CN219123208U - Wafer carrying platform device - Google Patents
Wafer carrying platform device Download PDFInfo
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- CN219123208U CN219123208U CN202223395749.XU CN202223395749U CN219123208U CN 219123208 U CN219123208 U CN 219123208U CN 202223395749 U CN202223395749 U CN 202223395749U CN 219123208 U CN219123208 U CN 219123208U
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- air
- slip ring
- air inlet
- wafer
- inlet pipe
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a wafer carrying platform device, which comprises: the device comprises a sucker, a supporting frame, an air slip ring and a motor; the air slip ring comprises a rotating part and a fixing part, the supporting frame is arranged below the sucker, the motor is arranged below the supporting frame, the rotating part of the air slip ring is arranged in the supporting frame, an air inlet pipe of the rotating part of the air slip ring is communicated with the inside of the sucker, an air outlet pipe of the fixing part of the air slip ring is communicated with an air exhaust structure, and the rotating part of the air slip ring and the sucker rotate under the driving of the motor. The suction device comprises a suction disc, a driving motor, a suction disc, a gas inlet pipe, a gas sliding ring, a driving motor, a rotating part and a wafer, wherein the suction disc is connected with the suction disc through the gas inlet pipe of the gas sliding ring, the wafer can be adsorbed all the time through the gas inlet pipe of the gas sliding ring, the wafer is prevented from falling off in the rotating process, and the wafer is further prevented from being damaged.
Description
Technical Field
The utility model relates to the technical field of wafer detection, in particular to a wafer carrying table device.
Background
Currently, in the wafer inspection field, it is generally required to support and adsorb a wafer by a carrier, so as to facilitate subsequent inspection of the wafer. In addition, in the wafer inspection process, the wafer needs to be rotated in order to inspect the wafer from different angles.
In the prior art, a general carrier can support and adsorb a wafer, but if the wafer needs to be rotated, the adsorption operation needs to be stopped and then rotated. However, this method is easy to slip during the rotation process, so that the wafer is damaged, or the edge of the wafer is fixed and then rotated, but this method may scratch the wafer.
Based on this, how to realize the adsorption and rotation of the wafer so as to ensure that the wafer is not damaged is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
Based on the above problems, the present utility model provides a wafer carrier apparatus to adsorb and rotate a wafer, so as to avoid the wafer from being damaged.
The embodiment of the utility model discloses the following technical scheme:
the embodiment of the utility model discloses a wafer carrier device, which comprises: the device comprises a sucker, a supporting frame, an air slip ring and a motor; wherein the gas slip ring comprises a rotating part and a fixed part;
the supporting frame is arranged below the sucker; a motor is arranged below the supporting frame; the rotating part of the air slip ring is internally arranged in the supporting frame; an air inlet pipe of the rotating part of the air slip ring is communicated with the inside of the sucker; the air outlet pipe of the fixed part of the air slip ring is communicated with the air exhaust structure;
the rotating part of the air slip ring and the sucker rotate under the drive of the motor.
Optionally, the lower end of the supporting frame is fixedly connected with the rotating part of the motor.
Optionally, the apparatus further comprises: a support plate; wherein, the motor with backup pad fixed connection.
Optionally, the upper end of the air slip ring is fixedly connected with the sucker; the lower end of the air slip ring is fixedly connected with the supporting plate.
Optionally, the suction cup includes a first suction region and a second suction region that are isolated from each other.
Optionally, the air inlet pipe comprises a first air inlet pipe and a second air inlet pipe; the first air inlet pipe is communicated with the first adsorption area; the second air inlet pipe is communicated with the second adsorption area.
Optionally, the air outlet pipe comprises a first air outlet pipe and a second air outlet pipe; the first air outlet pipe is communicated with the first air inlet pipe; the second air outlet pipe is communicated with the second air inlet pipe.
Optionally, the first adsorption zone is circular; the second adsorption zone is annular and surrounds the first adsorption zone.
