CN219088334U - Radio frequency generating device, radio frequency thawing device and refrigerator - Google Patents

Abstract

The application discloses a radio frequency generating device, radio frequency thawing apparatus and refrigerator to solve the technical problem that present power amplifier board is with high costs, shielding structure is complicated to a certain extent. The radio frequency generating device comprises a power amplification module, a control module and a power supply module, wherein the power amplification module comprises a signal source and a power amplification circuit which are arranged on the same circuit board and are electrically connected, the control module is electrically connected with the signal source and the power amplification circuit, and the power supply module is electrically connected with the power amplification module and the control module and is used for supplying power to the power amplification module and the control module, wherein the control module and the power supply module are arranged on the same circuit board. The radio frequency generating device, the radio frequency thawing device and the refrigerator provided by the application reduce the complexity and cost of the design of the power amplification board.

Description

Radio frequency generating device, radio frequency thawing device and refrigerator

Technical Field

The application belongs to the technical field of radio frequency, and particularly relates to a radio frequency generating device, a radio frequency thawing device and a refrigerator.

Background

The radio frequency thawing system consists of a power supply module, a power amplification module, a control module and a tuning module, wherein the power supply module is used for supplying power to the power amplification module and the control module, the control system is used for carrying out output voltage regulation control on the power supply module according to an algorithm, the power amplification module is mainly used for carrying out power amplification on a signal source and outputting the signal source to the tuning module to achieve thawing purposes, meanwhile, the power amplification module is used for detecting and outputting a signal to the control module, and the control module is used for carrying out relevant control on the signal source, the power amplification circuit and the power supply module through the algorithm.

The common topology mode of the radio frequency generation system draws the control module and the power amplifier module on the same electric control board, and because the power amplifier module needs to be designed by using a multi-layer board and a PCB high-frequency board is required to be adopted, the cost is high, meanwhile, because the power amplifier module can generate high-frequency signals, the interference to the control system drawn on the same electric control board is easy to generate, and therefore, the shielding on the internal structure needs to be carried out according to the actual layout, so that the shielding cover is complex in structural design and installation, and the cost is high.

Disclosure of Invention

In order to solve the technical problems of high cost and complex shielding structure of the current power amplification board, the application provides a radio frequency generating device, a radio frequency thawing device and a refrigerator.

The application adopts a technical scheme that: there is provided a radio frequency generating device comprising:

the power amplification module comprises a signal source and a power amplification circuit which are arranged on the same circuit board and are electrically connected;

the control module is electrically connected with the signal source and the power amplifying circuit;

the power module is electrically connected with the power amplifier module and the control module and is used for supplying power to the power amplifier module and the control module;

the control module and the power module are arranged on the same circuit board.

According to the technical scheme, the control module and the power amplifier module are separated, so that the control module and the power module are combined on the circuit board, the power module integrated with the control module is installed as an independent component, the power amplifier module does not need to carry out special shielding design on the shielding cover according to the internal layout of the circuit board, only a simple outer cover shielding is needed to be designed, and the design complexity and cost are reduced. Meanwhile, the power supply module needs to be regulated by the control module and is made of common plates, so that the size of the special plates is reduced, and the cost of the whole radio frequency generating device is reduced.

In some embodiments, the power amplifier module further includes a detection circuit electrically connected to the control module, where the detection circuit, the signal source, and the power amplifier circuit are disposed on a same circuit board.

In some embodiments, the power amplifying circuit includes a primary driver and a secondary power amplifying circuit, and the signal source, the primary driver and the secondary power amplifying circuit are electrically connected in sequence.

In some embodiments, the radio frequency generating device further comprises a mounting shell provided with a mounting cavity, and the control module and the circuit board where the power supply module is located and/or the power amplifier module are arranged in the mounting cavity and connected with the mounting shell.

In some embodiments, the power amplifier module includes:

the power amplification plate is provided with a first surface and a second surface which are arranged in a back-to-back manner;

the power amplifier shielding cover is covered on the first surface of the power amplifier board;

the radiating piece is arranged on the second surface of the power amplification plate and connected with the mounting shell, and the radiating piece is provided with an airflow channel;

the air blowing assembly is provided with an air outlet which is communicated with the air flow channel of the heat radiating piece.

In some embodiments, the blower assembly includes:

a blowing device for generating a wind flow;

the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with a blowing opening of the blowing device, the second opening is communicated with an airflow channel of the radiating piece to form the air outlet, and the size of the second opening in the width direction of the power amplification plate is larger than that of the first opening.

In some embodiments, the heat dissipation member is made of metal, and comprises a metal plate and a plurality of heat dissipation fins arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins at intervals form the air flow channel; the power amplification plate is connected to the metal plate and is in contact with the metal plate.

In some embodiments, the power module includes a power housing and a power strip disposed in the power housing, the power housing being coupled to the mounting housing.

In some embodiments, a partition board is arranged in the mounting shell, and the mounting cavity is divided into a power amplifier cavity and a power supply cavity by the partition board; the power amplifier module is arranged in the power amplifier cavity, and the power module is arranged in the power cavity.

