CN219258300U - Semiconductor device accommodating shell - Google Patents

Abstract

The utility model relates to the technical field of semiconductors and discloses a semiconductor device accommodating shell which solves the problems that the protection effect of the existing semiconductor device protecting shell is poor, impact force cannot be effectively reduced when the outside is impacted, and damage to a semiconductor device is easy to occur.

Description

Semiconductor device accommodating shell

Technical Field

The utility model belongs to the technical field of semiconductors, and particularly relates to a semiconductor device accommodating shell.

Background

The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, the semiconductor device is fragile, a protective shell is required to be covered outside to protect the semiconductor device, the existing protective shell is made of plastics or steel, impact force cannot be effectively reduced when the outside is impacted, the semiconductor device is easy to damage, the use is influenced, the protective effect of the protective shell of the semiconductor device is poor, impact force cannot be effectively reduced when the outside is impacted, and the semiconductor device is easy to damage.

Disclosure of Invention

In view of the above, in order to overcome the defects of the prior art, the present utility model provides a semiconductor device accommodating housing, which effectively solves the problems that the protection effect of the existing semiconductor device protecting housing is poor, the impact force cannot be effectively reduced when the outside is impacted, and the semiconductor device is easy to be damaged.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor device holding casing, includes the holding case, holding case upper end one side is connected with the protection subassembly, the protection chamber has been seted up to holding incasement portion one side, the equal symmetrical connection in holding incasement portion both sides has the carriage, the inside one side sliding connection of carriage has the semiconductor device body, the protection subassembly is including installing the connecting plate in holding case upper end middle part both sides, the connecting plate upper end is connected with the protection casing, the connecting plate lower extreme runs through and extends to the inside department of protection chamber, connecting plate lower extreme both sides are the slope structure setting.

Preferably, the inside both sides of protection chamber all are connected with the gag lever post, the outside both sides of gag lever post all overlap and are equipped with the movable plate, movable plate one end both sides all are connected with branch, branch one end is connected with the hang plate, hang plate slope one end is laminated each other with connecting plate slope one side.

Preferably, one of them movable plate one end both sides all are connected the round bar, round bar one end is connected with the telescopic link, telescopic link one end is connected with another movable plate one side, telescopic link one end runs through and extends to the inside department of round bar and be connected with the clamp plate.

Preferably, one end of the pressing plate is connected with a damping rod, one end of the damping rod is connected with one side of the inner part of the round rod, a spring is sleeved on one side of the outer part of the damping rod, one end of the spring is connected with one side of the pressing plate, and the other end of the spring is connected with one side of the inner wall of the round rod.

Preferably, the movable plate lower extreme one side rotates and is connected with the dwang, dwang one end rotates and is connected with the buffer board, the outside sliding connection of buffer board has the buffer seat, the buffer seat lower extreme is connected with the inside bottom of protection chamber, the inside bottom of buffer seat is connected with the elasticity soft board, elasticity soft board upper end is connected with the buffer board lower extreme, the elasticity soft board is wave structure setting.

Preferably, one end of the accommodating box is rotationally connected with a cover plate, heat dissipation openings are formed in the periphery of one end of the cover plate, and a dustproof filter screen is connected inside the heat dissipation openings.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, through the arrangement of the protection component, when the outside of the protection cover is subjected to impact force, the inclined end of the inclined plate is mutually attached to the inclined surface of the connecting plate, the connecting plate moves downwards to drive the inclined plate to move, the inclined plate moves to drive the movable plate to move to two sides, then the damping rod stretches out, the spring is in a stretching state, part of the impact force is reduced under the absorption of the damping rod and the spring, meanwhile, the buffer plate is driven by the rotating rod to move downwards, the elastic soft plate is compressed by the downward movement of the buffer plate, and then the impact force of the other part of the impact force can be reduced, so that the safety of the accommodating box is protected, the impact force is prevented from directly contacting the accommodating box, and the safety of the semiconductor device body is damaged under the impact.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model.

