CN219106883U - Block terminal and block terminal heat radiation structure - Google Patents

Abstract

The application relates to the technical field of power equipment and provides a distribution box and a distribution box heat radiation structure. The power distribution box heat dissipation structure comprises a first circuit board, a second circuit board, a heat dissipation fan and heat dissipation holes, wherein the first circuit board, the second circuit board and the heat dissipation fan are arranged in a box body; the first circuit board and the second circuit board are arranged at intervals and are stacked, and a first heat dissipation gap is formed at the intervals of the first circuit board and the second circuit board; a second heat dissipation gap is formed at the interval between the second circuit board and the box body; the heat dissipation fan is configured to be disposed toward the first heat dissipation gap and the second heat dissipation gap. And cooling air blown out by the cooling fan passes through the first cooling gap and the second cooling gap to form an air channel so as to take away heat of the electronic components on the first circuit board and the second circuit board, and the cooling air is blown out of the box body through the cooling holes so as to reduce the temperature in the box body.

Description

Block terminal and block terminal heat radiation structure

Technical Field

The application relates to the technical field of power equipment, in particular to a distribution box and a distribution box heat radiation structure.

Background

The distribution box is a distribution device for assembling switching equipment, measuring instruments, protection electrical appliances and auxiliary equipment in a closed or semi-closed metal cabinet according to the electrical wiring requirements. When a household power grid is externally connected with power equipment, a distribution box is generally required to distribute the current of the household power grid, so that the voltage and current requirements of the specific power equipment are met.

A large number of electronic elements are integrated in the distribution box, and when the electronic elements are electrified and run, a large amount of heat is generated, so that the temperature in the distribution box is often too high, and the electrical elements in the distribution box are easily short-circuited and damaged due to the too high temperature in the distribution box, so that the normal use of the distribution box is influenced.

Accordingly, it is desirable to provide a power distribution box with a good heat dissipation effect, which dissipates heat from electronic components in the power distribution box.

Disclosure of Invention

For overcoming the not enough among the prior art, this application provides a block terminal and block terminal heat radiation structure.

The utility model provides a block terminal heat radiation structure, including locate first circuit board, second circuit board, radiator fan in the box and locate the louvre on the box;

the first circuit board and the second circuit board are arranged at intervals and are stacked, and a first heat dissipation gap is formed at the intervals of the first circuit board and the second circuit board;

the second circuit board is arranged at intervals with the box body, and a second heat dissipation gap is formed at the intervals between the second circuit board and the box body;

the heat dissipation fan is configured to be disposed toward the first heat dissipation gap and the second heat dissipation gap;

the heat dissipation holes are used for enabling the inside of the box body to be communicated with the outside of the box body.

In one possible embodiment, the cooling air volume blown into the first heat dissipation gap by the heat dissipation fan is larger than the cooling air volume blown into the second heat dissipation gap.

In one possible embodiment, the component face on the first circuit board is configured to be disposed toward the first heat dissipation gap, and the component face on the second circuit board is configured to be disposed toward the second heat dissipation gap; the total heating power of the electronic components on the first circuit board is larger than that of the electronic components on the second circuit board.

In one possible implementation manner, the heat dissipation holes are arranged in the air inlet direction and the air outlet direction of the heat dissipation fan, so that an air channel penetrating through the box body is formed.

In one possible embodiment, the heat dissipation structure of the electrical box further includes a supporting and positioning member for spacing apart the first circuit board and the second circuit board and positioning the first circuit board and the second circuit board.

In one possible implementation manner, the plurality of supporting and positioning pieces are provided, and two ends of the plurality of supporting and positioning pieces are arranged at intervals along the circumferential direction of the first circuit board and the second circuit board.

In one possible embodiment, the support fixture is made of a thermally conductive material.

The application also provides a block terminal, includes the box still includes foretell block terminal heat radiation structure.

