CN219320991U - Electronic display with heat radiation structure - Google Patents
Electronic display with heat radiation structure Download PDFInfo
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- CN219320991U CN219320991U CN202320207698.9U CN202320207698U CN219320991U CN 219320991 U CN219320991 U CN 219320991U CN 202320207698 U CN202320207698 U CN 202320207698U CN 219320991 U CN219320991 U CN 219320991U
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- heat conduction
- heat dissipation
- heat
- electronic display
- silicone grease
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses an electronic display with a heat radiation structure, relates to the technical field of heat radiation of electronic displays, and aims to solve the problems that the existing electronic display utilizes flowing air to realize heat radiation operation, the heat radiation effect is poor under the condition of higher external environment temperature, active refrigeration and heat radiation cannot be carried out, and the whole practicability and the heat radiation effect are both to be improved. The inside fixed mounting of shell body has the work circuit board, one side of work circuit board is provided with the heat conduction casing, the inside packing of heat conduction casing has first heat conduction silicone grease layer, first heat conduction silicone grease layer laminating is on one side surface of work circuit board, one side of heat conduction casing is provided with the semiconductor refrigeration board, the laminating of semiconductor refrigeration board is on one side surface of heat conduction casing, the inside of shell body is provided with the mounting groove, and the inside fixed mounting of mounting groove has the heat dissipation casing.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electronic displays, in particular to an electronic display with a heat dissipation structure.
Background
The electronic display is used as an electronic product, and the circuit board in the electronic display can generate heat during operation, and as the operation of the electronic element has a certain requirement on temperature, the electronic display needs to perform heat dissipation operation on the working circuit board during operation, so that the stable operation of the circuit board is ensured.
The authorized bulletin number is: the utility model discloses an LED electronic display with good heat dissipation performance, which belongs to the technical field of displays and comprises a shell and an LED display main body, wherein the LED display main body is detachably connected in the shell, the right end of the shell is provided with a square hole, the inside of the square hole is movably hinged with a mounting plate through a hinge shaft, the right end of the mounting plate is fixedly connected with a driving motor, the output end of the driving motor movably penetrates through the mounting plate, the output end of the driving motor is fixedly connected with a cooling fan, the cooling fan is positioned in the shell, the outer side of the shell is provided with a reciprocating lifting mechanism, the reciprocating lifting mechanism is connected with the driving motor, the lower side of the shell is provided with a supporting mechanism, the heat dissipation effect of the display can be improved through the mutual cooperation of the cooling fan and the heat dissipation hole, and further, the display is prevented from being damaged due to high temperature.
Disclosure of Invention
The utility model aims to provide an electronic display with a heat dissipation structure, which is used for solving the problems that the existing electronic display in the background technology realizes heat dissipation operation by using flowing air, has poor heat dissipation effect and cannot perform active refrigeration and heat dissipation under the condition of higher external environment temperature, and has to be improved in the whole practicability and heat dissipation effect.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an electronic display from taking heat radiation structure, includes the shell body, the inside fixed mounting of shell body has the work circuit board, one side of work circuit board is provided with the heat conduction casing, the inside of heat conduction casing is filled with first heat conduction silicone grease layer, first heat conduction silicone grease layer laminating is on one side surface of work circuit board, one side of heat conduction casing is provided with the semiconductor refrigeration board, the laminating of semiconductor refrigeration board is on one side surface of heat conduction casing.
Preferably, the inside of shell body is provided with the mounting groove, and the inside fixed mounting of mounting groove has the heat dissipation casing, one side of heat dissipation casing is provided with the second heat conduction silicone grease layer.
Preferably, the second heat-conducting silicone grease layer is attached to the outer surface of the other side of the semiconductor refrigeration plate, and the second heat-conducting silicone grease layer is located between the semiconductor refrigeration plate and the heat dissipation shell.
Preferably, the display screen is mounted on the inner wall of the outer shell in a buckling manner, and the display screen is electrically connected with the working circuit board.
