CN219094031U - Laser cutting device - Google Patents

Abstract

The utility model discloses a laser cutting device, which comprises a processing table, a lifting mechanism and a laser component; the processing platform includes first slip table and second slip table, and second slip table slidable is located on the first slip table for hold and put the work piece of waiting to process, elevating system includes the execution end, and the top of processing platform is located to the execution end liftable, and the execution end is located to the laser subassembly, and the laser subassembly includes the cutting head, and the cutting head includes a accommodation space and communicates the inlet port and the venthole in accommodation space respectively, and the inlet port is used for supplying the shielding gas to get into the accommodation space, and the venthole is seted up and is located the one end that the accommodation space is close to the processing platform for the shielding gas and laser beam pass through. The laser cutting device improves the cutting efficiency and the yield.

Description

Laser cutting device

Technical Field

The utility model relates to the technical field of cutting equipment, in particular to a laser cutting device.

Background

Silicon has photoelectric effect with high conversion efficiency, is mainly applied to photovoltaic and semiconductor industries, and needs to be segmented before the silicon enters an assembly link.

The current cutting mode for the silicon wafer is as follows: cutting with a diamond piece and laser preheating cutting; firstly, diamond pre-slides on a silicon wafer to form a cutting mark, then the silicon wafer is broken according to the cutting mark direction, and the laser pre-heating cutting is to enable the silicon wafer to generate a temperature gradient field, enable the silicon wafer to generate marks along a heated track through thermal stress, and then break the silicon wafer. The above scheme for dividing the silicon wafer has the following defects: the silicon wafer needs to be pre-scratched or pre-cut along the scratch and the preheating track, and broken materials and even cracks can be generated in the breaking process, so that the silicon wafer is damaged, and the cutting efficiency and the cutting yield of the silicon wafer are reduced.

Disclosure of Invention

The utility model mainly aims to provide a laser cutting device which aims to improve the efficiency and the cutting yield of a silicon wafer.

In order to achieve the above object, the laser screen removing device provided by the present utility model includes:

the processing table comprises a first sliding table and a second sliding table, and the second sliding table is slidably arranged on the first sliding table and is used for bearing a workpiece to be processed;

the lifting mechanism comprises an execution end, and the execution end is arranged above the processing table in a lifting manner;

the laser component is arranged at the execution end and comprises a cutting head, the cutting head comprises a containing space, an air inlet hole and an air outlet hole, the air inlet hole and the air outlet hole are respectively communicated with the containing space, the air inlet hole is used for allowing protective gas to pass through and enter the containing space, and the air outlet hole is formed in one end, close to the processing table, of the containing space so as to allow the protective gas and the laser beam to pass through.

In some embodiments, the laser assembly further comprises a lens disposed in the accommodation space, and the air inlet hole is located between the lens and the air outlet hole.

In some embodiments, the laser assembly further includes a focusing mechanism movably disposed in the accommodating space and connected to the lens, for driving the lens to translate toward or away from the air outlet.

In some embodiments, the processing table further includes an adsorption fixture, where the adsorption fixture is disposed on the first sliding table toward the laser component, and is used for adsorbing the workpiece to be processed.

In some embodiments, the laser cutting device further comprises:

a base;

the first driving device is arranged on the machine base and used for driving the first sliding table to transversely reciprocate along the surface of the machine base;

the second driving device is arranged on the first sliding table and is used for driving the second sliding table to vertically reciprocate along the surface of the base relative to the first sliding table;

the lifting mechanism comprises a third driving device and a sliding module, the sliding module is slidably arranged on the base along the direction perpendicular to the first sliding table, and the third driving device is used for driving the sliding module.

In some embodiments, the stand comprises:

a base;

the cantilever is fixedly arranged on the base, the cantilever is positioned above the first sliding table, and the lifting mechanism is arranged on the cantilever.

In some embodiments, the laser cutting device further comprises a translation mechanism that spans the stand, the lifting mechanism is disposed on the translation mechanism, and the translation mechanism is disposed horizontally slidably along the stand.