Optionally, the central axis of the first adsorption zone is collinear with the central axis of the second adsorption zone.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model provides a wafer carrier device, comprising: the device comprises a sucker, a supporting frame, an air slip ring and a motor; the air slip ring comprises a rotating part and a fixing part, the supporting frame is arranged below the sucker, the motor is arranged below the supporting frame, the rotating part of the air slip ring is arranged in the supporting frame, an air inlet pipe of the rotating part of the air slip ring is communicated with the inside of the sucker, an air outlet pipe of the fixing part of the air slip ring is communicated with an air exhaust structure, and the rotating part of the air slip ring and the sucker rotate under the driving of the motor. The suction device comprises a suction disc, a driving motor, a suction disc, a gas inlet pipe, a gas sliding ring, a driving motor, a rotating part and a wafer, wherein the suction disc is connected with the suction disc through the gas inlet pipe of the gas sliding ring, the wafer can be adsorbed all the time through the gas inlet pipe of the gas sliding ring, the wafer is prevented from falling off in the rotating process, and the wafer is further prevented from being damaged.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a side cross-sectional view of a wafer carrier apparatus provided by the present utility model;
FIG. 2 is a schematic illustration of an air slip ring 103 provided by the present utility model;
fig. 3 is a schematic diagram of a suction cup 101 according to the present utility model.
Detailed Description
In order to make the present utility model better understood by those skilled in the art, the following description will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As described above, in the prior art, a general carrier can support and adsorb a wafer, but if the wafer needs to be rotated, the adsorption operation needs to be stopped and then rotated. However, this method is easy to slip during the rotation process, so that the wafer is damaged, or the edge of the wafer is fixed and then rotated, but this method may scratch the wafer.
Based on the above problems, the present utility model provides a wafer stage apparatus. Various non-limiting embodiments of the present application are described in detail below in conjunction with the examples and figures, respectively.
Fig. 1 is a side cross-sectional view of a wafer carrier apparatus provided by the present utility model.
Referring to fig. 1, a wafer carrier apparatus 100 provided by the present utility model may specifically include: suction cup 101, support frame 102, air slip ring 103 and motor 104; wherein the gas slip ring 103 comprises a rotating part 201 and a fixed part 202;
the supporting frame 102 is arranged below the sucker 101; a motor 104 is arranged below the supporting frame 102; the rotating part 201 of the air slip ring 103 is arranged in the supporting frame 102; the air inlet pipe of the rotating part 201 of the air slip ring 103 is communicated with the inside of the sucker 101; the air outlet pipe of the fixing part 202 of the air slip ring 103 is communicated with an air exhaust structure;
wherein the rotating part 201 of the air slip ring 103 and the suction cup 101 are driven to rotate by the motor 104.
The suction cup 101 may be a ceramic suction cup, a silica gel suction cup, or the like, and is not particularly limited herein.
The motor 104 may be a DD motor or other motors, and the type of the motor is not specifically limited herein. The motor may include a rotating portion and a fixed portion.
The lower end of the supporting frame 102 is fixedly connected to the rotating portion of the motor 104.
As an implementation manner, the apparatus 100 may further include: a support plate 105; wherein, the motor 104 is fixedly connected with the supporting plate 105.
The support plate 105 is fixedly connected to the fixing portion 202 of the motor 104. The support plate 105 is fixedly connected with the lower surface of the suction cup 101, and the area of the upper surface of the support plate 105 is larger, so that the suction cup 101 can be stably supported.
It should be noted that, since the supporting frame 102 is hollow and has the upper and lower surfaces thereof being communicated, the upper end of the supporting frame 102 is fixedly connected with the supporting plate 105, and the lower end of the supporting frame 102 is fixedly connected with the rotor 1041 of the motor 104, so as to drive the supporting frame 102 and the suction cup 101 to rotate therewith.
The motor 104 may include a rotor 1041 and a stator 1042, among others.
Wherein, the upper end of the air slip ring 103 is fixedly connected with the sucker 101; the lower end of the gas slip ring 103 is fixedly connected with the support plate 105.
