CN219372431U - Optical module - Google Patents

Abstract

The application discloses optical module includes: an upper housing; the lower shell is covered with the upper shell to form a wrapping cavity; the circuit board is arranged in the wrapping cavity. And the laser bias circuit is arranged on the circuit board, and one end of the laser bias circuit is connected with the laser chip and is used for controlling the driving of the laser chip. The temperature detector is arranged on one side of the laser chip and used for monitoring the temperature of the laser chip. And the MCU is connected with the temperature detector and the laser bias circuit, and adjusts the output voltage of the laser bias circuit according to the temperature. In the application, the laser bias circuit is connected with the MCU, and the MCU adjusts the control voltage output to the laser bias circuit according to the temperature of the received laser chip so as to control the output voltage of the laser bias circuit, and the laser chip is directly driven by the laser bias circuit.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

With the increase of communication rate, the rate requirement of the optical module is higher and higher, and especially in recent years, the limit of the optical module on the space occupation is more and more stringent, and more control schemes are required to be realized in the smallest space range possible.

Disclosure of Invention

The application provides an optical module to improve and reduce circuit board space.

In order to solve the technical problems, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, including:

an upper housing;

the lower shell is covered with the upper shell to form a wrapping cavity;

the circuit board is arranged in the wrapping cavity:

the laser bias circuit is arranged on the circuit board, one end of the laser bias circuit is connected with the laser chip, and a direct-current driving signal is output to the laser chip;

the DSP chip is arranged on the circuit board, one end of the DSP chip is connected with the laser chip, and an alternating current load signal is output to the laser chip;

the temperature detector is arranged on one side of the laser chip and used for monitoring the temperature of the laser chip;

MCU is arranged on the circuit board, is connected with the temperature detector and the laser bias circuit, and adjusts the output voltage of the laser bias circuit according to the temperature.

Compared with the prior art, the beneficial effect of this application:

the application discloses optical module includes: an upper housing; the lower shell is covered with the upper shell to form a wrapping cavity; the circuit board is arranged in the wrapping cavity. And the laser bias circuit is arranged on the circuit board, and one end of the laser bias circuit is connected with the laser chip and is used for controlling the driving of the laser chip. The temperature detector is arranged on one side of the laser chip and used for monitoring the temperature of the laser chip. And the MCU is connected with the temperature detector and the laser bias circuit, and adjusts the output voltage of the laser bias circuit according to the temperature. In the application, the laser bias circuit is connected with the MCU, and the MCU adjusts the control voltage output to the laser bias circuit according to the temperature of the received laser chip so as to control the output voltage of the laser bias circuit, and the laser chip is directly driven by the laser bias circuit. On the basis of the existing optical module hardware, the integrated laser chip driving chip is replaced by the laser bias circuit which is independently designed, so that the circuit design is simplified, the module cost is reduced, and the dependence on the laser chip driving chip is eliminated.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.

FIG. 1 is a diagram of an optical communication system connection relationship according to some embodiments;

fig. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a diagram of an optical module architecture provided in accordance with some embodiments;

FIG. 4 is an exploded block diagram of an optical module according to some embodiments;

fig. 5 is a schematic structural diagram of a portion of an optical module according to an embodiment of the present application;

fig. 6 is a schematic diagram of a signal flow of an optical module portion provided in an embodiment of the present application;

fig. 7 is a schematic structural diagram of a light emitting device provided in the present application;

FIG. 8 is a schematic diagram of an MCU according to an example of the present application;

fig. 9 is a block diagram of a second embodiment of a light emitting device according to the present application;

fig. 10 is a block diagram III of a light emitting device according to an example of the present application;

fig. 11 is a block diagram III of a light emitting device according to an example of the present application;

fig. 12 is a block diagram of a light emitting device according to an example of the present application;

fig. 13 is a block diagram of a light emitting device according to an example of the present application;

fig. 14 is a block diagram showing a structure of a light emitting device according to an example of the present application;

fig. 15 is a block diagram of a light emitting device according to an example of the present application.

Detailed Description

In order to better understand the technical solutions in the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without inventive effort, based on the embodiments in this disclosure, shall fall within the scope of the present disclosure.