In one possible implementation manner, the case body includes a case body and a cover body, the cover body is movably connected to the case body and configured to be buckled with the opening of the case body, and the second heat dissipation gap is formed between the cover body and the second circuit board.

In one possible embodiment, the housing is made of a thermally conductive material.

Compared with the prior art, the beneficial effect of this application: the application provides a heat dissipation structure of a distribution box, which comprises a first circuit board and a second circuit board which are arranged at intervals in a stacked mode, wherein a first heat dissipation gap is formed at the intervals of the first circuit board and the second circuit board; a second heat dissipation gap is formed at the interval between the second circuit board and the box body; the air outlet of the heat dissipation fan is configured to face the first heat dissipation gap and the second heat dissipation gap. The first circuit board and the second circuit board can integrate a plurality of electronic components, cooling air blown by the cooling fan passes through the first cooling gap and the second cooling gap to form an air channel so as to take away heat of the electronic components on the first circuit board and the second circuit board, and the cooling air carrying certain heat can reduce the temperature in the box body after being blown out of the box body through the cooling holes. The utility model also provides a block terminal because including foretell block terminal heat radiation structure, consequently also have block terminal heat radiation structure's technical effect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 shows a schematic perspective view of a heat dissipation structure of a power distribution box;

fig. 2 shows a schematic perspective view of a heat dissipation structure of the distribution box at another angle;

FIG. 3 shows an assembly view of a heat dissipating structure of an electrical box with a cover portion of the box;

FIG. 4 illustrates a side view of a heat dissipating structure of an electrical box;

fig. 5 shows a schematic view of the structure of the distribution box when opened;

fig. 6 shows a schematic view of the structure of the distribution box when closed;

fig. 7 shows a schematic structural view of the supporting and positioning member.

Description of main reference numerals:

100-a first circuit board; 200-a second circuit board; 300-a heat dissipation fan; 400-supporting the positioning piece; 410-countersink; 500-box body; 510-a box body; 520-cover; 600-heat dissipation holes; 700-power module; 800-a first heat dissipation gap; 900-second heat dissipation gap.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Example 1

The embodiment provides a cooling structure of a distribution box, which is used for reducing the temperature in the distribution box. Referring to fig. 1-2, fig. 1 shows a schematic perspective view of a heat dissipation structure of a power distribution box, and fig. 2 shows a schematic perspective view of a heat dissipation structure of a power distribution box at another angle. As can be seen from fig. 1 and 2, the heat dissipation structure of the distribution box includes a first circuit board 100, a second circuit board 200, a heat dissipation fan 300, and a supporting and positioning member 400. In addition, the heat dissipation structure of the distribution box further includes a heat dissipation hole 600 (in fig. 1 and 2, the heat dissipation hole 600 is not shown) disposed in the box 500.

Referring to fig. 1, in the present application, a first circuit board 100 and a second circuit board 200 are used to integrate each group of power modules 700 in a distribution box.

In the conventional power distribution box, each group of power modules 700 that realize different functions is independently provided and is mounted to different positions in the power distribution box in a scattered manner. On the one hand, in order to accommodate the power modules 700 in different positions, the overall volume of the distribution box must be designed to be large, so that enough space is available inside the distribution box to accommodate various power modules 700; on the other hand, since the power modules 700 are independently arranged, wiring between the power modules 700 is complex, which is not beneficial to heat dissipation of the distribution box.

In this application, the power modules 700 of each group are uniformly integrated on the first circuit board 100 or the second circuit board 200, and the power modules 700 of each group are electrically connected through copper wires on the first circuit board 100 or the second circuit board 200. Since the conductive wires (copper wires) connecting the power modules 700 of each group are only on the board surface of the first circuit board 100 or the second circuit board 200, the conductive wire structure in the distribution box is simplified, and uniform heat dissipation is facilitated for each group of power modules 700. On the other hand, since the power modules 700 of the respective groups are sequentially mounted on the first circuit board 100 or the second circuit board 200 without being separately mounted, the internal space of the distribution box for accommodating the power modules 700 of the respective groups is reduced, which contributes to the design of the distribution box to be small.

