CN219180491U - Chip stripping negative pressure heating platform - Google Patents
Chip stripping negative pressure heating platform Download PDFInfo
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- CN219180491U CN219180491U CN202223600004.2U CN202223600004U CN219180491U CN 219180491 U CN219180491 U CN 219180491U CN 202223600004 U CN202223600004 U CN 202223600004U CN 219180491 U CN219180491 U CN 219180491U
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- negative pressure
- pressure heating
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- heating platform
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a chip stripping negative pressure heating platform, which comprises: the device comprises a main control console, a negative pressure heating platform and a vacuum suction mechanism, wherein the negative pressure heating platform is arranged at the top of the main control console, and the vacuum suction mechanism is arranged at the top of the negative pressure heating platform; the vacuum suction mechanism comprises: the utility model provides a chip stripping negative pressure heating platform which is simple, convenient and safe in operation method, free of scratches on the surface of a substrate after the negative pressure type heating platform is used, reusable in the substrate and reduced in production cost.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a negative pressure heating platform for chip stripping.
Background
To confirm the effect of flip chip cleaning, the substrate surface needs to be heated to peel off the chip. The existing heating platform comprises a main control console and a heating plate. In the operation, a main control desk switch is turned on, and the heating plate starts to heat until the temperature reaches the temperature set by the main control desk (about 240-250 ℃). The operator firstly puts the bare substrate on the surface of the heating plate, then holds the tweezers by the left hand to press the surface of the substrate to fully heat the substrate, and finally holds the other tweezers by the right hand to take off the chip.
The prior method has the following defects:
1. complicated operation and insufficient safety, and operators risk being scalded at high temperature;
2. the substrate is pressed by holding tweezers manually, the substrate is scratched, and the substrate cannot be used as a seasoning for a second time; unnecessary waste of the production line is caused, and the production cost is high.
Disclosure of Invention
In order to solve the problems, the utility model aims to provide the chip stripping negative pressure heating platform which is simple and safe in operation method, free of scratches on the surface of the substrate after the negative pressure type heating platform is used, reusable in substrate and low in production cost.
According to one aspect of the present utility model, there is provided a chip peel negative pressure heating platen comprising: the device comprises a main control console, a negative pressure heating platform and a vacuum suction mechanism, wherein the negative pressure heating platform is arranged at the top of the main control console, and the vacuum suction mechanism is arranged at the top of the negative pressure heating platform;
the vacuum suction mechanism comprises: the device comprises a moving part, a telescopic part and a suction part, wherein the moving part is arranged on a main control desk and is positioned above a chip stripping negative pressure heating platform, the telescopic part is connected to the moving part, and the suction part is arranged at the bottom of the telescopic part. The substrate and the chip are heated through the negative pressure heating platform, and the heated chip is subjected to negative pressure adsorption transfer through the vacuum suction mechanism, so that the substrate and the chip are safer and more convenient to replace manual work.
In some embodiments, the moving part includes: the X-axis screw module is arranged on the X-axis screw module, and the X-axis screw module drives the Y-axis screw module to reciprocate. The telescopic part and the suction part can be moved to any position on the negative pressure heating platform to suck the chip through the X-axis screw rod module and the Y-axis screw rod module.
In some embodiments, the telescoping portion is mounted on the Y-axis lead screw module and driven to reciprocate.
In some embodiments, the telescopic part is a cylinder and a mounting seat, the output end of the cylinder is provided with the mounting seat, the mounting seat is provided with the suction part, and the cylinder drives the suction part to move up and down. The up-and-down movement of the suction part is realized through the driving of the air cylinder, so that the chip is grabbed.
In some embodiments, the suction portion comprises: the vacuum suction pen is connected with the mounting seat, and the first vacuum pipeline is communicated with the vacuum suction pen. The vacuum suction pen is connected through the first vacuum pipeline to generate negative pressure to adsorb the chip so as to grasp the chip to move.
In some embodiments, the negative pressure heating platform comprises: shell, electrical heating subassembly, vacuum hole, constant head tank and second vacuum pipeline, electrical heating subassembly sets up in the shell, and the shell is fixed at the master control stand top, and the top of shell has the constant head tank, has a plurality of vacuum holes in the constant head tank, vacuum hole and second vacuum pipeline intercommunication. The position of the substrate is limited by the positioning groove, the second vacuum pipeline is connected with the vacuum hole, and finally the substrate is adsorbed and fixed by negative pressure.
In some embodiments, the diameter of the vacuum holes is 1mm-2mm.