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Since the optical signal has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost and low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a diagram of an optical communication system connection relationship according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6-8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to realize ultra-long-distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. By way of example, since the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103 and transmits a signal from the network cable 103 to the optical module 200, the optical network terminal 100 can monitor the operation of the optical module 200 as a host computer of the optical module 200. The upper computer of the optical module 200 may include an optical line terminal (Optical Line Terminal, OLT) or the like in addition to the optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical network terminal 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical fiber 100.

Fig. 3 is a diagram of an optical module structure provided according to some embodiments, and fig. 4 is an exploded structure diagram of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate, and two upper side plates disposed at two sides of the cover plate and perpendicular to the cover plate, and two side walls are combined with the two side plates to realize that the upper case 201 is covered on the lower case 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. Illustratively, opening 204 is located at the end of light module 200 (left end of fig. 3) and opening 205 is also located at the end of light module 200 (right end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to be connected to the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver device inside the optical module 200.

By adopting the assembly mode of combining the upper shell 201 and the lower shell 202, devices such as the circuit board 300, the optical transceiver and the like are conveniently installed in the shell, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when devices such as the circuit board 300 are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are conveniently arranged, and the automatic implementation and production are facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located on an outer wall of the housing, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates 2022 of the lower housing 202, and includes an engagement member that mates with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components (e.g., capacitors, resistors, transistors, MOS transistors), chips (e.g., MCU, laser driver chip, limiting amplifier chip, clock data recovery CDR, power management chip, DSP chip DSP), etc.

The circuit board 300 connects the above devices in the optical module 200 together according to a circuit design through circuit traces to realize functions of power supply, electric signal transmission, grounding, and the like.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear chips; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and in some embodiments disclosed in the application, a metal pin/golden finger is formed on one side end surface of the hard circuit board and used for being connected with the electric connector; these are all inconvenient to implement with flexible circuit boards.

A flexible circuit board is also used in part of the optical module; the flexible circuit board is generally matched with the hard circuit board for use, for example, the hard circuit board and the optical transceiver can be connected by adopting the flexible circuit board to supplement the hard circuit board.

The optical transceiver device comprises an optical transmitting sub-module and an optical receiving sub-module.

The light emission sub-module is generally provided with a laser chip, and for realizing the driving of the laser chip, the light emission sub-module is provided with a laser chip driving chip, the peripheral power supply and control circuit of the current laser chip driving chip is complex, the occupied area of the PCB is large, and meanwhile, the light emission sub-module has single function and high cost, and is not beneficial to reducing the space occupation rate and the cost control of the light module.

Fig. 5 is a schematic structural diagram of an optical module portion provided in an embodiment of the present application, and fig. 6 is a schematic signal flow diagram of an optical module portion provided in an embodiment of the present application. In order to solve the above problems, the application provides an optical module, wherein one end of a circuit board of the optical module is provided with a golden finger, and the golden finger is connected with an upper computer and is used for receiving an electrical signal of the upper computer. MCU 302 is disposed on the circuit board, connected to the golden finger, receives the electrical signal from the upper computer, and processes the electrical signal for controlling the DSP chip and the laser bias circuit.

The laser bias circuit 303 is connected to the MCU 302 and receives a control signal from the MCU 302. The MCU 302 outputs a signal to the laser bias circuit 303, which controls the magnitude of the output signal of the numerical analog converter. The laser bias circuit 303 is connected to the laser chip 401, and outputs a bias signal to drive the laser chip.

The laser chip 401 is an important component of the light emitting sub-module,

the DSP chip 301 is also communicatively coupled to the MCU 302, and receives control signals from the MCU 302. The MCU 302 outputs a signal to the DSP chip 301, controlling the output of the DSP chip 301. In the embodiment of the application, the optical module is connected with the upper computer through the golden finger on the circuit board and receives the electric signal from the upper computer. The MCU 302 is connected to the golden finger, receives the above electrical signals, processes the electrical signals, and outputs an amplitude modulation signal and a control signal for controlling the DSP chip 301 and the laser bias circuit 303. The laser bias circuit 303 receives a control signal from the MCU 302, outputs a bias signal value to the laser chip, and drives the laser chip 401. The DSP chip 301 receives the amplitude modulation data signal from the MCU 302, performs data processing on the amplitude modulation data signal, outputs a modulation signal corresponding thereto to the laser chip 401, and performs amplitude modulation on the laser chip 401. In the present application, there is no complex, integrated and expensive laser chip driving chip, and the laser chip 401 is directly driven by the laser bias circuit 303. On the basis of the existing optical module hardware, the integrated laser chip driving chip is replaced by the laser bias circuit 303 which is independently designed, so that the circuit design is simplified, the module cost is reduced, and the dependence on the laser chip driving chip is eliminated.

