CN219243346U - Heating device for semiconductor gas storage bottle - Google Patents

Abstract

The application relates to the technical field of gas storage devices, and particularly discloses a heating device for a semiconductor gas storage bottle, which comprises a first metal heating module and a heating rod, wherein the first metal heating module comprises a first metal holding block and a second metal holding block, and the first metal holding block and the second metal holding block are buckled to form a first accommodating chamber for accommodating the gas storage bottle; the first metal holding block and the second metal holding block are both internally provided with first mounting holes, the heating rod is inserted in the first mounting holes, and heat generated by the heating rod is transferred to the first accommodating cavity through the first metal holding block and the second metal holding block. The utility model provides a can carry out reliable and stable heating to the gas bomb through the improvement to heating device structure, improve the temperature control ability that is used for semiconductor gas bomb heating device.

Description

Heating device for semiconductor gas storage bottle

Technical Field

The application relates to the technical field of gas storage devices, in particular to a heating device for a semiconductor gas storage bottle.

Background

The current atomic vapor deposition process requires the use of a gas cylinder to store a chemical gas source and allow the chemical gas source to be rapidly released into a reaction chamber at a specific temperature by the gas cylinder, so that the gas cylinder needs to be heated to ensure that hot gas at the specific temperature is introduced into the reaction chamber, thereby preventing the generation of particles due to gas condensation. The prior art adopts the silica gel heating band to twine in the gas bomb outside generally, heats the gas cylinder through the inside heating wire of silica gel heating band. There are problems in that the silica gel heating tape is easily aged under the condition of long-time heating, so that the silica gel heating tape is not firmly adhered, and the temperature accuracy of the silica gel heating tape is low. In addition, the silica gel heating belt is softer, and if the silica gel heating belt is too severely bent, the heating wire can be broken, so that the heating failure is caused. The prior art therefore does not allow a stable and reliable heating of the gas cylinder.

Disclosure of Invention

The object of the present application is to provide a heating device for a semiconductor gas bomb, which can heat the gas bomb stably and reliably, and improve the temperature control capability for the semiconductor gas bomb heating device.

Embodiments of the present application are implemented as follows:

the application provides a heating device for a semiconductor gas storage bottle, which comprises a first metal heating module and a heating rod, wherein the first metal heating module comprises a first metal holding block and a second metal holding block, and the first metal holding block and the second metal holding block are buckled to form a first accommodating cavity; the first metal holding block and the second metal holding block are both internally provided with first mounting holes, the heating rod is inserted in the first mounting holes, and heat generated by the heating rod is transferred to the first accommodating cavity through the first metal holding block and the second metal holding block.

As an embodiment, the first accommodating chamber is used for accommodating a gas cylinder, and the first mounting hole is provided along a length direction of the gas cylinder.

As an implementation mode, the vacuum gauge also comprises a vacuum gauge, wherein the vacuum gauge is communicated with the gas storage bottle through a connecting joint; the second metal heating module is arranged outside the connecting joint.

As an embodiment, the connection joint is a 90 ° right angle joint with both ends respectively connected to the vacuum gauge and the gas cylinder.

As an implementation manner, the first metal heating module and the second metal heating module are both provided with temperature detection assemblies.

As an implementation manner, the second metal heating module comprises a third metal holding block and a fourth metal holding block, the third metal holding block and the fourth metal holding block are buckled to form a second accommodating cavity, and the connecting joint is arranged in the second accommodating cavity; the inner wall surfaces of the third metal holding block and the fourth metal holding block are attached to the outer wall surface of the connecting joint.

As an implementation mode, the third metal holding block and the fourth metal holding block are provided with second mounting holes along the extending direction of the connecting joint, heating assemblies are arranged in the second mounting holes, and heat generated by the heating assemblies is transmitted to the connecting joint through the third metal holding block and the fourth metal holding block.

As an implementation mode, connecting holes are formed in the buckling surfaces of the first metal holding block and the second metal holding block at intervals, and connecting pieces are arranged in the connecting holes; and/or the buckling surfaces of the third metal holding block and the fourth metal holding block are provided with connecting holes at intervals, and connecting pieces are arranged in the connecting holes.

As an implementation manner, a heat conducting medium layer is arranged between the inner wall surface of the first metal heating module and the outer wall surface of the gas storage bottle; and/or a heat conducting medium layer is arranged between the inner wall surface of the second accommodating chamber and the outer wall surface of the connecting joint.