The first circuit board 100 is mounted on the substrate in a bonding manner, a plurality of supporting and positioning members 400 are mounted on the first circuit board 100, and the plurality of supporting and positioning members 400 are all located on the same side of the first circuit board 100. The upper end surfaces of the plurality of supporting and positioning members 400 are located in the same plane, and the second circuit board 200 is mounted above the first circuit board 100 through the plurality of supporting and positioning members 400. The supporting and positioning member 400 is used for spacing the first circuit board 100 from the second circuit board 200 and positioning the first circuit board 100 from the second circuit board 200. At this time, the first circuit board 100 and the second circuit board 200 are spaced apart and stacked, and a first heat dissipation gap 800 is formed at the interval between the first circuit board 100 and the second circuit board 200.

Referring to fig. 4, fig. 4 shows an assembly diagram of the heat dissipation structure of the distribution box and the cover portion of the box 500. As can be seen, the second circuit board 200 is spaced apart from the cover plate, and thus a second heat dissipation gap 900 is formed at the interval of the second circuit board 200 and the case 500.

Referring to fig. 1-3, it can be seen that the air outlet of the cooling fan 300 is configured to face the first cooling gap 800 and the second cooling gap 900, and the projection of the cooling fan 300 to the first circuit board 100 or the second circuit board 200 falls into the first cooling gap 800 and the second cooling gap 900, so that the cooling air blown by the cooling fan 300 can pass through the first cooling gap 800 and the second cooling gap 900 to form two layers of air channels to take away the heat emitted by the power modules 700 on the first circuit board 100 and the second circuit board 200.

Referring to fig. 2, it can be seen that the number of the heat dissipation fans 300 is two, and the air outlets of the two heat dissipation fans 300 face the first heat dissipation gap 800 or the second heat dissipation gap 900, so as to generate a better heat dissipation effect. In other possible embodiments, the specific number of the heat dissipation fans 300 is not limited, and may be more than three.

Referring to fig. 5 and 6, fig. 5 shows a schematic structural diagram of the power distribution box when opened, and fig. 6 shows a schematic structural diagram of the power distribution box when closed.

The above-mentioned distribution box heat radiation structure is arranged in the box 500 of the distribution box, and it can be seen from the figure that one surface of the box 500 is provided with a heat radiation hole 600 for conducting the interior of the box 500 and the exterior of the box 500, and the temperature in the box 500 can be reduced after the cooling air carrying a certain amount of heat is blown out of the box 500 through the heat radiation hole 600.

Referring to fig. 3, fig. 3 shows a side view of the heat dissipation structure of the distribution box. As can be seen, the heat dissipation fan 300 is mounted on the substrate and is disposed on the same side as the second circuit board 200. The top of the heat dissipation fan 300 is slightly higher than the second circuit board 200, and most of the projection of the heat dissipation fan 300 to the first circuit board 100 or the second circuit board 200 falls into the first heat dissipation gap 800, and the other part falls into the second heat dissipation gap 900. Therefore, the cooling air volume blown into the first heat dissipation gap 800 by the heat dissipation fan 300 is larger than the cooling air volume blown into the second heat dissipation gap 900.

It should be noted that, the first heat dissipation gap 800 is formed at a space between the first circuit board 100 and the second circuit board 200, and the cooling air passing through the first heat dissipation gap 800 can take away heat of the first circuit board 100 and the second circuit board 200 at the same time. The second heat dissipation gap 900 is formed between the second circuit board 200 and the case 500, and the cooling air passing through the second heat dissipation gap 900 can only substantially remove the heat on the second circuit board 200. Therefore, the height of the cooling fan 300 is set such that most of the cooling air blown out therefrom passes through the first cooling gap 800, which is advantageous in sufficiently utilizing the cooling air for heat dissipation.

