CN219228307U

CN219228307U - Base plate hold-down mechanism of integrated circuit board chip mounter

Info

Publication number: CN219228307U
Application number: CN202320060713.1U
Authority: CN
Inventors: 周维; 温远锋; 宋天福
Original assignee: Shenzhen Bochuangde Electronics Co ltd
Current assignee: Shenzhen Bochuangde Electronics Co ltd
Priority date: 2023-01-09
Filing date: 2023-01-09
Publication date: 2023-06-20
Anticipated expiration: 2033-01-09

Abstract

The utility model discloses a substrate pressing mechanism of an integrated circuit board chip mounter, which relates to the field of circuit board chip mounter, and aims to solve the technical problems that an operator is required to manually turn over and lock a substrate when a double-sided substrate of an integrated circuit board is mounted, the operation is complicated and the chip mounter is not beneficial to the mounting operation; can drive the vertical lifting of base plate and overturn under the drive of upset motor through sucking disc structure, the chip mounter of being convenient for carries out two-sided paster fast to the both sides of base plate.

Description

Base plate hold-down mechanism of integrated circuit board chip mounter

Technical Field

The utility model belongs to the field of circuit board surface mounting equipment, and particularly relates to a substrate pressing mechanism of an integrated circuit board surface mounting machine.

Background

When the circuit board is subjected to the surface mounting process, the surface of the circuit board is subjected to work, and then the mounting position on the circuit board is aligned with the operation station of the chip mounter and firmly positioned through the locking mechanism, so that the situation that dislocation occurs due to the fact that the circuit board is displaced when the chip is mounted is avoided, the existing integrated circuit board is provided with a substrate structure capable of being subjected to double-sided mounting compared with a single-chip circuit board, more electric elements can be carried on the integrated circuit board, but when the integrated circuit board is subjected to double-sided alternate mounting operation, operators are required to manually release the fixation, the substrate is overturned and is fixed again, the operation is complicated, and the quick operation of the chip mounter is not facilitated.

The traditional Chinese patent with the publication number of CN217770521U discloses a circuit board patch positioning device, which comprises a protective cover, a placement box, a placement table, a U-shaped plate, a connecting column, a sliding plate, a side plate, a rotating rod, a clamping plate, a rubber pad, a plug-in column, a base plate, a bonding plate, a sliding rod and a squeezing plate. Through clamping mechanism's setting, through promoting the stripper plate, when making the interval in its two supports minimum, the laminating board is placed the top of placing the box with placing the box inside, through reset spring's effect, make two stripper plates can extrude the both sides of circuit board, under the effect of gear and curb plate, make two sliding plates be close to the circuit board simultaneously, and then when rubber pad and circuit board laminating, the staff only need twist the position that limiting nut on the spliced pole of arbitrary one side can fix two clamp plates, and then all press from both sides tightly fixedly around to the circuit board, avoid when the paster, the circuit board takes place the displacement, cause the condition that the dislocation appears in the paster.

Therefore, to the situation that the operator needs to manually overturn and lock the substrate when the double-sided substrate of the integrated circuit board is pasted, the operation is complex, and pasting operation is not facilitated, a novel substrate pressing mechanism is developed, and the sucker structure with adsorption capacity is used as an auxiliary overturning mechanism to be matched with a synchronous pressing mechanism, so that the quick overturning and fixing of the integrated circuit board are achieved.

Disclosure of Invention

(1) Technical problem to be solved

Aiming at the defects of the prior art, the utility model aims to provide a substrate pressing mechanism of an integrated circuit board chip mounter, which aims to solve the technical problems that an operator is required to manually turn over and lock a substrate when a double-sided substrate of an integrated circuit board is mounted at present, the operation is complex, and the chip mounting operation is not facilitated.

(2) Technical proposal

In order to solve the technical problems, the utility model provides a substrate pressing mechanism of an integrated circuit board chip mounter, which comprises a chip mounting operation table, a positioning groove arranged at the upper end of the chip mounting operation table, and suckers symmetrically arranged above the positioning groove in a left-right manner, wherein magnetic tracks are symmetrically arranged at the left and right sides of the upper end of the chip mounting operation table, a linear motor is arranged at one opposite side of each magnetic track, a turnover motor is fixedly arranged at one end of a shell of the linear motor towards the positioning groove, an end head seat is arranged at the top end of a power output element of the turnover motor, an air pressure pump is arranged at the upper end of the end head seat, and the lower end of the air pressure pump is fixedly connected with the upper end of the suckers through a pump pipeline.