As an embodiment, the first metal heating module is provided with a fixing member for fixing the first metal heating module; a heat insulation assembly is arranged between the contact surface of the fixing piece and the first metal heating module.

The beneficial effects of the embodiment of the application include: the application provides a heating device for a semiconductor gas bomb, which comprises a gas bomb, a first metal heating module and a heating rod, wherein the first metal heating module comprises a first metal holding block and a second metal holding block, and a first accommodating cavity is formed by buckling the first metal holding block and the second metal holding block; this application is with the gas bomb setting in first chamber that holds, embraces piece and second metal through the heating rod to first metal simultaneously and embraces the piece and heat for first metal embraces the piece and can reach the temperature of predetermineeing with the second metal embraces the piece, and then with temperature transfer to the gas bomb, realizes the heating to the gas bomb. Compared with the prior art, the heating structure is stable, the service life is long, and the gas cylinder can be heated stably and reliably. In addition, the first metal holding block and the second metal holding block are heated through the heating rod, and heat is conducted to the inside of the first accommodating cavity through metal, so that the gas storage bottle is uniformly heated, and accurate heating of gas in the gas storage bottle is facilitated. The first metal heating module and the heating rod provided by the application are low in implementation cost and convenient to implement. This application is through inserting the heating rod and establish in first mounting hole, is favorable to carrying out quick replacement to the heating rod, and the accessible changes the adjustment of heating power of the heating rod realization of different specifications, therefore the technical scheme application that this application provided application range is wide, has the characteristics that the practicality is strong.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a first overall construction diagram of a heating device for a semiconductor gas cylinder according to an embodiment of the present application;

FIG. 2 is a second overall construction diagram of a heating device for a semiconductor gas cylinder according to an embodiment of the present application;

FIG. 3 is a third overall construction diagram of a heating device for a semiconductor gas cylinder according to an embodiment of the present application;

fig. 4 is a fourth overall configuration diagram of a heating device for a semiconductor gas cylinder according to an embodiment of the present application.

Icon: 100-gas storage bottles; 101-a first metal heating module; 102-heating a rod; 103-a first metal block; 104-a second metal holding block; 105-a first accommodation chamber; 106-a first mounting hole; 107-vacuum gauge; 108-connecting joints; 109-a second metal heating module; 110-a temperature detection assembly; 111-a third metal block; 112-a fourth metal block; 113-a second containment chamber; 114-a second mounting hole; 115-a heating assembly; 116-connecting holes; 117-connection; 118-a heat conducting medium layer; 119-fixing piece; 120-insulation assembly.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

Referring to fig. 1 and 2, the present application provides a heating device for a semiconductor gas bomb, which comprises a first metal heating module 101 and a heating rod 102, wherein the first metal heating module 101 comprises a first metal holding block 103 and a second metal holding block 104, and the first metal holding block 103 and the second metal holding block 104 are buckled to form a first accommodating chamber 105 for accommodating the gas bomb 100; the first metal holding block 103 and the second metal holding block 104 are internally provided with a first mounting hole 106, the heating rod 102 is inserted into the first mounting hole 106, and heat generated by the heating rod 102 is transmitted to the gas storage bottle 100 through the first metal holding block 103 and the second metal holding block 104.

It should be noted that, in the heating device for a semiconductor gas bomb provided in the embodiment of the present application, the gas bomb 100 is disposed in the first accommodating chamber 105, and the outer wall of the gas bomb 100 may be attached to the inner walls of the first metal holding block 103 and the second metal holding block 104, so that the first metal holding block 103 and the second metal holding block 104 may directly transfer heat to the gas bomb 100. The first metal holding block 103 and the second metal holding block 104 may be made of metal materials such as stainless steel, copper, and aluminum. For example, the first metal holding block 103 and the second metal holding block 104 are rectangular aluminum blocks, and the first accommodating chamber 105 and the first mounting hole 106 inside the first metal holding block 103 and the second metal holding block 104 may be obtained by machining. In this embodiment, the heating rod 102 is specifically used to heat the first metal holding block 103 and the second metal holding block 104, and according to the scene, a person skilled in the art can also replace the heating rod 102 with other heating components 115, so as to achieve heating of the first metal holding block 103 and the second metal holding block 104. For example, heating wires may be used to heat the first and second metal clasps 103 and 104. For example, the heating plate may be used to heat the first metal holding block 103 and the second metal holding block 104, where the heating plate may be inserted into the first metal holding block 103 and the second metal holding block 104, or may be directly attached to the surfaces of the first metal holding block 103 and the second metal holding block 104 to implement heating.

