CN219043806U - Substrate thinning workbench and substrate thinning device - Google Patents

Abstract

The utility model discloses a substrate thinning workbench and a substrate thinning device, wherein the substrate thinning workbench comprises: a turntable; the sucker is arranged at the upper part of the turntable and used for bearing the substrate to be processed; the flushing component is arranged on the upper side of the sucker so as to flush the surface of the sucker; the brushing assembly comprises a swinging arm and a brushing head, one end of the swinging arm is rotatably connected to the outer side of the rotary table, and the other end of the swinging arm is provided with the brushing head; the brushing head comprises a brushing base, a brush body and a driving motor, wherein the driving motor is fixed on the brushing base, and an output shaft of the driving motor is connected with the brush body so as to brush the surface of the sucker; the upper surface of the brushing base is provided with an annular groove which is communicated with an external vacuum source; the inside of ring channel is provided with fluid channel, fluid channel is followed scrub the thickness direction of base and link up the setting, fluid channel can adsorb the particulate matter on sucking disc surface.

Description

Substrate thinning workbench and substrate thinning device

Technical Field

The utility model belongs to the technical field of substrate thinning, and particularly relates to a substrate thinning workbench and a substrate thinning device.

Background

In the semiconductor field, it is necessary to grind the back surface of a substrate using a thinning (grinding) device before the substrate is divided, thereby thinning the substrate to a predetermined thickness. The grinding of the back surface of the substrate can reduce the packaging volume of the chip, reduce the packaging and mounting height, and the thickness of the chip after the back surface is thinned can even reach below 5% of the initial thickness.

In the substrate thinning apparatus, a chuck (chuck table) is one of the key components, which generally vacuum-adsorbs a substrate to be processed. The stability of the operation of the suction cup is directly related to the reliability of the operation of the substrate thinning device.

In order to prevent the accumulation of particles on the surface of the sucker and ensure the flatness of the sucker, the surface of the sucker needs to be cleaned regularly. Along with the forward movement of the chip manufacturing process, higher requirements are put on the cleanliness of the surface of the sucker.

The existing sucker cleaning mode is as follows: fluid is sprayed towards the rotating chuck surface to throw out residual particulate matter from the chuck surface under centrifugal force. Because the back surface of the substrate is not thoroughly cleaned, the surface of the sucker is extremely easy to be polluted, so that a large amount of tiny particles are accumulated on the surface of the sucker, namely, the flatness of the surface of the sucker is influenced, the processing quality of thinning the substrate is reduced, and even the substrate is broken.

Disclosure of Invention

The embodiment of the utility model provides a substrate thinning workbench and a substrate thinning device, which aim to at least solve one of the technical problems in the prior art.

A first aspect of an embodiment of the present utility model provides a substrate thinning stage, including:

a turntable;

the sucker is arranged at the upper part of the turntable and used for bearing the substrate to be processed;

the flushing component is arranged on the upper side of the sucker so as to flush the surface of the sucker;

the brushing assembly comprises a swinging arm and a brushing head, one end of the swinging arm is rotatably connected to the outer side of the rotary table, and the other end of the swinging arm is provided with the brushing head;

the brushing head comprises a brushing base, a brush body and a driving motor, wherein the driving motor is fixed on the brushing base, and an output shaft of the driving motor is connected with the brush body so as to brush the surface of the sucker; the upper surface of the brushing base is provided with an annular groove which is communicated with an external vacuum source; the inside of ring channel is provided with fluid channel, fluid channel is followed scrub the thickness direction of base and link up the setting, fluid channel can adsorb the particulate matter on sucking disc surface.

In some embodiments, the brushing base is in a columnar structure, a groove is arranged in the middle of the lower part of the brushing base, and the brush body is concentrically arranged in the groove.

In some embodiments, the recess has a profile and size that matches the profile and size of the brush body.

In some embodiments, the number of fluid channels is a plurality that are evenly distributed with respect to the center of the brushing base.

In some embodiments, the fluid channel is disposed in a vertical direction with an upper port connected to the annular groove and a lower port located on a lower surface of the scrubbing base.

