CN219066096U

CN219066096U - Heat pipe welding cold plate structure form for dissipating heat of display card on XMC sub-card

Info

Publication number: CN219066096U
Application number: CN202223284841.9U
Authority: CN
Inventors: 段泽锋; 肖学海; 冯志新; 力江
Original assignee: Beijing Siasun Jiahe Control Co ltd
Current assignee: Beijing Siasun Jiahe Control Co ltd
Priority date: 2022-12-08
Filing date: 2022-12-08
Publication date: 2023-05-23
Anticipated expiration: 2032-12-08

Abstract

The utility model relates to a heat pipe welding cold plate structure for radiating a display card on an XMC sub-card, which comprises a main board PCB, a heat pipe welding cold plate, the XMC sub-card, an XMC sub-card cover plate and a lower cold plate, wherein the XMC sub-card is welded with the display card, the display card is positioned between the XMC sub-card and the main board PCB, the heat pipe welding cold plate is arranged between the main board PCB and the display card, the display card corresponds to the hot end of the heat pipe welding cold plate, the heat pipe welding cold plate is convenient for transferring the heat of the display card from the heat pipe welding cold plate to the cold end, and the cold end is provided with a radiating fin area.

Description

Heat pipe welding cold plate structure form for dissipating heat of display card on XMC sub-card

Technical Field

The utility model relates to the field of cold plates, in particular to a heat pipe welding cold plate structure form for radiating a display card on an XMC sub-card.

Background

With the changing technology of the technology, the electronic technology is widely applied and rapidly developed, and more electronic devices are also widely applied. Taking a server as an example, it is an important component in electronic devices, and mainly can provide computing services. Because the server needs to respond to the service request and process it, the server should generally have the ability to afford the service and to guarantee the service. In the current big data age, the server generally needs to provide a large amount of data computing services, so as to ensure the normal operation capability of the server, and heat dissipation is needed, and the current general air cooling mode is adopted for heat dissipation.

However, with the development of technology, the heat consumption of the graphics card in some electronic devices is higher and higher, where after the XMC daughter card is inserted with the carrier board, the graphics card on the XMC daughter card is located between the two boards, which is not beneficial to heat dissipation of the graphics card, and increases the heat consumption, so that heat dissipation of the graphics card becomes a problem to be solved.

Disclosure of Invention

The utility model provides a heat pipe welding cold plate structure for dissipating heat of a display card on an XMC sub-card.

The utility model adopts the technical scheme that:

a heat pipe welding cold plate structure form for radiating a display card on an XMC sub-card comprises a main board PCB, a heat pipe welding cold plate, the XMC sub-card, an XMC sub-card cover plate and a lower cold plate, wherein the display card is welded on the XMC sub-card and is positioned between the XMC sub-card and the main board PCB, the heat pipe welding cold plate is arranged between the main board PCB and the display card, the display card corresponds to the hot end of the heat pipe welding cold plate, the heat pipe welding cold plate is convenient for transferring heat of the display card from the heat pipe welding cold plate to a cold end, a radiating fin area is arranged at the cold end, a sub-card XMC connector is welded on the XMC sub-card, the XMC sub-card cover plate covers the XMC sub-card, the main board XMC connector and the VPX connector are welded on the main board PCB, the sub-card XMC connector on the XMC sub-card is connected with the main board XMC connector on the main board PCB, the bottom of the main board PCB is provided with the lower cold plate, the bottom of the lower cold plate is provided with a battery cover plate at a battery mounting position, and the XMC sub-card cover plate, the XMC sub-card, the XMC sub-board and the XMC sub-card and the lower cold plate are connected from top to bottom to top to bottom to face outside of a chassis.

The heat pipe welding cold plate comprises a cold plate, the right side of the cold plate is provided with a hollowed-out notch corresponding to the display card, the hollowed-out notch is welded with a display card heat dissipation copper block, a heat pipe groove is formed in the display card heat dissipation copper block, the heat pipe groove is welded with a display card heat dissipation heat pipe, a heat dissipation fin area is arranged on the left side of the cold plate, and the display card heat dissipation heat pipe extends from the display card heat dissipation copper block to the heat dissipation fin area on the other side of the cold plate.

The right side of the cold plate is provided with local radiating fins at one side of the periphery of the welded display card radiating copper block.

And one side of the display card heat dissipation copper block, which is close to the local heat dissipation fins, is provided with another heat pipe groove, a short pipe heat pipe is welded on the heat pipe groove, and two ends of the short pipe heat pipe extend to the local heat dissipation fins.

The left side of the cold plate is welded with a first heat pipe and a second heat pipe at two sides of the heat dissipation heat pipe of the display card, a first copper block is arranged on the first heat pipe corresponding to the heat source position of the main board PCB, and a second copper block is arranged on the second heat pipe corresponding to the heat source position of the main board PCB.