In some embodiments, the installation shell comprises a bottom plate and a top cover covered on the bottom plate, the bottom plate and the top cover enclose the installation cavity, the top cover, the power amplifier module and the power module are all connected to the bottom plate, and the partition board is arranged on the bottom plate;

or, the installation shell comprises a top cover, the inner cavity of the top cover forms the installation cavity, the power amplifier module and the power module are both connected to the top cover, and the top cover is provided with the partition board.

The other technical scheme adopted by the application is as follows: there is provided a radio frequency thawing apparatus comprising: the radio frequency thawing assembly and the radio frequency generating device are arranged on the same side of the radio frequency thawing assembly; the radio frequency thawing assembly comprises:

a shielding cylinder provided with an opening end with an opening;

The shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

In some embodiments, a tuning cavity and a thawing cavity for containing food to be thawed are provided in the shielding cylinder, and the tuning plate and the polar plate are both provided in the tuning cavity.

The application adopts the following technical scheme: provided is a refrigerator including:

a refrigerator main body;

in the radio frequency thawing device, the radio frequency thawing assembly is arranged in the refrigerator main body, and the radio frequency generating device is arranged in or outside the refrigerator main body.

In some embodiments, the radio frequency generating device is disposed outside the refrigerator body and on a top surface, a back surface, or a side surface of the refrigerator body.

In some embodiments, the refrigerator body is provided with a mounting cavity, and the radio frequency thawing assembly is arranged in the mounting cavity;

the shielding barrel is also provided with an air inlet and an air outlet which are communicated with the inner cavity of the shielding barrel, the air inlet and the air outlet are arranged on the same or different side walls of the shielding barrel, and a gap is arranged between the side wall of the air inlet and the air outlet and the mounting cavity.

In some embodiments, the refrigerator further comprises a wind flow accelerator that accelerates cool wind through the gap and the air inlet into the interior cavity of the shield cylinder.

In some embodiments, the mounting cavity is located within one of a freezer compartment, a refrigerator compartment, and a temperature change compartment of the refrigerator.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 shows a schematic block diagram of a radio frequency thawing device in an embodiment of the present application.

Fig. 2 shows a functional block diagram of a radio frequency thawing device in accordance with another embodiment of the present application.

Fig. 3 is a schematic structural view of the rf generator in the partially cut-away state of the top cover according to the embodiment of the present application.

Fig. 4 is a schematic diagram showing an internal structure of the radio frequency generating device according to still another embodiment of the present application after the top cover is removed.

Fig. 5 shows a schematic structural diagram of a power amplifier module of a radio frequency generating device in an embodiment of the present application.

Fig. 6 shows an exploded view of the power amplifier module of fig. 5.

Fig. 7 shows a schematic structural diagram of a power module of the radio frequency generating device in the embodiment of the application.

Fig. 8 is a schematic diagram illustrating an internal structure of the rf generator after the top cover is removed according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of an rf generator according to another embodiment of the present application in a bottom view.

Fig. 10 is a schematic view showing a structure of a refrigerator according to an embodiment of the present application.

Fig. 11 shows a partial enlarged view at a of fig. 10.

Fig. 12 is a view showing an assembled structure of a shield cylinder and a shield door in the refrigerator of fig. 10.

Fig. 13 is a view showing an installation structure of a radio frequency generating device in a refrigerator according to an embodiment of the present application.

Fig. 14 is a view showing an installation structure of a radio frequency generating device in a refrigerator according to another embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

In the related art, the power amplifier board has the technical problems of high cost and complex shielding structure. The embodiment of the application provides a radio frequency generating device, a radio frequency thawing device and a refrigerator, which at least can solve the technical problems of high cost and complex shielding structure of the current power amplification board to a certain extent.

The present application is described below with reference to specific embodiments in conjunction with the accompanying drawings:

example 1:

the embodiment of the application provides a radio frequency generating device, as shown in fig. 3 and fig. 4, which is a schematic structural diagram of the radio frequency generating device in a partially cut-away state of a top cover and a schematic internal structural diagram of the radio frequency generating device after the top cover is removed. The radio frequency generating device 10 includes a mounting case 11, a power amplification module 12 for generating a radio frequency signal amplified by power, and a power supply module 13 for supplying power to the power amplification module 12. The mounting shell 11 is provided with a mounting cavity 11a, the power amplifier module 12 and the power module 13 are both positioned in the mounting cavity 11a, and the power amplifier module 12 and the power module 13 are both connected with the mounting shell 11.

The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power module 13 is internally provided with an ac/dc conversion circuit and a voltage regulating circuit, and is used for performing ac/dc conversion and voltage regulation, and supplying low-voltage dc power to the power amplifier module 12.

The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of the amplifying circuits at all stages can refer to related publications in the prior art, so that the power amplifying circuit is not limited. The signal source and the power amplifying circuit may be both disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited in the specific arrangement manner. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.