As an implementation manner, the apparatus provided by the present utility model may further include: a bottom plate 106; the stator 1042 of the motor 104 is fixed to the bottom plate 106, and the bottom plate 106 is mainly used for supporting the whole wafer stage device.
In the embodiment of the present utility model, the rotating portion 201 of the gas slip ring 103 is rotatable and disposed on the fixed block, and the rotating portion 201 is fixedly connected to the support plate 105 and the ceramic chuck 101 through a connecting piece. The rotary part 201 is provided with a plurality of air inlet pipes, which may be used for air inlet (and also for air outlet, not specifically described herein), and at least two air inlet pipes (a first air inlet pipe and a second air inlet pipe as indicated in the present utility model) are provided.
The supporting block 107 is fixed below the fixing portion 202 of the gas slip ring 103, the supporting block 107 is fixedly connected with the bottom plate 106, a channel 1 can be arranged on the supporting block 107, the channel 1 is communicated with the channel 2, and an external pipeline is conveniently connected into the supporting frame 102. The fixing portion 202 is provided with a plurality of air outlet pipes, the number of the air outlet pipes is the same as that of the air inlet pipes and corresponds to the air inlet pipes one by one, so that the air inlet pipes are communicated with the interiors of the corresponding air outlet pipes. The air outlet pipe can be connected with an external air extraction structure through a pipeline penetrating through the channel 1 and the channel 2, so that the suction cup 101 is subjected to air extraction to form negative pressure or air blowing to release negative pressure.
Based on the foregoing, as shown in fig. 1, in an embodiment of the present utility model, an air inlet pipe 108 and an air outlet pipe 109 may be further included.
In the utility model, in order to distinguish the air pipes of different parts, the air inlet pipe and the air outlet pipe are distinguished, but in practical application, the air inlet pipe and the air outlet pipe are of corresponding structures, so that negative pressure can be formed by air suction or negative pressure can be released by air blowing, namely, the air inlet pipe and the air outlet pipe can both realize air inlet or air outlet.
The suction cup 101 includes a first suction area and a second suction area that are isolated from each other.
Correspondingly, the air inlet pipe comprises a first air inlet pipe and a second air inlet pipe; the first air inlet pipe is communicated with the first adsorption area; the second air inlet pipe is communicated with the second adsorption area.
Correspondingly, the air outlet pipe comprises a first air outlet pipe and a second air outlet pipe; the first air outlet pipe is communicated with the first air inlet pipe; the second air outlet pipe is communicated with the second air inlet pipe.
In the embodiment of the present utility model, the number of the air outlet pipes and the air inlet pipes is two, but in other realizable embodiments, the number of the air outlet pipes and the air inlet pipes is not limited to two, but may be multiple, and is not limited herein specifically.
Wherein the first adsorption zone is circular; the second adsorption zone is annular and surrounds the first adsorption zone.
In one embodiment, the diameter of the first adsorption zone may be 8 inches, and the diameter of the second adsorption zone may be 12 inches, which may be determined according to practical situations, and is not particularly limited herein.
Since the wafer is generally circular, in practical applications, the adsorption zone is arranged in a circular shape. The adsorption zone means the whole area containing the adsorption function, the first adsorption zone is generally used for adsorbing the wafer with smaller size, and the second adsorption zone is used for adsorbing the wafer with larger size than the first adsorption zone by combining the first adsorption zone.
Wherein the central axis of the first adsorption zone is collinear with the central axis of the second adsorption zone. That is, the first adsorption area and the second adsorption area are concentric.
According to the wafer carrying platform device provided by the embodiment of the utility model, the air inlet pipe of the air slip ring is connected with the sucker, so that the wafer can be adsorbed, and meanwhile, the rotating part of the air slip ring drives the sucker to rotate through the driving motor, so that the wafer can be rotated, the wafer can be always in an adsorbed state in the rotating process, the wafer is prevented from falling off in the rotating process, and the wafer is further prevented from being damaged.