The utility model has the beneficial effects that: the heat dissipation structure of the cold plate designed by the utility model has the advantages that the volume of the cold plate is not increased, the effective heat dissipation of the display card can be met, the copper block is arranged at the heat source position of the cold plate corresponding to the display card, the heat generated by the display card is conducted to the heat pipe through the copper block, then the heat is quickly conducted to the heat dissipation fin end of the cold plate through the heat pipe, the heat dissipation of the display card is assisted, and finally the heat on the fin is taken away through the fan blowing of the chassis, so that the normal work of the display card is ensured.

Drawings

Fig. 1 is a schematic structural view of the present utility model.

Fig. 2 is an exploded view of the present utility model rotated 90 deg. counterclockwise.

Fig. 3 is a schematic diagram of a heat pipe welded cold plate of the present utility model showing the front side.

FIG. 4 is a schematic view of a heat pipe welded cold plate of the present utility model showing the back side.

Fig. 5 is a schematic diagram of the application of the present utility model.

Wherein: 1-a motherboard PCB; 2-welding a cold plate by a heat pipe; 201-a cold plate; 202-a first heat pipe; 203-a second heat pipe; 204-a display card heat dissipation heat pipe; 205-short tube heat pipe; 206-a first copper block; 207-a second copper block; 208-a display card heat dissipation copper block; 209—local heat sink fins; 210-heat sink fin area; 3-XMC daughter card; 4-XMC daughter card cover plate; 5-a lower cooling plate; 6-battery cover plate; 7-connecting the panel and the pull-out aid; an 8-daughter card XMC connector; 9-motherboard XMC connector; a 10-VPX connector; 11-chassis.

Detailed Description

A heat pipe welded cold plate structure for dissipating heat of a graphics card on an XMC sub-card comprises a main board PCB1, a heat pipe welded cold plate 2, the XMC sub-card 3, an XMC sub-card cover plate 4 and a lower cold plate 5, wherein the graphics card is welded on the XMC sub-card 3 and is positioned between the XMC sub-card 3 and the main board PCB1, the heat pipe welded cold plate 2 is arranged between the main board PCB1 and the graphics card and corresponds to the hot end of the heat pipe welded cold plate 2, the heat pipe welded cold plate 2 is convenient for transferring heat of the graphics card from the hot end of the heat pipe welded cold plate 2 to the cold end, a heat dissipating fin area 210 is arranged at the cold end, a welded sub-card XMC connector 8 is arranged on the XMC sub-card 3, an XMC sub-card cover plate 4 is covered on the XMC sub-card 3, a main board XMC connector 9 and a VPX connector 10 are welded on the main board PCB1, a sub-card XMC connector 8 on the XMC sub-card 3 is connected with a main board connector 9 on the main board PCB1, the bottom of the main board PCB1 is provided with a lower cold plate 5, the bottom of the lower cold plate 5 is provided with a battery cover plate 6 at a battery installation position, the XMC daughter card cover plate 4, the XMC daughter card 3, the heat pipe welding cold plate 2, the main board PCB1 and the lower cold plate 5 are connected from top to bottom to form an integral module, one end of the integral module, which faces the outside of the case 11, is connected with the panel and the drawing aid 7, and the module is required to be a standard 6U5HP with the size of 233.35mm by 25.4mm and 160mm deep.

The heat pipe welding cold plate 2 comprises a cold plate 201, a hollowed-out notch is formed in the position, corresponding to the display card, on the right side of the cold plate 201, a display card heat dissipation copper block 208 is welded at the hollowed-out notch, a heat pipe groove is formed in the display card heat dissipation copper block 208, a display card heat dissipation heat pipe 204 is welded on the heat pipe groove, a heat dissipation fin area 210 is formed in the left side of the cold plate 201, and the display card heat dissipation heat pipe 204 extends from the display card heat dissipation copper block 208 to the heat dissipation fin area 210 on the other side of the cold plate 201.

The right side of the cold plate 201 is provided with a local radiating fin 209 at one side of the periphery of the welded display card radiating copper block 208. Another heat pipe groove is formed in one side, close to the local radiating fins 209, of the display card radiating copper block 208, a short pipe heat pipe 205 is welded on the heat pipe groove, and two ends of the short pipe heat pipe 205 extend to the local radiating fins 209. The heat of the display card heat dissipation copper block 208 is guided to the local heat dissipation fins 209 to dissipate heat through the short pipe heat pipe 205, so that the heat dissipation of the display card is improved.

