CN219244831U - High-sensitivity temperature sensor - Google Patents
High-sensitivity temperature sensor Download PDFInfo
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- CN219244831U CN219244831U CN202223531224.4U CN202223531224U CN219244831U CN 219244831 U CN219244831 U CN 219244831U CN 202223531224 U CN202223531224 U CN 202223531224U CN 219244831 U CN219244831 U CN 219244831U
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Abstract
The utility model relates to the technical field of temperature measurement, in particular to a high-sensitivity temperature sensor which comprises a wire rod, a sensing chip arranged at one end of the wire rod and a bullet-shaped shell sleeved on the sensing chip, wherein a heat-conducting silicone grease layer is packaged at the small opening end of the bullet-shaped shell, one end of the sensing chip is positioned in the heat-conducting silicone grease layer, a heat-conducting epoxy resin layer is packaged between the sensing chip and the wire rod, a potting epoxy resin layer is packaged between the sensing chip, the wire rod and the bullet-shaped shell, the heat-conducting epoxy resin layer is arranged in a circular truncated cone shape, the small opening end of the heat-conducting epoxy resin layer is connected with the heat-conducting silicone grease layer, and the interface of the heat-conducting silicone grease layer and the heat-conducting epoxy resin layer is arranged in a wave shape. The utility model has the effect of short response time.
Description
Technical Field
The utility model relates to the technical field of temperature measurement, in particular to a high-sensitivity temperature sensor.
Background
In daily life and actual production, temperature is a very important physical measurement quantity, and a common thermocouple, a thermal resistance temperature sensor, an infrared thermometer and the like are generally used for measuring the temperature at present.
However, the current temperature sensor is generally packaged by using epoxy resin, but the response is relatively slow, and the response time of the current temperature sensor is very high in some fields, but the response time of the current temperature sensor is generally about two seconds, and the requirement of short response time cannot be met, so improvement is needed.
Disclosure of Invention
The utility model provides a high-sensitivity temperature sensor aiming at the problems in the prior art, and aims to solve the technical problems in the prior art.
The utility model provides a high-sensitivity temperature sensor, which adopts the following technical scheme:
the utility model provides a high sensitivity temperature sensor, includes the wire rod, set up in sensing chip and the cover of wire rod one end tip are located bullet shape shell on the sensing chip, the tip encapsulation of bullet shape shell has the heat conduction silicone grease layer, sensing chip's one end is located in the heat conduction silicone grease layer, sensing chip with the encapsulation has the heat conduction epoxy layer between the wire rod, sensing chip the wire rod with encapsulate between the bullet shape shell has the embedment epoxy layer.
Preferably, the heat conduction coefficient of the heat conduction silicone grease layer ranges from 1.5W/(m.K).
Preferably, the thermal conductivity of the encapsulating epoxy resin layer ranges from 1.0 to 2.2W/(m.K).
Preferably, the thermal conductivity of the thermal conductive epoxy layer is in the range of 1.5-2.2W/(m.k).
Preferably, the heat-conducting epoxy resin layer is arranged in a truncated cone shape, and the small opening end of the heat-conducting epoxy resin layer is connected with the heat-conducting silicone grease layer.
Preferably, the interface between the heat conduction silicone grease layer and the heat conduction epoxy resin layer is in a wavy arrangement.
In summary, the present utility model includes at least one of the following beneficial technical effects:
external heat is transmitted to the sensing chip through the shell and the heat-conducting silicone grease layer, the sensing chip converts the temperature change into an electric signal and transmits the electric signal out, the whole process is sensitive and rapid, the response time is less than 0.5 seconds, and the design requirement is met through the test use of 1 ten thousand pcs.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present utility model.
In the figure: 1. a wire rod; 2. a sensing chip; 3. a bullet-shaped housing; 4. a thermally conductive silicone grease layer; 5. a thermally conductive epoxy layer; 6. encapsulating the epoxy resin layer; 7. and a fixing ring.
Detailed Description
The present utility model will be described in further detail with reference to fig. 1.
The embodiment of the utility model discloses a high-sensitivity temperature sensor, as shown in fig. 1, the high-sensitivity temperature sensor comprises wires 1 and a sensing chip 2 arranged at one end part of the wires 1, the sensing chip 2 can be a common nfc thermistor in the market, the wires 1 are two, each wire 1 comprises wires and a protective layer wrapping the wires, one ends of the two wires 1 close to each other are exposed, the sensing chip 2 comprises two pins, the exposed two wires are respectively welded to the two pins of the sensing chip 2, meanwhile, a heat-conducting epoxy resin layer 5 is packaged on the exposed wires, the heat-conducting epoxy resin layer 5 is arranged in a truncated cone shape, the exposed two wires are completely positioned in the heat-conducting epoxy resin layer 5, one end part of the wires 1 close to the sensing chip 2 is positioned in the heat-conducting epoxy resin layer 5, the sensing chip 2 is positioned at a small opening end of the heat-conducting epoxy resin layer 5, and one part of the sensing chip 2 is positioned in the heat-conducting epoxy resin layer 5. Meanwhile, the thermal conductivity of the thermal conductive epoxy layer 5 ranges from 1.5 to 2.2W/(m.k), and in this embodiment, the thermal conductivity of the thermal conductive epoxy layer 5 may be 1.5W/(m.k). The thermally conductive epoxy layer 5 in this thermal conductivity range has good heat conduction capability.
