CN219185605U

CN219185605U - Adsorption electrode preheating device

Info

Publication number: CN219185605U
Application number: CN202222909562.0U
Authority: CN
Inventors: 高峰; 董鹏举; 王伟锋; 李玉岭; 孟现宇; 高晓东
Original assignee: Henan Youde Medical Equipment Co Ltd
Current assignee: Henan Youde Medical Equipment Co Ltd
Priority date: 2022-11-02
Filing date: 2022-11-02
Publication date: 2023-06-16
Anticipated expiration: 2032-11-02

Abstract

The utility model relates to an adsorption electrode preheating device, which comprises a shell, wherein a plurality of placing holes are formed in the upper end surface of the shell at equal intervals, a heating layer and a heat conducting plate are arranged in the shell, the heat conducting plate is arranged on the upper part of the heating layer, the heat conducting plate is fixedly connected with the shell, a temperature sensor is arranged in the middle of the heating layer and used for detecting the temperature of the heating layer, the temperature sensor is electrically connected with a plug, and the plug is electrically connected with a wiring socket; the temperature sensor is electrically connected with an ADC pin of the MCU chip through a plug and a wiring socket; the heating layer is electrically connected with a driving circuit through a plug and a wiring socket, and the input end of the driving circuit is connected with an IO pin of the MCU chip; the side of the shell is provided with a round wire passing hole corresponding to the plug position. According to the utility model, the adsorption electrode is placed on the heat conducting plate through the placement hole, the heating layer is arranged to heat the heat conducting plate, and the adsorption electrode is preheated under the heat conduction effect.

Description

Adsorption electrode preheating device

Technical Field

The utility model relates to the field of electrotherapy equipment, in particular to an adsorption electrode preheating device.

Background

The adsorption electrode is electrically connected with a host, the host comprises an MCU chip, the existing electrotherapy instrument achieves a physiotherapy effect by combining adsorption electrodes through controlling output frequency and adsorption force, the host adopts a PID control algorithm, and the MCU chip outputs PWM signals to adjust power output frequency, so that the electrode plates output middle-frequency and low-frequency pulses.

The existing adsorption electrode body is made of metal, and is contacted with a human body through a sponge after water absorption, and as the specific heat capacity of the adsorption electrode is small, the surface temperature of the adsorption electrode body is low when the adsorption electrode body is not used, the adsorption electrode body is uncomfortable to the human body when the adsorption electrode body is just contacted with the human body, and the treatment experience is poor.

Therefore, there is a need for an adsorption electrode preheating device, which is based on a host to preheat the adsorption electrode.

Disclosure of Invention

The utility model provides an adsorption electrode preheating device for solving the problem that an adsorption electrode of an existing electrotherapy instrument cannot be preheated before use, which is provided with a shell, a heat conducting plate and a heating layer, wherein the shell is provided with a placement hole, the adsorption electrode is placed on the heat conducting plate through the placement hole, and the heating layer is arranged to heat the heat conducting plate, so that the adsorption electrode is preheated under the heat conduction effect.

In order to achieve the above object, the technical scheme of the present utility model is as follows:

the utility model provides an adsorption electrode preheating device, includes the host computer, the host computer includes MCU chip and wiring socket, including the casing, the casing is inside hollow square structure, and a plurality of holes of placing have been offered to the up end position equidistance of casing, and the inside of casing is provided with zone of heating and heat-conducting plate, the heat-conducting plate sets up in the upper portion of zone of heating, heat-conducting plate and casing fixed connection, the middle part position of zone of heating is provided with temperature sensor, temperature sensor is used for detecting zone of heating temperature, temperature sensor and zone of heating electric connection have the plug, plug and wiring socket electric connection;

the temperature sensor is electrically connected with an ADC pin of the MCU chip through a plug and a wiring socket;

the heating layer is electrically connected with a driving circuit through a plug and a wiring socket, the heating layer is connected with a power supply through the driving circuit to form a loop, and the input end of the driving circuit is connected with an IO pin of the MCU chip;

the side of the shell is provided with a round wire passing hole corresponding to the plug position.