The heating device for the semiconductor gas storage bottle comprises a first metal heating module 101 and a heating rod 102, wherein the first metal heating module 101 comprises a first metal holding block 103 and a second metal holding block 104, and a first accommodating chamber 105 is formed by buckling the first metal holding block 103 and the second metal holding block 104; this application sets up gas bomb 100 in first accommodation chamber 105, through heating rod 102 to holding piece 103 and second metal holding piece 104 simultaneously to first metal holding piece 103 and second metal holding piece 104 can reach the temperature of predetermineeing, and then with the temperature transfer to gas bomb 100, realizes the heating to gas bomb 100. Compared with the prior art that adopts the silica gel heating tape to twine in the gas bomb 100 outside, the heating system of heating the gas cylinder through the inside heating wire of silica gel heating tape, the heating structure of this application is stable, long service life can carry out reliable and stable's heating to the gas cylinder. In addition, the first metal holding block 103 and the second metal holding block 104 are heated through the heating rod 102, and heat is conducted to the inside of the first accommodating chamber 105 through metal, so that the gas storage bottle 100 can be uniformly heated, and accurate heating of gas in the gas storage bottle 100 is facilitated. The first metal heating module 101 and the heating rod 102 provided by the application are low in implementation cost and convenient to implement. This application is through inserting the heating rod 102 and establish in first mounting hole 106, is favorable to carrying out quick replacement to the heating rod 102, and the adjustment to heating power is realized to the heating rod 102 of the different specifications of accessible change, therefore the technical scheme application that this application provided is wide in application range, has the characteristics that the practicality is strong.

Referring to fig. 3, as an embodiment, the first mounting hole 106 is provided along the longitudinal direction of the gas cylinder 100. The embodiment of the application discloses a setting direction of first mounting hole 106 preferred, this application embodiment through setting up first mounting hole 106 along the length direction of gas bomb 100, can make heating rod 102 insert first metal and second metal and hold piece 103 and 104 along the length direction of gas bomb 100, consequently makes first metal and hold piece 103 and second metal and hold piece 104 and can obtain even heating in length direction. It should be noted that, a person skilled in the art may adjust the setting direction of the first mounting hole 106 as required. In addition, all can set up the first mounting hole 106 that a plurality of intervals set up on first metal embracing piece 103 and the second metal embracing piece 104 to can make first mounting hole 106 evenly set up, realize embracing the even heating of piece 103 and second metal embracing piece 104, make first metal embracing piece 103 and second metal embracing piece 104 can carry out accurate stable heating to gas bomb 100, reduce the temperature error when heating, effectively improve the temperature control ability that is used for the heating device of semiconductor gas bomb.

Referring to fig. 1, 2 and 3, as an embodiment, the vacuum gauge 107 is further included, and the vacuum gauge 107 communicates with the gas cylinder 100 through a connection joint 108; the connection joint 108 is provided externally with a second metal heating module 109. The gas cylinder 100 of the embodiment of the application is communicated with the vacuum gauge 107 through the connecting joint 108, and the detection of the gas pressure inside the gas cylinder 100 can be completed through the vacuum gauge 107. The embodiment of the present application heats the connection joint 108 through the second metal heating module 109, so as to avoid the temperature change of the gas passing through the connection joint 108, which results in the decrease of the uniformity of the gas temperature inside the gas bomb 100. It should be noted that, the first metal heating module 101 and the second metal heating module 109 need to heat the gas cylinder 100 and the connection joint 108 at the same time, wherein the connection joint 108 may be a stainless steel tube joint.

As shown in fig. 2 and 4, the connection joint 108 is a 90 ° right angle joint having both ends connected to the vacuum gauge 107 and the gas cylinder 100, respectively. Because the pressure gauge is usually connected to the head or tail of the gas bomb 100 in the prior art, the pressure gauge has a large volume and a heavy weight, which results in a relatively occupied space of the whole device, and causes a relatively large stress on the connecting joint 108, which can result in poor air tightness of the connecting joint 108 in long-term use. Therefore, the connecting joint 108 disclosed in the embodiment of the present application is a 90 ° right angle joint, and is communicated with the gas bomb 100 by welding, and the vacuum gauge 107 is connected with the connecting joint 108 by a VCR joint, so as to avoid the problem of reduced air tightness at the joint. The vacuum gauge 107 can be connected with the gas cylinder 100 side by side through the 90 degree right angle joint, and the installation space required by the whole device can be saved to a certain extent.