In some embodiments, the laser cutting device further comprises a fourth drive device;

the translation mechanism comprises a fifth driving device and a traversing module provided with the lifting mechanism, wherein the traversing module is arranged above the machine base, the fourth driving device drives the translation mechanism to reciprocate along the surface of the machine base, and the fifth driving device drives the traversing module to reciprocate transversely along the surface of the machine base.

According to the technical scheme, the laser cutting device is used for fixing the silicon wafer to be cut through the processing table, driving the silicon wafer to be cut to adjust the cutting track according to preset parameters, jetting out protective gas at a high speed from the air outlet hole of the cutting head, blowing away heat, fragments and the like generated by cutting the silicon wafer, and finally directly cutting the silicon wafer to be cut through the laser beam emitted by the laser component. Compared with the prior art, according to the cutting scheme that cutting marks are preheated by diamond and laser and broken along the marks, the laser cutting device provided by the utility model can cut and separate the silicon wafer at one time, meanwhile, the generation of cracks is avoided, and the efficiency and the yield of cutting the silicon wafer are improved.

Drawings

FIG. 1 is a schematic view of the overall structure of a laser cutting device according to an embodiment of the present utility model;

FIG. 2 is a schematic view of the whole structure of another embodiment of the laser cutting device of the present utility model;

FIG. 3 is a schematic cross-sectional view of a cutting head of an embodiment of the laser cutting apparatus of the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

It will also be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The utility model provides a laser cutting device which is mainly applied to cutting of silicon wafers.

Referring to fig. 1, in the present embodiment, the laser cutting apparatus includes a processing table 100, a lifting mechanism 200, and a laser assembly 202, wherein:

the processing table 100 comprises a first sliding table 101 and a second sliding table 102, and the second sliding table 102 is slidably arranged on the first sliding table 101 and is used for bearing a workpiece to be processed;

the lifting mechanism 200 comprises an executing end, and the executing end is arranged above the processing table 100 in a lifting manner;

the laser assembly 202 is disposed at the execution end, the laser assembly 202 includes a cutting head 201, the cutting head 201 includes a containing space 213, and an air inlet 211 and an air outlet 212 respectively connected to the containing space 213, the air inlet 211 is used for passing through a shielding gas and entering the containing space 213, and the air outlet 212 is disposed at one end of the containing space 213 near the processing table 100 for passing through the shielding gas and the laser beam. Note that, the execution end of the lifting mechanism 200 may be a sliding table, and the shielding gas in this embodiment is an inert gas (for example, helium, neon, argon, krypton, xenon, etc.). The workpieces to be processed in this embodiment all refer to silicon wafers to be cut (referred to as silicon wafers to be cut).

The working principle of the laser cutting device of the embodiment is as follows: firstly, the device is powered on and started, a silicon wafer to be cut is placed on the second sliding table 102, the lifting mechanism 200 is controlled by the main control unit (for example, a CPU) to lift, so as to adjust the distance between the cutting head 201 and the silicon wafer to be cut (for example, 0.3mm, 0.4mm, 0.5mm, etc.), the distance can be adjusted according to the thickness of the silicon wafer to be cut, then the main control unit is used for setting and adjusting the working parameters (for example, outputting the duty ratio, the frequency, the cutting speed, the cutting pattern track, the laser focus, etc.), after the above preparation work is done, the cutting operation can be started, at this moment, the laser component 202 emits the laser beam towards the silicon wafer to be cut, at the same time, the main control unit controls the protective gas to be ejected from the air outlet 212 at a high speed, the generated fragments of the cut silicon wafer are blown out from the cutting gap, at the same time, part of heat generated by the cut silicon wafer is taken away, and the cutting head 201 cuts the silicon wafer to be cut along the preset cutting track under the dynamic cooperation of the main control unit controls the first sliding table 101, the second sliding table 102 and the lifting mechanism 200 until the cutting is completed.

