CN219193986U - Full-automatic chip mounter on monolithic scraps of paper - Google Patents
Full-automatic chip mounter on monolithic scraps of paper Download PDFInfo
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- CN219193986U CN219193986U CN202223532910.3U CN202223532910U CN219193986U CN 219193986 U CN219193986 U CN 219193986U CN 202223532910 U CN202223532910 U CN 202223532910U CN 219193986 U CN219193986 U CN 219193986U
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- placing groove
- patch
- paper board
- negative pressure
- paperboard
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a full-automatic chip mounter on a single piece of paper, which comprises a paper board placing groove, a chip mounting groove, a paper board conveying mechanism, a chip mounting mechanism and a gluing mechanism, wherein the paper board placing groove is arranged at the head end of the paper board conveying mechanism, a plurality of paper boards which are overlapped up and down are placed in the paper board placing groove, a negative pressure adsorption component is arranged between the paper board placing groove and the paper board conveying mechanism, and the bottom of the paper board is adsorbed through the negative pressure adsorption component; a patch placing groove is formed above the paperboard conveying mechanism, a groove is formed in the side face of the patch placing groove, a patch is vertically placed in the patch placing groove, and a patch mechanism is arranged between the patch placing groove and the paperboard conveying mechanism; the automatic paster on the cardboard is convenient for realize, and paster efficiency is higher like this, just falls into the monolithic with cardboard and paster through automatic mode simultaneously, guarantees the qualification rate like this.
Description
Technical Field
The utility model relates to the field of patches, in particular to a full-automatic chip mounter on a single piece of paper.
Background
In order to ensure the strength of the paper board, the paper board needs to be pasted on the outer wall of the paper board, so that the strength of paper sheets is ensured, the current paper board pasting piece is glued on the paper sheets, then the pasting piece is pressed on the paper board to be pasted, and the paper sheets and the pasting piece are required to be separated through complex processes, so that the pasting of single paper sheets and pasting pieces is realized; at present, the paster and the paper sheet are generally separated into single sheets in a manual sorting mode, and then the paper sheet is pasted in a manual mode, but the efficiency of the manual paster is low (the manual glue brushing, alignment, adhesion, pressing and drying solidification are needed), so that the efficiency of the paster of the staff is low, and the current industrial telephone output requirement cannot be met.
Disclosure of Invention
Aiming at the defects in the prior art, the utility model provides the full-automatic chip mounter on the single-piece paper sheet, which is convenient for realizing automatic chip mounting on the paper sheet, so that the chip mounting efficiency is higher, and meanwhile, the paper sheet and the chip are divided into single pieces in an automatic mode, so that the qualification rate is ensured.
To achieve the above object, the present utility model provides: a full-automatic chip mounter on a single paper sheet comprises a paper board placing groove, a chip mounting placing groove, a paper board conveying mechanism, a chip mounting mechanism and a gluing mechanism, wherein the paper board placing groove is arranged at the head end of the paper board conveying mechanism, a plurality of paper boards which are overlapped up and down are placed in the paper board placing groove, a negative pressure adsorption component is arranged between the paper board placing groove and the paper board conveying mechanism, and the bottom of the paper board is adsorbed by the negative pressure adsorption component; a patch placing groove is formed above the paperboard conveying mechanism, a groove is formed in the side face of the patch placing groove, a patch is vertically placed in the patch placing groove, and a patch mechanism is arranged between the patch placing groove and the paperboard conveying mechanism; the patch mechanism comprises a rotating frame, a telescopic component and a negative pressure head, wherein a plurality of negative pressure heads which are distributed in an annular array are arranged on the rotating frame, the telescopic component is arranged between each negative pressure head and the rotating frame, the telescopic component is used for realizing the telescopic action of the negative pressure head, and the negative pressure heads extend into the patch placing grooves to adsorb patches; a gluing mechanism is arranged above the paperboard conveying mechanism, the bottom of the paster is glued by the gluing mechanism, and the glued paster is conveyed to the upper part of the paperboard to be pasted.