The left side of the cold plate 201 is welded with a first heat pipe 202 and a second heat pipe 203 on two sides of a heat dissipation heat pipe 204 of the display card, a first copper block 206 is arranged on the first heat pipe 202 corresponding to the heat source position of the main board PCB1, a second copper block 207 is arranged on the second heat pipe 203 corresponding to the heat source position of the main board PCB1, the first copper block 206 and the second copper block 207 respectively correspond to heat generating devices on the main board PCB1, and heat is conducted to a heat dissipation fin area 210 through the first heat pipe 202 and the second heat pipe 203, so that heat dissipation of the heat generating devices on the main board PCB1 is facilitated.

When the display card cooling device is applied, the whole module is inserted into a 2U case 11, heat dissipation fans are arranged on two sides of the case 11, the case 11 is blown to left and right, a display card is arranged between a main board PCB1 and an XMC daughter card 3, the middle space is limited, heat dissipation of the display card is not facilitated, a display card heat dissipation copper block 208 of a heat pipe welding cold board 2 is in contact with the display card to conduct heat, one end, connected with the display card heat dissipation copper block 208, of the display card heat dissipation heat pipe 204 is a hot end, one end, extending to a heat dissipation fin area 210, of the display card heat dissipation heat pipe 204 is a cold end, heat generated by the display card flows from the hot end to the cold end, and due to the fact that the cold board 201 is integrally formed, the cold board 201 can directly conduct the heat to the heat dissipation fin area 210 through the display card heat dissipation heat pipe 204, and finally the heat on the fins is taken away through the fan of the case 11, so that normal operation of the display card is ensured.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

The foregoing describes the embodiments of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.

Claims

1. A heat pipe welded cold plate structure form for dissipating heat of an graphics card on an XMC daughter card, the heat pipe welded cold plate form is characterized by comprising a main board PCB (1), a heat pipe welded cold plate (2), an XMC daughter card (3), an XMC daughter card cover plate (4) and a lower cold plate (5), wherein the graphics card is welded on the XMC daughter card (3), the graphics card is positioned between the XMC daughter card (3) and the main board PCB (1), the heat pipe welded cold plate (2) is arranged between the main board PCB (1) and the graphics card, the heat pipe welded cold plate (2) is convenient for transferring heat of the graphics card from the heat pipe welded cold plate (2) to the cold end, a heat dissipating fin area (210) is arranged at the cold end, the XMC daughter card (3) is welded on the XMC daughter card connector (8), the XMC daughter card cover plate (4) is covered on the XMC daughter card (3), the XMC connector (9) and the VPX connector (10) are welded on the main board PCB (1), the daughter card connector (8) on the XMC daughter card (3) is connected with the XMC daughter card (3) and the heat pipe welded on the main board (2), and the heat pipe (2) is arranged at the bottom of the main board (2) and the heat pipe welded on the main board (2) The integrated module formed by connecting the main board PCB (1) and the lower cold board (5) from top to bottom is connected with the panel and the pull-out aid (7) towards one end outside the chassis (11).

2. The heat pipe welding cold plate structure for dissipating heat of a graphics card on an XMC daughter card according to claim 1, wherein the heat pipe welding cold plate (2) comprises a cold plate (201), a hollowed-out notch is formed in a position, corresponding to the graphics card, on the right side of the cold plate (201), a graphics card heat dissipation copper block (208) is welded at the hollowed-out notch, a heat pipe groove is formed in the graphics card heat dissipation copper block (208), a graphics card heat dissipation heat pipe (204) is welded on the heat pipe groove, a heat dissipation fin area (210) is formed in the left side of the cold plate (201), and the graphics card heat dissipation heat pipe (204) extends from the graphics card heat dissipation copper block (208) to the heat dissipation fin area (210) on the other side of the cold plate (201).

3. The heat pipe welded cold plate structure for dissipating heat from a graphics card on an XMC daughter card of claim 2, wherein the right side of the cold plate (201) is provided with local heat dissipating fins (209) on the peripheral side of the welded graphics card heat dissipating copper block (208).

4. A welded cold plate structure of a heat pipe for dissipating heat from a graphics card on an XMC daughter card according to claim 3, wherein another heat pipe groove is formed on a side of the graphics card heat dissipating copper block (208) near the local heat dissipating fin (209), a short pipe heat pipe (205) is welded on the heat pipe groove, and two ends of the short pipe heat pipe (205) extend to the local heat dissipating fin (209).

5. The heat pipe welding cold plate structure for dissipating heat from a graphics card on an XMC daughter card according to claim 4, wherein a first heat pipe (202) and a second heat pipe (203) are welded on two sides of the graphics card heat dissipating heat pipe (204) on the left side of the cold plate (201), the first heat pipe (202) is provided with a first copper block (206) corresponding to a heat source position of the motherboard PCB (1), and the second heat pipe (203) is provided with a second copper block (207) corresponding to the heat source position of the motherboard PCB (1).