In the drawings:

fig. 1 is a front view of a semiconductor device housing according to the present utility model;

FIG. 2 is a schematic view of the mounting structure of the carriage of the present utility model;

FIG. 3 is a schematic view of the protective assembly of the present utility model;

FIG. 4 is a schematic view of the mounting structure of the spring of the present utility model;

FIG. 5 is a schematic diagram of a connection structure of the elastic flexible board according to the present utility model;

in the figure: 1. a housing box; 2. a protective assembly; 21. a connecting plate; 22. a protective cover; 23. a limit rod; 24. a moving plate; 25. a support rod; 26. an inclined plate; 27. a round bar; 28. a telescopic rod; 29. a pressing plate; 210. a damping rod; 211. a spring; 212. a rotating lever; 213. a buffer plate; 214. a buffer seat; 215. an elastic soft board; 3. a protective cavity; 4. a carriage; 5. a semiconductor device body; 6. a cover plate; 7. and a heat radiation port.

Detailed Description

The present application is described in further detail below in conjunction with figures 1-5.

The embodiment of the application discloses a semiconductor device accommodating shell. Referring to fig. 1-2, including holding case 1, holding case 1 upper end one side is connected with protection subassembly 2, protection chamber 3 has been seted up to holding case 1 inside one side, holding case 1 inside both sides all symmetric connection has carriage 4, it slides in carriage 4 to remove semiconductor device body 5, and then conveniently take off and install semiconductor device body 5, sliding connection has semiconductor device body 5 in carriage 4 inside one side, holding case 1 one end rotates and is connected with apron 6, the thermovent 7 has all been seted up all around apron 6 one end, thermovent 7 plays the radiating effect, avoid holding case 1 inside high temperature, the influence is caused to semiconductor device body 5, thermovent 7 internally connected has dustproof filter screen, when outside air passes through thermovent 7 to get into holding case 1 inside, dustproof filter screen can effectively filter the dust in the air, protection subassembly 2 is including installing in connecting plate 21 of holding case 1 upper end middle part both sides, the connecting plate 21 upper end is connected with protection casing 22, when the object impact holding case 1, protection casing 22 is contacted with the object at first, protection casing 22 plays the protection effect to holding case 1, the lower extreme 21 is run through 21, the inclined structure is set up to the connecting plate 21 is down to the both sides and incline and is moved down to the connecting plate 21, both sides slope structure is moved down to the connecting plate 21.

Referring to fig. 3-5, both sides of the inside of the protection cavity 3 are connected with a limit rod 23, when the movable plate 24 slides along the outside of the limit rod 23, the limit rod 23 plays a role of limiting, the movable plate 24 can slide along a straight line only, both sides of the outside of the limit rod 23 are sleeved with the movable plate 24, both sides of one end of the movable plate 24 are connected with a supporting rod 25, one end of the supporting rod 25 is connected with an inclined plate 26, the inclined end of the inclined plate 26 is attached to one inclined surface of the connecting plate 21, the connecting plate 21 moves downwards to drive the inclined plate 26 to move, then the inclined plate 26 drives the movable plate 24 to move towards both sides, one end of one movable plate 24 is connected with a round rod 27, one end of the round rod 27 is connected with a telescopic rod 28, one end of the telescopic rod 28 is connected with one side of the other movable plate 24, one end of the telescopic rod 28 extends through to the inside of the round rod 27 to be connected with a pressing plate 29, one end of the pressing plate 29 is connected with a damping rod 210, one end of the damping rod 210 is connected with one side of the inside of the round rod 27, the damping rod 210 stretches out or stretches out and draws back to play a role of damping, under the cooperation of a spring 211, a better absorbing impact force outside the protective cover 22, one side of the damping rod 210 is sleeved with a spring 211, one side of the outside the spring 211 is connected with one end of the damping rod 211, one end of the damping rod 215 is connected with the other end of the damping rod 215, the damping rod 215 is connected with the damping rod 213, one end of the damping rod 213 is connected with the other end of the damping rod 213, the damping rod 213 is connected with the other end of the damping rod 213, the damping rod is connected with the other end of the damping rod 213, and the damping rod is connected with the end of the damping rod 213, and the other end of the damping rod is connected with the damping rod and the other end of the damping rod 23, 3. And further, the external force applied to the buffer plate 213 can be absorbed, and thus, the impact force applied to the protection cover 22 can be reduced.