Preferably, the paperboard conveying mechanism comprises a guide rail, a reciprocating conveying rod and a negative pressure adsorption assembly, wherein the guide rail is a plurality of guide rails, the guide rails are arranged side by side, baffle plates for limiting two sides of the paperboard are arranged on the guide rails positioned at two sides, the paperboard is conveyed on the guide rails, the reciprocating conveying rod is arranged at the bottom of the guide rail, a sliding block sliding on the guide rails is arranged at the bottom of the guide rail, the sliding block is connected with the reciprocating conveying rod through a cylinder, lifting of the reciprocating conveying rod is realized through the cylinder, a conveying cylinder is arranged between the sliding block and the guide rail, reciprocating translation of the sliding block is realized through expansion and contraction of the conveying cylinder, a plurality of negative pressure adsorption assemblies distributed at equal intervals are fixed at the top of the reciprocating conveying rod, and the negative pressure adsorption assembly is vertically upwards adsorbed at the bottom of the paperboard; the bottom of the paperboard placing groove is provided with a notch, the negative pressure adsorption component passes through the notch to be adsorbed on the paperboard, the side surface of the paperboard placing groove is provided with a notch, and the paperboard at the bottom of the paperboard placing groove is conveyed to the guide rail through the notch.
Preferably, rubberizing mechanism includes glue box, sponge board and translation subassembly, has put into glue in the glue box, wherein is provided with the sponge board in the glue box, is covered at sponge board top and has the sponge layer, is provided with translation subassembly between glue box outer wall and the orbital baffle of direction, translates the front and back of realizing the glue box through translation subassembly, and the sponge layer that has the glue contacts with the bottom of paster like this, realizes like this to the paster rubberizing, after pasting the contact of sponge layer, the glue box is pressed down to the paster through translation subassembly and is stepped down.
Compared with the prior art, the utility model has the advantages that: the automatic paster on the cardboard is convenient for realize, and paster efficiency is higher like this, just falls into the monolithic with cardboard and paster through automatic mode simultaneously, guarantees the qualification rate like this.
Drawings
Fig. 1 is a front view of the present utility model.
Fig. 2 is a bottom view of the paperboard conveying mechanism of the utility model.
Fig. 3 is a schematic view of a paperboard holding tank according to the utility model.
Fig. 4 is a schematic view of the patch mechanism of the present utility model.
Fig. 5 is a schematic view of a patch placement slot of the present utility model.
Fig. 6 is a schematic view of the gluing mechanism of the present utility model.
Wherein, 1, cardboard standing groove, 2, paster standing groove, 3, cardboard conveying mechanism, 3.1, guide rail, 3.2, reciprocating conveying pole, 3.3, slider, 3.4, conveying cylinder, 3.5, negative pressure adsorption component, 3.6, baffle, 4, paster mechanism, 4.1, swivel mount, 4.2, expansion assembly, 4.3, negative pressure head, 5, rubberizing mechanism, 5.1, glue box, 5.2, sponge board, 5.3, the sponge layer, 5.4, translation assembly.
Detailed Description
The present utility model will now be further elucidated with reference to the accompanying drawings.