Compared with the prior art, the utility model has the advantages that the operation method is simple and safe, the surface of the substrate after the negative pressure type heating platform is used is not scratched, the substrate can be reused, and the production cost is reduced; the substrate and the chip are heated by the negative pressure heating platform, and the heated chip is subjected to negative pressure adsorption transfer by the vacuum suction mechanism, so that the manual work is replaced more safely and conveniently; the position of the substrate is limited through the positioning groove, then the second vacuum pipeline is used for connecting the vacuum holes, and finally the substrate is adsorbed and fixed by negative pressure; the telescopic part and the suction part can move to any position on the negative pressure heating platform to suck the chip through the X-axis screw rod module and the Y-axis screw rod module; the up-and-down movement of the suction part is realized through the driving of the air cylinder, so that the chip is grabbed.
Drawings
FIG. 1 is a schematic diagram of a chip peel negative pressure heating platform according to the present utility model;
FIG. 2 is a schematic diagram of a moving part of a chip peeling negative pressure heating platform;
fig. 3 is a schematic structural diagram of the chip peeling negative pressure heating platform of the present utility model.
Detailed Description
The present utility model will be described in detail below with reference to the embodiments shown in the drawings, but it should be understood that the embodiments are not limited to the utility model, and equivalent changes or substitutions of functions, methods or structures according to the embodiments by those skilled in the art are included in the scope of the present utility model.
In the description of the present utility model, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, mechanically or electrically connected, may be in communication with each other between two elements, may be directly connected, or may be indirectly connected through an intermediate medium, and the specific meaning of the terms may be understood by those skilled in the art according to circumstances.
As shown in fig. 1, the negative pressure heating platform for chip peeling according to the present utility model comprises: the vacuum heating device comprises a main control platform 1, a negative pressure heating platform 2 and a vacuum suction mechanism 3, wherein the negative pressure heating platform 2 is arranged at the top of the main control platform 1, and the vacuum suction mechanism 3 is arranged at the top of the negative pressure heating platform 2;
the vacuum suction mechanism 3 includes: the chip stripping negative pressure heating platform comprises a moving part 31, a telescopic part 32 and a suction part 33, wherein the moving part 31 is arranged on the main control platform 1 and is positioned above the chip stripping negative pressure heating platform 2, the telescopic part 32 is connected to the moving part 31, and the suction part 33 is arranged at the bottom of the telescopic part 32. The substrate and the chip are heated through the negative pressure heating platform 2, and the heated chip is subjected to negative pressure adsorption transfer through the vacuum suction mechanism 3, so that the substrate and the chip are safer and more convenient to replace manual work.
As shown in fig. 2, the moving unit 31 includes: the support 311, X-axis screw rod module 312 and Y-axis screw rod module 313, the support 311 is vertically installed on the main control desk 1, the X-axis screw rod module 312 is erected on the support 311, the X-axis screw rod module 312 is provided with two groups, the Y-axis screw rod module 313 is installed on the X-axis screw rod module 312, and the X-axis screw rod module 312 drives the Y-axis screw rod module 313 to reciprocate. The telescopic part 32 and the suction part 33 can be moved to any position on the negative pressure heating platform 2 to suck the chip through the X-axis screw rod module 312 and the Y-axis screw rod module 313. In the specific implementation process, the support 311 is used to fix the positions of the four corners at the top of the main control console 1, the X-axis screw rod modules 312 are installed on two corresponding edges, and the two groups of X-axis screw rod modules 312 need to be arranged in parallel. The Y-axis screw rod assembly is mounted on the sliding block of the X-axis screw rod module 312, and the X-axis screw rod module 312 and the Y-axis screw rod module 313 are both existing screw rod modules, so that the sealing is good and the mounting is convenient.
The Y-axis screw module 313 is provided with a telescopic part 32 and drives the telescopic part 32 to reciprocate. The telescopic portion 32 is mounted on the slider of the X-axis screw module 312.
The telescopic part 32 is a cylinder 321 and a mounting seat 322, the output end of the cylinder 321 is provided with the mounting seat 322, the mounting seat 322 is provided with the suction part 33, and the cylinder 321 drives the suction part 33 to move up and down. The up-and-down movement of the suction portion 33 is achieved by driving of the air cylinder 321, and thus the gripping of the chip is completed.
The suction portion 33 includes: the vacuum suction pen 331 and the first vacuum pipeline 332, the vacuum suction pen 331 is connected with the mounting seat 322, and the first vacuum pipeline 332 is communicated with the vacuum suction pen 331. The vacuum suction pen 331 is connected through the first vacuum pipe 332 to generate negative pressure to adsorb the chip so as to grasp the chip for movement.