In some embodiments, the heat dissipation structure of the electrical box includes more than two heat dissipation fans 300, wherein the cooling air blown by one heat dissipation fan 300 passes through the first heat dissipation gap 800 and the second heat dissipation gap 900 at the same time, and the cooling air blown by the other heat dissipation fans 300 is preferably blown into only the second heat dissipation gap 900, so as to optimally distribute the air volume of the cooling air.

The element face on the first circuit board 100 is configured to be disposed toward the first heat dissipation gap 800, and the element face of the second circuit board 200 is configured to be disposed toward the second heat dissipation gap 900. The two surfaces of the circuit board are a component surface and a soldering surface, respectively, and the component surface is a surface on which electronic components are mainly mounted. The total heating power of the power module 700 on the first circuit board 100 is greater than the total heating power of the power module 700 on the second circuit board 200.

It can be appreciated that since the amount of cooling air passing through the first heat dissipation gap 800 is relatively large, heat dissipation of the power module 700 on the first circuit board 100 having a larger total heat dissipation amount is facilitated.

Referring to fig. 5 and 6 again, the distribution box is provided with heat dissipation holes 600 in both the air inlet direction and the air outlet direction of the heat dissipation fan 300, so as to form an air channel penetrating through the box 500. Specifically, when the cooling fan 300 is running, negative pressure is formed in the air inlet direction, and air outside the distribution box is sucked into the box body 500 through the cooling holes 600, so as to increase the air volume blown out by the cooling fan 300. Positive pressure is formed in the direction of the air outlet of the cooling fan 300, so that cooling air carrying a certain amount of heat can be conveniently blown out of the case 500.

Referring to fig. 5, in some preferred embodiments, the heat dissipation holes 600 are disposed on two opposite sides of the case 500, and the air inlet of the heat dissipation fan 300 is closely attached to the heat dissipation hole 600 on one of the sides, so that air outside the case 500 is sucked into the case 500 through the heat dissipation fan 300. In addition, the cooling fan 300 is closely attached to the inner wall of the case 500, and the air outlet of the cooling fan 300 is disposed toward the center of the case 500, so as to extend the path of the cooling air flowing in the case 500.

Referring to fig. 1, in some embodiments, two ends of the plurality of supporting and positioning members 400 are disposed at intervals along the circumferential direction of the first circuit board 100 and the second circuit board 200, so as to reduce the blocking area of the supporting and positioning members 400 against the cooling wind in the first heat dissipation gap 800.

In some preferred embodiments, the support fixture 400 is made of a thermally conductive material, and in particular, the support fixture 400 may be a stainless steel piece. Through the above arrangement, the heat of the first circuit board 100 and the second circuit board 200 is conducted to the supporting and positioning member 400, so as to cool the first circuit board 100 and the second circuit board 200. The supporting and positioning member 400 can also radiate heat by the heat radiation fan 300.

Referring to fig. 7, in some embodiments, the support fixture 400 is a stud. The upper end of the stud is in a shape of a hexagonal prism, a countersunk hole 410 is arranged at the top of the stud, and the lower end of the stud is in a shape of a cylinder.

Through holes penetrating the first circuit board 100 and the substrate are formed in the peripheries of the first circuit board 100 and the substrate, a connector (not shown in the figure) matched with the lower end of the stud is arranged on the box 500, and the lower end of the stud penetrates through the through holes and is inserted into the connector of the box 500. The upper end of the stud passes through the second circuit board 200, and a fastening screw (not shown in the figure) is screwed into a countersunk hole 410 at the top of the stud, and the screw head of the fastening screw is sleeved with a compression ring and is compressed on the second circuit board 200 through the compression ring. Through the arrangement, the position of the stud is fixed.