In the embodiment of the application, the laser bias circuit is controlled by the MCU, outputs different bias currents to drive the laser chip, and keeps the laser chip open and stably works.

In some embodiments of the present application, the input end of the MCU 302 is connected to a gold finger, and is configured to receive an electrical signal from an upper computer and process the electrical signal.

The control pin of the MCU 302 is connected with the laser bias circuit 303 to control the output voltage of the laser bias circuit 303. Specifically, the control pin of the MCU 302 is a GPIO output terminal, and the output voltage and current of the laser bias circuit 303 are controlled by controlling the high-low level.

The laser bias circuit 303 is arranged on the circuit board, the input end of the laser bias circuit 303 is connected with a control pin of the MCU 302, the output end of the laser bias circuit 303 is connected with the laser chip LD, and the laser chip 401 is directly driven, so that the configuration of a common laser driving chip and related matching circuits of the laser driving chip is reduced, the occupied area of the space of the circuit board is reduced, and the module integration level is improved.

The DSP chip outputs an alternating current load signal and loads the alternating current load signal and a driving signal output by the laser bias circuit to the laser chip together. In order to further reduce signal disturbance, a first filter network is arranged at the output end of the laser bias circuit to prevent the alternating current signal from passing reversely. The first filter network is an RL filter network and is mainly an alternating current filter network built by resistors and inductors or magnetic beads, and the first filter network mainly has the function of forward passing direct current bias current and preventing alternating current signals from passing reversely to interfere normal work of direct current signals.

Fig. 7 is a block diagram of a light emitting device according to an example of the present application, fig. 7 is a schematic diagram of a single-ended driving light emitting device, an LDO chip is a laser bias circuit, and an MCU is provided with an enable pin, and is connected to the LDO chip for implementing switching on and off of the LDO chip. The LDO chip is also connected with a power circuit, and the power circuit provides input current for the LDO chip.

The MCU is also connected with a temperature detector, the temperature detector can detect the ambient temperature of the laser chip, and the magnitude of control voltage output to the LDO chip is controlled according to the ambient temperature of the laser chip. And the MCU is internally provided with a temperature and voltage relation algorithm, and the magnitude of the output voltage is calculated through the received temperature.

In some embodiments of the present application, the temperature detector may further be disposed inside the MCU, and by detecting the temperature of the MCU, the magnitude of the control voltage output to the LDO chip is adjusted according to the mapping relationship between the temperature of the MCU and the optical power of the laser chip.

Fig. 8 is a schematic structural diagram of an MCU according to an example of the present application, and in combination with fig. 7, in an example of the present application, the MCU sets a temperature pin, and is connected to a temperature detector, to receive an ambient temperature of a laser chip. The MCU is also provided with a control pin which is connected with the second input end of the LDO chip and used for controlling the output voltage of the LDO chip.

Under the condition that the driving voltages are the same, the optical power of the laser chip changes along with the change of the ambient temperature, so that the driving voltages need to be adjusted when the ambient temperature changes in order to ensure that the emitted optical power of the laser chip is within the rated range. The input voltage of the LDO chip is unchanged, and the output voltage is regulated by controlling the change of the voltage. And a temperature and control voltage relation algorithm is arranged in the MCU, the control voltage is calculated and controlled through the received environmental temperature of the laser chip, and the output voltage of the LDO is controlled through regulating the control voltage.

The DSP chip includes a data pin, is connected to the communication pin of the MCU, is connected to the MCU in communication, and the DSP chip 301 receives the amplitude modulation data signal from the MCU 302, performs data processing on the amplitude modulation data signal, outputs a modulation signal corresponding to the amplitude modulation data signal to the laser chip 401, and performs amplitude modulation on the laser chip 401. MCU outputs an enabling signal to control the turn-off of the LDO chip. The DSP chip is also provided with a positive load pin which is connected with the positive electrode of the laser chip LD. The negative load pin of the DSP chip is connected with the negative electrode of the laser chip.