In some embodiments, referring to fig. 1 and 2, the power amplifying circuit adopts a second-stage amplification, including a first-stage driver and a second-stage power amplifying circuit, where the signal source, the first-stage driver and the second-stage power amplifying circuit are electrically connected in sequence, the first-stage driver and the second-stage power amplifying circuit amplify an initial signal sent by the signal source step by step, and the second-stage power amplifying circuit outputs the amplified signal. The specific circuit structures of the primary driver and the secondary power amplifying circuit can refer to related publications in the prior art, and the application is not limited.

In some embodiments, referring to fig. 2, the power amplification board 121 is further provided with a detection circuit, where the detection circuit, the signal source, and the power amplification circuit are provided on the same circuit board. In other embodiments, the detection circuit and the signal source and the power amplification circuit may be provided on different circuit boards. The detection circuit is used for detecting the output power of the radio frequency signal after power amplification and feeding back the output power to the control board. If the load connected to the power amplification board 121 is provided with a tuning board, the detection circuit is further used for detecting the reflected power reflected by the tuning module and feeding back to the control board.

The radio frequency generating device 10 is controlled by a control system (e.g. MCU controller) on a control board when in operation, the control board is electrically connected with the power module 13 and the power amplifier module 12, the control board is electrically connected with an external input device (display screen, operation panel, keyboard, etc.), receives an operation instruction sent by a user, and controls circuits in the power module 13 and the power amplifier module 12 to work. When the output power of the power amplifier module 12 needs to be regulated, the control board calculates a voltage regulation control instruction based on an internal algorithm and sends the voltage regulation control instruction to the power module 13, and the power module 13 regulates the voltage to change the output voltage of the power module 13. For the power amplification board 121 provided with the detection circuit, the control board is electrically connected with the detection circuit, the detection circuit detects the output power of the power amplification module 12 and feeds back to the control module, and the control module performs relevant control on the signal source, the power amplification circuit and the power supply module 13 through an internal algorithm.

In some embodiments, the functions of the control board are integrated on the device on which the rf generator 10 is mounted, such as a refrigerator in which the rf generator 10 is configured, and the functions of the control board may be integrated on a main control board of the refrigerator. In some embodiments, the control board is a circuit board which is separately arranged, the control board exists independently of the power module 13 and the power amplifier module 12 to form a control module, under the arrangement scheme, the installation positions of the power amplifier module 12, the power module 13 and the control module can be set according to actual needs, the power amplifier module 12 is arranged in the installation cavity 11a of the installation shell 11 and is fixedly connected with the installation shell 11, and the power module 13 and the control module can be selectively arranged in the installation shell 11 or on the equipment main body of the equipment carried by the radio frequency generating device 10. Taking a refrigerator with a radio frequency thawing device as an example, a radio frequency generating device 10 is arranged in the radio frequency thawing device, a mounting shell 11 with a built-in power amplifier module 12 can be selectively arranged inside or outside a refrigerator main body of the refrigerator, a power module 13 can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body, and a control module can be selectively arranged in the mounting shell 11, or positioned outside the mounting shell 11 and inside the refrigerator main body.

In other embodiments, the control board is integrated with the power module 13 on the same circuit board, as shown in FIG. 1. In this embodiment, since the control board is integrated with the power module 13 and the same circuit board, the power amplifier board 121 and the control board are all independently arranged, and only the power amplifier board 121 adopts a PCB high-frequency board, the consumption of the PCB high-frequency board is minimum, and the independent control module only needs to adopt a common low-cost material, so that the cost is reduced. Meanwhile, the power amplification plate 121, the control plate and the power module 13 are all independently arranged, the power amplification module 12 does not need to carry out special shielding design on the shielding cover according to the internal layout of the circuit board, only a simple outer cover shielding power amplification plate 121 is needed to be designed, and the design complexity and cost are reduced. Meanwhile, as the power amplification plate 121, the control plate and the power module 13 are arranged independently, heat insulation is carried out through air in installation, heat radiation of the power amplification module 12 to the control module is greatly reduced, and reliability of the whole radio frequency generating device 10 is improved.

Referring to fig. 4, a partition plate 113 is disposed in the inner cavity of the installation shell 11, the partition plate 113 divides the installation cavity 11a of the installation shell 11 into two independent chambers, and the partition plate 113 may be integrally formed with the installation shell 11 or fixedly connected with the installation shell 11 by means of gluing, welding, etc. When the mounting case 11 includes the bottom plate 111 and the top cover 112 covering the bottom plate 111, the partition 113 may alternatively be provided on the bottom plate 111 or the top cover 112, and in some embodiments, the partition 113 may also be provided on the bottom plate 111 or the top cover 112, respectively, and the two partitions 113 abut or overlap in the height direction. When the mounting case 11 includes only the top cover 112, the partition 113 is provided on the top cover 112.