When the substrate pressing mechanism of the integrated circuit board chip mounter is used, a user places a substrate of an integrated circuit board into a positioning groove and stably supports the substrate by utilizing a supporting beam, then a linear motor drives an end seat to longitudinally move downwards along a magnetic track to be close to a substrate surface until the sucker contacts with the substrate surface, then an air pump pumps air in the sucker, the substrate is adsorbed at the lower end of the sucker by utilizing internal and external air pressure difference, then a first rotary motor is started, a balance Liang Duixiang is driven to horizontally rotate ninety degrees, then a blowing mechanism is started, the surface of the substrate is blown and dedusted by high-speed air flow, after dedusting is finished, a second rotary motor is started, a pressing angle seat is driven to rotate to one side of the edge of the substrate by a certain angle until the edge of the pressing angle seat is tightly attached to the edge of the substrate, then the front end of the substrate is subjected to a pressing locking effect, the surface of the substrate is subjected to a chip mounting operation by a chip mounter arranged at the upper end of a chip mounting operation table, after the chip mounting is finished, the surface is completely mounted, the pressing angle seat is rotated, the edge of the substrate is removed, the substrate is adsorbed by the linear motor is driven to move upwards the positioning groove, then the turnover motor is driven, the end of the substrate is driven to rotate to the substrate to rotate one hundred degrees, the substrate is driven to rotate the substrate to rotate the base, and then the substrate to rotate one side to the edge to the substrate to tightly press the edge by the base, and the substrate is locked by the angle seat.

Further, both ends are provided with the end tank about the constant head tank, the end tank set up in the magnetic track downside, the constant head tank bottom set up with the end tank is in logical groove on the same horizontal line, and linear motor moves to the bottom along the magnetic track is vertical down, avoids producing the interference between linear motor and the paster operation panel through the setting of end tank.

Further, two groups of parallel supporting beams are fixedly arranged at the bottom end of the inner side of the positioning groove, the supporting beams are arranged on the front side and the rear side of the through groove, a gasket is arranged on the inner wall of the rear end of the positioning groove, the supporting beams have a certain height, a certain space exists below the base plate, and after the base plate is turned over, structures such as a sucker are hidden in the space between the base plate and the supporting beams.

Further, a rotary motor is symmetrically arranged at the upper end of the patch operating table, the rotary motor is arranged at the front side of the magnetic track, a balance beam is arranged at the upper end of a power output element of the rotary motor, the rotary motor drives the balance beam to horizontally rotate, so that a compression angle seat outside a positioning groove enters the positioning groove and is close to the front end edge of the substrate.

Further, the balance beam is far away from the upper end of one side of the first rotary motor and is provided with the second rotary motor, the lower part of the balance beam is provided with a pressing angle seat with the edge in a smooth arc shape, the pressing angle seat is arranged at the lower end of a power output element of the second rotary motor, the pressing angle seat horizontally rotates under the driving of the second rotary motor, the pressing angle seat has a certain length, and the arc-shaped end part of the pressing angle seat is extruded at the edge of the substrate in the rotating process.

Further, the linear motor and the turnover motor are both arranged above the end groove, the end head seat and the air pressure pump are both arranged above the through groove, after the sucking disc and the air pressure pump are turned over, the sucking disc and the air pressure pump fall back to the positioning groove along with the substrate, the through groove provides a folding space for the sucking disc and the air pressure pump, and interference between structures such as the inner wall of the bottom end of the positioning groove and the air pressure pump is avoided.

Further, compress tightly the angle seat surface and be provided with the cladding pad, the mechanism of sweeping is installed to the compensating beam upper end, sweeping the mechanism and including bellows, air-blower and air-out panel, the flexible material of cladding pad plays the guard action when locking the base plate edge, and the compensating beam is rotatory, makes the air-out position forward facing the base plate of sweeping the mechanism and the air outlet slope is decurrent, and the air-blower is to the high-speed air current of base plate surface blast, sweeps the dust.

(3) Advantageous effects

Compared with the prior art, the utility model has the beneficial effects that: the substrate pressing mechanism of the integrated circuit board chip mounter adopts the air pressure pump to be matched with the sucker so as to longitudinally adsorb and fix the surface of the substrate, and the vertical pressing is performed and the positioning stability is improved by means of adsorption; the substrate can be driven to longitudinally lift and turn over under the drive of the turning motor through the sucker structure, the direction of the surface of the substrate is adjusted, and the chip mounter can conveniently and rapidly carry out double-sided chip mounting on two sides of the substrate; when sucking disc adsorbs and vertical compress tightly fixedly, the tight angle seat of base plate front side carries out horizontal extrusion locking to the edge of base plate simultaneously, improves positioning stability.