The implementation principle of the semiconductor device accommodating shell in the embodiment of the application is as follows: when the protective cover 22 is used, the protective cover 22 moves downwards when being subjected to impact force, the connecting plate 21 moves downwards to be in contact with the inclined plate 26, one inclined end of the inclined plate 26 is mutually attached to one inclined surface of the connecting plate 21, the inclined plate 21 moves downwards to drive the inclined plate 26 to move, the inclined plate 26 moves to drive the movable plate 24 to move, the movable plate 24 moves to two sides under the limiting effect of the limiting rod 23, the movable plate 24 moves to drive the round rod 27 and the telescopic rod 28 to be away from each other, the pressing plate 29 drives the spring 211 to move, the damping rod 210 stretches out, the spring 211 is in a stretching state, a part of impact force is reduced under the absorption of the damping rod 210 and the spring 211, the rotating rod 212 is driven to move when the movable plate 24 moves, the buffer plate 213 is driven to move downwards, and when the buffer plate 213 moves downwards to compress the elastic soft plate 215, the elastic soft plate 215 is in a wave-shaped structure, and external force applied to the buffer plate 213 can be absorbed, and then the impact force of the other part of the elastic soft plate 215 can be reduced, so that the safety of the storage box 1 is protected, the impact force is prevented from directly contacting the storage box 1, and the safety of the body 5 is damaged under impact.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A semiconductor device housing, comprising a housing box (1), characterized in that: the protection device is characterized in that a protection component (2) is connected to one side of the upper end of the accommodating box (1), a protection cavity (3) is formed in one side of the inner portion of the accommodating box (1), sliding frames (4) are symmetrically connected to two sides of the inner portion of the accommodating box (1), a semiconductor device body (5) is connected to one side of the inner portion of the sliding frames (4) in a sliding mode, the protection component (2) comprises a connecting plate (21) mounted on two sides of the middle of the upper end of the accommodating box (1), a protection cover (22) is connected to the upper end of the connecting plate (21), the lower end of the connecting plate (21) penetrates through and extends to the inner portion of the protection cavity (3), and two sides of the lower end of the connecting plate (21) are in inclined structure.

2. The semiconductor device housing according to claim 1, wherein: the protection cavity (3) is characterized in that limit rods (23) are connected to two sides of the inside of the protection cavity (3), movable plates (24) are sleeved on two sides of the outside of the limit rods (23), supporting rods (25) are connected to two sides of one end of each movable plate (24), inclined plates (26) are connected to one end of each supporting rod (25), and inclined ends of the inclined plates (26) are mutually attached to inclined surfaces of the connecting plates (21).

3. The semiconductor device housing according to claim 2, wherein: one of them movable plate (24) one end both sides all are connected round bar (27), round bar (27) one end is connected with telescopic link (28), telescopic link (28) one end is connected with another movable plate (24) one side, telescopic link (28) one end runs through and extends to round bar (27) inside department and be connected with clamp plate (29).

4. A semiconductor device housing according to claim 3, wherein: the damping rod is characterized in that one end of the pressing plate (29) is connected with a damping rod (210), one end of the damping rod (210) is connected with one side of the inside of the round rod (27), a spring (211) is sleeved on one side of the outside of the damping rod (210), one end of the spring (211) is connected with one side of the pressing plate (29), and the other end of the spring (211) is connected with one side of the inner wall of the round rod (27).

5. The semiconductor device housing according to claim 2, wherein: the utility model discloses a movable plate, including movable plate (24), movable plate, buffer plate (213), buffer plate (214) lower extreme and protection cavity (3) inside bottom are connected, buffer plate (214) inside bottom is connected with elastic soft board (215), elastic soft board (215) upper end is connected with buffer plate (213) lower extreme, elastic soft board (215) are wave structure setting.

6. The semiconductor device housing according to claim 1, wherein: the dustproof filter comprises a containing box (1), and is characterized in that one end of the containing box is rotatably connected with a cover plate (6), heat dissipation ports (7) are formed in the periphery of one end of the cover plate (6), and dustproof filter screens are connected inside the heat dissipation ports (7).

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