Referring to fig. 4, in some embodiments, a power module 13 and a power amplifier module 12 are disposed in the installation cavity 11a of the radio frequency generating device 10, and the control module is external, or the control board is integrated with the power board 131 or the power amplifier board 121. The inner cavity of the installation shell 11 is divided into a power amplification cavity 11b and a power supply cavity 11c through a partition plate 113, the power supply module 13 and the power amplification module 12 are separately placed, the power amplification module 12 is arranged in the power amplification cavity 11b, and the power supply module 13 is arranged in the power supply cavity 11 c. Because the power amplifier module 12 is provided with the air blowing component 123, the power amplifier cavity 11b and the power amplifier cavity 11c are relatively airtight, the air flow blown by the air blowing component 123 only can be disturbed in the power amplifier cavity 11b, compared with the condition that the partition plate 113 is not arranged, the air flow flows in a smaller space, the wind noise is relatively smaller, the power amplifier module 13 is free to radiate heat, the power amplifier cavity 11c can be provided with no radiating holes 11d, so that the power amplifier cavity 11c becomes an airtight chamber, or compared with the power amplifier cavity 11b, the radiating holes 11d are reduced, and the water spraying risk of the power panel 131 is reduced.

Referring to fig. 5 and 6, the power amplifier module 12 includes a power amplifier board 121, a heat dissipation member 122 and a blower assembly 123, wherein the power amplifier board 121 is used for generating a radio frequency signal after power amplification, the heat dissipation member 122 is disposed on the power amplifier board 121, and the heat dissipation member 122 is selectively connected and fixed with the power amplifier board 121 or only contacts with the power amplifier board 121. The heat sink 122 is provided with an air flow passage 122a, and heat of the heat sink 122 can be taken away when wind flows through the air flow passage 122 a. The air blowing assembly 123 is configured to blow air into the air flow channel 122a to dissipate heat of the power amplification board 121, and the air blowing assembly 123 includes an air blowing device 1231 and an air duct 1232, wherein the air blowing device 1231 is configured to generate air flow, and the air duct 1232 is configured to communicate the air blowing device 1231 with the heat dissipation component 122. Specifically, the air duct 1232 has a first opening 1234 and a second opening 1235 that are disposed opposite to each other, the first opening 1234 is communicated with the air blowing opening 1231a of the air blowing device 1231, the second opening 1235 is communicated with the air flow channel 122a of the heat dissipation member 122, and the air flow generated by the air blowing device 1231 enters the air flow channel 122a through the air duct 1232, so that the heat dissipation member 122 is dissipated by forced convection.

When in use, the heat dissipation element 122 is in contact with the power amplification plate 121, and the heat of the power amplification plate 121 is conducted to the heat dissipation element 122. The wind flow generated by the blowing device 1231 enters the airflow channel 122a through the air duct 1232, forced convection dissipates heat of the heat dissipation part 122, and the heat dissipation part 122 further dissipates heat of the power amplification plate 121, so that the temperature of the power amplification plate 121 is effectively reduced, and the safety and reliability of products are improved. Due to the arrangement of the air duct 1232 and the heat dissipation member 122 having the air flow channel 122a, the air flow generated by the air blowing device 1231 can all enter the air flow channel 122a, the air volume utilization rate is high, and the heat dissipation requirement of the power amplification plate 121 can be met with smaller power and flow.

Referring to fig. 6, in the power amplifier module 12 provided in the present application, the size of the second opening 1235 of the air duct 1232 in the width direction of the power amplifier board 121 is greater than the size of the first opening 1234 in the width direction of the power amplifier board 121. That is, the air duct 1232 adopts a flaring design, and along the flow direction of the wind flow, the size of the inner cavity of the air duct 1232 in the width direction of the power amplification plate 121 tends to increase, and specifically, linear increase, nonlinear increase or gradient increase can be adopted. To reduce wind resistance, in some embodiments, the projection of the air duct 1232 on the plane parallel to the power amplification plate 121 is trapezoidal, and the shapes of the first opening 1234 and the second opening 1235 are respectively adapted to the shape of the air blowing opening 1231a of the air blowing device 1231 and the inlet shape of the air flow channel 122a of the heat dissipation member 122.

Because the second opening 1235 of the air duct 1232 is larger than the first opening 1234 in the width direction of the power amplification plate 121, the air flow is increased in the width direction of the power amplification plate 121 in the process of flowing from the first opening 1234 to the second opening 1235 of the air duct 1232, and the air flow can be matched with a heat dissipation device, so that the air flow is blown across the whole width of the power amplification plate 121, and the heat dissipation efficiency is further improved. In addition, the air duct 1232 can also realize the adaptation of the shapes of the air blowing device 1231 and the opening 11g of the heat dissipation member 122, so that the requirement on the shape selection of the air blowing device 1231 is reduced. The blowing device 1231 may employ a fan, or the like capable of generating a wind flow, which is not limited in this application. In some embodiments, to further meet the miniaturization requirements of the device, the blower 1231 employs an axial flow fan.

The heat dissipation member 122 and the power amplification plate 121 conduct heat, and the heat dissipation member 122 is required to have good thermal conductivity, and metal and ceramic thermal conductivity, and the material and shape of the heat dissipation member 122 are not limited in this application. In some embodiments, the heat dissipation element 122 is made of metal, and may be aluminum, iron, or other metals or alloys thereof, and aluminum is preferred in view of light weight.