As shown in fig. 1-6, a full-automatic chip mounter on a single piece of paper sheet comprises a paper board placing groove 1, a chip mounting groove 2, a paper board conveying mechanism 3, a chip mounting mechanism 4 and a gluing mechanism 5, wherein the paper board placing groove 1 (the top, the bottom and the right side of the paper board placing groove 1 are opened) is arranged at the head end of the paper board conveying mechanism 3 (the left end of the paper board conveying mechanism 3), a plurality of paper boards which are overlapped up and down are placed in the paper board placing groove 1, a negative pressure adsorption component 3.5 is arranged between the paper board placing groove 1 and the paper board conveying mechanism 3, the bottom of the paper board is adsorbed by the negative pressure adsorption component 3.5, the negative pressure adsorption component 3.5 stretches into the paper board at the bottom of the paper board placing groove 1 from the bottom opening of the paper board placing groove 1, the negative pressure adsorption component 3.5 moves rightwards along with the paper board conveying mechanism 3, and the negative pressure adsorption component 3.5 adsorbs the paper board to rightwards along with the paper board, and leaves the paper board placing groove 1 through the opening on the right side of the paper board placing groove 1; a patch placing groove 2 is formed above the paperboard conveying mechanism 3, the patch placing groove 2 is provided with a notch on the right side surface, a hanging frame is fixed at the top of the patch placing groove 2 in a welding mode and is arranged on the roof of the top of the paperboard conveying mechanism 3 through bolts, the right side surface of the patch placing groove 2 is grooved, a plurality of cylinders for pushing the patch to the right side are fixed on the inner wall of the left side of the patch placing groove 2 in a bolt fastening mode, a patch mechanism 4 is arranged between the patch placing groove 2 and the paperboard conveying mechanism 3, the patch in the patch placing groove 2 is adsorbed through the patch mechanism 4, then the patch is rotated to the upper side of the paperboard, and the lamination of the paperboard and the patch is realized through pressing adhesion; the patch mechanism 4 comprises a rotating frame 4.1, a telescopic component 4.2 and a negative pressure head 4.3, wherein a plurality of negative pressure heads 4.3 which are distributed in an annular array are arranged on the rotating frame 4.1, the rotating frame 4.1 is in a circular ring shape, the center of the rotating frame 4.1 is rotationally fixed with a bearing seat through a bearing, the bearing seat is arranged on the ground through a bolt, the center of the rotating frame 4.1 is connected with an output shaft of a stepping motor in a welding mode, the rotating frame 4.1 is driven to rotate through the stepping motor, the telescopic component 4.2 is arranged between each negative pressure head 4.3 and the rotating frame 4.1 (the telescopic component 4.2 is a cylinder), a piston rod of the telescopic component 4.2 is fixedly provided with the negative pressure head 4.3 in a bolt fastening mode, the negative pressure head 4.3 is connected with a negative pressure pump through a pipeline, the negative pressure pump is in a negative pressure state, the negative pressure head 4.3 is realized through the negative pressure pump, the telescopic component 4.2 is connected with an output shaft of the stepping motor in a welding mode, the negative pressure head 4.3 is correspondingly pushed into a patch 2, and then the patch 2 is pulled out of the patch 2, and the patch 2 is pulled up by the patch 2 when the patch 2 is pushed up, and the patch 2 is correspondingly pulled up to the patch 2.2, and the patch 2 is placed in a position, and the patch 2 is pulled up and the patch 2 is pulled down by the patch 2; the paper board conveying mechanism 3 is provided with rubberizing mechanism 5 directly over (rubberizing mechanism 5 is the top of paper board conveying mechanism 3, and rubberizing mechanism 5 is located the below of swivel mount 4.1), and rubberizing mechanism 5 rubberizes the bottom of paster, and the paster of rubberizing is carried the top of paper board and is carried the paster.