In some embodiments, the outer diameter of the brushing base is less than or equal to the radius of the suction cup.

In some embodiments, the brushing base is configured with a vertical channel extending downward from the upper surface, the end of the vertical channel is in communication with a radial channel, the end of the radial channel is configured with an oblique hole, and the oblique hole is disposed toward the inner side wall of the groove.

In some embodiments, the number of radial channels is a plurality, and the angled holes are disposed toward a gap between the brush body and the recess.

In some embodiments, the vertical channel communicates with an external water source via a conduit, and the angled holes are configured to inject fluid toward the gap.

In some embodiments, the number of fluid channels is a plurality that varies in distribution density across the brushing base.

In some embodiments, the bottom surface of the brush base includes a first region and a second region, the first region corresponding to a substrate edge gap; the distribution density of the fluid channels in the first region is greater than the distribution density of the fluid channels in the second region.

A second aspect of an embodiment of the present utility model provides a substrate thinning apparatus, including:

the substrate thinning workbench comprises a substrate, a chuck, a plurality of polishing heads and a plurality of polishing heads, wherein the chuck bears the substrate to be processed and drives the substrate to rotate around the axis of the chuck;

and the thinning mechanism is used for enabling the grinding wheel to be abutted against the substrate so as to thin the substrate.

The beneficial effects of the utility model include:

a. the brushing assembly comprises a brush body and a fluid channel, the brush body brushes particles on the surface of the sucker, and the fluid channel conveys the particles to the outside of the sucker in time through vacuum adsorption, so that the cleanliness of the surface of the sucker is ensured;

b. the inside of the brushing base is provided with a vertical channel, a radial channel and an inclined hole, and fluid is sprayed towards the gap between the groove of the brushing base and the brush body through the vertical channel, the radial channel and the inclined hole so as to reduce or avoid accumulation of particles in the gap and ensure the use effect of the brushing assembly.

c. The distribution density of the fluid channels arranged on the brushing base is different, and the distribution density of the fluid channels in the area corresponding to the substrate edge notch is larger than that in other areas, so that the particulate matters in the position corresponding to the substrate edge notch are cleaned in a focused manner, and the flatness of the surface of the sucker is ensured.

Drawings

The advantages of the present utility model will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the utility model, wherein:

FIG. 1 is a schematic view of a substrate thinning apparatus according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a brushing assembly according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a brushing assembly according to an embodiment of the present utility model;

FIG. 4 is a schematic view of a suction cup configured with a rinse assembly and a brush assembly;

FIG. 5 is a schematic view of a brushing assembly with angled holes according to an embodiment of the present utility model;

fig. 6 is a bottom view of a brushing assembly provided in accordance with an embodiment of the present utility model;

fig. 7 is a schematic view of an embodiment of an application of the brushing assembly corresponding to fig. 6.

Detailed Description

The following describes the technical scheme of the present utility model in detail with reference to specific embodiments and drawings thereof. The examples described herein are specific embodiments of the present utility model for illustrating the concept of the present utility model; the description is intended to be illustrative and exemplary in nature and should not be construed as limiting the scope of the utility model in its aspects. In addition to the embodiments described herein, those skilled in the art can adopt other obvious solutions based on the disclosure of the claims of the present application and the specification thereof, including those adopting any obvious substitutions and modifications to the embodiments described herein.

The drawings in the present specification are schematic views, which assist in explaining the concept of the present utility model, and schematically show the shapes of the respective parts and their interrelationships. It should be understood that for the purpose of clearly showing the structure of various parts of embodiments of the present utility model, the drawings are not drawn to the same scale and like reference numerals are used to designate like parts in the drawings.

In the semiconductor industry, semiconductor chips are manufactured by forming electronic circuits such as ICs (Integrated Circuit, integrated circuits) and LSIs (Large Scale Integration, large-scale integrated circuits) on the surface of a substrate. The back surface of the substrate is ground by a substrate thinning apparatus before the substrate is divided into semiconductor chips, thereby grinding the substrate to a predetermined thickness. The utility model relates to a substrate thinning device, which is used for removing materials on the surface of a substrate according to process requirements.