For further clarity of the structure of the gas slip ring 103, refer to fig. 2, which is a schematic diagram of the gas slip ring 103 provided by the present utility model, and in combination with fig. 2, the gas slip ring 103 may include: an air inlet pipe 1081, an air outlet pipe 1091, a rotating portion 201, and a fixed portion 202.
The fixing portion 202 is externally arranged on the rotating portion 201, that is, the rotating portion 201 is nested in the fixing portion 202, and specifically, the structure of the actual gas slip ring 103 can be seen.
In the utility model, in order to distinguish the air pipes of different parts, the air inlet pipe and the air outlet pipe are distinguished, but in practical application, the air inlet pipe and the air outlet pipe are of corresponding structures, so that negative pressure can be formed by air suction or negative pressure can be released by air blowing, namely, the air inlet pipe and the air outlet pipe can both realize air inlet or air outlet.
For further clarity of the structure of the chuck 101, refer to fig. 3, which is a schematic diagram of the chuck 101 provided by the present utility model, and in conjunction with fig. 3, the chuck 101 may include: a first adsorption region 301, a second adsorption region 302, and a through hole 303.
The through hole 303 of the first adsorption zone 301 is used for being connected to a first air inlet pipe, and can be used for adsorbing a wafer. In the embodiment of the present utility model, the connection relationship between the second adsorption area and the corresponding second air inlet pipe is not shown, and the connection relationship between the first adsorption area 301 and the first air inlet pipe may be referred to specifically, or may be connected in other manners, which is not limited specifically herein.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A wafer carrier apparatus, the apparatus comprising: the device comprises a sucker, a supporting frame, an air slip ring and a motor; wherein the gas slip ring comprises a rotating part and a fixed part;
the supporting frame is arranged below the sucker; a motor is arranged below the supporting frame; the rotating part of the air slip ring is internally arranged in the supporting frame; an air inlet pipe of the rotating part of the air slip ring is communicated with the inside of the sucker; the air outlet pipe of the fixed part of the air slip ring is communicated with the air exhaust structure;
the rotating part of the air slip ring and the sucker rotate under the drive of the motor.
2. The wafer carrier apparatus of claim 1, wherein a lower end of the support frame is fixedly connected to a rotating portion of the motor.
3. The wafer carrier apparatus of claim 1, wherein the apparatus further comprises: a support plate; wherein, the motor with backup pad fixed connection.
4. The wafer carrier apparatus of claim 3, wherein an upper end of the gas slip ring is fixedly connected to the suction cup; the lower end of the air slip ring is fixedly connected with the supporting plate.
5. The wafer carrier apparatus of claim 1, wherein the chuck comprises a first suction zone and a second suction zone that are isolated from each other.
6. The wafer carrier apparatus of claim 5, wherein the air inlet duct comprises a first air inlet duct and a second air inlet duct; the first air inlet pipe is communicated with the first adsorption area; the second air inlet pipe is communicated with the second adsorption area.
7. The wafer carrier apparatus of claim 6, wherein the gas outlet duct comprises a first gas outlet duct and a second gas outlet duct; the first air outlet pipe is communicated with the first air inlet pipe; the second air outlet pipe is communicated with the second air inlet pipe.
8. The wafer carrier apparatus of claim 5, wherein the first suction zone is circular; the second adsorption zone is annular and surrounds the first adsorption zone.
9. The wafer carrier apparatus of claim 7, wherein a central axis of the first suction zone is collinear with a central axis of the second suction zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223395749.XU CN219123208U (en) | 2022-12-15 | 2022-12-15 | Wafer carrying platform device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223395749.XU CN219123208U (en) | 2022-12-15 | 2022-12-15 | Wafer carrying platform device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219123208U true CN219123208U (en) | 2023-06-02 |
Family
ID=86530902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223395749.XU Active CN219123208U (en) | 2022-12-15 | 2022-12-15 | Wafer carrying platform device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219123208U (en) |
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2022
- 2022-12-15 CN CN202223395749.XU patent/CN219123208U/en active Active
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