Preferably, fin structures are arranged on the outer surfaces of the heat dissipation shell and the heat conduction shell, the fin structures on the outer surfaces of the heat conduction shell are inserted into the first heat conduction silicone grease layer, and the fin structures on the outer surfaces of the heat dissipation shell penetrate through grooves in the back of the outer shell and are arranged outside the outer shell.
Preferably, the lower surface of the outer shell is fixedly provided with a movable connecting seat, and the lower end surface of the movable connecting seat is fixedly connected with a support column base.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the working circuit board is fixedly arranged in the outer shell, the heat conducting shell is arranged on one side of the working circuit board, the first heat conducting silicone grease layer is filled in the heat conducting shell, the first heat conducting silicone grease layer is attached to the outer surface of one side of the working circuit board, the semiconductor refrigerating plate is arranged on one side of the heat conducting shell, the heat generated by the working circuit board can be efficiently conducted to the heat conducting shell by utilizing the first heat conducting silicone grease layer, then the temperature on the heat conducting shell is actively reduced by utilizing the refrigeration of the semiconductor refrigerating plate, the active cooling operation is effectively realized, the efficient heat dissipation operation is further effectively realized, compared with the traditional natural heat dissipation mode by arranging the heat dissipation holes on the shell, the heat dissipation effect is stronger, compared with the heat dissipation mode by utilizing the axial flow fan, the heat dissipation structure is stronger in silence, the vibration condition can not occur after the long-time use, and the overall heat dissipation effect and stability are stronger.
Drawings
FIG. 1 is a perspective first view of the present utility model;
FIG. 2 is a perspective second view of the present utility model;
fig. 3 is an internal structural view of the present utility model.
In the figure: 1. an outer housing; 2. a display screen; 3. a support column base; 4. a movable connecting seat; 5. a heat dissipation housing; 6. a working circuit board; 7. a thermally conductive housing; 8. a first thermally conductive silicone grease layer; 9. a semiconductor refrigeration plate; 10. and a second thermally conductive silicone grease layer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-3, an embodiment of the present utility model is provided: the utility model provides an electronic display from taking heat radiation structure, including shell body 1, the inside fixed mounting of shell body 1 has work circuit board 6, one side of work circuit board 6 is provided with heat conduction casing 7, the inside packing of heat conduction casing 7 has first heat conduction silicone grease layer 8, first heat conduction silicone grease layer 8 laminating is on the surface of one side of work circuit board 6, one side of heat conduction casing 7 is provided with semiconductor refrigeration board 9, semiconductor refrigeration board 9 laminating is on the surface of one side of heat conduction casing 7, this can utilize first heat conduction silicone grease layer 8 to conduct the high-efficient heat transfer of work circuit board 6 work production to heat conduction casing 7, then utilize the refrigeration of semiconductor refrigeration board 9 to initiatively reduce the temperature on the heat conduction casing 7, the operation of effectual realization initiative cooling, and then the operation of effectual realization high-efficient heat dissipation, compared traditional mode through offering the louvre on the casing carries out natural heat dissipation, this radiating effect is stronger, compare the mode through axial fan carries out radiating, this heat radiation structure silence nature is stronger, and can not be after long-time use, holistic stability and vibration effect are stronger.
Further, the inside of shell 1 is provided with the mounting groove, and the inside fixed mounting of mounting groove has heat dissipation casing 5, one side of heat dissipation casing 5 is provided with second heat conduction silicone grease layer 10, second heat conduction silicone grease layer 10 laminating is on the opposite side surface of semiconductor refrigeration board 9, second heat conduction silicone grease layer 10 is located between semiconductor refrigeration board 9 and heat dissipation casing 5, all be provided with the fin structure on the surface of heat dissipation casing 5 and heat conduction casing 7, and the fin structure on the surface of heat conduction casing 7 is installed in the inside of first heat conduction silicone grease layer 8, the fin structure on the surface of heat dissipation casing 5 runs through the logical groove in shell 1 back, and be placed in the outside of shell 1, this can utilize second heat conduction silicone grease layer 10 and heat dissipation casing 5 to conduct the heat that produces on the other side of semiconductor refrigeration board 9 to the external environment in, the stable work of this electronic display heat dissipation structure has been guaranteed.