Drawings

Fig. 1 is a schematic diagram of an assembly structure of a substrate pressing mechanism of an integrated circuit board mounter according to an embodiment of the present utility model;

fig. 2 is a schematic diagram of an assembly structure of another embodiment of a substrate pressing mechanism of an integrated circuit board mounter according to the present utility model;

fig. 3 is a schematic structural diagram of a bonding operation table of a specific embodiment of a substrate pressing mechanism of an integrated circuit board bonding machine according to the present utility model;

fig. 4 is a schematic diagram of a suction cup structure of a specific embodiment of a substrate pressing mechanism of an integrated circuit board chip mounter according to the present utility model;

fig. 5 is a schematic view of a pressing angle seat of a substrate pressing mechanism of an integrated circuit board chip mounter according to an embodiment of the present utility model.

The marks in the drawings are: 1. a patch operation table; 2. a positioning groove; 3. a magnetic track; 4. a linear motor; 5. a turnover motor; 6. an end head seat; 7. an air pressure pump; 8. a suction cup; 9. an end groove; 10. a through groove; 11. a bolster; 12. a gasket; 13. a first rotary motor; 14. a balance beam; 15. a second rotary motor; 16. compressing the angle seat; 17. a coating pad; 18. a purging mechanism.

Detailed Description

The embodiment is a substrate pressing mechanism for an integrated circuit board chip mounter, the assembly structure diagram of the substrate pressing mechanism is shown in fig. 1, the assembly structure diagram of the substrate pressing mechanism is shown in fig. 2, the structure diagram of a chip mounter 1 is shown in fig. 3, the structure diagram of a sucker 8 is shown in fig. 4, the structure diagram of a pressing angle seat 16 is shown in fig. 5, the substrate pressing mechanism comprises the chip mounter 1, a positioning groove 2 arranged at the upper end of the chip mounter 1, suckers 8 symmetrically arranged above the positioning groove 2 in a left-right manner, magnetic tracks 3 are symmetrically arranged at the left and right sides of the upper end of the chip mounter 1, a linear motor 4 is arranged at one side opposite to the magnetic tracks 3, a turnover motor 5 is fixedly arranged at one end of the positioning groove 2 in a shell of the linear motor 4, an end seat 6 is arranged at the top end of a power output element of the turnover motor 5, a pneumatic pump 7 is arranged at the upper end of the end seat 6, and the lower end of the pneumatic pump 7 is fixedly connected with the upper end of the sucker 8 through a pump pipeline.

For this embodiment, the linear motor 4 directly converts electric energy into linear motion mechanical energy, the magnetic track 3 is a magnetic track fixed with a magnet, the mover of the linear motor 4 comprises a coil winding, a hall element circuit board, a thermistor and an electronic interface, the position of the mover in a magnetic field generated by the magnetic track 3 is kept by the magnetic track 3, the linear motor 4 is fed back by the linear encoder, the linear motor 4 is pushed by magnetic force to axially move along the magnetic track 3, and the substrate of the integrated circuit board is pulled to longitudinally move to provide a turnover space.

The positioning groove 2 is provided with an end groove 9 at the left end and the right end, the end groove 9 is arranged at the lower side of the magnetic track 3, a through groove 10 which is positioned on the same horizontal line with the end groove 9 is formed at the bottom end of the positioning groove 2, two groups of parallel supporting beams 11 are fixedly arranged at the bottom end of the inner side of the positioning groove 2, the supporting beams 11 are arranged at the front side and the rear side of the through groove 10, gaskets 12 are arranged on the inner wall of the rear end of the positioning groove 2, the linear motor 4 and the turnover motor 5 are arranged above the end groove 9, the end seat 6 and the air pressure pump 7 are arranged above the through groove 10, the linear motor 4 moves downwards to the bottom along the longitudinal direction of the magnetic track 3, interference between the linear motor 4 and the patch operation table 1 is avoided through the arrangement of the end groove 9, the supporting beams 11 have a certain height, structures such as a sucker 8 are hidden in a space between the substrate and the supporting beams 11 after the substrate is turned over, the sucker 8 and the space between the sucker 8 and the air pressure pump 11 is avoided, and the suction pump 7 falls back to the bottom end groove 7 along with the turnover seat 7, and the space between the suction pump 7 and the positioning groove 2 is provided, and the space between the sucker 7 and the suction pump is avoided.

Meanwhile, a first rotary motor 13 is symmetrically arranged at the upper end of the patch operation table 1 left and right, the first rotary motor 13 is arranged at the front side of the magnetic track 3, a balance beam 14 is arranged at the upper end of a power output element of the first rotary motor 13, a second rotary motor 15 is arranged at the upper end of one side of the balance beam 14, which is far away from the first rotary motor 13, a compression angle seat 16 with a smooth arc-shaped edge is arranged below the balance beam 14, the compression angle seat 16 is arranged at the lower end of the power output element of the second rotary motor 15, the first rotary motor 13 drives the balance beam 14 to horizontally rotate, the compression angle seat 16 positioned outside the positioning groove 2 enters the positioning groove 2 and is close to the edge of the front end of the substrate, the compression angle seat 16 horizontally rotates under the driving of the second rotary motor 15, the compression angle seat 16 has a certain length, and the arc-shaped end of the compression angle seat 16 is extruded at the edge of the substrate in the rotating process.