Fig. 1 is a schematic diagram of a substrate thinning apparatus 100 according to an embodiment of the utility model. The substrate thinning apparatus 100 includes a substrate thinning table 1 and a thinning mechanism 2, wherein the substrate thinning table 1 is disposed above a thinning device base body, and the thinning mechanism 2 is disposed above the substrate thinning table 1 and is located at an end portion of the thinning device base body.

Further, the substrate thinning workbench 1 comprises a rotary table 10, wherein the rotary table 10 is arranged above a thinning equipment base body, and the rotary table 10 can rotate around the central axis under the drive of the driving device; the upper part of the turntable 10 is provided with a suction cup 20 for holding a substrate, and the lower part of the suction cup 20 is provided with a driving part for driving the suction cup and the substrate thereon to rotate.

Further, the thinning mechanism 2 is disposed above the suction cup 20; the grinding wheel arranged at the bottom of the thinning mechanism 2 is abutted against the surface of the substrate so as to grind the surface of the substrate and realize material removal.

The thinning mechanism 2 includes a rough grinding section 21 and a finish grinding section 22, the rough grinding section 21 being provided with a rough grinding wheel for rough grinding the substrate, and the finish grinding section 22 being provided with a finish grinding wheel for finish grinding the substrate. The grinding process is to press the grinding wheel for grinding on the surface of the substrate and rotate the grinding wheel so as to grind and remove the material layer with a certain thickness.

The rough grinding section 21 includes a rough grinding wheel having a cup-shaped structure, a rough grinding spindle seat, and a rough grinding feed mechanism. The rough grinding wheel is connected to the bottom of the rough grinding main shaft so that the rough grinding main shaft drives the rough grinding wheel to rotate to realize the rotary grinding of the rough grinding wheel on the surface of the substrate, the rough grinding main shaft is connected with the rough grinding feeding mechanism through the rough grinding main shaft seat to realize up-and-down movement, and the rough grinding feeding mechanism is used for controlling the rough grinding wheel to approach or separate from the substrate so as to perform axial plunge feeding grinding. The rough grinding wheel can be a diamond grinding wheel, and the surface of the rough grinding wheel is rough so as to realize rapid grinding of the substrate, and the thinning time of the substrate is shortened.

The finish grinding portion 22 includes a finish grinding wheel in a cup-shaped structure, a finish grinding main shaft holder, and a finish grinding feed mechanism. The fine grinding wheel is connected to the bottom of the fine grinding main shaft so that the fine grinding main shaft drives the fine grinding wheel to rotate to realize the rotary grinding of the fine grinding wheel on the surface of the substrate, the fine grinding main shaft is connected with the fine grinding feeding mechanism through the fine grinding main shaft seat to realize up-and-down movement, and the fine grinding wheel is controlled to approach or separate from the substrate through the fine grinding feeding mechanism so as to perform axial plunge type feeding grinding. The fine grinding wheel may be a diamond wheel, which has a surface roughness lower than that of the rough grinding wheel, and may generate serious surface defects and loss due to rapid removal of the substrate surface material by the rough grinding, and the fine surface of the fine grinding wheel is used for low-speed grinding to reduce the thickness of the damaged layer of the substrate surface and improve the substrate surface quality.

In fig. 1, three suction cups 20 are uniformly arranged on the upper portion of the turntable 10, and specifically, the centers of the three suction cups 20 and the central line of the turntable 10 form an included angle of 120 degrees. The three suction cups 20 are rotated at a rough grinding station, a finish grinding station, and a loading and unloading station, wherein two stations opposite to the thinning mechanism 2 are rough ground and finish ground, respectively, and the remaining one station is used for loading and unloading and cleaning of the substrate.

In the embodiment shown in fig. 1, the substrate thinning stage 1 further includes:

a rinsing assembly 30 disposed on an upper side of the suction cup 20 to rinse a surface of the suction cup 20; the flushing assembly 30 can clean particles remained on the surface of the suction cup 20 in a flushing manner;

the brushing assembly 40 includes a swing arm 41 and a brushing head 42 shown in fig. 2, and the brushing head 42 is disposed at the end of the swing arm 41 to brush out particles on the surface of the suction cup 20.