The paperboard conveying mechanism 3 comprises guide rails 3.1, reciprocating conveying rods 3.2 and negative pressure adsorption components 3.5, wherein the guide rails 3.1 are four in number and are arranged side by side, the bottoms of the guide rails 3.1 are fixedly provided with a plurality of supporting legs in a bolt fastening mode and are arranged on the ground through bolts, baffle plates 3.6 for limiting two sides of the paperboard are fixedly arranged on the guide rails 3.1 positioned on the front side and the rear side in a bolt fastening mode, the side walls of the paperboard are limited by the baffle plates 3.6, the paperboard is conveyed on the guide rails 3.1, the bottom of the guide rails 3.1 is provided with the reciprocating conveying rods 3.2, the bottoms of the guide rails 3.1 are clamped with sliding blocks 3.3 sliding on the guide rails 3.1, the sliding blocks 3.3 translate left and right along the bottoms of the guide rails 3.1, the sliding blocks 3.3 are connected with the reciprocating conveying rods 3.2 in a welding mode, namely, the reciprocating conveying rod 3.2 moves left and right along the guide track 3.1, a cylinder which vertically ascends and descends is fixed at the bottom of the sliding block 3.3 in a bolt fastening mode, a piston rod of the cylinder is fixed on the reciprocating conveying rod 3.2 in a welding mode, the lifting of the reciprocating conveying rod 3.2 is realized through the cylinder, a conveying cylinder 3.4 is arranged between the sliding block 3.3 and the guide track 3.1 (a cylinder body of the conveying cylinder 3.4 is fixed on the guide track 3.1 in a bolt fastening mode, a piston rod of the conveying cylinder 3.4 is fixed on the sliding block 3.3 in a bolt fastening mode), the reciprocating translation of the sliding block 3.3 is realized through the expansion and contraction of the conveying cylinder 3.4, a plurality of equally-spaced negative pressure adsorption assemblies 3.5 are fixed at the top of the reciprocating conveying rod 3.2 in a welding mode (the negative pressure adsorption assemblies 3.5 are negative pressure adsorption heads, the reciprocating conveying rod 3.2 is hollow rod and the hollow rod is connected with a negative pressure pump through a pipeline, the negative pressure adsorption head is communicated with the hollow part inside the reciprocating conveying rod 3.2, the air-taking negative pressure adsorption head forms a negative adsorption paperboard), the negative pressure adsorption component 3.5 is vertically upwards and adsorbed at the bottom of the paperboard, the paperboard is conveyed rightwards by rightward movement of the negative pressure adsorption component 3.5, after the conveying cylinder 3.4 is lifted rightwards once, the negative pressure adsorption component 3.5 contacts negative pressure, the cylinder is lifted downwards, the reciprocating conveying rod 3.2 is lowered, the negative pressure adsorption component 3.5 is separated from the paperboard, the conveying cylinder 3.4 is retracted and returned, the cylinder is retracted, the reciprocating conveying rod 3.2 is lifted, the negative pressure adsorption component 3.5 contacts with the bottom of the paperboard, the negative pressure adsorption component 3.5 is started to adsorb the bottom of the paperboard in a negative pressure working state, the conveying cylinder 3.4 is lifted upwards, and the paperboard is conveyed rightwards; the notch is opened to cardboard standing groove 1 bottom, and negative pressure adsorption component 3.5 passes the notch and adsorbs on the cardboard, opens jaggedly (the cardboard passes through the breach output cardboard on cardboard standing groove 1 right side) on the right side face of cardboard standing groove 1, and the cardboard of cardboard standing groove 1 bottom is carried on the top surface of guide rail 3.1 through right side breach.
The glue applying mechanism 5 comprises a glue box 5.1, a sponge plate 5.2 and a translation component, glue is placed in the glue box 5.1 (can be heated to prevent the glue from solidifying), wherein the sponge plate 5.2 is embedded in the glue box 5.1, a sponge layer 5.3 capable of absorbing the glue is covered on the top of the sponge plate 5.2 (the sponge layer 5.3 is covered with the glue), the translation component 5.4 is fixed between the glue box 5.1 and the baffle 3.6 in a bolt fastening way (the translation component 5.4 is an air cylinder, a cylinder body of the translation component 5.4 is fixed on the inner wall of the baffle 3.6 in a bolt fastening way, a piston rod of the translation component 5.4 is fixed on the outer wall of the glue box 5.1 in a bolt fastening way, front-back translation of the glue box 5.1 is realized through the translation component 5.4, when the adhesive of a patch is required, the glue box 5.1 is positioned right below the patch, when the paster is required to be adhered to the paperboard, the glue box 5.1 is used for giving way to the paster through the translation component 5.4, the left and right translation of the glue box 5.1 is realized through the translation component 5.4, when the operation is carried out, the rotary frame 4.1 rotates the paster to the position right above the paperboard, meanwhile, the telescopic component 4.2 is lifted, the paster is contacted with the sponge layer 5.3 in the glue box 5.1, glue on the sponge layer 5.3 is smeared at the bottom of the paster, meanwhile, the telescopic component 4.2 is retracted, the paster is lifted, meanwhile, the glue box 5.1 is used for lowering the paster to the paperboard through the translation component 5.4 to give way, the telescopic component 4.2 is lifted completely, the paster is attached to the paperboard, the negative pressure head 4.3 loses negative pressure, and is separated from the iron sheet, the telescopic component 4.2 is retracted, and the negative pressure head 4.3 is lifted and rotated.