The laser cutting device of this embodiment is used for fixing a silicon wafer to be cut through the processing table 100, driving the silicon wafer to be cut to adjust a cutting track according to preset parameters, and then jetting out a protective gas at a high speed through the air outlet 212 of the cutting head 201 to blow away heat, fragments and the like generated by cutting the silicon wafer, and meanwhile, directly cutting the silicon wafer to be cut through a laser beam emitted by the laser component 202. Compared with the prior art, the laser cutting device of the embodiment cuts and separates the silicon wafer once through the scheme that cutting marks are preheated by diamond and laser and broken along the marks on the silicon wafer to be cut, thereby avoiding the generation of cracks and improving the efficiency and the yield of cutting the silicon wafer. In addition, heat and scraps generated in the process of cutting the silicon wafer are blown away by spraying the protective gas at a high speed, so that scraps are prevented from remaining on the surface of the silicon wafer, and the thermal influence on the silicon wafer is reduced.

Referring to fig. 3, in the present embodiment, the laser assembly 202 further includes a lens 210, the lens 210 is disposed in the accommodating space 213, and the air inlet 211 is located between the lens 210 and the air outlet 212. In the present embodiment, only the air intake hole 211 is taken as a single example. Of course, in other embodiments, the air intake holes 211 may be two or three, which is not particularly limited herein. It should be noted that, it is preferable to provide the air inlet 211 between the lens 210 and the air outlet 212, so as to ensure that the shielding gas smoothly enters the accommodating space 213. In the laser cutting device of the embodiment, the air inlet 211 is arranged between the lens 210 and the air outlet 212, so that the protective gas can smoothly enter the accommodating space 213, and meanwhile, the trafficability is not affected because the lens 210 is arranged in the accommodating space 213.

Referring to fig. 3, in the present embodiment, the laser assembly 202 further includes a focusing mechanism movably disposed in the accommodating space 213 and connected to the lens 210 for driving the lens 210 to translate toward or away from the air outlet 212. Preferably, the focusing mechanism is automatically adjusted under the control of a main control unit (e.g., CPU), for example, the focusing mechanism may be a slide rail and slide block type structure or a cylinder type driving structure. Of course, in other embodiments, manual focusing may be performed, that is, by providing an adjusting lever on the outer side of the cutting head 201, and a worker manually focuses the lens 210 provided in the accommodating space 213 through the adjusting lever.

In the present embodiment, when the focusing mechanism drives the lens 210 to move toward the air outlet 212, the lens 210 does not exceed the position of the air inlet 211.

The working principle of the laser cutting device of the embodiment is as follows: first, the laser beam emitted from the laser assembly 202 passes through the air outlet 212 and exits on the silicon wafer to be cut via the lens 210, and at the same time, the main control device (e.g. CPU) controls the focusing mechanism to drive the lens 210 to translate toward the air outlet 212 or translate away from the air outlet 212 until the laser beam exiting on the silicon wafer to be cut is a minimum brightest spot (i.e. the best focus), and then stops moving the lens 210 to complete focusing. It should be noted that, in the process of driving the lens 210 to move toward the air outlet 212, the lens 210 does not exceed the air inlet 212 all the time.

The laser cutting device of this embodiment is used for driving the lens 210 to translate towards the air outlet 212 through the focusing mechanism, or translate away from the air outlet 212, so that the focus can be adjusted, and the laser cutting device is quite convenient and fast during cutting operation.

Referring to fig. 1, in the present embodiment, the processing table 100 further includes an adsorption fixture 103, where the adsorption fixture 103 is disposed on the first sliding table 101 toward the laser component 202, and is used for adsorbing a workpiece to be processed (i.e. a silicon wafer to be cut). In this embodiment, the adsorption jig 103 may be a jig with electrostatic adsorption or adhesion. Of course, in other embodiments, the silicon wafer to be cut may be fixed in position in a mechanically fixed manner.

The laser cutting device of this implementation is used for waiting to cut the silicon chip fixed through adsorbing tool 103, avoids at the cutting operation in-process, makes waiting to cut the silicon chip and takes place the displacement, influences the precision of cutting, has promoted the stability of cutting.