Referring to fig. 2 and 3, as an embodiment, a temperature detecting unit 110 is disposed on each of the first metal heating module 101 and the second metal heating module 109. In this embodiment, temperature detection assemblies 110 are respectively disposed on the first metal heating module 101 and the second metal heating module 109, and the temperatures of the first metal heating module 101 and the second metal heating module 109 are detected in real time by the temperature detection assemblies 110, so as to reflect the temperature inside the gas bomb 100. The embodiments of the present application thus enable temperature detection of the gas inside the gas cylinder 100 by means of the temperature detection assembly 110. The temperature detection of the gas in the gas storage bottle 100 is beneficial to helping the first metal heating module 101 and the second metal heating module 109 to accurately heat the gas storage bottle 100, so that the gas in the gas storage bottle 100 is ensured to be at a preset specific temperature, the temperature control capability of the whole device can be greatly improved, and the gas with the specific temperature is ensured to be introduced into the reaction chamber during vapor deposition, so that the generation of particles caused by gas condensation is prevented.

Referring to fig. 3 and 4, as an implementation manner, the second metal heating module 109 includes a third metal holding block 111 and a fourth metal holding block 112, where the third metal holding block 111 and the fourth metal holding block 112 are buckled to form a second accommodating chamber 113, and the connection joint 108 is disposed in the second accommodating chamber 113; the inner wall surfaces of the third metal block 111 and the fourth metal block 112 are bonded to the outer wall surface of the connection joint 108. The outer wall of the connecting joint 108 in the embodiment of the application may be attached to the inner walls of the third metal holding block 111 and the fourth metal holding block 112, so that the third metal holding block 111 and the fourth metal holding block 112 can directly transfer heat to the connecting joint 108. The third metal holding block 111 and the fourth metal holding block 112 may be made of metal materials such as stainless steel, copper, and aluminum. For example, the third metal holding block 111 and the fourth metal holding block 112 are rectangular aluminum blocks, and the second accommodating chambers 113 inside the third metal holding block 111 and the fourth metal holding block 112 may be obtained by machining.

Referring to fig. 1, as an embodiment, the third metal block 111 and the fourth metal block 112 are provided with a second mounting hole 114 along the extending direction of the connection joint 108, a heating assembly 115 is provided in the second mounting hole 114, and heat generated by the heating assembly 115 is transferred to the connection joint 108 through the third metal block 111 and the fourth metal block 112. The purpose of the heating component 115 in the second mounting hole 114 in the embodiment of the present application is to heat the third metal block 111 and the fourth metal block 112. For example, the third metal block 111 and the fourth metal block 112 may be heated using the heating rod 102. For example, the heating plate may be used to heat the third metal holding block 111 and the fourth metal holding block 112, where the heating plate may be inserted into the third metal holding block 111 and the fourth metal holding block 112, or may be directly attached to the surfaces of the third metal holding block 111 and the fourth metal holding block 112 to achieve heating.

Referring to fig. 3, as an embodiment, a connecting hole 116 is formed on the fastening surface of the first metal block 103 and the second metal block 104 at intervals, and a connecting piece 117 is formed in the connecting hole 116; and/or, the fastening surface of the third metal holding block 111 and the fourth metal holding block 112 is provided with a connecting hole 116 at intervals, and a connecting piece 117 is arranged in the connecting hole 116. The embodiment of the application discloses a connection mode of a first metal holding block 103 and a second metal holding block 104 or a third metal holding block 111 and a fourth metal holding block 112. The connecting piece 117 is arranged in the connecting hole 116, so that the first metal holding block 103 and the second metal holding block 104 can stably hold and surround the gas cylinder 100, or the third metal holding block 111 and the fourth metal holding block 112 can stably hold and surround the connecting joint 108. It should be noted that, a person skilled in the art may specifically select the connection member 117 as needed. The connection 117 may be a bolt, a rivet, for example.

Referring to fig. 2, as an embodiment, a heat conductive medium layer 118 is provided between the inner wall surface of the first metal heating module 101 and the outer wall surface of the gas cylinder 100; and/or a heat conductive medium layer 118 is provided between the inner wall surface of the second accommodation chamber 113 and the outer wall surface of the connection joint 108. This embodiment sets up heat conduction medium layer 118 at metal heating module internal face to make heat conduction medium layer 118 and gas bomb 100 and the outer wall surface contact of attach fitting 108, consequently make first metal heating module 101 and second metal heating module 109 can be with the heat that produces transfer fast to gas bomb 100 and attach fitting 108 on, realize the promotion of heat conduction efficiency.

