CN219065660U

CN219065660U - Semiconductor laser chip test fixing device

Info

Publication number: CN219065660U
Application number: CN202223339507.9U
Authority: CN
Inventors: 丁晶晶; 姚昌余; 杨江峰
Original assignee: Zhijiang Yishuo Semiconductor Co ltd
Current assignee: Zhijiang Yishuo Semiconductor Co ltd
Priority date: 2022-12-12
Filing date: 2022-12-12
Publication date: 2023-05-23
Anticipated expiration: 2032-12-12

Abstract

The utility model discloses a semiconductor laser chip testing and fixing device which comprises a test table, a mounting box and an air cylinder, wherein the test table is fixedly connected with the air cylinder, a first clamping plate is arranged on one side of the test table, a sucker is arranged in the test table, one side of the sucker is in threaded connection with the test table through a screw rod, and a spring plate are arranged in the mounting box, and particularly relates to the technical field of semiconductor laser chip testing. This semiconductor laser chip test fixing device, because at the in-process that the spring board removed, the spring board can oppress or tensile spring leads to the spring deformation, can damage after causing the spring to use for a long time, through unscrewing the bolt from spring board and testboard in, make first fixture block and spring board and testboard break away from, then will take out the spring that changes new spring and continue to use after taking out from the mounting box with the second fixture block joint for the spring board can normal use, has prolonged the life of device.

Description

Semiconductor laser chip test fixing device

Technical Field

The utility model belongs to the technical field of semiconductor laser chip testing, and particularly relates to a semiconductor laser chip testing fixing device.

Background

The patent with the publication number of CN215466227U discloses a semiconductor laser chip test fixing device, and the device can avoid the problem that the traditional clamp clamping force is too big to cause damage to the semiconductor laser chip through the mode of elasticity centre gripping, but at the in-process of moving the splint centre gripping semiconductor laser chip, the long-time shrinkage deformation of spring can damage, has reduced test fixing device's life, has had the room of improvement.

Disclosure of Invention

The utility model aims to provide a semiconductor laser chip testing and fixing device which is used for solving the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor laser chip test fixing device, includes testboard, mounting box and cylinder, testboard and cylinder rigid coupling, one side of testboard is provided with first splint, the inside of testboard is provided with the sucking disc, one side of sucking disc is connected with the testboard spiro union through the screw rod, the inside of mounting box is provided with spring and spring plate, the output of cylinder passes mounting box and spring plate rigid coupling, the one end of spring is through first fixture block and spring plate loose joint, the other end is through bolt and mounting box loose joint, one side of spring plate is through the connecting rod rigid coupling has the second splint.

Preferably, the spring plate and the test bench are fixedly connected with second clamping blocks, two groups of first clamping blocks are arranged, one group of first clamping blocks is bolted with the spring plate through bolts, and the other group of first clamping blocks is bolted with the test bench through bolts.

Preferably, wedge edges are formed on one sides of the first clamping block and the second clamping block.

Preferably, a main sliding block is fixedly connected to one side of the second clamping plate, a main sliding groove is formed in one side of the test table, and the main sliding block is in sliding connection with the main sliding groove.

Preferably, a side sliding block is arranged on one side of the main sliding block, a side sliding groove is arranged on one side of the main sliding groove, and the side sliding block is in sliding connection with the side sliding groove.

Preferably, a counter bore for accommodating the bolt is formed in the first clamping block.

Preferably, the spring plate and the test bench are fixedly connected with elastic sheets.

Compared with the prior art, the utility model has the following beneficial effects:

(1) This semiconductor laser chip test fixing device, because at the in-process that the spring board removed, the spring board can oppress or tensile spring leads to the spring deformation, can damage after causing the spring to use for a long time, through unscrewing the bolt from spring board and testboard in, make first fixture block and spring board and testboard break away from, then will take out the spring that changes new spring and continue to use after taking out from the mounting box with the second fixture block joint for the spring board can normal use, has prolonged the life of device.

(2) According to the semiconductor laser chip testing and fixing device, the main sliding groove is in sliding connection with the side sliding block, and the side sliding groove is in sliding connection with the main sliding block, so that the semiconductor laser chip clamping effect is better due to the fact that the second clamping plate moves more stably.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of a split structure of a second clamping plate and a test bench according to the present utility model;

FIG. 3 is a schematic view of the wedge edge of the present utility model;

FIG. 4 is a top view of the present utility model;

FIG. 5 is an enlarged view of the utility model A;

FIG. 6 is a schematic view of the structure of the screw of the present utility model;

in the figure: 1. a test bench; 11. a first clamping plate; 12. a main chute; 13. a side chute; 14. a suction cup; 15. a screw; 2. a mounting box; 3. a cylinder; 4. a spring; 5. a first clamping block; 51. countersink; 6. a bolt; 7. a spring plate; 71. a connecting rod; 72. a second clamping plate; 73. a main slider; 74. a side slider; 8. a spring plate; 9. a second clamping block; 10. wedge edge.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the present utility model provides the following technical solutions: the utility model provides a semiconductor laser chip test fixing device, including testboard 1, mounting box 2 and cylinder 3, testboard 1 and cylinder 3 rigid coupling, one side of testboard 1 is provided with first splint 11, the inside of testboard 1 is provided with sucking disc 14, one side of sucking disc 14 is through screw 15 and testboard 1 spiro union connection, the inside of mounting box 2 is provided with spring 4 and spring plate 7, the output of cylinder 3 passes mounting box 2 and spring plate 7 rigid coupling, the one end of spring 4 is through first fixture block 5 and spring plate 7 loose joint, the other end is through bolt 6 and mounting box 2 loose joint, one side of spring plate 7 is through connecting rod 71 rigid coupling has second splint 72.