In order to satisfy the installation and heat dissipation of the power amplifier board 121, referring to fig. 5, the heat dissipation member 122 includes a metal plate 1221 and a plurality of heat dissipation fins 1222, the heat dissipation fins 1222 are distributed on one surface of the metal plate 1221, and the heat dissipation fins 1222 are spaced apart so that gaps between the heat dissipation fins 1222 form the air flow channel 122a, and the specific number and spacing of the heat dissipation fins 1222 are determined according to the heat dissipation requirement of the power amplifier board 121, which is not limited in this application. In certain embodiments, the metal plate 1221 is integrally formed with the heat dissipating fins 1222. The metal plate 1221 has a large mounting surface 1221a, the power amplification plate 121 is mounted on the mounting surface 1221a of the metal plate 1221 by the fastener 127, and the power amplification plate 121 is at least partially in contact with the metal plate 1221.

Because the metal is conductive, in order to ensure that the power amplification board 121 and the metal board 1221 are fully contacted as much as possible, referring to fig. 6, in some embodiments, a mounting plane 1221a of the metal board 1221 is provided with a plurality of avoidance blind holes 122b, the number and positions of the avoidance blind holes 122b completely correspond to the number and distribution of conductors (pins, soldering tin parts, wires and the like of the components 1211) of the power amplification board 121, the size of the avoidance blind holes 122b is larger than that of the corresponding conductors on the power amplification board 121, so that the conductors extend into the avoidance blind holes 122b and are not contacted with the metal board 1221, thereby ensuring that the power amplification board 121 and the metal board 1221 are tightly attached, the contact area is larger, heat dissipation is facilitated, and the overall structure of the power amplification board 121 is more stable. The avoidance blind hole 122b is designed as a blind hole, so that the problem of leakage caused by contact between the conductor and water due to the design as the through hole 132a can be avoided.

The structural strength of the heat sink 122 is higher than that of the power amplification board 121, and thus the heat sink 122 simultaneously serves as a mounting base of the power amplification board 121. In some embodiments, at least two lugs 1223 are disposed on the metal plate 1221, where the lugs 1223 may be disposed on a bottom surface or a side surface of the metal plate 1221 according to actual needs, and fixing holes for installing the fasteners 127 are disposed in the lugs 1223, and the fixing holes may be light holes or threaded holes, and the fasteners 127 may be in a screw, rivet, pin shaft or other structure.

The power amplification board 121 is a circuit board structure, and has a first surface 121a and a second surface 121b that are disposed opposite to each other, hereinafter also referred to as a first surface 121a of the power amplification board 121 is a front surface, and a second surface 121b of the power amplification board 121 is a back surface. The power amplification board 121 generally includes a signal source and a power amplification circuit, which are electrically connected, where the signal source is used to generate an initial signal with a set frequency (e.g. 40.68 MHz), and the power amplification circuit is used to power amplify the initial signal, enhance the power of the initial signal, and output a radio frequency signal after power amplification. The power amplifying circuit can adopt primary amplification, secondary amplification, tertiary amplification or even more according to actual needs, and specific amplification stages and circuit structures of the amplifying circuits at all stages can refer to related publications in the prior art, so that the power amplifying circuit is not limited. The signal source and the power amplifying circuit may be both disposed on the same surface of the power amplifying board 121, or may be disposed on the first surface 121a and the second surface 121b, which is not limited in the specific arrangement manner. In some embodiments, the components 1211 (chips, inductors, capacitors, resistors, etc.) on the power amplification board 121 are located on the first surface 121a, that is, each component 1211 of the signal source and the power amplification circuit is mounted on the front surface of the power amplification board 121, the back surface of the power amplification board 121 is mainly a soldering leg, a soldering wire, etc. of a pin, and the second surface 121b of the power amplification board 121 contacts the heat dissipation element 122 for heat transfer.

Referring to fig. 4 and 7, in some embodiments, the power module 13 includes a power supply housing 132 and a power supply board 131 disposed in the power supply housing 132, the power supply housing 132 protecting the power supply board 131. In some embodiments, the power supply housing 132 is provided with a plurality of through holes 132a for heat dissipation of the power panel 131. Considering that there is a gap between the power supply housing 132 and the power supply board 131, the power supply board 131 and the power supply housing 132 conduct heat only through air, so that the heat dissipation effect is poor, and the service life of the power supply board 131 may be affected.

Specifically, the heat conducting insulating glue is arranged in the power module 13, and is arranged between the power panel 131 and the power shell 132 of the power module 13, so that on one hand, water, insects and the like outside the power module 13 can be prevented from entering the power module 13 to erode the components 1311 on the power panel 131, and the waterproof and insect-preventing effects are achieved, and on the other hand, heat generated by the components 1311 on the power panel 131 can be conducted to the power shell 132 through the heat conducting insulating glue, so that the heat dissipation effect of the power module 13 is improved. In addition, the heat conductive insulating paste wraps the components 1311 on the power board 131, so that heat dissipation uniformity of the components 1311 can be improved. Thereby improving the reliability and safety of the power module 13 as a whole.

In some embodiments, in order to ensure the bonding degree of the heat-conducting insulating glue with the power panel 131 and the power supply housing 132, poor contact is avoided, and the heat dissipation effect is affected, so that the glue filling mode is adopted, the through hole 132a arranged on the power supply module 13 can be used as a glue filling hole, glue filling is performed through the through hole 132a on the power supply module 13, the bonding degree of the heat-conducting insulating glue with the power panel 131 and the power supply housing 132 is improved, and the heat dissipation effect of the power supply module 13 is ensured to a certain extent.