Referring to fig. 3, as an embodiment, a fixing member 119 for fixing the first metal heating module 101 is provided on the first metal heating module 101; an insulating assembly 120 is disposed between the mount 119 and the contact surface of the first metal heating module 101. The fixing piece 119 is arranged on the first metal heating module 101, and the whole device is convenient to fix through the fixing piece 119, so that the whole device can be installed on a rack of equipment. The heat insulation assembly 120 is arranged between the fixing piece 119 and the first metal heating module 101, so that the first metal heating module 101 is prevented from transferring heat to the fixing piece 119, and the fixing piece 119 is in a normal temperature state. It should be noted that, a person skilled in the art may set the specific structure of the fixing element 119 according to needs, so as to fix the whole device.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (10)

1. A heating device for a semiconductor gas bomb, characterized by comprising a first metal heating module (101) and a heating rod (102), wherein the first metal heating module (101) comprises a first metal holding block (103) and a second metal holding block (104), and the first metal holding block (103) and the second metal holding block (104) are buckled to form a first accommodating chamber (105); the first metal holding block (103) and the second metal holding block (104) are internally provided with first mounting holes (106), the heating rod (102) is inserted into the first mounting holes (106), and heat generated by the heating rod (102) is transmitted to the first accommodating chamber (105) through the first metal holding block (103) and the second metal holding block (104).

2. A heating device for a semiconductor gas cylinder according to claim 1, characterized in that the first housing chamber (105) is for placing a gas cylinder (100), the first mounting hole (106) being arranged along the length of the gas cylinder (100).

3. The heating device for a semiconductor gas cylinder according to claim 2, further comprising a vacuum gauge (107), the vacuum gauge (107) being in communication with the gas cylinder (100) through a connection joint (108); the second metal heating module (109) is arranged outside the connecting joint (108).

4. A heating device for a semiconductor gas cylinder according to claim 3, characterized in that the connection joint (108) is a 90 ° right angle joint with both ends connected to the vacuum gauge (107) and the gas cylinder (100), respectively.

5. A heating device for a semiconductor gas cylinder according to claim 3, characterized in that the first metal heating module (101) and the second metal heating module (109) are each provided with a temperature detection assembly (110).

6. A heating device for a semiconductor gas bomb according to claim 3, characterized in that the second metal heating module (109) comprises a third metal holding block (111) and a fourth metal holding block (112), the third metal holding block (111) and the fourth metal holding block (112) are buckled to form a second containing chamber (113), and the connecting joint (108) is arranged in the second containing chamber (113); the inner wall surfaces of the third metal holding block (111) and the fourth metal holding block (112) are attached to the outer wall surface of the connecting joint (108).

7. The heating device for a semiconductor gas bomb according to claim 6, characterized in that the third metal holding block (111) and the fourth metal holding block (112) are provided with a second mounting hole (114) along the extending direction of the connecting joint (108), a heating component (115) is arranged in the second mounting hole (114), and heat generated by the heating component (115) is transferred to the connecting joint (108) through the third metal holding block (111) and the fourth metal holding block (112).

8. The heating device for the semiconductor gas bomb according to claim 6, wherein connecting holes (116) are formed in the buckling surface of the first metal holding block (103) and the second metal holding block (104) at intervals, and connecting pieces (117) are arranged in the connecting holes (116); and/or, the fastening surface of the third metal holding block (111) and the fourth metal holding block (112) is provided with connecting holes (116) at intervals, and connecting pieces (117) are arranged in the connecting holes (116).

9. The heating device for a semiconductor gas cylinder according to claim 6, characterized in that a heat conducting medium layer (118) is provided between the inner wall surface of the first metal heating module (101) and the outer wall surface of the gas cylinder (100); and/or a heat conducting medium layer (118) is arranged between the inner wall surface of the second accommodating chamber (113) and the outer wall surface of the connecting joint (108).

10. A heating device for a semiconductor gas cylinder according to claim 1, characterized in that the first metal heating module (101) is provided with a fixing element (119) for fixing the first metal heating module (101); an insulation assembly (120) is arranged between the fixing piece (119) and the contact surface of the first metal heating module (101).

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