CN219321186U

CN219321186U - Patch type solid plastic package capacitor

Info

Publication number: CN219321186U
Application number: CN202223539576.4U
Authority: CN
Inventors: 王国华; 邹伟平; 黎华章; 蒋镇麟
Original assignee: Yangzhou Shengyang Electronics Co ltd
Current assignee: Yangzhou Shengyang Electronics Co ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2023-07-07
Anticipated expiration: 2032-12-29

Abstract

The utility model relates to a patch type solid plastic package capacitor, which comprises a lead frame, wherein a plurality of hollowed holes are formed in the surface of the lead frame, the hollowed holes are arranged at equal intervals, the surface of the lead frame is fixedly connected with a plurality of first connecting plates, the left side and the right side of one side surface of each first connecting plate are fixedly connected with a negative electrode clamping arm, and a plastic package capacitor assembly is attached to the surface of one side, far away from the first connecting plates, of each negative electrode clamping arm; the plastic package capacitor assembly comprises a capacitor base, and lead pin positioning grooves are formed in the left end and the right end of the lower side of the capacitor base. The patch type solid plastic package capacitor can effectively improve the electric energy transmission and can not fall off by inserting the lead pins in the middle of the positive clamping arm and the negative clamping arm which are connected with the left end and the right end of the first connecting plate and the second connecting plate into the lead pin positioning grooves and matching the first connecting plate and the second connecting plate in a clamping and fixing manner.

Description

Patch type solid plastic package capacitor

Technical Field

The utility model relates to the technical field of capacitors, in particular to a patch type solid plastic package capacitor.

Background

The capacitor is an indispensable important element in a power supply circuit of the computer system, various boards and chipsets on the main board need to use various types of voltage power supplies, and capacitors are needed to be used for filtering the power supplies to ensure the stable operation of the main board and the boards, so that the voltage stability is ensured. Compared with a common liquid aluminum electrolytic capacitor, the solid capacitor adopts conductive polymer as a dielectric material, and the material does not react with aluminum oxide, so that explosion phenomenon is avoided after the material is electrified; at the same time, it is a solid product, and there is no bursting caused by thermal expansion.

Chinese patent CN 2328089Y discloses a flange forging device capable of rapid cooling, comprising a left pin, a right pin, an insulating medium, a polar plate a, a polar plate B, and a plastic package casing; the left lead pin is pressed on the polar plate B to be in good contact conduction with the polar plate B, the right lead pin is pressed on the polar plate A to be in good contact conduction with the polar plate A, and a medium is arranged on the outer side of the polar plate.

However, the connection between the lead frame and the capacitor is not firm enough, the lead frame is easy to loose when used for a long time or the use environment is severe, and the conductive performance is not good, so that the application requirement cannot be met, and the patch type solid plastic package capacitor is provided to solve the problems.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a patch type solid plastic package capacitor which has the advantages of good stability and the like, and solves the problems that the connection between a lead frame and the capacitor is not firm enough, and the lead frame and the capacitor are easy to loose when used for a long time or the use environment is severe.

In order to achieve the purpose of good stability, the utility model provides the following technical scheme: the utility model provides a solid-state plastic envelope condenser of paster, includes lead frame, lead frame surface fixedly connected with a plurality of first connecting plates, the equal fixedly connected with negative pole card of the left and right sides of first connecting plate one side surface holds the arm, the negative pole card holds the arm and keeps away from first connecting plate one side surface laminating and has plastic envelope capacitance assembly.

The plastic package capacitor assembly comprises a capacitor base, wherein a capacitor body is fixedly connected to the upper side surface of the capacitor base, an insulating medium is adhered to the inner wall surface of the capacitor body, a core bag is fixedly connected to the middle of the inner bottom wall of the capacitor body, and connecting ends are fixedly connected to the left end and the right end of the lower side of the core bag.

Further, the capacitor base is connected with positive pole clamping arms in a laminating manner at the left end and the right end of the surface of one side of the negative pole clamping arm, and a plurality of hollowed-out holes are formed in the surface of the lead frame.