The beneficial effects of this application: the application provides a heat dissipation structure of a distribution box, which comprises a first circuit board 100 and a second circuit board 200 which are arranged at intervals in a stacked manner, wherein a first heat dissipation gap 800 is formed at the intervals of the first circuit board 100 and the second circuit board 200; a second heat dissipation gap 900 is formed at a space between the second circuit board 200 and the case 500; the air outlet of the heat dissipation fan 300 is configured to face the first heat dissipation gap 800 and the second heat dissipation gap 900. The first circuit board 100 and the second circuit board 200 can integrate a plurality of electronic components, the cooling air blown by the cooling fan 300 passes through the first cooling gap 800 and the second cooling gap 900 to form an air channel so as to take away the heat of the electronic components on the first circuit board 100 and the second circuit board 200, and the cooling air carrying a certain amount of heat can reduce the temperature in the box 500 after being blown out of the box 500 through the cooling holes 600.

Example two

The embodiment provides a power distribution box, which comprises the power distribution box heat dissipation structure in the first embodiment, so that the power distribution box heat dissipation structure has all beneficial effects.

Referring to fig. 5-6, a box 500 of the distribution box includes a box body 510 and a cover 520, wherein the cover 520 is movably connected to the box body 510 and configured to be fastened to an opening of the box body 510. Specifically, one side of the cover 520 is hinged to the opening edge of the case 510 by a hinge. The second heat dissipation gap 900 is formed between the cover 520 and the second circuit board 200. Therefore, when the cover 520 is opened, it is advantageous to cool the second circuit board 200.

In some embodiments, the enclosure 500 is made of a thermally conductive material to facilitate reducing the temperature of the enclosure 500. Specifically, the case 500 may be made of a sheet metal material or a stainless steel material.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.

Claims (10)

1. The utility model provides a block terminal heat radiation structure which is characterized in that the block terminal heat radiation structure comprises a first circuit board, a second circuit board, a heat radiation fan and a heat radiation hole arranged on the block terminal;

the first circuit board and the second circuit board are arranged at intervals and are stacked, and a first heat dissipation gap is formed at the intervals of the first circuit board and the second circuit board;

the second circuit board is arranged at intervals with the box body, and a second heat dissipation gap is formed at the intervals between the second circuit board and the box body;

the heat dissipation fan is configured to be disposed toward the first heat dissipation gap and the second heat dissipation gap;

the heat dissipation holes are used for enabling the inside of the box body to be communicated with the outside of the box body.

2. The heat dissipating structure of the electrical box of claim 1, wherein the cooling air volume blown into the first heat dissipating gap by the heat dissipating fan is greater than the cooling air volume blown into the second heat dissipating gap.

3. The electrical box heat dissipating structure of claim 2, wherein the component face on the first circuit board is configured to be disposed toward the first heat dissipating gap and the component face on the second circuit board is configured to be disposed toward the second heat dissipating gap; the total heating power of the electronic components on the first circuit board is larger than that of the electronic components on the second circuit board.

4. The heat dissipating structure of the electrical box according to claim 2, wherein the heat dissipating holes are provided in both the air inlet direction and the air outlet direction of the heat dissipating fan, thereby forming an air channel penetrating through the box body.

5. The electrical box heat dissipating structure of claim 1, further comprising a support locator for spacing and locating the first circuit board from the second circuit board.

6. The heat dissipating structure of the electrical box of claim 5, wherein the plurality of supporting and positioning members are provided, and two ends of the plurality of supporting and positioning members are disposed at intervals along the circumferential direction of the first circuit board and the second circuit board.

7. The electrical box heat dissipating structure of claim 5, wherein the support locator is made of a thermally conductive material.

8. A power distribution box comprising said box body, further comprising the power distribution box heat dissipation structure as claimed in any one of claims 1 to 7.

9. The electrical box of claim 8, wherein the box comprises a case and a cover, the cover is movably connected to the case and configured to be fastened to the case opening, and the second heat dissipation gap is formed between the cover and the second circuit board.

10. The electrical box of claim 8, wherein the box body is made of a thermally conductive material.

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