The DSP chip 301 is also communicatively coupled to the MCU 302, and receives control signals from the MCU 302. The MCU 302 outputs a signal to the DSP chip 301, controlling the output of the DSP chip 301. MCU issues parameter configuration to DSP chip, DSP chip

In order to avoid signal disturbance, a first direct current filter circuit is arranged between the positive load pin of the DSP chip and the laser chip and used for isolating direct current signals. The direct current filter circuit can be a capacitor, and the size of the volume value is determined according to the alternating current signal, so that the direct current filter circuit plays a role in isolating the direct current signal from the alternating current signal.

And a second direct current filter circuit is arranged between the load pin of the DSP chip and the laser chip and is used for isolating direct current signals. The direct current filter circuit can be a capacitor, and the size of the volume value is determined according to the alternating current signal, so that the direct current filter circuit plays a role in isolating the direct current signal from the alternating current signal.

In the present application, there is no complex, integrated and expensive laser chip driving chip, and the laser chip 401 is directly driven by the laser bias circuit 303. On the basis of the existing optical module hardware, the integrated laser chip driving chip is replaced by the laser bias circuit 303 which is independently designed, so that the circuit design is simplified, the module cost is reduced, and the dependence on the laser chip driving chip is eliminated. And the MCU receives the temperature of the laser chip, calculates and controls the voltage according to the temperature, and controls the output voltage of the LDO by adjusting the control voltage, so that the emitted light power of the laser chip is within the rated range.

Fig. 9 is a block diagram of a light emitting device according to an example of the present application, and fig. 9 is a schematic diagram of a light emitting device driven by two ends, where the LDO chip is a laser bias circuit, and the MCU is provided with an enable pin, and is connected to the LDO chip for implementing the on and off of the LDO chip. The LDO chip is also connected with a power circuit, and the power circuit provides input voltage for the LDO chip, and the voltage of the input circuit is constant. The MCU is also connected with a temperature detector, the temperature detector can detect the ambient temperature of the laser chip, and the magnitude of control voltage output to the LDO chip is controlled according to the ambient temperature of the laser chip. And the MCU is internally provided with a temperature and voltage relation algorithm, and the magnitude of the output voltage is calculated through the received temperature.

A second alternating current filter circuit is arranged between the negative electrode of the laser chip and the grounding wire, a negative electrode load pin of the DSP chip is connected with the negative electrode of the laser chip, and a differential signal is arranged between the negative electrode load pin and the positive electrode load pin of the DSP chip. And the digital signal processor is used for processing the load alternating current signal, converting the signal into an alternating current signal capable of driving the laser chip, and outputting the processed signal to the laser chip through the negative load pin and the positive load pin as a differential signal.

The MCU is provided with a temperature pin, is connected with a temperature detector and receives the ambient temperature of the laser chip. The MCU is also provided with a control pin which is connected with the second input end of the LDO chip and used for controlling the output voltage of the LDO chip. And a temperature and control voltage relation algorithm is arranged in the MCU, the control voltage is calculated and controlled through the received environmental temperature of the laser chip, and the output voltage of the LDO is controlled through regulating the control voltage.

The DSP chip includes a data pin, is connected to the communication pin of the MCU, is connected to the MCU in communication, and the DSP chip 301 receives the amplitude modulation data signal from the MCU 302, performs data processing on the amplitude modulation data signal, outputs a modulation signal corresponding to the amplitude modulation data signal to the laser chip, and performs amplitude modulation on the laser chip. MCU outputs an enabling signal to control connection and disconnection of the LDO chip. The DSP chip is also provided with a positive load pin which is connected with the positive electrode of the laser chip LD. The negative load pin of the DSP chip is connected with the negative electrode of the laser chip.

In order to avoid signal disturbance, a first direct current filter circuit is arranged between the positive load pin of the DSP chip and the laser chip and used for isolating direct current signals. The direct current filter circuit can be a capacitor, and the size of the volume value is determined according to the alternating current signal, so that the direct current filter circuit plays a role in isolating the direct current signal from the alternating current signal.

And a second direct current filter circuit is arranged between the load pin of the DSP chip and the laser chip and is used for isolating direct current signals. The direct current filter circuit can be a capacitor, and the size of the volume value is determined according to the alternating current signal, so that the direct current filter circuit plays a role in isolating the direct current signal from the alternating current signal.

Fig. 10 is a block diagram of a light emitting device according to an example of the present application, and fig. 10 is a schematic diagram of a single-ended driving light emitting device, and compared with fig. 7, the DCDC chip in this example is mainly used for generating a constant voltage or constant current power supply, and is controlled by the MCU to provide different driving bias currents for the LD according to different conditions.