Further, the positive electrode clamping arm is fixedly connected with a second connecting plate on the surface of one side, far away from the capacitor base, of the positive electrode clamping arm, and the hollowed holes are arranged at equal intervals.

Further, a plurality of the fretwork holes are arranged between the first connecting plate and the second connecting plate at a time, and the top end of the connecting end penetrates through the capacitor base and extends to the lower side surface of the core package.

Further, lead pin positioning grooves are formed in the left end and the right end of the lower side of the capacitor base.

Further, the insulating medium is made of rubber and is completely attached to the inner wall surface of the capacitor body.

Further, the middle parts of the opposite sides of the second connecting plate and the first connecting plate are respectively provided with a lead pin.

Compared with the prior art, the utility model provides a patch type solid plastic package capacitor, which has the following beneficial effects:

1. the patch type solid plastic package capacitor can effectively improve the electric energy transmission and can not fall off by inserting the lead pins in the middle of the positive clamping arm and the negative clamping arm which are connected with the left end and the right end of the first connecting plate and the second connecting plate into the lead pin positioning grooves and matching the first connecting plate and the second connecting plate in a clamping and fixing manner.

2. This solid-state plastic envelope condenser of paster formula, wrap up through insulating medium through the core package outside and can have fine insulativity, core package bottom fixed two link sets up the left and right sides both ends in the capacitor base inboard so that with anodal card hold the arm and the negative pole card hold the arm between be connected, solved the connection between lead frame and the condenser not firm enough, use for a long time or the problem that the pine takes off easily when service environment is comparatively abominable.

Drawings

FIG. 1 is a top plan view of the structure of the present utility model;

fig. 2 is a front view of the structure of the capacitor body of the present utility model;

FIG. 3 is a cross-sectional view of the structure of the capacitor body of the present utility model;

fig. 4 is a schematic structural view of the first and second connection plates and the capacitor body according to the present utility model.

In the figure: 1 lead frame, 2 fretwork holes, 3 first connecting plates, 4 negative pole card hold the arm, 5 condenser bases, 6 condenser bodies, 7 second connecting plates, 8 positive pole card hold the arm, 9 insulating medium, 10 core package, 11 link, 12 lead pin constant head tank.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, a chip solid plastic package capacitor includes a lead frame 1, a plurality of hollow holes 2 are formed in the surface of the lead frame 1, the hollow holes 2 are arranged at equal intervals, a plurality of first connecting plates 3 are fixedly connected to the surface of the lead frame 1, negative electrode clamping arms 4 are fixedly connected to the left and right sides of one side surface of the first connecting plates 3, and plastic package capacitor components are attached to the surface of one side, far away from the first connecting plates 3, of the negative electrode clamping arms 4.

The plastic package capacitor assembly comprises a capacitor base 5, lead pin positioning grooves 12 are formed in the left end and the right end of the lower side of the capacitor base 5, the left end and the right end of the surface of one side of a capacitor base 5, which is far away from a negative clamping arm 4, are connected with a positive clamping arm 8 in a laminating mode, the surface of one side of the positive clamping arm 8, which is far away from the capacitor base 5, is fixedly connected with a second connecting plate 7, the middle of the opposite side of the second connecting plate 7 and the first connecting plate 3 is provided with lead pins, a plurality of hollowed holes 2 are formed between the first connecting plate 3 and the second connecting plate 7 once, the upper side surface of the capacitor base 5 is fixedly connected with a capacitor body 6, the inner wall surface of the capacitor body 6 is adhered with an insulating medium 9, the insulating medium 9 is made of rubber, the inner wall surface of the capacitor body 6 is completely laminated, the middle part of the inner wall of the capacitor body 6 is fixedly connected with a core package 10, the left end and the right end of the lower side of the core package 10 are fixedly connected with a connecting end 11, and the top end 11 penetrates through the capacitor base 5 and extends to the lower side surface of the core package 10.

In this embodiment, the lead pins disposed in the middle of the second connecting plate 7 and the first connecting plate 3 may be directly inserted into the capacitor base 5 through the lead pin positioning slots 12 and connected with the connection end 11, so as to be electrically connected with the core package 10, and the insulating medium 9 is made of rubber, which does not have good tightness and insulation.