The operation principle is as follows: the plug is connected with the socket, the heating layer is electrified to generate heat, and the heating layer transfers heat to the bottom of the adsorption electrode through the heat conducting plate according to the heat conduction effect, so that the adsorption electrode is preheated.

The shell is arranged to fix the heating layer and the heat conducting plate, a plurality of placing holes are formed in the shell, the placing holes, the shell and the heat conducting plate are combined to limit the adsorption electrodes, a plurality of adsorption electrodes are placed in order, the heat conducting plate is arranged to prevent the heating layer from directly heating the adsorption electrodes to cause damage to the adsorption electrodes, the heating layer is arranged in the shell, the modularization of the adsorption electrode preheating device is realized through the electric connection of the plug and the socket of the host, and the replacement and the disassembly are convenient.

Further, the temperature sensor comprises a 10K thermistor, the thermistor is arranged at the middle of the heating layer, an outgoing line of the thermistor is electrically connected with a voltage sampling circuit through a plug and a wiring socket, and the output end of the voltage sampling circuit is connected with an ADC pin of the MCU chip.

The existing integrated temperature sensor is large in size, and the thermistor is adopted as a probe part of the temperature sensor, so that the heating layer is convenient to combine with the heat conducting plate, and meanwhile, the production cost is reduced.

Further, the heating layer is of a straight-line plate structure formed by equidistantly arranging carbon fiber heating wires;

the driving circuit comprises a MOS tube driving circuit, the MOS tube driving circuit comprises a MOS tube, the G electrode of the MOS tube is connected with the IO pin of the MCU chip, the D electrode of the MOS tube is connected with a power supply, the S electrode of the MOS tube is grounded, and the heating layer is connected with the power supply through the MOS tube.

The MCU chip outputs PWM signals to control the on-off of the driving circuit in a PID control mode by combining the analog signals transmitted by the MCU chip and the temperature sensor of the host, so that the energizing time of the carbon fiber heating wire is adjusted to enable the heating value of the carbon fiber heating wire to be stabilized in a temperature range, and the adsorption electrode is protected.

Further, the placement holes are one or a combination of square holes and round holes.

Further, the casing includes upper portion and lower part, upper portion and lower part pass through the bolt fastening, four corner positions of up end of lower part are provided with the baffle, the baffle is the triangle-shaped board, and baffle upper portion sets up the heat-conducting plate, and the baffle passes through the bolt fastening with the heat-conducting plate, the heat-conducting plate is the square plate body that the metal material was made.

Because the shell is provided with the placement holes, the ash falling of the heat conducting plate is avoided, and the shell is divided into the upper part and the lower part so as to be convenient for disassembly, thereby being convenient for cleaning the heat conducting plate.

Through the technical scheme, the utility model has the beneficial effects that:

1. the utility model realizes preheating of the adsorption electrodes, the shell is arranged for placing a plurality of adsorption electrodes, the main body of the adsorption electrodes is of an inverted bowl-shaped structure, the placement holes formed in the shell limit the adsorption electrodes, the bottoms of the adsorption electrodes are in contact with the heat conducting plate, and the heating layer heats the adsorption electrodes through the heat conducting effect during operation.

2. The temperature sensor is arranged to detect the temperature of the heating layer, the temperature of the heating layer is controlled by PWM (pulse-width modulation) control by combining the existing PID algorithm in the field and the MCU chip of the host, the temperature of the heating layer is prevented from being too high, and the preheating effect of the adsorption electrode is optimized.

Drawings

FIG. 1 is a schematic diagram of an adsorption electrode preheating device according to the present utility model;

FIG. 2 is a schematic diagram of a preheating device for an adsorption electrode according to a second embodiment of the present utility model;

FIG. 3 is a third schematic diagram of an adsorption electrode preheating device according to the present utility model;

FIG. 4 is one of the electrical schematic diagrams of an adsorption electrode preheating apparatus according to the present utility model;

FIG. 5 is a second electrical schematic diagram of an adsorption electrode preheating device according to the present utility model.