Referring to fig. 1, in addition, a bullet-shaped housing 3 is sleeved on the sensing chip 2 and the heat-conducting epoxy resin layer 5, the sensing chip 2 is located at the small opening end of the bullet-shaped housing 3, so that the distance from heat conduction to the sensing chip 2 is greatly reduced, response sensitivity is improved, the heat-conducting epoxy resin layer 5 is completely located in the bullet-shaped housing 3, and the bottom end part of the wire 1 close to the sensing chip 2 is located in the bullet-shaped housing 3. Meanwhile, the small opening end of the bullet-shaped shell 3 is encapsulated with the heat-conducting silicone grease layer 4, the heat-conducting silicone grease layer 4 is positioned in the bullet-shaped shell 3, the part of the sensing chip 2 exposed out of the heat-conducting epoxy resin layer 5 is positioned in the heat-conducting silicone grease layer 4, the heat-conducting silicone grease generally takes organic silicone as a main raw material, and the prepared heat-conducting silicone grease-like compound is added with materials with excellent heat resistance and heat conduction performance, so that the heat-conducting silicone grease-like compound has good heat conduction performance, and the heat-conducting silicone grease layer 4 can improve heat transfer efficiency, so that the sensing chip 2 can quickly sense the change of external temperature. The heat conduction silicone grease layer 4 is connected with the small opening end of the heat conduction epoxy resin layer 5, and meanwhile, the interface of the heat conduction silicone grease layer 4 and the heat conduction epoxy resin layer 5 is in wave-shaped arrangement, and the arrangement can enable the connection of the heat conduction silicone grease layer 4 and the heat conduction epoxy resin layer 5 to be more compact. In addition, the thermal conductivity of the thermal silicone grease layer 4 ranges from 1.5W/(m.k), and in this embodiment, the thermal conductivity of the thermal silicone grease layer 4 may be 1.5W/(m.k), and the thermal silicone grease layer 4 within this thermal conductivity range has good thermal conductivity, so as to improve the response sensitivity of the sensing chip 2.
Referring to fig. 1, in addition, the bullet-shaped casing 3 is internally encapsulated with a potting epoxy layer 6, the potting epoxy layer 6 is circumferentially arranged on the outer peripheral surfaces of the heat-conducting epoxy layer 5 and the wire 1, and the potting epoxy layer 6 can improve the sealing performance, and meanwhile, the sensing chip 2 is not easy to fall off from the bullet-shaped casing 3. The thermal conductivity of the potting epoxy layer 6 ranges from 1.0W/(m.k), in this embodiment, the thermal conductivity of the potting epoxy layer 6 may be 1.0W/(m.k), and the use of epoxy with a lower thermal conductivity can reduce cost. In addition, for the convenience of installation on the electrical apparatus, fixed ring 7 has been fixedly sleeved on bullet shape shell 3.
The implementation principle of the high-sensitivity temperature sensor provided by the embodiment of the utility model is as follows: the operator fills heat conduction silicone grease layer 4 at the tip of bullet shape shell 3 earlier, then peg graft heat conduction epoxy resin layer 5 into the shell, and insert sensing chip 2 in heat conduction silicone grease layer 4, then embedment on embedment epoxy resin layer 6 in bullet shape shell 3, fix heat conduction epoxy resin layer 5, in the during operation, external heat passes through shell and heat conduction silicone grease layer 4, transfer sensing chip 2, sensing chip 2 converts the change of temperature into the signal of telecommunication and carries out, whole process is sensitive quick, response time has reached below 0.5 seconds, and through the test use of 1 ten thousand pcs, all reached the design requirement.
The present utility model is not limited to the preferred embodiments, but is intended to be limited to the following description, and any modifications, equivalent changes and variations in light of the above-described embodiments will be apparent to those skilled in the art without departing from the scope of the present utility model.
Claims (6)
1. A high sensitivity temperature sensor, characterized by: the sensing chip comprises a wire rod (1), a sensing chip (2) arranged at one end of the wire rod (1) and a bullet-shaped shell (3) sleeved on the sensing chip (2), wherein a heat-conducting silicone grease layer (4) is packaged at the small opening end of the bullet-shaped shell (3), one end of the sensing chip (2) is positioned in the heat-conducting silicone grease layer (4), a heat-conducting epoxy resin layer (5) is packaged between the sensing chip (2) and the wire rod (1), and a potting epoxy resin layer (6) is packaged between the wire rod (1) and the bullet-shaped shell (3).
2. A high sensitivity temperature sensor according to claim 1, wherein: the heat conduction coefficient of the heat conduction silicone grease layer (4) ranges from 1.5W/(m.K).
3. A high sensitivity temperature sensor according to claim 1, wherein: the heat conductivity coefficient of the encapsulating epoxy resin layer (6) ranges from 1.0W/(m.K).
4. A high sensitivity temperature sensor according to claim 1, wherein: the heat conduction coefficient of the heat conduction epoxy resin layer (5) ranges from 1.5W/(m.K).
5. A high sensitivity temperature sensor according to claim 1, wherein: the heat-conducting epoxy resin layer (5) is arranged in a truncated cone shape, and the small opening end of the heat-conducting epoxy resin layer (5) is connected with the heat-conducting silicone grease layer (4).
6. A high sensitivity temperature sensor according to claim 5, wherein: the interface of the heat conduction silicone grease layer (4) and the heat conduction epoxy resin layer (5) is arranged in a wave shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223531224.4U CN219244831U (en) | 2022-12-27 | 2022-12-27 | High-sensitivity temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223531224.4U CN219244831U (en) | 2022-12-27 | 2022-12-27 | High-sensitivity temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219244831U true CN219244831U (en) | 2023-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223531224.4U Active CN219244831U (en) | 2022-12-27 | 2022-12-27 | High-sensitivity temperature sensor |
Country Status (1)
| Country | Link |
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| CN (1) | CN219244831U (en) |
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2022
- 2022-12-27 CN CN202223531224.4U patent/CN219244831U/en active Active
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