gap in the whole structure, so that the heat dissipation device has a dust prevention effect; in addition, heat is conducted to the shell, the temperature of the equipment is guaranteed to be higher than the ambient temperature, water vapor cannot be condensed on the equipment, and therefore stable operation of the equipment is protected.
The utility model provides a network computer heat dissipation device for coping with high dust environment, which has the following advantages:
(1) The utility model has simple and reasonable structural design, is convenient and reliable to use, can be flexibly installed on 2U network security equipment with various specifications, and is suitable for cabinets with different depths and widths;
(2) Good radiating effect, include: 1. the heat dissipation cover body has large enough area and a plurality of fins, so the heat dissipation effect is good; 2. because the area of the heat dissipation cover body is larger, the contact area with the case is larger, and certain heat can be conducted to the upper surface of the case, so that the temperature of the equipment in operation is always higher than the external environment temperature, and the condensation of water vapor on the equipment is avoided. 3. The sintering heat conduction pipe can be used for rapidly conducting heat of the heating chip to the upper surface of the heat dissipation cover body, so that the heat conduction efficiency is improved.
(3) The dustproof effect is good: the contact surface between the device and the case is gapless, and the device has a dustproof effect; the network installation computer using the device can well run stably in environments such as high dust, high water vapor and the like under the construction of subway stations.
The foregoing is merely a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model, which is also intended to be covered by the present utility model.
Claims (4)
1. An on-line computer heat sink for handling high dust environments, comprising: the heat-conducting device comprises an outer shell (1), a heat-conducting contact block (2), a heat-conducting pipe (3) and a heat-radiating cover body (4);
the outer shell (1) comprises an outer shell top cover (1-1) and an outer shell bottom cover (1-2); the heat dissipation cover body (4) is assembled into the mounting groove body (1-3) in a sealing way, so that the outer shell body (1) forms a closed structure; the heat dissipation cover body (4) is of a two-layer structure, the upper layer is provided with a plurality of heat dissipation fins (4-1), the lower layer is sintered and provided with a plurality of heat conduction pipes (3), one end of each heat conduction pipe (3) is converged, and the other end of each heat conduction pipe is arranged in an outward radiation way;
a heating element (5) is arranged on the surface of the bottom cover (1-2) of the outer shell (1) in the inner cavity of the outer shell; the heat conduction contact block (2) is of a cylindrical structure, one end of the heat conduction contact block is in contact with the surface of the heating element (5), and the other end of the heat conduction contact block is fixedly connected with the converging positions of the heat conduction pipes (3).
2. The heat dissipating device for a web-mounted computer for handling high dust environment according to claim 1, wherein the number of the heat conducting contact blocks (2) is the same as the number of the heat generating pieces (5), and each heat generating piece (5) is provided with one heat conducting contact block (2) correspondingly; each heat conduction contact block (2) is correspondingly provided with a group of radial heat conduction pipes (3).
3. A web-mounted computer heat sink against high dust environment according to claim 2, characterized in that each set of radial heat conducting pipes (3) comprises 3 heat conducting pipes (3).
4. The heat dissipation device for a web-mounted computer for handling high dust environments according to claim 1, wherein the heat conduction contact block (2) comprises a bridge chip heat conduction contact block (2-1) and a CPU heat conduction contact block (2-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320820039.2U CN219392617U (en) | 2023-04-13 | 2023-04-13 | Net safety computer heat abstractor for coping with high dust environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320820039.2U CN219392617U (en) | 2023-04-13 | 2023-04-13 | Net safety computer heat abstractor for coping with high dust environment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219392617U true CN219392617U (en) | 2023-07-21 |
Family
ID=87187222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320820039.2U Active CN219392617U (en) | 2023-04-13 | 2023-04-13 | Net safety computer heat abstractor for coping with high dust environment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219392617U (en) |
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2023
- 2023-04-13 CN CN202320820039.2U patent/CN219392617U/en active Active
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