The reference numerals in the drawings are: the temperature sensor comprises an MCU chip 1, a wiring socket 2, a shell 3, a placement hole 4, a heating layer 5, a heat conducting plate 6, a temperature sensor 7, a plug 8, a driving circuit 9, a wire passing hole 10, a thermistor 11, a voltage sampling resistor 12, an upper part 13, a lower part 14 and a baffle 15.

Detailed Description

The utility model is further described with reference to the drawings and detailed description which follow:

example 1

As shown in fig. 1-5, an adsorption electrode preheating device comprises a host, wherein the host comprises an MCU chip 1 and a wiring socket 2, the host comprises a shell 3, the shell 3 is of a square structure with hollow inside, a plurality of placement holes 4 are formed in the upper end surface of the shell 3 at equal intervals, a heating layer 5 and a heat conducting plate 6 are arranged in the shell 3, the heat conducting plate 6 is arranged on the upper part 13 of the heating layer 5, the heat conducting plate 6 is fixedly connected with the shell 3, a temperature sensor 7 is arranged in the middle of the heating layer 5, the temperature sensor 7 is used for detecting the temperature of the heating layer 5, a plug 8 is electrically connected with the heating layer 7 and the heating layer 5, and the plug 8 is electrically connected with the wiring socket 2;

the temperature sensor 7 is electrically connected with the ADC pins of the MCU chip 1 through the plug 8 and the wiring socket 2;

the heating layer 5 is electrically connected with the wiring socket 2 through the plug 8 and is provided with a driving circuit 9, the heating layer 5 is connected with a power supply through the driving circuit 9 to form a loop, and the input end of the driving circuit 9 is connected with the IO pin of the MCU chip 1;

the side of the housing 3 is provided with a circular wire through hole 10 corresponding to the plug 8.

Preferably, the temperature sensor 7 includes a thermistor 11 with a temperature of 10K, the thermistor 11 is disposed at a middle position of the heating layer 5, an outgoing line of the thermistor 11 is electrically connected with the wiring socket 2 through the plug 8, and an output end of the voltage sampling circuit 12 is connected with an ADC pin of the MCU chip 1.

Preferably, the heating layer 5 is a straight-line plate structure formed by equidistantly arranging carbon fiber heating wires;

the driving circuit 9 comprises an MOS tube driving circuit, the MOS tube driving circuit comprises an MOS tube, the G electrode of the MOS tube is connected with the IO pin of the MCU chip 1, the D electrode of the MOS tube is connected with a power supply, the S electrode of the MOS tube is grounded, and the heating layer 5 is connected with the power supply through the MOS tube.

Preferably, the placement hole 4 is one or a combination of a square hole and a round hole.

In this embodiment, the MCU chip 1 is an STM32 single-chip microcomputer, and in this embodiment, the placement holes 4 are circular, and the number of the placement holes is four.

During operation, the adsorption electrode is arranged in the placement hole 4, the lower end of the adsorption electrode is in contact with the heat conducting plate 6, the plug 8 is connected with the wiring socket 2, the heating layer 5 is connected with a power supply through the MOS tube driving circuit, the heating layer 5 heats, on the other hand, the thermistor 11 is influenced by temperature and has resistance value changed, the voltage sampling circuit 12 outputs a changed analog voltage signal to the MCU chip 1, and the MCU chip 1 controls the on and off of the MOS tube by outputting a PWM signal according to a general PID algorithm in the field, so that the effect of adjusting the output heat of the heating layer 5 is achieved, and the output temperature of the heating layer 5 is maintained in a fixed range;

the heat of the heating layer 5 is transferred to the adsorption electrode through the heat conducting plate 6, the adsorption electrode is preheated, the plug 8 is pulled out during shutdown, the heating layer 5 is disconnected to stop heating, and the operation is finished.