In order to further improve the heat dissipation effect of the power module 13, referring to fig. 13, in some embodiments, a plurality of heat dissipation holes 11d are formed on a side wall of the body 110 of the mounting case 11 at intervals, and when the internal power module 13 generates heat, the heat is dissipated outwards through air, so as to achieve heat dissipation of the power module 13. The heat dissipation holes 11d are formed on at least one side wall of the installation shell 11, and in some embodiments, the heat dissipation holes 11d are formed on at least two opposite side walls of the installation shell 11, so that air flow passing through the installation cavity 11a is formed, and the heat dissipation effect is effectively improved; or the heat radiation holes 11d are opened on the side walls except the side wall facing the user, thereby improving the beauty of the mounting case 11 while improving the heat radiation effect.

Referring to fig. 8, in some embodiments, a power module 13 and a power amplifier module 12 are disposed in the installation cavity 11a of the radio frequency generating device 10, and the control module is external, or the control board is integrated with the power panel 131 or the power amplifier panel 121. The installation shell 11 is provided with two wire passing holes, namely a strong current threading hole 11m and a weak current threading hole 11n, wherein the strong current threading hole 11m and the weak current threading hole 11n are distributed at intervals and are communicated with the installation cavity 11 a. The power amplifier module 12 is provided with only the weak current harness 17, and is used for supplying power to the power amplifier board 121 and the blowing device 1231, outputting the radio frequency signal and the detection signal after power amplification, and receiving the control instruction of the control board. Referring to fig. 8, the power amplifier module 12 is disposed in the mounting cavity 11a and far away from the strong electric threading hole 11m, and the power module 13 is disposed in the mounting cavity 11a and near the strong electric threading hole 11m, i.e. the power module 13 is closer to the strong electric threading hole 11m than the power amplifier module 12. The strong current and the weak current are separated to form the wiring, so that the discharge risk of the radio frequency generating device 10 is reduced, the reliability of electromagnetic shielding is improved, the safety requirements are met, and the safety reliability of the radio frequency generating device 10 is improved.

The strong current and weak current threading holes 11m and 11n may be located at different regions of the installation housing 11, and in some embodiments, referring to fig. 8, the strong current and weak current threading holes 11m and 11n are located at the same side of the installation housing 11, and the weak current threading holes 11n are closer to the power amplification board 121 than the strong current threading holes 11m, thereby making the lengths of the strong current and weak current harnesses 16 and 17 shorter. When the installation housing 11 includes the bottom plate 111 and the top cover 112, both the strong current threading hole 11m and the weak current threading hole 11n are provided on the bottom plate 111, as shown in fig. 8. Since the bottom plate 111 is covered by the top cover 112, the entire rf generator 10 is more waterproof when the strong current through holes 11m and the weak current through holes 11n are provided in the bottom plate 111. When the installation shell 11 only includes the top cover 112, the strong current threading hole 11m and the weak current threading hole 11n are all disposed on the top cover 112, as shown in fig. 9, the strong current threading hole 11m and the weak current threading hole 11n may be all disposed on the top wall 1124 or the side wall of the top cover 112, which is not limited in this application.

Since the top cover 112 is directly exposed, when the strong current threading hole 11m and the weak current threading hole 11n are both formed in the top cover 112, the waterproof requirements of the strong current threading hole 11m and the weak current threading hole 11n need to be considered, and the shapes and the sizes of the strong current threading hole 11m and the weak current threading hole 11n are matched with the cross-sectional shapes and the sizes of the corresponding strong current wire harness 16 and the weak current wire harness 17. Referring to fig. 9, in some embodiments, the top cover 112 is provided with two terminal boxes 1125, the two terminal boxes 1125 are fixedly connected and sealed with the top cover, and the wiring harness in the device and the wiring harness of the electronic module are wired in the terminal boxes 1125. The junction box 1125 and the top cover 112 may be separately disposed and fixedly connected by screws, and in some embodiments, the junction box 1125 and the top cover 112 may be provided as a unitary structure, for example, a sink is disposed in the top cover 112 as the junction box 1125, and a cover plate 1126 is disposed over the opening of the junction box 1125 to close the junction box 1125, and the cover plate 1126 is flush with the surface of the top cover 112.

Referring to fig. 8, the outlet end of the power amplification board 121 of the power amplification module 12 is located at an end far away from the power module 13, and the power amplification board 121 is electrically connected with a first weak current harness 171 and a second weak current harness 172, wherein the first weak current harness 171 includes a harness output by the power amplification module 12 to external electronic equipment, and is used for outputting radio frequency signals and detection signals after power amplification, or is also used for receiving control instructions of a control board, and the first weak current harness 171 extends out of the mounting shell 11 through a weak current threading hole 11 n. The second weak current harness 172 is used for electrically connecting the power module 13 with the power amplifier module 12 to supply power to the power amplifier module 12, and the second weak current harness 172 is located in the mounting cavity 11 a. The outlet end of the power panel 131 of the power module 13 is located at a side far away from the power amplifier panel 121, the power module 13 is electrically connected with the strong electric wire harness 16 and the second weak electric wire harness 172, and the strong electric wire harness 16 extends out of the installation shell 11 through the strong electric wire threading hole 11m and is used for accessing the commercial power.

