CN219210625U

CN219210625U - Automatic screening machine for BGA solder balls

Info

Publication number: CN219210625U
Application number: CN202320685283.2U
Authority: CN
Inventors: 闫焉服; 顾天亮; 贾亚杰; 李自强; 闫博恒
Original assignee: Haipu Semiconductor Luoyang Co ltd
Current assignee: Haipu Semiconductor Luoyang Co ltd
Priority date: 2023-03-31
Filing date: 2023-03-31
Publication date: 2023-06-20
Anticipated expiration: 2033-03-31

Abstract

The utility model discloses an automatic BGA solder ball screening machine, which comprises a storage hopper, a material guide pipe, a flow control valve, a micro motor, an optical fiber sensor, a screening table, a vibrating table and a controller, wherein the material guide pipe is arranged on the storage hopper; the feeding hopper is arranged at the position corresponding to the feeding hole on one side above the sieve table, the material guiding pipe is arranged on the discharging hole of the feeding hopper, the flow control valve is arranged on the material guiding pipe, the micro motor is arranged on the material guiding pipe on the lower side of the flow control valve, and the lower end of the material guiding pipe is positioned in the sieve table; the optical fiber sensor is arranged at the discharging position corresponding to the lower end of the material guiding pipe, the sieve table in the sieve table is arranged on the vibrating table, and the flow control valve, the micro motor, the optical fiber sensor and the vibrating table are all connected with the controller. According to the utility model, the corresponding materials are automatically collected through each discharge hole, so that the screening efficiency is improved; the inclination of the upper screen and the lower screen can be adjusted at will, and the device is suitable for screening solder balls of various specifications; the controller controls the micro motor to work according to the feedback material condition of the optical fiber sensor, prevents the blocking phenomenon in the blanking process of the BGA solder balls, and realizes unattended operation.

Description

Automatic screening machine for BGA solder balls

Technical Field

The utility model relates to the technical field of BGA solder ball screening, in particular to an automatic BGA solder ball screening machine.

Background

As the pins of the chip, BGA solder balls are extremely critical solder materials in the BGA packaging process, and because of their severe application scenario, the BGA solder balls are required to have characteristics of small ball diameter tolerance, high concentration, and the like, so that the ball diameter screening is required by using a precise screen or planetary precise screening equipment. Whether the precise screen or the planetary precise screening equipment has respective defects, such as manual or semi-automatic equipment screening is required for the precise screen, the efficiency is low, and the product quality cannot be ensured; the planetary precise screening equipment can realize full-automatic screening, but the screening efficiency is extremely low, and the equipment cost is high; because the existing microsphere screening technology in the industry is not mature enough, the particle size and the roundness of the microspheres have certain probability deviation to influence the screening quality, and therefore the microsphere screening technology becomes a technical problem to be solved urgently.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provide an automatic BGA solder ball screening machine which is continuous and stable in quality of screened products and high in screening efficiency.

The technical scheme adopted by the utility model is as follows:

an automatic BGA solder ball screening machine comprises a storage hopper, a material guide pipe, a flow control valve, a miniature motor, an optical fiber sensor, a screening table, a vibrating table and a controller;

the feeding hopper is arranged at a position corresponding to a feeding hole on one side above the sieve table, the material guiding pipe is arranged on a discharging hole of the feeding hopper, the flow control valve is arranged on the material guiding pipe, the micro motor is arranged on the material guiding pipe on the lower side of the flow control valve, and the lower end of the material guiding pipe is positioned in the sieve table; the optical fiber sensor is arranged in the sieve table corresponding to the discharging position of the lower end of the material guide pipe;

the screen table is arranged on the vibrating table, and an upper screen, a lower screen and a sliding plate are sequentially arranged in the screen table in an inclined manner from top to bottom; the mesh specification of the upper screen is the upper tolerance of the screened sphere diameter; the mesh specification of the lower screen is the lower tolerance of the screened sphere diameter; the side wall of the sieve table is respectively provided with a big ball discharge port, a good product discharge port and a small ball discharge port corresponding to the ends of the upper sieve, the lower sieve and the sliding plate;

the flow control valve, the micro motor, the optical fiber sensor and the vibrating table are all connected with the controller.

Specifically, the vertical distance between the discharge hole below the material guiding pipe and the upper screen is 3mm-5mm.

Specifically, the length of the upper screen mesh and the lower screen mesh is 300mm-400mm, the width of the upper screen mesh and the lower screen mesh is 160mm-200mm, the vertical distance between the upper screen mesh and the lower screen mesh is 10-50mm, and the gradient is 10-20 degrees.

More specifically, the upper ends of the upper screen and the lower screen are matched with limiting holes arranged on the side wall of the screen table through limiting pin shafts to adjust the inclination angles of the upper screen and the lower screen.

Specifically, the vibration frequency of the vibration table is 30-60Hz, and the vibration amplitude is 0.5-1 mm.

By adopting the technical scheme, the utility model has the following advantages:

the upper screen and the lower screen are arranged on the vibrating table, and the corresponding materials are automatically collected by each discharge port, so that the screening efficiency is improved; the inclination of the upper screen and the lower screen can be adjusted at will, and the device is suitable for screening solder balls with various specifications; the controller controls the micro motor to work according to the feedback material condition of the optical fiber sensor, prevents the blocking phenomenon in the blanking process of the BGA solder balls, and realizes unattended operation.