Referring to fig. 1, in the present embodiment, the laser cutting device further includes:

a stand 10;

the first driving device is arranged on the machine base 10 and is used for driving the first sliding table 101 to transversely reciprocate along the surface of the machine base 10;

the second driving device is arranged on the first sliding table 101 and is used for driving the second sliding table 102 to vertically reciprocate along the surface of the machine base 10 relative to the first sliding table 101;

the lifting mechanism 200 includes a third driving device 203 and a sliding module 204, the sliding module 204 is slidably disposed on the base 10 along a direction perpendicular to the first sliding table 101, and the third driving device 203 is used for driving the sliding module 204. It should be noted that, the driving device in this embodiment may be an execution end of the driving device to drive the sliding table to move (an execution end, for example, a motor transmission shaft, a push rod of an air cylinder, etc.), or the execution end of the driving device may be connected to the base 10, that is, the driving device moves along with the sliding table.

The working principle of the laser cutting device of the embodiment is as follows: the main control device (e.g. CPU) controls the first driving device and the second driving device, and drives the first sliding table 101 and the second sliding table 102 according to preset cutting track parameters (e.g. by drawing a graph, setting a travelling coordinate value, etc.), so as to drive the silicon wafer to be cut placed on the second sliding table to move, and simultaneously, the silicon wafer to be cut is cut into a preset shape by the light beam emitted by the laser component 202.

The laser cutting device of this embodiment is used for driving the first sliding table 101 to reciprocate transversely along the surface of the stand 10 through the first driving device, and meanwhile, the second driving device is used for driving the second sliding table 102 to vertically move along the surface of the stand 10 relative to the first sliding table 101, so as to drive the silicon wafer to be cut to leave a preset cutting track relative to the cutting head 201, which is quite convenient.

Referring to fig. 1, in the present embodiment, a stand 10 includes a base 11 and a cantilever 12, wherein:

the cantilever 12 is fixedly installed on the base 11, the cantilever 12 is located above the first sliding table 101, and the lifting mechanism 200 is arranged on the cantilever 12.

According to the laser cutting device of the embodiment, the cantilever 12 is arranged above the first sliding table 101, the cantilever 12 is used for bearing the lifting mechanism 200, the lifting mechanism 200 can adjust the positions of the cutting head 201 and the silicon wafer to be cut only by perpendicular to the base 11 in a reciprocating mode, and the structure is quite simple.

Referring to fig. 2, in the present embodiment, the laser cutting apparatus further includes a translation mechanism that spans the machine base 10, and the lifting mechanism 200 is disposed on the translation mechanism and the translation mechanism is horizontally slidably disposed along the machine base 10. In this embodiment, the translation mechanism further includes two sliding rails (not shown in the drawing), and the two sliding rails are disposed on two opposite sides of the base 10.

The working principle of the laser cutting device of the embodiment is as follows: when the main control device (for example, a CPU) executes a preset cutting track, the main control device controls the translation mechanism to horizontally reciprocate along the surface of the stand 10, and drives the lifting mechanism 200 to move at the same time, and executes the preset cutting track under the cooperation of the simultaneous movement of the translation mechanism and the lifting mechanism 200.

Referring to fig. 2, in the present embodiment, the laser cutting device further includes a fourth driving device 304; the translation mechanism further comprises a fifth driving device 305 and a traversing module 306 provided with the lifting mechanism 200, the traversing module 306 is arranged above the machine base 10, the fourth driving device 304 drives the translation mechanism to reciprocate along the surface of the machine base 10, and the fifth driving device 305 drives the traversing module 306 to reciprocate transversely along the surface of the machine base 10. In this embodiment, two opposite sides of the stand 10 are respectively provided with a sliding rail, and the supporting columns (two supporting columns are relatively erected) respectively vertically erected in the two sliding rails, the traversing module 306 is erected on the two supporting columns, the execution end of the fourth driving device 304 is connected with one of the sliding rails for driving the sliding rails, and the execution end (the execution end, such as a transmission shaft of a motor, a push rod of a cylinder) of the fifth driving device 305 is connected with the traversing module 306 for driving the traversing module 306, and it should be noted that the fourth driving device 304 and the fifth driving device 305 may be motors. Of course, in other embodiments, a cylinder or the like may be used, and the present utility model is not limited thereto.