In addition, compress tightly angle seat 16 surface and be provided with cladding pad 17, the mechanism 18 is swept in the installation of compensating beam 14 upper end, sweeping mechanism 18 includes bellows, air-blower and air-out panel, and the flexible material of cladding pad 17 plays the guard action when locking the base plate edge, and compensating beam 14 is through rotatory, makes the air-out position forward facing the base plate of sweeping mechanism 18 and the air outlet slope downwards, and the air-blower is to the high-speed air current of base plate surface blast, sweeps the dust.

When the substrate pressing mechanism of the integrated circuit board surface mounting machine is used, a user places a substrate of the integrated circuit board into the positioning groove 2 and stably supports the substrate by utilizing the supporting beam 11, then the linear motor 4 drives the end head seat 6 to longitudinally move downwards along the magnetic track 3 to be close to the substrate surface until the sucker 8 is in contact with the substrate surface, then the air in the sucker 8 is pumped out by the air pump 7, the substrate is adsorbed at the lower end of the sucker 8 by utilizing internal and external air pressure difference, then the first rotary motor 13 is started, the balance beam 14 is driven to horizontally rotate ninety degrees, then the purging mechanism 18 is started, the substrate surface is purged and dedusted by high-speed air flow, after dedusting is finished, the second rotary motor 15 is started, the compaction angle seat 16 is driven to rotate a certain angle towards one side of the edge of the substrate until the edge of the compaction angle seat 16 is tightly attached to the edge of the substrate, then the surface of the substrate is subjected to surface mounting operation on the lower side of the substrate by the surface mounting machine arranged at the upper end of the surface mounting operation table 1, after the surface mounting is finished, the compaction angle seat 16 is rotated, the substrate edge of the substrate is removed, then the motor 4 is driven to be driven to move upwards by the linear motor 4 through the adsorption angle seat 4, the substrate 2 is driven to rotate upwards, the substrate surface positioning seat 2 is driven to be locked by the eighth rotary angle seat 4, and then the substrate surface positioning seat 4 is rotated, and the edge of the substrate is locked by the positioning seat 2.

Claims

1. The substrate pressing mechanism comprises a surface mounting operation table, a positioning groove arranged at the upper end of the surface mounting operation table, and suckers symmetrically arranged above the positioning groove; the patch operation table is characterized in that magnetic tracks are symmetrically arranged on the left side and the right side of the upper end of the patch operation table, a linear motor is arranged on one opposite side of the magnetic tracks, a turnover motor is fixedly arranged on a shell of the linear motor towards one end of the positioning groove, an end head seat is arranged on the top end of a power output element of the turnover motor, an air pressure pump is arranged on the upper end of the end head seat, and the lower end of the air pressure pump is fixedly connected with the upper end of the sucker through a pump air pipeline.

2. The substrate pressing mechanism of an integrated circuit board chip mounter according to claim 1, wherein end grooves are formed in left and right ends of the positioning groove, the end grooves are formed in the lower side of the magnetic track, and through grooves which are on the same horizontal line with the end grooves are formed in the bottom of the positioning groove.

3. The substrate pressing mechanism of an integrated circuit board mounting machine according to claim 2, wherein two sets of parallel joists are fixedly arranged at the bottom end of the inner side of the positioning groove, the joists are arranged at the front side and the rear side of the through groove, and a gasket is arranged on the inner wall of the rear end of the positioning groove.

4. The substrate pressing mechanism of an integrated circuit board chip mounter according to claim 1, wherein a first rotary motor is symmetrically installed at the upper end of the chip mounter operation table, the first rotary motor is arranged at the front side of the magnetic track, and a balance beam is installed at the upper end of a power output element of the first rotary motor.

5. The substrate pressing mechanism of the integrated circuit board chip mounter according to claim 4, wherein a second rotary motor is installed at the upper end of one side of the balance beam, which is far away from the first rotary motor, a pressing angle seat with a smooth arc-shaped edge is arranged below the balance beam, and the pressing angle seat is installed at the lower end of a power output element of the second rotary motor.

6. The substrate pressing mechanism of an integrated circuit board mounting machine according to claim 2, wherein the linear motor and the turnover motor are both disposed above the end slot, and the end seat and the air pressure pump are both disposed above the through slot.

7. The substrate pressing mechanism of claim 5, wherein the pressing angle seat surface is provided with a cladding pad, and the upper end of the balance beam is provided with a blowing mechanism, and the blowing mechanism comprises a bellows, a blower and an air outlet panel.