Further, the flushing assembly 30 may be a nozzle, which is filled with a dual fluid, such as a mixture of deionized water and nitrogen, to spray the fluid with a certain pressure toward the surface of the suction cup 20, so as to enhance the impact capability of the fluid and ensure the cleaning effect of the suction cup 20. In fig. 1, one end of a swing arm 41 is rotatably connected to the outer side of the turntable 10, and the swing arm 41 can rotate around the connection point to drive the brush head 42 to move on the surface of the suction cup 20.

Fig. 2 is a schematic view of a brush assembly 40 according to an embodiment of the present utility model, wherein a brush head 42 includes a brush base 43, a brush body 44, and a driving motor 45; the driving motor 45 is disposed on the brushing base 43, and an output shaft of the driving motor 45 is connected to the brush body 44 to drive the brush body 44 to rotate. The lower surface of the brush body 44 is abutted against the suction cup 20 to brush off particles remained on the surface of the suction cup 20 by mutual friction of the two.

Further, the brushing base 43 is a column structure, which is disposed below the swing arm 41. The upper surface of the brush base 43 is provided with an annular groove 43a, and the annular groove 43a is concentrically provided on the upper surface of the brush base 43. The annular groove 43a communicates with an external vacuum source through tubing to draw in the annular groove 43a and the passageway or duct in communication therewith.

In fig. 2, a fluid passage 43b is provided in the annular groove 43a, and the fluid passage 43b penetrates in the thickness direction of the brush base 43. When the external vacuum source is turned on, the fluid channel 43b communicating with the annular groove 43a is capable of generating suction force on the particulate matter on the surface of the suction cup 20; the particles remained on the surface of the sucker 20 are far away from the substrate thinning workbench 1 through the fluid channel 43b, the annular groove 43a and the pipeline, so that the cleanliness of the surface of the sucker 20 is ensured, and the influence of the aggregation of the particles on the surface of the sucker on the flatness of the surface of the sucker is avoided.

In the embodiment shown in fig. 2, the brushing base 43 has a columnar structure, a groove 43c is provided in the middle of the lower portion, and the brush body 44 is concentrically disposed in the groove 43 c. Further, the shape and size of the groove 43c are matched with those of the brush body 44, so as to avoid interference between the outer peripheral wall of the brush body 44 and the inner side wall of the groove 43 c.

In fig. 2, the brush body 44 has a columnar structure made of a material having good water absorbability, such as polyvinyl alcohol, and the bottom surface of the brush body 44 is provided with a plurality of micro-protrusions to brush the surface of the suction cup 20. Accordingly, the groove 43c is a circular hole, and the inner diameter of the groove 43c is slightly larger than the outer diameter of the brush body 44, so as to ensure that the brush body 44 does not interfere with the inner side wall of the groove 43c in the rotating process. In some embodiments, the gap G (shown in FIG. 2) between the brush body 44 and the inside wall of the recess 43c is 2-3mm.

In the embodiment shown in fig. 2, the number of fluid passages 43b is plural and is uniformly distributed with reference to the center of the brush base. During the swing of the swing arm 41 around the connection point, the fluid channel 43b sweeps different areas of the surface of the rotating suction cup 20 to adsorb particles on the surface of the suction cup 20, thereby improving the cleaning ability of the surface of the suction cup 20.

Fig. 3 is a schematic diagram of a brushing assembly 40 according to an embodiment of the present utility model, 24 fluid channels 43b are disposed on a brushing base 43, and the fluid channels 43b are uniformly distributed to ensure a good adsorption effect. It will be appreciated that other numbers of fluid passages 43b are possible, such as 12, 36, 48 or other numbers of odd numbered pieces, provided that they are substantially evenly distributed across the brush base 43.