Example 2:

based on the same inventive concept, the embodiment of the present application provides a radio frequency thawing apparatus, which includes a radio frequency thawing assembly 30 and the radio frequency generating device 10 of the above embodiment 1. The rf thawing assembly 30 is provided with a tuning plate and a polar plate, the tuning plate is electrically connected with a tuning inductor, and the tuning inductor is selectively arranged on the tuning plate or independent from the tuning plate. The tuning plate is electrically connected with the power amplification plate 121 of the radio frequency generating device 10, the tuning module is used for balancing the impedance of the load end so as to realize impedance matching, and the polar plate is electrically connected with the tuning plate and is used for transmitting radio frequency signals with set frequencies. The signal output by the power amplification module 12 is a radio frequency signal corresponding to the standard load after power amplification, and the tuning module is used for adjusting the impedance of the load end. The different unfreezed substances have different impedances, the impedance of the drawer is not the standard load impedance, the load impedance changes in the unfreezing process, the impedance matching is realized through the tuning module, the impedance matching is equivalent to the standard load, the control module controls the tuning module to perform the impedance matching, the tuning module outputs a signal to the polar plate, and the polar plate sends out a radio frequency signal, so that the food material unfreezing purpose is realized.

Referring to fig. 10 and 11 and 12, the rf thawing assembly 30 further includes a shielding cylinder 31 and a shielding door 32, the shielding cylinder 31 having an open end 31a with an opening, and the shielding door 32 is provided at the open end 31a of the shielding cylinder 31 for closing the opening to form a closed shielding cavity together with the shielding cylinder 31. The tuning plate and the polar plate are arranged in the shielding cylinder 31, the shielding cylinder 31 can provide a mounting foundation for the tuning plate and the polar plate, the purpose of protecting the tuning plate and the polar plate can be achieved, radio frequency signals emitted by the polar plate can be shielded, and radio frequency signal leakage is avoided.

Referring to fig. 10, in some embodiments, a tuning cavity 31e and a thawing cavity 31f are provided in the shielding cylinder 31, the tuning plate and the polar plate are both provided in the tuning cavity 31e, the thawing cavity 31f is used for containing food to be thawed, and the polar plate radiates radio frequency energy into the thawing cavity 31f, thereby thawing the food in the thawing cavity 31 f. The tuning plate and the polar plate are placed separately from the food material, so that on one hand, pollution to the food material is avoided, and on the other hand, water melted after thawing the food material is prevented from contacting the tuning plate and the polar plate, and damage to the component 1211 is avoided.

Referring to fig. 11, in some embodiments, the shielding cylinder 31 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, where the air inlet 31c and the air outlet 31d may be disposed on the same side wall of the shielding cylinder 31, or may be disposed on different side walls, which is not limited in this application.

Example 3:

based on the same inventive concept, the present embodiment provides a refrigerator 100 including a refrigerator main body 20 and the radio frequency thawing apparatus of embodiment 2 described above. The radio frequency generating device 10 of the radio frequency thawing device is disposed inside or outside the refrigerator main body 20, and the specific structure thereof is described in the above embodiment 2, and will not be repeated here. The radio frequency thawing assembly 30 of the radio frequency thawing device is disposed in the refrigerator main body 20, specifically, the refrigerator main body 20 is provided with an installation cavity 21, the radio frequency thawing assembly 30 is disposed in the installation cavity 21, and the specific structure of the radio frequency thawing device is described in reference to embodiment 3 and will not be repeated here. The installation cavity 21 is located in one of a freezing chamber, a refrigerating chamber, and a temperature changing chamber of the refrigerator 100, which is not limited in this application.

In some embodiments, the rf generating device 10 is disposed outside the refrigerator main body 20, and the rf generating device 10 may be disposed on the top, back or side of the refrigerator main body 20, which is not limited in this application. Referring to fig. 13, in some embodiments, the rf generating device 10 is located on the top surface of the refrigerator main body 20, the mounting case 11 of the rf generating device 10 is connected to the U-shaped case 23 of the top of the refrigerator main body 20 through the fixing member 18, and when the mounting case 11 includes the base plate 111 and the top cover 112, both the electronic module and the top cover 112 are mounted on the base plate 111, and the base plate 111 is mounted on the top surface of the U-shaped case 23 through the fixing member 18. Referring to fig. 14, in some embodiments, the mounting housing 11 includes only a top cover 112, the electronic module is mounted on an inner surface of a top wall 1124 of the top cover 112, and the top cover 112 is flip-off mounted to a top surface of the U-shaped housing 23 by the fixing member 18.