Further, the spring plate 7 and the test bench 1 are fixedly connected with second clamping blocks 9, the first clamping blocks 5 are provided with two groups, one group of the first clamping blocks 5 are bolted with the spring plate 7 through bolts 6, and the other group of the first clamping blocks 5 are bolted with the test bench 1 through bolts 6.

Further, a wedge edge 10 is formed on one side of each of the first clamping block 5 and the second clamping block 9.

Further, a main sliding block 73 is fixedly connected to one side of the second clamping plate 72, a main sliding groove 12 is formed in one side of the test bench 1, and the main sliding block 73 is in sliding connection with the main sliding groove 12.

Further, a side slider 74 is provided on one side of the main slider 73, a side chute 13 is provided on one side of the main chute 12, and the side slider 74 is in sliding contact with the side chute 13.

Further, a counter bore 51 for accommodating the bolt 6 is formed in the first clamping block 5.

Further, the spring plate 7 and the test bench 1 are fixedly connected with a spring piece 8.

During operation, the patent with publication number CN215466227U discloses a semiconductor laser chip testing and fixing device, through placing the semiconductor laser chip onto the test bench 1, make one side of the semiconductor laser chip laminate with the first clamping plate 11, then drive the cylinder 3 and make the cylinder 3 drive the spring plate 7 remove, the spring plate 7 remove the back and drive the second clamping plate 72 through the connecting rod 71 and remove and make the second clamping plate 72 laminate with one side of the semiconductor laser chip far away from the first clamping plate 11, then rotate the screw 15 and make the screw 15 drive sucking disc 14 approach and hold the bottom of chip, in order to accomplish the fixing and the centre gripping operation of chip, then carry out the test operation of semiconductor laser chip, but in the in-process that the spring plate 7 removed, spring plate 7 can oppress or stretch spring 4 and lead to deformation, can damage after making spring 4 use for a long time, therefore, need change spring 4, through screwing out bolt 6 from spring plate 7 and test bench 1 in, make first fixture block 5 and spring plate 7 and test bench 1, then will break away from second fixture block 9 and install new spring plate 5 and new fixture block 4 in the box from spring plate 7, then take out the second fixture block 5 and change in the process of the first fixture block 5 and spring plate 4, can continue to change the process.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor laser chip test fixing device is characterized in that: including testboard (1), mounting box (2) and cylinder (3), one side of testboard (1) is provided with first splint (11), the inside of testboard (1) is provided with sucking disc (14), one side of sucking disc (14) is connected with testboard (1) spiro union through screw rod (15), the inside of mounting box (2) is provided with spring (4) and spring plate (7), the output of cylinder (3) passes mounting box (2) and spring plate (7) rigid coupling, one end of spring (4) is through first fixture block (5) and spring plate (7) loose joint, the other end is through bolt (6) and mounting box (2) loose joint, one side of spring plate (7) is through connecting rod (71) rigid coupling has second splint (72).

2. The semiconductor laser chip test fixture of claim 1, wherein: the inside of spring board (7) and testboard (1) all rigid coupling has second fixture block (9), first fixture block (5) are provided with two sets of, and one set of first fixture block (5) are through bolt (6) and spring board (7) bolt, and another set of first fixture block (5) are through bolt (6) and testboard (1) bolt.

3. The semiconductor laser chip test fixture of claim 2, wherein: wedge edges (10) are formed on one sides of the first clamping block (5) and the second clamping block (9).

4. A semiconductor laser chip test fixture as defined in claim 3, wherein: one side of the second clamping plate (72) is fixedly connected with a main sliding block (73), one side of the test table (1) is provided with a main sliding groove (12), and the main sliding block (73) is in sliding connection with the main sliding groove (12).

5. The semiconductor laser chip test fixture of claim 4, wherein: a side sliding block (74) is arranged on one side of the main sliding block (73), a side sliding groove (13) is formed in one side of the main sliding groove (12), and the side sliding block (74) is in sliding connection with the side sliding groove (13).

6. The semiconductor laser chip test fixture of claim 5, wherein: a counter bore (51) for accommodating the bolt (6) is formed in the first clamping block (5).

7. The semiconductor laser chip test fixture of claim 6, wherein: the spring plate (7) and the test bench (1) are fixedly connected with elastic sheets (8).