In fig. 2, the fluid passage 43b is arranged in a vertical direction, an upper port thereof is connected to the annular groove 43a, and a lower port thereof is located on the lower surface of the brush base 43. I.e., the lower port of the fluid channel 43b of the brush head 42 is disposed toward the surface of the suction cup 20 so as to adsorb the residual particulate matter on the surface thereof.

Fig. 4 is a schematic view of a suction cup 20 according to an embodiment of the present utility model, over which a rinse assembly 30 and a brush assembly 40 are disposed. The flushing assembly 30 may be in communication with a dual fluid source, the fluid flushing the surface of the suction cup 20 at a pressure; the annular groove 43a (shown in fig. 2) of the brush assembly 40 is connected to an external vacuum source through a pipe line to timely suck out the particles on the surface of the suction cup 20. Reference herein to dual fluid means a mixture of liquid and gas, such as deionized water and nitrogen in a certain ratio. As one embodiment of the utility model, the fluid ejected by the flushing assembly 30 has a temperature, such as 40-60, to enhance the force of the flushing fluid against the suction cup surface.

Further, the suction cup 20 includes a suction cup base 20b and a ceramic suction cup 20c, a suction cup pipeline 20a disposed towards the ceramic suction cup is disposed in the suction cup base 20b, compressed gas can be introduced into the suction cup pipeline 20a, and the compressed gas is sprayed towards the ceramic suction cup 20c to blow up particles on the surface of the suction cup 20, and the fluid channel 43b on the brush body head 42 can absorb the blown particles in time, so as to enhance the cleaning effect of the brush head 42. In this application, the ceramic chuck 20c refers to a porous material to vacuum-adsorb a substrate to be thinned.

To avoid particulate accumulation inside the fluid channel 43b, the brush base 43 may be made of polytetrafluoroethylene to ensure a smoother wall of the fluid channel 43b. In some embodiments, the roughness of the inner surface of the fluid channel 43b is controlled below Ra0.2.

In the embodiment shown in fig. 4, the outer diameter of the brush base 43 is smaller than the radius of the suction cup 20, and the brush body 44 on the brush head 42 covers the edge area of the suction cup 20. This is because the residual particulate matter is mostly concentrated at the edges of the ceramic suction cup 20c by the centrifugal force. In addition, the outer edge of the substrate is typically provided with notches (notches) that correspond to areas that accumulate some particulate matter. In fig. 4, the outer diameter of the brush base 43 is approximately 1/2 the radius of the suction cup 20 to focus the cleaning process on the edge of the ceramic suction cup 20 c.

It will be appreciated that the outer diameter of the brush base 43 may also be equal to the radius of the chuck 20 such that during rotation of the chuck 20, there is a fluid channel 43b facing the surface of the ceramic chuck 20 c.

In fig. 2, a gap G is disposed on the brush head 42 of the brush assembly 40, and during long-term use of the brush assembly 40, the gap G is unlikely to accumulate a large amount of particulate matter to affect the cleaning effect of the suction cup 20.

In order to solve the above problems and ensure the cleaning effect of the suction cup 20, the brushing assembly 40 provided in fig. 5 provides a solution, and compared with the solution shown in fig. 2, the brushing base 43 is configured with a vertical channel 43d extending downward from the upper surface, the end of the vertical channel 43d is communicated with a radial channel 43e, and the end of the radial channel 43e is configured with an inclined hole 43f, and the inclined hole 43f is disposed towards the inner sidewall of the groove 43c to remove the particles adhered to the inner sidewall of the groove 43 c.

In fig. 5, vertical passage 43d is in communication with an external water source via a conduit, and angled holes 43f are capable of injecting a fluid, such as compressed air and/or deionized water, toward gap G to remove residual particulate matter from gap G.

In the present utility model, the radial passage 43e is a passage provided along the radial direction of the brush base 43. The number of the radial passages 43e is plural, and accordingly, the number of the inclined holes 43f is equal to the number of the radial passages 43e, and the inclined holes 43f are provided toward the gap G between the brush body 44 and the groove 43c to flush the particulate matter adhering to the gap G with the water flow and/or the air flow.