The DCDC chip is a laser bias circuit, and the MCU is provided with an enabling pin and is connected with the DCDC chip for realizing the opening and the closing of the DCDC chip. The DCDC chip is also connected to a power circuit that provides an input voltage to the DCDC chip. The MCU is also connected with a temperature detector, the temperature detector can detect the ambient temperature of the laser chip, and the magnitude of control voltage output to the DCDC chip is controlled according to the ambient temperature of the laser chip. And the MCU is internally provided with a temperature and voltage relation algorithm, and the magnitude of the output voltage is calculated through the received temperature.

A second alternating current filter circuit is arranged between the negative electrode of the laser chip and the grounding wire, a negative electrode load pin of the DSP chip is connected with the negative electrode of the laser chip, and a differential signal is arranged between the negative electrode load pin and the positive electrode load pin of the DSP chip. And the digital signal processor is used for processing the load alternating current signal, converting the signal into an alternating current signal capable of driving the laser chip, and outputting the processed signal to the laser chip through the negative load pin and the positive load pin as a differential signal.

The MCU is provided with a temperature pin, is connected with a temperature detector and receives the ambient temperature of the laser chip. The MCU is also provided with a control pin which is connected with the second input end of the DCDC chip and used for controlling the output voltage of the DCDC chip. And a temperature and control voltage relation algorithm is arranged in the MCU, the control voltage is calculated and controlled through the received environmental temperature of the laser chip, and the output voltage of the LDO is controlled through regulating the control voltage.

The DSP chip includes a data pin, is connected to the communication pin of the MCU, is connected to the MCU in communication, and the DSP chip 301 receives the amplitude modulation data signal from the MCU 302, performs data processing on the amplitude modulation data signal, outputs a modulation signal corresponding to the amplitude modulation data signal to the laser chip, and performs amplitude modulation on the laser chip. MCU outputs an enabling signal to control the connection and disconnection of the DCDC chip. The DSP chip is also provided with a positive load pin which is connected with the positive electrode of the laser chip LD. The negative load pin of the DSP chip is connected with the negative electrode of the laser chip.

In order to avoid signal disturbance, a first direct current filter circuit is arranged between the positive load pin of the DSP chip and the laser chip and used for isolating direct current signals. The direct current filter circuit can be a capacitor, and the size of the volume value is determined according to the alternating current signal, so that the direct current filter circuit plays a role in isolating the direct current signal from the alternating current signal.

And a second direct current filter circuit is arranged between the load pin of the DSP chip and the laser chip and is used for isolating direct current signals. The direct current filter circuit can be a capacitor, and the size of the volume value is determined according to the alternating current signal, so that the direct current filter circuit plays a role in isolating the direct current signal from the alternating current signal.

Also, in some examples of the present application, fig. 11 is a structural block diagram three of a light emitting device of the examples of the present application; fig. 12 is a block diagram of a light emitting device according to an example of the present application. As shown in fig. 11 and 12, an IDAC chip or an operational amplifier may be further used to connect with the control pin of the MCU, and output different driving voltages to the laser chip according to the magnitude of the MCU control voltage.

Fig. 13 is a block diagram of a light emitting device according to an example of the present application; fig. 14 is a block diagram showing a structure of a light emitting device according to an example of the present application; fig. 15 is a block diagram of a light emitting device according to an example of the present application. In some embodiments of the present application, as shown in fig. 9, 13, 14 and 15, the dual-end driving light emitting device structure may further use a DCDC chip, an IDAC chip or an operational amplifier, etc. for connecting with a control pin of the MCU, and outputting different driving voltages to the laser chip according to the magnitude of the MCU control voltage.

In summary, the present application discloses a light emitting device, including: and the temperature detector is arranged around the laser chip and is used for detecting the ambient temperature of the laser chip. And the MCU receives the ambient temperature of the detection laser chip and outputs different control voltages according to the ambient temperature so as to adjust the driving voltage output by the bias circuit. The output end of the bias circuit is connected with the positive electrode of the laser chip. A DSP chip is also provided to output an ac load signal to the positive electrode of the laser chip for amplitude modulation of the laser chip 401. In the present application, there is no complex, integrated and expensive laser chip driving chip, and the laser chip 401 is directly driven by the laser bias circuit 303. On the basis of the existing optical module hardware, the integrated laser chip driving chip is replaced by the laser bias circuit 303 which is independently designed, so that the circuit design is simplified, the module cost is reduced, and the dependence on the laser chip driving chip is eliminated. The MCU is internally provided with a temperature-voltage relation algorithm, the control voltage is calculated according to the received temperature, and the output voltage of the bias circuit is regulated by regulating the control voltage, so that the purpose of controlling the output light power of the laser chip is achieved.