As shown in fig. 3, the negative pressure heating stage 2 includes: the electric heating device comprises a shell 21, an electric heating component 22, vacuum holes 23, a positioning groove 24 and a second vacuum pipeline 25, wherein the electric heating component 22 is arranged in the shell 21, the shell 21 is fixed at the top of the main control console 1, the positioning groove 24 is arranged at the top of the shell 21, a plurality of vacuum holes 23 are formed in the positioning groove 24, and the vacuum holes 23 are communicated with the second vacuum pipeline 25. The position of the substrate is limited by the positioning groove, the second vacuum pipeline 25 is connected with the vacuum hole 23, and finally the substrate is adsorbed and fixed by negative pressure.
The diameter of the vacuum holes 23 is 1mm-2mm.
The first vacuum pipe 332 and the second vacuum pipe 25 are both connected to a vacuum pump.
The method specifically comprises the following steps:
placing the substrate in the positioning groove 24, opening the electric heating assembly 22, then completely adsorbing the substrate on the shell 21 through the vacuum hole 23, and then operating the main control console 1 to open the heating switch to perform heating action; when the temperature reaches the melting point of tin, the vacuum suction pen 331 is controlled to pass through the X-axis screw rod module 312 and the Y-axis screw rod module 313, after the appointed position on the corresponding substrate is found, the vacuum suction pen 331 is opened to take the chip away from the substrate through the telescopic part 32 when the chip is contacted, the vacuum suction pen 331 is released to complete the chip taking action after the inspection container is placed, and the vacuum suction pen 331 is closed after all the inspection actions are completed; the main control desk 1 turns on the heating switch, and the whole operation is completed after the temperature is reduced to the room temperature.
While only certain embodiments of the present utility model have been described, it will be apparent to those skilled in the art that other modifications and improvements can be made without departing from the inventive concept of the present utility model.
Claims (7)
1. Chip stripping negative pressure heating platform, its characterized in that includes: the vacuum heating device comprises a main control platform, a negative pressure heating platform and a vacuum suction mechanism, wherein the negative pressure heating platform is arranged at the top of the main control platform, and the vacuum suction mechanism is arranged at the top of the heating platform;
the vacuum suction mechanism comprises: the mobile part is arranged on the main control desk and is positioned above the chip stripping negative pressure heating platform, the mobile part is connected with the telescopic part, and the suction part is arranged at the bottom of the telescopic part.
2. The negative pressure heating platen for chip detachment according to claim 1, wherein the moving section includes: the X-axis screw module is arranged on the X-axis screw module, and the X-axis screw module drives the Y-axis screw module to reciprocate.
3. The negative pressure heating platform for chip detachment according to claim 2, wherein the telescopic part is mounted on the Y-axis screw module and is driven to reciprocate.
4. The negative pressure heating platform for chip peeling according to claim 3, wherein the telescopic part comprises an air cylinder and a mounting seat, the output end of the air cylinder is provided with the mounting seat, the mounting seat is provided with a suction part, and the air cylinder drives the suction part to move up and down.
5. The negative pressure heating platen for die peeling of claim 4, wherein the suction portion comprises: the vacuum suction pen is connected with the mounting seat, and the first vacuum pipeline is communicated with the vacuum suction pen.
6. The negative pressure heating platen of claim 5, wherein the negative pressure heating platen comprises: shell, electrical heating subassembly, vacuum hole, constant head tank and second vacuum pipeline, electrical heating subassembly sets up in the shell, the shell is fixed at the master control stand top, the top of shell has the constant head tank, have a plurality of vacuum holes in the constant head tank, vacuum hole and second vacuum pipeline intercommunication.
7. The negative pressure heating platen of claim 6, wherein the vacuum holes have a diameter of 1mm-2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223600004.2U CN219180491U (en) | 2022-12-30 | 2022-12-30 | Chip stripping negative pressure heating platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223600004.2U CN219180491U (en) | 2022-12-30 | 2022-12-30 | Chip stripping negative pressure heating platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219180491U true CN219180491U (en) | 2023-06-13 |
Family
ID=86667442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223600004.2U Active CN219180491U (en) | 2022-12-30 | 2022-12-30 | Chip stripping negative pressure heating platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219180491U (en) |
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2022
- 2022-12-30 CN CN202223600004.2U patent/CN219180491U/en active Active
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