In some embodiments, referring to fig. 11, the shielding cylinder 31 of the rf thawing assembly 30 is further provided with an air inlet 31c and an air outlet 31d that are in communication with the tuning cavity 31e, and the air inlet 31c and the air outlet 31d may be disposed on the same side wall of the shielding cylinder 31 or on different side walls. The side walls provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21 are provided with a gap a, so that the air circulation is formed by the air inlet 31c and the air outlet 31d and the gap a between the side walls provided with the air inlet 31c and the air outlet 31d and the mounting cavity 21, and the heat dissipation of the tuning cavity 31e is performed.

In some embodiments, referring to fig. 10, the refrigerator 100 further includes a wind flow accelerator 40, and the wind flow accelerator 40 accelerates cool wind into the tuning cavity 31e through the gap a and the wind inlet 31c to accelerate air circulation, thereby improving heat dissipation efficiency.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise" indicate or positional relationships are based on the positional relationships shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

It should be noted that all the directional indicators in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indicators are correspondingly changed.

In the present application, unless explicitly specified and limited otherwise, the terms "coupled," "secured," and the like are to be construed broadly, and for example, "secured" may be either permanently attached or removably attached, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In addition, descriptions such as those related to "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated in this application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (12)

1. A radio frequency generating device, comprising:

the power amplification module comprises a signal source and a power amplification circuit which are arranged on the same circuit board and are electrically connected;

the control module is electrically connected with the signal source and the power amplifying circuit;

the power module is electrically connected with the power amplifier module and the control module and is used for supplying power to the power amplifier module and the control module;

the control module and the power module are arranged on the same circuit board.

2. The radio frequency generating device according to claim 1, wherein: the power amplifier module further comprises a detection circuit electrically connected with the control module, and the detection circuit, the signal source and the power amplifier circuit are arranged on the same circuit board.

3. The radio frequency generating device according to claim 1, wherein: the power amplifying circuit comprises a primary driver and a secondary power amplifying circuit, and the signal source, the primary driver and the secondary power amplifying circuit are electrically connected in sequence.

4. A radio frequency generating device according to any one of claims 1-3, characterized in that: the radio frequency generating device further comprises a mounting shell provided with a mounting cavity, and the control module and a circuit board where the power supply module is located and/or the power amplifier module are arranged in the mounting cavity and connected with the mounting shell.

5. The radio frequency generating device according to claim 4, wherein: the power amplifier module comprises:

the power amplification plate is provided with a first surface and a second surface which are arranged in a back-to-back manner;

the power amplifier shielding cover is covered on the first surface of the power amplifier board;

the radiating piece is arranged on the second surface of the power amplification plate and connected with the mounting shell, and the radiating piece is provided with an airflow channel;

the air blowing assembly is provided with an air outlet which is communicated with the air flow channel of the heat radiating piece.

6. The radio frequency generating device according to claim 5, wherein: the air blowing assembly includes:

a blowing device for generating a wind flow;

the air duct is provided with a first opening and a second opening which are oppositely arranged, the first opening is communicated with a blowing opening of the blowing device, the second opening is communicated with an airflow channel of the radiating piece to form the air outlet, and the size of the second opening in the width direction of the power amplification plate is larger than that of the first opening.

7. The radio frequency generating device according to claim 5, wherein: the heat dissipation piece is made of metal and comprises a metal plate and a plurality of heat dissipation fins which are arranged on one surface of the metal plate at intervals, and gaps among the plurality of heat dissipation fins which are arranged at intervals form the air flow channel; the power amplification plate is connected to the metal plate and is in contact with the metal plate.

8. The radio frequency generating device according to claim 4, wherein: the power module comprises a power shell and a power board arranged in the power shell, and the power shell is connected with the mounting shell.

9. The radio frequency generating device according to claim 4, wherein: a partition board is arranged in the installation shell, and the installation cavity is divided into a power amplifier cavity and a power supply cavity by the partition board; the power amplifier module is arranged in the power amplifier cavity, and the power module is arranged in the power cavity.

10. The radio frequency generating device according to claim 9, wherein: the mounting shell comprises a bottom plate and a top cover covered on the bottom plate, the bottom plate and the top cover are surrounded to form the mounting cavity, the top cover, the power amplifier module and the power module are all connected to the bottom plate, and the bottom plate is provided with the partition board;

or, the installation shell comprises a top cover, the inner cavity of the top cover forms the installation cavity, the power amplifier module and the power module are both connected to the top cover, and the top cover is provided with the partition board.

11. A radio frequency thawing device, comprising: a radio frequency thawing assembly and a radio frequency generating device as defined in any one of claims 1-10; the radio frequency thawing assembly comprises:

A shielding cylinder provided with an opening end with an opening;

the shielding door is arranged at the opening end of the shielding cylinder body and is used for closing the opening;

the tuning plate is arranged in the shielding cylinder body and is electrically connected with the power amplification plate of the radio frequency generating device;

and the polar plate is arranged in the shielding cylinder body, is electrically connected with the tuning plate and is used for transmitting radio frequency signals.

12. A refrigerator, comprising:

a refrigerator main body;

the rf thawing device as defined in claim 11, wherein the rf thawing assembly is disposed inside the refrigerator body, and the rf generating device is disposed inside or outside the refrigerator body.

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