Because the edge of the substrate is provided with a notch (notch), after the substrate is placed on the surface of the suction cup 20, the porous ceramic at the notch of the edge of the substrate is not plugged, so that more particles are easily accumulated at the notch of the edge of the substrate, and the region needs to be cleaned in a focus manner so as to avoid that the flatness of the surface of the suction cup 20 is not in accordance with the process requirement due to the accumulation of the particles.

To solve the above problems, the present utility model provides the following solutions: the brush base 43 of the brush unit 40 is provided with fluid passages 43b having different distribution densities. Specifically, more fluid channels 43b are arranged at positions corresponding to the notches at the edges of the substrate, so that areas with more accumulated particulate matters are mainly removed, and the cleaning effect of the surfaces of the suckers is ensured.

Fig. 6 is a bottom view of a brushing assembly 40 according to an embodiment of the present utility model, wherein the bottom surface of the brushing base 43 includes a first area A1 and a second area A2; during the swing arm 41 of the brushing assembly 40 swings around the fixed point, the first area A1 of the brushing base 43 can sweep the corresponding position at the edge notch of the substrate. In the substrate thinning process, the orientation of the edge notch of the substrate is relatively fixed so as to facilitate the transport positioning. That is, the substrate edge notch is always located at the corresponding position on the surface of the suction cup 20, so that the position where the particles are accumulated on the surface of the suction cup 20 is relatively fixed.

In fig. 6, the distribution density of the fluid channels 43b disposed in the first area A1 is greater than the distribution density of the fluid channels 43b disposed in the second area A2, so as to focus on cleaning the positions corresponding to the edge notches of the substrate.

Further, in the first area A1, the fluid passages 43b are arranged in a plurality of rows, and the fluid passages 43b are arranged at intervals along the radial direction of the brushing base 43, so as to enhance the sucking capability of the brushing assembly 40.

Further, the inner diameter of the fluid channel 43b in the first area A1 is smaller than the inner diameter of the fluid channel 43b in the second area A2, so as to ensure the cleaning effect of the focal position of the suction cup 20.

Fig. 7 is a top view of the brushing assembly 40 provided in fig. 6 disposed on the upper side of the suction cup 20. The brushing assembly 40 rotates around a fixed point located at the outer side of the suction cup 20, and the fluid channel 43b of the first area A1 can cover the position corresponding to the gap of the edge of the substrate, so as to ensure the cleaning effect of the suction cup 20.

In fig. 7, the number of the fluid passages 43b is plural in the first area A1, which is arranged in three rows along the bottom surface of the brushing base 43, and the area of the first area A1 is 1/10-1/6 of the total area of the bottom of the brushing base 43; the inner diameter of the fluid channel 43b in the first area A1 is smaller than 1/2 of the inner diameter of the fluid channel 43b in the second area A2, so as to effectively clean the important area of the surface of the suction cup 20.

Meanwhile, the utility model also provides a substrate thinning device 100, as shown in fig. 1, wherein the substrate thinning device 100 comprises the substrate thinning workbench 1 and the thinning mechanism 2, and the sucker 20 of the substrate thinning workbench 1 bears a substrate to be processed and drives the substrate to rotate around the axis of the sucker 20; the thinning mechanism 2 brings the grinding wheel into contact with the substrate to perform thinning processing on the substrate. The upper side of the suction cup 20 is provided with a brushing assembly 40 to effectively remove particles remained on the surface of the suction cup 20.

The following will briefly describe the steps of using the substrate thinning apparatus in conjunction with the substrate thinning apparatus shown in fig. 1, which includes:

s1, placing a substrate on a sucker 20 of a substrate thinning workbench 100, and grinding the substrate by using a grinding wheel of a thinning mechanism 2;

s2, after the substrate is ground, transferring the substrate to a next process by using a manipulator;

s3, the brushing assembly 40 is used for cleaning the surface of the sucker 20, the brushing head 42 is abutted against the surface of the sucker 20, and the fluid channel 43b in the cleaning base 43 sucks particulate matters on the surface of the sucker 20 so as to ensure the cleaning effect of the surface of the sucker 20.

