CN219350259U

CN219350259U - High-brightness high-contrast LED COB

Info

Publication number: CN219350259U
Application number: CN202223511932.1U
Authority: CN
Inventors: 陈振林; 徐志文; 陈彦铭; 桑建; 陈永铭
Original assignee: Guangzhou Hongli Display Electronics Co ltd
Current assignee: Guangzhou Hongli Display Electronics Co ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-07-14
Anticipated expiration: 2032-12-28

Abstract

The utility model provides a high-brightness high-contrast LED COB, which comprises a substrate, a packaging adhesive layer and more than two LED chips, wherein the adjacent LED chips are arranged on the substrate at intervals, the packaging adhesive layer comprises a shielding layer and more than two light-transmitting layers, the light-transmitting layers correspond to the LED chips, one light-transmitting layer is covered on one LED chip, the shielding layer is arranged in an area outside the light-transmitting layer on the substrate, and the shielding layer and the light-transmitting layers are alternately arranged on the substrate; the horizontal height of the shielding layer is larger than that of the LED chip, and the shielding layer can block outwards diffused light emitted by the LED chip; the horizontal height of the shielding layer is smaller than that of the light-transmitting layer; light emitted from directly above the LED chip is not blocked by the shielding layer; forming a non-light-emitting region on the shielding layer; and a light-emitting area is formed on the light-transmitting layer, the contrast between the non-light-emitting area and the light-emitting area is large, and the image formed by the LED COB is clear.

Description

High-brightness high-contrast LED COB

Technical Field

The utility model relates to the technical field of LEDs, in particular to a high-brightness high-contrast LED COB.

Background

The on-board package COB (Chip on Board) is a package structure in which a plurality of LED chips are directly mounted on a PCB substrate to directly conduct heat. The traditional MINI LED packaging structure based on COB packaging is characterized in that a flat adhesive layer is formed on the periphery of a Mini LED light-emitting chip, light emitted by the Mini LED light-emitting chip when being electrified is scattered to the periphery, the emergent angle is large, the light is not concentrated enough, the quantity of light received by an observer is small, the utilization rate of the light is insufficient, and the defect of insufficient display brightness is generated.

Patent literature with publication number 202210693543.0 and publication date 2022.10.4 discloses a Mini LED packaging structure based on COB packaging, which comprises a substrate, wherein a packaging adhesive layer and a plurality of LED chips are arranged on the substrate; the LED chips are arranged on the substrate at intervals; the LED chip is wrapped by the packaging adhesive layer; the packaging adhesive layer comprises a first adhesive layer and a second adhesive layer which are sequentially stacked on the substrate, the first adhesive layer is an opaque adhesive layer, the second adhesive layer is a transparent adhesive layer, and the thickness of the first adhesive layer is smaller than or equal to the height of the LED chip.

Referring to fig. 1, the light emitting angle of the COB-packaged LED chip is generally 120 °; light emitted from the top of the LED chip can spread outwards; in the packaging structure, although the light-tight adhesive layer is arranged, the height of the light-tight adhesive layer is flush with the height of the LED chip, and the light-tight adhesive layer can not block the emitted light at the top of the LED chip; the emitted light of the LED chips still diffuses outwards, and then the emitted light of the LED chips can be intersected in a non-luminous area between the adjacent LED chips; the non-light-emitting areas can emit light, and the contrast ratio between the non-light-emitting areas between adjacent LED chips and the light-emitting areas where the LED chips are located is small.

Disclosure of Invention

The utility model provides a high-brightness high-contrast LED COB, which is provided with a shielding layer with the horizontal height larger than that of an LED chip, wherein the emitted lights of adjacent LED chips cannot interfere with each other; the contrast ratio between the non-light-emitting area between the adjacent LED chips and the light-emitting area where the LED chips are positioned is large.

In order to achieve the above purpose, the technical scheme of the utility model is as follows: the utility model provides a high-brightness high-contrast LED COB, includes base plate, encapsulation glue film and more than two LED chips, and adjacent LED chip interval sets up on the base plate, and encapsulation glue film includes shielding layer and more than two euphotic layer, euphotic layer corresponds with the LED chip, and a euphotic layer cover is established on an LED chip, and shielding layer sets up the region beyond euphotic layer on the base plate, shielding layer and euphotic layer set up alternately on the base plate; the horizontal height of the shielding layer is greater than that of the LED chip, and the horizontal height of the shielding layer is less than that of the light-transmitting layer.

The shielding layer is arranged to shield the emitted light of the LED chip, the horizontal height of the shielding layer is larger than that of the LED chip, and the shielding layer can further block the light emitted by the LED chip and spread outwards; meanwhile, the light-transmitting layer is covered on the LED chip, the horizontal height of the shielding layer is smaller than that of the light-transmitting layer, and light emitted from the position right above the LED chip cannot be blocked by the shielding layer; meanwhile, shielding layers and light-transmitting layers are alternately arranged on the substrate; forming a non-luminous area on the shielding layer, wherein the emitted lights of adjacent LED chips cannot interfere with each other; and a light-emitting area is formed on the light-transmitting layer, the contrast between the non-light-emitting area and the light-emitting area is large, and the image formed by the LED COB is clear.

Further, the width of one end of the light-transmitting layer far away from the LED chip is smaller than the width of one end of the light-transmitting layer close to the LED chip. Thus, the light emitting angle of the LED chip can be reduced.