Since the foregoing embodiments are all described in other modes by reference to the above, the same parts are provided between different embodiments, and the same and similar parts are provided between the embodiments in the present specification. And will not be described in detail herein.

It should be noted that in this specification, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the statement "comprises" or "comprising" a … … "does not exclude that an additional identical element is present in a circuit structure, article or apparatus that comprises the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application are not intended to limit the scope of the present application.

Claims (10)

1. An optical module, comprising: an upper housing;

the lower shell is covered with the upper shell to form a wrapping cavity;

the circuit board is arranged in the wrapping cavity:

the laser bias circuit is arranged on the circuit board, one end of the laser bias circuit is connected with the laser chip, and a direct-current driving signal is output to the laser chip;

the DSP chip is arranged on the circuit board, one end of the DSP chip is connected with the laser chip, and an alternating current load signal is output to the laser chip;

the temperature detector is arranged on one side of the laser chip and used for monitoring the temperature of the laser chip;

MCU is arranged on the circuit board, is connected with the temperature detector and the laser bias circuit, and adjusts the output voltage of the laser bias circuit according to the temperature.

2. The optical module of claim 1, wherein the laser bias circuit comprises any one of an LDO chip, a DCDC chip, an IDAC chip, or an operational amplifier circuit.

3. The light module of claim 2, wherein the MCU comprises:

the temperature pin is connected with the temperature detector and used for receiving the temperature of the laser chip;

the enabling pin is connected with the LDO chip and used for sending an enabling signal to the LDO chip to control the opening and closing of the LDO chip;

and the control pin is connected with the LDO chip and outputs different control signals according to the temperature of the laser chip so as to control the output voltage of the LDO chip.

4. A light module as recited in claim 3, wherein the DSP chip is further communicatively coupled to the MCU.

5. The optical module of claim 1, wherein the DSP chip comprises:

the positive electrode load pin is connected with the positive electrode of the laser chip;

the negative load pin is connected with the negative electrode of the laser chip;

and the negative electrode of the laser chip is grounded.

6. The optical module according to claim 5, wherein a first dc filter circuit is disposed between the positive load pin and the laser chip to isolate the passage of dc signals;

and a second direct current filter circuit is arranged between the negative load pin and the laser chip to isolate the passing of direct current signals.

7. The optical module of claim 1, wherein a first ac filter circuit is disposed between the laser bias circuit and the positive electrode of the laser chip for isolating ac signals.

8. An optical module, comprising:

an upper housing;

the lower shell is covered with the upper shell to form a wrapping cavity;

the circuit board is arranged in the wrapping cavity:

the laser bias circuit is arranged on the circuit board, one end of the laser bias circuit is connected with the laser chip, and a direct-current driving signal is output to the laser chip;

the DSP chip is arranged on the circuit board, one end of the DSP chip is connected with the laser chip, and an alternating current load signal is output to the laser chip;

the temperature detector is arranged on one side of the laser chip and used for monitoring the temperature of the laser chip;

the MCU is arranged on the circuit board, is connected with the temperature detector and the laser bias circuit, and adjusts the output voltage of the laser bias circuit according to the temperature;

a first alternating current filter circuit is arranged between the laser bias circuit and the positive electrode of the laser chip and used for isolating alternating current signals;

and a second alternating current filter circuit is arranged between the negative electrode of the laser chip and the grounding wire.

9. The optical module of claim 8, wherein the first ac filter circuit is a RL ac filter circuit.

10. The optical module of claim 8, wherein the laser bias circuit comprises an LDO chip;

the MCU includes:

the temperature pin is connected with the temperature detector and used for receiving the temperature of the laser chip;

the enabling pin is connected with the LDO chip and used for sending an enabling signal to the LDO chip to control the opening and closing of the LDO chip;

and the control pin is connected with the LDO chip and outputs different control signals according to the temperature of the laser chip so as to control the output voltage of the LDO chip.