When the insulation structure is used, the outer side of the core package 10 can be wrapped by the insulation medium 9, two connecting ends 11 fixed at the bottom end of the core package 10 are arranged at the left end and the right end of the inner side of the capacitor base 5 so as to be connected with the positive clamping arm 8 and the negative clamping arm 4, the lower side surface of the capacitor base 5 is moved to the upper side of the lead frame 1, and meanwhile, the lower side surface of the capacitor base 5 is clamped on the left side and the right side through the second connecting plate 7 and the first connecting plate 3 respectively, so that looseness can be effectively avoided under severe conditions, and middle lead pins of the positive clamping arm 8 and the negative clamping arm 4 are inserted into the lead pin positioning groove 12 to be connected with the connecting ends 11.

The beneficial effects of the embodiment are as follows:

the patch type solid plastic package capacitor can effectively improve the electric energy transmission and can not fall off by inserting the lead pins in the middle of the positive clamping arm 8 and the negative clamping arm 4 which are connected at the left end and the right end of the first connecting plate 3 and the second connecting plate 7 into the lead pin positioning groove 12 and matching the first connecting plate 3 and the second connecting plate 7.

This solid-state plastic envelope capacitor of paster, it can have fine insulating property to wrap up through insulating medium 9 through the core package 10 outside, and core package 10 bottom mounting's two link 11 set up the left and right sides both ends in the capacitor base 5 inboard so that with anodal card hold the arm 8 and the negative pole card hold the arm 4 between be connected, solved the connection between lead frame and the condenser and not firm enough, the problem that the pine takes off easily appears when using for a long time or service environment is comparatively abominable.

The electrical components appearing herein are all electrically connected with the master controller and the power supply, the master controller can be a conventional known device for controlling a computer and the like, and the prior art of power connection is not described in detail herein.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a paster solid state plastic package capacitor, includes lead frame (1), its characterized in that: the surface of the lead frame (1) is fixedly connected with a plurality of first connecting plates (3), the left side and the right side of one side surface of the first connecting plates (3) are fixedly connected with negative electrode clamping arms (4), and one side surface, far away from the first connecting plates (3), of the negative electrode clamping arms (4) is attached with a plastic package capacitor assembly;

the plastic package capacitor assembly comprises a capacitor base (5), a capacitor body (6) is fixedly connected to the upper side surface of the capacitor base (5), an insulating medium (9) is adhered to the inner wall surface of the capacitor body (6), a core bag (10) is fixedly connected to the middle of the inner bottom wall of the capacitor body (6), and connecting ends (11) are fixedly connected to the left end and the right end of the lower side of the core bag (10).

2. The chip solid state plastic package capacitor as claimed in claim 1, wherein: the capacitor base (5) is far away from the left and right ends of the surface of one side of the negative electrode clamping arm (4) and is connected with positive electrode clamping arms (8) in an attached mode, and a plurality of hollowed-out holes (2) are formed in the surface of the lead frame (1).

3. The chip solid state plastic package capacitor as claimed in claim 2, wherein: the positive electrode clamping arm (8) is fixedly connected with a second connecting plate (7) on one side surface far away from the capacitor base (5), and the hollowed holes (2) are arranged at equal intervals.

4. A chip solid state plastic package capacitor as defined in claim 3, wherein: the plurality of hollowed holes (2) are arranged between the first connecting plate (3) and the second connecting plate (7) at one time, and the top ends of the connecting ends (11) penetrate through the capacitor base (5) and extend to the lower side surface of the core bag (10) of the capacitor base.

5. The chip solid state plastic package capacitor as defined in claim 4, wherein: lead pin positioning grooves (12) are formed in the left end and the right end of the lower side of the capacitor base (5).

6. The chip solid state plastic package capacitor as claimed in claim 1, wherein: the insulating medium (9) is made of rubber and is completely attached to the inner wall surface of the capacitor body (6).

7. The chip solid state plastic package capacitor as defined in claim 4, wherein: and the middle parts of one side opposite to the second connecting plate (7) and the first connecting plate (3) are respectively provided with a lead pin.