Drawings

Fig. 1 is an overall schematic of the present utility model.

In the figure: the device comprises a 1-storage hopper, a 2-material guide pipe, a 3-flow control valve, a 4-micro motor, a 5-optical fiber sensor, a 6-sieve table, a 61-upper sieve, a 62-lower sieve, a 63-sliding plate, a 64-limit pin shaft, a 7-vibrating table and an 8-controller.

Detailed Description

The present utility model is further explained below with reference to the drawings and examples, which are not to be construed as limiting the scope of the utility model, and the purpose of the present utility model is to protect all technical improvements within the scope of the utility model.

An automatic BGA solder ball screening machine shown in the attached figure 1 comprises a storage hopper 1, a material guide pipe 2, a flow control valve 3, a micro motor 4, an optical fiber sensor 5, a screening table 6, a vibrating table 7 and a controller 8.

The feeding hopper 1 is arranged at a position corresponding to a feeding hole on one side above the sieve table 6, the material guiding pipe 2 is arranged on a discharging hole of the feeding hopper 1, the flow control valve 3 is arranged on the material guiding pipe 2, the micro motor 4 is arranged on the material guiding pipe 2 on the lower side of the flow control valve 3, and the lower end of the material guiding pipe 2 is positioned inside the sieve table 6; the optical fiber sensor 5 is arranged in the sieve table 6 corresponding to the discharging position of the lower end of the material guiding pipe 2.

The screen table 6 is arranged on the vibrating table 7, and an upper screen 61, a lower screen 62 and a sliding plate 63 are sequentially arranged in the screen table 6 in an inclined manner from top to bottom; the mesh specification of the upper screen 61 is the upper tolerance of the screened sphere diameter; the mesh size of the lower screen 62 is the lower tolerance of the screened sphere diameter; the side wall of the sieve table 6 is provided with a big ball discharge port, a good product discharge port and a small ball discharge port corresponding to the ends of the upper sieve 61, the lower sieve 62 and the sliding plate 63.

The flow control valve 3, the micro motor 4, the optical fiber sensor 5 and the vibration table 7 are all connected with the controller 8.

Preferably, the vertical distance between the discharge hole below the material guiding pipe 2 and the upper screen 61 is 3mm-5mm.

Preferably, the length of the upper screen 61 and the lower screen 62 is 300mm-400mm, the width is 160mm-200mm, the vertical distance between the upper screen 61 and the lower screen 62 is 20mm, the upper ends of the upper screen 61 and the lower screen 62 are matched with limit holes arranged on the side wall of the screen table 6 through limit pins 64 to adjust the inclination angle of the upper screen 61 and the lower screen 62, and the inclination angle is 10 degrees-20 degrees.

Preferably, the vibration frequency of the vibration table is 50Hz, and the vibration amplitude is 0.5mm-1mm.

When the feeding hopper is used, BGA solder balls are added into the feeding hopper 1, the controller 8 and the vibrating table 7 are opened, the vibrating table 7 starts to work, the flow control valve 3 is opened, the flow is adjusted to a proper flow according to the specification of the BGA solder balls, and feeding screening is started; the big ball exceeding the upper tolerance enters a big ball discharging hole at the tail end of the upper screen 61; the qualified products enter a qualified product discharge port along a lower screen 62; the pellets exceeding the lower tolerance fall from the lower screen 62, onto the slide 63 and into the pellet discharge port; when the blanking process of the solder balls is blocked, the optical fiber sensor 5 detects that no material falls, a signal is fed back to the controller 8, the controller 8 controls the micro motor 4 to vibrate, at the moment, the material is continuously supplied, if the micro motor 4 vibrates once and then no material is supplied, the controller 8 controls the micro motor 4 to vibrate for a certain time; if no material is supplied after repeating the vibration for 3-5 times, the controller 8 and the vibration table 7 are all stopped.

The utility model is not described in detail in the prior art.

The embodiments selected herein for the purposes of disclosing the present utility model are presently considered to be suitable, however, it is to be understood that the present utility model is intended to include all such variations and modifications as fall within the spirit and scope of the present utility model.

Claims

1. The automatic BGA solder ball screening machine is characterized by comprising a storage hopper, a material guide pipe, a flow control valve, a micro motor, an optical fiber sensor, a screening table, a vibrating table and a controller;

2. The automatic screening machine for BGA solder balls according to claim 1, wherein: the vertical distance between the discharge hole below the material guiding pipe and the upper screen is 3mm-5mm.

3. The automatic screening machine for BGA solder balls according to claim 1, wherein: the length of the upper screen mesh and the lower screen mesh is 300mm-400mm, the width of the upper screen mesh and the lower screen mesh is 160mm-200mm, the vertical distance between the upper screen mesh and the lower screen mesh is 10-50mm, and the gradient is 10-20 degrees.

4. The automatic BGA solder ball screening machine according to claim 3, wherein: the upper ends of the upper screen and the lower screen are matched with limiting holes arranged on the side wall of the screen table through limiting pin shafts to adjust the inclination angles of the upper screen and the lower screen.

5. The automatic screening machine for BGA solder balls according to claim 1, wherein: the vibration frequency of the vibrating table is 30-60Hz, and the vibration amplitude is 0.5-1 mm.