During the cleaning of the suction cup 20 by the brush assembly 40, the rinse assembly 30 sprays fluid toward the suction cup 20, while the swing arm 41 of the brush assembly 40 swings toward the suction cup 20 such that the brush head 20 is positioned above the suction cup 20; the driving motor 45 rotates to drive the brush body 44 to rotate so as to brush the surface of the suction cup 20.

During cleaning operation of the suction cup 20, an external air source sprays air from bottom to top through the suction cup pipeline 20a, so that particles are separated from the suction cup 20, and acting force is applied from above and below at the same time, so that the particles are separated from the surface of the suction cup 20. That is, the upward suction force is applied to the particles through the fluid duct 43b, and at the same time, the upward pushing force is applied to the particles through the suction cup pipeline 20a positioned in the suction cup 20, and the separation of the particles from the suction cup surface is realized through the resultant force of the two, so that the cleaning capability of the brushing assembly 40 is enhanced.

The tiny particles attached to the surface of the ceramic sucker are separated from the ceramic sucker, the fluid channel 43b on the brushing base 43 is communicated with an external vacuum source, and the particles suspended above the ceramic sucker and on the upper part of the ceramic sucker are timely sucked, so that the cleanliness of the surface of the sucker 20 is ensured.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (12)

1. A substrate thinning stage, comprising:

a turntable;

the sucker is arranged at the upper part of the turntable and used for bearing the substrate to be processed;

the flushing component is arranged on the upper side of the sucker so as to flush the surface of the sucker;

the brushing assembly comprises a swinging arm and a brushing head, one end of the swinging arm is rotatably connected to the outer side of the rotary table, and the other end of the swinging arm is provided with the brushing head;

the brushing head comprises a brushing base, a brush body and a driving motor, wherein the driving motor is fixed on the brushing base, and an output shaft of the driving motor is connected with the brush body so as to brush the surface of the sucker; the upper surface of the brushing base is provided with an annular groove which is communicated with an external vacuum source; the inside of ring channel is provided with fluid channel, fluid channel is followed scrub the thickness direction of base and link up the setting, fluid channel can adsorb the particulate matter on sucking disc surface.

2. The substrate thinning stage according to claim 1, wherein the brushing base has a columnar structure, a groove is provided in a middle position of a lower portion thereof, and the brush body is concentrically provided in the groove.

3. The substrate thinning stage according to claim 2, wherein the recess has a shape and size matching a shape and size of the brush body.

4. The substrate thinning stage according to claim 1, wherein the number of fluid passages is plural and is uniformly distributed with reference to a center of the brush base.

5. The substrate thinning stage according to claim 1, wherein the fluid passage is disposed in a vertical direction with an upper port connected to the annular groove and a lower port located on a lower surface of the brush base.

6. The substrate thinning station of claim 2, wherein an outer diameter of the brush base is less than or equal to a radius of the chuck.

7. The substrate thinning stage according to claim 2, wherein the brushing base is configured with a vertical channel extending downward from the upper surface, a distal end of the vertical channel being in communication with a radial channel, a distal end of the radial channel being configured with an angled hole, the angled hole being disposed toward an inner sidewall of the recess.

8. The substrate thinning stage according to claim 7, wherein the number of radial passages is plural, and the inclined holes are provided toward a gap between the brush body and the groove.

9. The substrate thinning stage of claim 8, wherein the vertical channel communicates with an external water source via a conduit, and the angled holes are capable of ejecting fluid toward the gap.

10. The substrate thinning stage of claim 1, wherein the number of fluid channels is a plurality of the fluid channels having different distribution densities at the brush base.

11. The substrate thinning station of claim 10, wherein the bottom surface of the brush base includes a first region and a second region, the first region corresponding to a substrate edge gap; the distribution density of the fluid channels in the first region is greater than the distribution density of the fluid channels in the second region.

12. A substrate thinning apparatus, comprising:

the substrate thinning stage according to any one of claims 1 to 11, the chuck carrying a substrate to be processed and rotating the substrate about an axis of the chuck;

and the thinning mechanism is used for enabling the grinding wheel to be abutted against the substrate so as to thin the substrate.

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