Further, the shielding portion extends along the horizontal direction toward one end of the light-transmitting layer away from the LED chip. The shielding parts extending towards the light-transmitting layer are used for improving the blocking effect of the shielding layers on the light which is emitted to the outside and spread by the LED chip, wherein the width between the two shielding parts is smaller than the width between the two shielding layers; the light-emitting angle of the LED chip is further reduced,

further, the aspect ratio of the light-transmitting layer is 1:1.

Further, the maximum height of the light-transmitting layer is 0.1mm-0.5mm.

Further, the maximum width of the light-transmitting layer is 0.1mm-0.5mm.

Drawings

Fig. 1 is a prior art.

Fig. 2 is a cross-sectional view of the present utility model.

Fig. 3 is a schematic diagram of a shielding layer for blocking part of light emitted from an LED chip according to the present utility model.

Fig. 4 is a schematic view of a light-transmitting layer according to the present utility model.

Detailed Description

The utility model is described in further detail below with reference to the drawings and the detailed description.

As shown in fig. 1-4; the utility model provides a high-brightness high-contrast LED COB, including base plate 1, encapsulation glue film and more than two LED chips 2, adjacent LED chips 2 interval sets up on base plate 1, encapsulation glue film includes shielding layer 3 and more than two euphotic layer 4, euphotic layer 4 corresponds with LED chips 2, and a euphotic layer 4 cover is established on an LED chip 2, and shielding layer 3 sets up the region beyond euphotic layer 4 on base plate 1, shielding layer 3 and euphotic layer 4 set up alternately on base plate 1; shielding the emitted light of the LED chip 2 by arranging a shielding layer 3; the horizontal height of the shielding layer 3 is greater than that of the LED chip 2, and as shown in fig. 3, the shielding layer 3 can block the light emitted from the LED chip 2 and diffused outward; the horizontal height of the shielding layer 3 is smaller than the horizontal height of the light-transmitting layer 4. Light emitted from directly above the LED chip 2 is not blocked by the blocking layer 3.

Since the shielding layers 3 and the light-transmitting layers 4 are alternately arranged on the substrate 1; a non-light-emitting area is formed on the shielding layer 3, and the emitted lights of the adjacent LED chips 2 do not interfere with each other; a light emitting region is formed on the light transmitting layer 4, the contrast between the non-light emitting region and the light emitting region is large, and the image formed by the LED COB is clear.

The height-width ratio of the light-transmitting layer 4 is 1:1, the maximum height H of the light-transmitting layer 4 is 0.1mm-0.5mm, and the maximum width L of the light-transmitting layer 4 is 0.1mm-0.5mm. In the present embodiment, the maximum height H of the light-transmitting layer 4 is 0.5mm, and the maximum width L of the light-transmitting layer 4 is 0.5mm.

In this embodiment, the light-transmitting layer 4 is arranged in an arc shape, and the width of one end of the light-transmitting layer 4 away from the LED chip 2 is smaller than the width of one end of the light-transmitting layer 4 close to the LED chip 2. This reduces the light emission angle of the LED chip 2.

Referring to fig. 3; the shielding portion 31 extends toward an end of the light-transmitting layer 4 away from the LED chip 2 along the horizontal shielding layer 3. The shielding parts 31 extending towards the light-transmitting layer 4 are used for improving the blocking effect of the shielding layers 3 on the light which is emitted to the outside and spread on the LED chip 2, wherein the width between the two shielding parts 31 is smaller than the width between the two shielding layers 3; the light-emitting angle of the LED chip 2 is further reduced.

In the present embodiment, the light-transmitting layer 4 is a LENS paste having high light transmittance, which is such that light of high brightness is emitted from directly above the LED chip 2; the shielding layer 3 and the shielding part 31 are made of black glue, the light transmittance of the black glue is small, the light which is emitted to the outside and spread to the LED chip 2 is blocked by the black glue, and the contrast of the LED COB is improved.

The manufacturing approach of high-brightness high-contrast LED COB, practical point gum machine spot LENS glue on LED chip 2 first, LENS glue forms the light-transmitting layer 4; and then, using a dispensing machine to dispense black glue on the rest areas except the light-transmitting layer 4 of the substrate 1, wherein the black glue forms a barrier layer.

Claims

1. The utility model provides a high-brightness high-contrast LED COB, includes base plate, encapsulation glue film and more than two LED chips, and adjacent LED chip interval sets up on the base plate, its characterized in that: the packaging adhesive layer comprises a shielding layer and more than two light-transmitting layers, the light-transmitting layers correspond to the LED chips, one light-transmitting layer is covered on one LED chip, the shielding layer is arranged in a region, except the light-transmitting layer, on the substrate, and the shielding layer and the light-transmitting layer are alternately arranged on the substrate; the horizontal height of the shielding layer is greater than that of the LED chip, and the horizontal height of the shielding layer is less than that of the light-transmitting layer.

2. The high brightness high contrast LED COB of claim 1 wherein: the width of one end of the light-transmitting layer far away from the LED chip is smaller than the width of one end of the light-transmitting layer close to the LED chip.

3. The high brightness high contrast LED COB of claim 2 wherein: the shielding part extends to one end of the light-transmitting layer far away from the LED chip along the horizontal shielding layer.

4. The high brightness high contrast LED COB of claim 1 wherein: the aspect ratio of the light-transmitting layer is 1:1.

5. The high brightness high contrast LED COB of claim 1 wherein: the maximum height of the light-transmitting layer is 0.1mm-0.5mm.

6. The high brightness high contrast LED COB of claim 4 wherein: the maximum width of the light-transmitting layer is 0.1mm-0.5mm.