Preferably, in order to further improve the circuit control effect, the IO pin of the MCU chip 1 is provided with a key, and a shutdown and starting signal is sent to the MCU chip 1 through the key to protect the MOS tube.

Example 2

Preferably, the housing 3 includes an upper portion 13 and a lower portion 14, the upper portion 13 and the lower portion 14 are fixed by bolts, four corner positions of an upper end surface of the lower portion 14 are provided with a baffle 15, the baffle 15 is a triangular plate, the upper portion 13 of the baffle 15 is provided with a heat-conducting plate 6, the baffle 15 and the heat-conducting plate 6 are fixed by bolts, and the heat-conducting plate 6 is a square plate body made of metal materials.

When the heating plate is disassembled, the bolts between the upper part 13 and the lower part 14 are unscrewed, the upper part 13 and the lower part 14 are separated, the heat conducting plate 6 is cleaned, the separation between the heat conducting plate 6 and the baffle 15 is realized by unscrewing the bolts between the heat conducting plate 6 and the baffle 15, and then the heating layer 5 is convenient to replace or maintain.

The above-described embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model, so that all equivalent changes or modifications of the structure, characteristics and principles described in the claims should be included in the scope of the present utility model.

Claims

1. The utility model provides an adsorption electrode preheating device, includes the host computer, the host computer includes MCU chip (1) and wiring socket (2), its characterized in that, including casing (3), casing (3) are inside hollow square structure, and a plurality of holes (4) of placing have been seted up to the up end position equidistance of casing (3), and the inside of casing (3) is provided with zone of heating (5) and heat conduction board (6), heat conduction board (6) set up in zone of heating (5) upper portion (13), heat conduction board (6) and casing (3) fixed connection, the middle part position of zone of heating (5) is provided with temperature sensor (7), temperature sensor (7) are used for detecting zone of heating (5) temperature, and temperature sensor (7) and zone of heating (5) electric connection have plug (8), plug (8) and wiring socket (2) electric connection.

The temperature sensor (7) is electrically connected with the ADC pin of the MCU chip (1) through the plug (8) and the wiring socket (2);

the heating layer (5) is electrically connected with the drive circuit (9) through the plug (8) and the wiring socket (2), the heating layer (5) is connected with a power supply through the drive circuit (9) to form a loop, and the input end of the drive circuit (9) is connected with the IO pin of the MCU chip (1);

a round wire passing hole (10) is arranged on the side surface of the shell (3) corresponding to the plug (8).

2. The adsorption electrode preheating device according to claim 1, wherein the temperature sensor (7) comprises a 10K thermistor (11), the thermistor (11) is arranged at the middle position of the heating layer (5), an outgoing line of the thermistor (11) is electrically connected with the wiring socket (2) through the plug (8) to form a voltage sampling circuit (12), and an output end of the voltage sampling circuit (12) is connected with an ADC pin of the MCU chip (1).

3. The adsorption electrode preheating device according to claim 1, wherein the heating layer (5) is a linear plate structure formed by equidistantly arranging carbon fiber heating wires;

the driving circuit (9) comprises a MOS tube driving circuit (9), the MOS tube driving circuit (9) comprises a MOS tube, the G electrode of the MOS tube is connected with the IO pin of the MCU chip (1), the D electrode of the MOS tube is connected with a power supply, the S electrode of the MOS tube is grounded, and the heating layer (5) is connected with the power supply through the MOS tube.

4. An adsorption electrode preheating apparatus according to claim 1, wherein the placement hole (4) is one or a combination of square holes and circular holes.

5. The adsorption electrode preheating device according to claim 1, wherein the housing (3) comprises an upper portion (13) and a lower portion (14), the upper portion (13) and the lower portion (14) are fixed through bolts, a baffle (15) is arranged at four corner positions of the upper end face of the lower portion (14), the baffle (15) is a triangular plate, a heat conducting plate (6) is arranged on the upper portion (13) of the baffle (15), the baffle (15) and the heat conducting plate (6) are fixed through bolts, and the heat conducting plate (6) is a square plate body made of metal materials.