The working principle of the laser cutting device of the embodiment is as follows: when the main control device (e.g. CPU) executes the preset cutting track parameters, the fourth driving device 304 is controlled to drive the translation mechanism to horizontally move along the surface of the frame 10, and meanwhile, the fifth driving device 305 drives the traverse module 306 to horizontally reciprocate along the surface of the frame 10, and in the process of executing the preset cutting track (e.g. the preset cutting track is a circle, an arc, a square, etc.), the translation mechanism, the traverse module 306 and the lifting mechanism 200 are dynamically matched to perform the cutting operation on the silicon wafer to be cut.

The laser cutting device of this embodiment is configured to erect the cutting head 201 and the traversing module 306 above the base 11 by setting a translation mechanism, and dynamically cooperate to execute a preset cutting track under the control of the main control device.

The above description of the preferred embodiments of the present utility model should not be taken as limiting the scope of the utility model, but rather should be understood to cover all modifications, variations and adaptations of the present utility model using its general principles and the following detailed description and the accompanying drawings, or the direct/indirect application of the present utility model to other relevant arts and technologies.

Claims (8)

1. A laser cutting device, comprising:

the processing table comprises a first sliding table and a second sliding table, and the second sliding table is slidably arranged on the first sliding table and is used for bearing a workpiece to be processed;

the lifting mechanism comprises an execution end, and the execution end is arranged above the processing table in a lifting manner;

the laser component is arranged at the execution end and comprises a cutting head, the cutting head comprises a containing space, an air inlet hole and an air outlet hole, the air inlet hole and the air outlet hole are respectively communicated with the containing space, the air inlet hole is used for allowing protective gas to pass through and enter the containing space, and the air outlet hole is formed in one end, close to the processing table, of the containing space so as to allow the protective gas and the laser beam to pass through.

2. The laser cutting device of claim 1, wherein the laser assembly further comprises a lens disposed within the receiving space, the air inlet aperture being located between the lens and the air outlet aperture.

3. The laser cutting device of claim 2, wherein the laser assembly further comprises a focusing mechanism movably disposed in the accommodating space and connected to the lens for driving the lens to translate toward or away from the air outlet.

4. The laser cutting device of claim 1, wherein the processing table further comprises an adsorption jig, and the adsorption jig is disposed on the first sliding table towards the laser assembly and is used for adsorbing a workpiece to be processed.

5. The laser cutting device according to any one of claims 1 to 4, further comprising:

a base;

the first driving device is arranged on the machine base and used for driving the first sliding table to transversely reciprocate along the surface of the machine base;

the second driving device is arranged on the first sliding table and is used for driving the second sliding table to vertically reciprocate along the surface of the base relative to the first sliding table;

the lifting mechanism comprises a third driving device and a sliding module, the sliding module is slidably arranged on the base along the direction perpendicular to the first sliding table, and the third driving device is used for driving the sliding module.

6. The laser cutting device of claim 5, wherein the housing comprises:

a base;

the cantilever is fixedly arranged on the base, the cantilever is positioned above the first sliding table, and the lifting mechanism is arranged on the cantilever.

7. The laser cutting device of claim 5, further comprising a translation mechanism spanning the housing, the lift mechanism being disposed on the translation mechanism, the translation mechanism being horizontally slidably disposed along the housing.

8. The laser cutting device of claim 7, further comprising a fourth drive device;

the translation mechanism comprises a fifth driving device and a traversing module provided with the lifting mechanism, wherein the traversing module is arranged above the machine base, the fourth driving device drives the translation mechanism to reciprocate along the surface of the machine base, and the fifth driving device drives the traversing module to reciprocate transversely along the surface of the machine base.

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