Claims (3)
1. The full-automatic chip mounter on a single piece of paper comprises a paper board placing groove, a chip mounting placing groove, a paper board conveying mechanism, a chip mounting mechanism and a gluing mechanism, wherein the paper board placing groove is arranged at the head end of the paper board conveying mechanism, and a plurality of paper boards which are overlapped up and down are placed in the paper board placing groove; a patch placing groove is formed above the paperboard conveying mechanism, a groove is formed in the side face of the patch placing groove, a patch is vertically placed in the patch placing groove, and a patch mechanism is arranged between the patch placing groove and the paperboard conveying mechanism; the patch mechanism comprises a rotating frame, a telescopic component and a negative pressure head, wherein a plurality of negative pressure heads which are distributed in an annular array are arranged on the rotating frame, the telescopic component is arranged between each negative pressure head and the rotating frame, the telescopic component is used for realizing the telescopic action of the negative pressure head, and the negative pressure heads extend into the patch placing grooves to adsorb patches; a rubberizing mechanism is arranged between the paster placing groove and the paperboard conveying mechanism, the rubberizing mechanism rubberizes the bottom of the paster, and the rubberized paster is conveyed to the upper part of the paperboard to carry out the paster.
2. The full-automatic chip mounter on single-sheet paper according to claim 1, wherein the paper board conveying mechanism comprises a guide rail, a reciprocating conveying rod and a negative pressure adsorption assembly, wherein the guide rail is multiple, the multiple guide rails are arranged side by side, baffles for limiting two sides of the paper board are arranged on the guide rails positioned at two sides of the paper board, the paper board is conveyed on the guide rails, the reciprocating conveying rod is arranged at the bottom of the guide rail, a sliding block sliding on the guide rail is arranged at the bottom of the guide rail, the sliding block is connected with the reciprocating conveying rod through a cylinder, lifting of the reciprocating conveying rod is realized through the cylinder, a conveying cylinder is arranged between the sliding block and the guide rail, reciprocating translation of the sliding block is realized through expansion and contraction of the conveying cylinder, a plurality of negative pressure adsorption assemblies distributed at equal intervals are fixed at the top of the reciprocating conveying rod, and the negative pressure adsorption assembly is vertically upwards and adsorbed at the bottom of the paper board; the bottom of the paperboard placing groove is provided with a notch, the negative pressure adsorption component passes through the notch to be adsorbed on the paperboard, the side surface of the paperboard placing groove is provided with a notch, and the paperboard at the bottom of the paperboard placing groove is conveyed to the guide rail through the notch.
3. The full-automatic chip mounter on a single-piece paper sheet according to claim 2, wherein the gluing mechanism comprises a glue box, a sponge plate and a translation assembly, glue is placed in the glue box, the sponge plate is arranged in the glue box, a sponge layer is covered on the top of the sponge plate, the translation assembly is arranged between the outer wall of the glue box and a baffle of a guide rail, front-back translation of the glue box is achieved through the translation assembly, the sponge layer adhered with the glue is contacted with the bottom of a patch, glue is glued for the patch, and after the contact of the glue layer is completed, the glue box is used for giving way to the downward pressing of the patch through the translation assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223532910.3U CN219193986U (en) | 2022-12-29 | 2022-12-29 | Full-automatic chip mounter on monolithic scraps of paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223532910.3U CN219193986U (en) | 2022-12-29 | 2022-12-29 | Full-automatic chip mounter on monolithic scraps of paper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219193986U true CN219193986U (en) | 2023-06-16 |
Family
ID=86710282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223532910.3U Active CN219193986U (en) | 2022-12-29 | 2022-12-29 | Full-automatic chip mounter on monolithic scraps of paper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219193986U (en) |
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2022
- 2022-12-29 CN CN202223532910.3U patent/CN219193986U/en active Active
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