Further, buckle installs display screen 2 on the inner wall of shell body 1, and display screen 2 and work circuit board 6 electric connection have movable connection seat 4 on the lower surface of shell body 1, fixedly connected with support column foot 3 on the lower terminal surface of movable connection seat 4, this has guaranteed that this electronic display can be by normal use.
Working principle: when the electronic display is used, the electronic display is placed at a designated position through the support column base 3, then normal use can be carried out, in the use process, the working circuit board 6 generates heat and is conducted to the heat conduction shell 7 through the first heat conduction silicone grease layer 8, the semiconductor refrigeration plate 9 is started at the moment, the temperature of the heat conduction shell 7 can be effectively reduced due to the fact that the refrigeration surface of the semiconductor refrigeration plate 9 is attached to the outer surface of the heat conduction shell 7, heat dissipation operation is achieved, meanwhile, the second heat conduction silicone grease layer 10 conducts the problem generated on the heating surface of the semiconductor refrigeration plate 9 to the heat dissipation shell 5, heat dissipation is accelerated through the fin structure on the heat dissipation shell 5, and stable operation of the electronic display is guaranteed.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. An electronic display with a heat dissipation structure, comprising an outer shell (1), characterized in that: the inside fixed mounting of shell body (1) has work circuit board (6), one side of work circuit board (6) is provided with heat conduction casing (7), the inside of heat conduction casing (7) is filled there is first heat conduction silicone grease layer (8), first heat conduction silicone grease layer (8) laminating is on one side surface of work circuit board (6), one side of heat conduction casing (7) is provided with semiconductor refrigeration board (9), semiconductor refrigeration board (9) laminating is on one side surface of heat conduction casing (7).
2. The electronic display with heat dissipation structure as defined in claim 1, wherein: the heat dissipation device is characterized in that a mounting groove is formed in the outer shell (1), a heat dissipation shell (5) is fixedly mounted in the mounting groove, and a second heat conduction silicone grease layer (10) is arranged on one side of the heat dissipation shell (5).
3. The electronic display with heat dissipation structure as recited in claim 2, wherein: the second heat conduction silicone grease layer (10) is attached to the outer surface of the other side of the semiconductor refrigeration plate (9), and the second heat conduction silicone grease layer (10) is located between the semiconductor refrigeration plate (9) and the heat dissipation shell (5).
4. The electronic display with heat dissipation structure as defined in claim 1, wherein: the display screen (2) is mounted on the inner wall of the outer shell (1) in a buckling mode, and the display screen (2) is electrically connected with the working circuit board (6).
5. The electronic display with heat dissipation structure as recited in claim 2, wherein: the heat dissipation shell body (5) and the heat conduction shell body (7) are respectively provided with a fin structure on the outer surfaces, the fin structures on the outer surfaces of the heat conduction shell body (7) are inserted into the first heat conduction silicone grease layer (8), and the fin structures on the outer surfaces of the heat dissipation shell body (5) penetrate through the through grooves in the back of the outer shell body (1) and are arranged outside the outer shell body (1).
6. The electronic display with heat dissipation structure as defined in claim 1, wherein: the lower surface of the outer shell (1) is fixedly provided with a movable connecting seat (4), and the lower end surface of the movable connecting seat (4) is fixedly connected with a support column base (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320207698.9U CN219320991U (en) | 2023-02-14 | 2023-02-14 | Electronic display with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320207698.9U CN219320991U (en) | 2023-02-14 | 2023-02-14 | Electronic display with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219320991U true CN219320991U (en) | 2023-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320207698.9U Active CN219320991U (en) | 2023-02-14 | 2023-02-14 | Electronic display with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219320991U (en) |
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2023
- 2023-02-14 CN CN202320207698.9U patent/CN219320991U/en active Active
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