CN218977086U - Quick-maintenance supporting natural heat dissipation assembly of totally-enclosed machine case - Google Patents
Quick-maintenance supporting natural heat dissipation assembly of totally-enclosed machine case Download PDFInfo
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- CN218977086U CN218977086U CN202120525679.1U CN202120525679U CN218977086U CN 218977086 U CN218977086 U CN 218977086U CN 202120525679 U CN202120525679 U CN 202120525679U CN 218977086 U CN218977086 U CN 218977086U
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- heat
- chassis
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- heat dissipation
- plate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- 238000012423 maintenance Methods 0.000 title abstract description 11
- 230000007246 mechanism Effects 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a full-closed chassis natural heat dissipation assembly supporting quick maintenance, which comprises a chassis shell, wherein a chassis heat dissipation outer cover is arranged on the chassis shell, a board track frame is arranged in the chassis shell, a track is arranged on the board track frame, the track is horizontally arranged, a main board connected with a board interface is arranged in the chassis shell, a heat conducting plate with a wedge-shaped section is arranged between the two board track frames, the thickness of the heat conducting plate at the opening side is smaller than that of the inner side, the heat conducting plate is arranged at the inner wall side of the chassis heat dissipation outer cover, a first inclined surface is arranged on the heat conducting plate, an elastic heat conducting gasket is arranged on the first inclined surface, the section of a board is wedge-shaped, a second inclined surface matched with the first inclined surface is arranged on the board, when the board is inserted, the first inclined surface and the second inclined surface are gradually close, and when the board is inserted in place, the heat conducting gasket is pressed between the first inclined surface and the second inclined surface. The natural heat dissipation assembly can fully dissipate heat generated on the board card, and meanwhile, the board card can be conveniently and quickly replaced.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a natural heat dissipation component of a full-closed chassis supporting fast maintenance.
Background
In the case, the board is an independent functional module, in the prior art, most boards are fixed in the case through screws, the purpose of quick maintenance is difficult to achieve by the fixing mode, especially in the case that the boards are out of order, in order to avoid equipment shutdown for a long time, the boards which need to be replaced are required to be immediately taken down and simultaneously replaced by standby boards, and if the boards are disassembled through screwing, the loss is caused. The circuit board and the components are arranged in the board card, and when the board card works, the components can emit a large amount of heat, and the heat must be timely discharged, otherwise, the board card can be burnt.
For a totally-enclosed chassis, how to realize efficient heat dissipation and realize rapid maintenance is a major problem to be solved in product design.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provides a natural heat dissipation component of a totally-enclosed chassis supporting quick maintenance.
The aim of the utility model is realized by the following technical scheme:
the quick-maintenance supporting totally-enclosed chassis natural heat dissipation assembly comprises a chassis shell, a chassis heat dissipation outer cover, a board card track frame, a heat conduction plate, a heat conduction gasket and a board card, wherein the chassis heat dissipation outer cover is arranged on the chassis shell and matched with the chassis shell, two board card track frames are symmetrically arranged in the chassis shell, tracks for installing the board card are arranged on opposite sides of the two board card track frames, the tracks are horizontally arranged, a main board connected with a board card interface is arranged in the chassis shell, the heat conduction plate with a wedge-shaped section is arranged between the two board card track frames, the thickness of the heat conduction plate at the opening side is smaller than the thickness of the inner side, the heat conduction plate is arranged on the inner wall side of the chassis heat dissipation outer cover, a first inclined surface is arranged on the heat conduction plate, an elastic heat conduction gasket is arranged on the first inclined surface, the section of the board is wedge-shaped, and a second inclined surface matched with the first inclined surface is arranged on the board;
in the process of horizontally inserting the board card along the track, the first inclined plane is gradually close to the second inclined plane, and when the board card is inserted in place, the heat conduction gasket is tightly pressed between the first inclined plane and the second inclined plane.
Further, a bonding surface and a dry smooth surface opposite to the bonding surface are arranged on the heat conduction gasket, the bonding surface is bonded with the first inclined surface, and the dry smooth surface is in contact with the second inclined surface.
Further, an adhesive heat conducting glue layer is arranged on the bonding surface.
Further, a graphite powder layer is arranged on the dry smooth surface.
Further, the plane of the board track frame is perpendicular to the plane of the heat dissipation outer cover of the chassis.
Further, the first inclined plane and the second inclined plane are consistent in inclination, and the inclination is 1.5-2.5 degrees.
Further, a heat dissipation skirt belt is arranged on the heat dissipation outer cover of the case.
Further, a locking mechanism for locking the board card on the track is arranged on the board card.
The beneficial effects of the utility model are as follows:
1) The natural heat dissipation assembly adopts the heat conduction gasket to realize the contact and heat conduction between the heat-generating plate card and the middle heat-conducting plate, in order to realize the quick maintenance function of the plate card, the opposite surfaces of the middle heat-conducting plate and the heat-generating plate card are set to be mutually matched inclined surfaces, the heat conduction gasket is elastic, one surface of the heat conduction gasket is provided with back glue with extremely high viscosity and is adhered and fixed on the heat-conducting plate, and the other surface contacted with the heat-generating plate card is a dry and smooth surface. When the board card is inserted in place, the elastic heat conducting gasket is pressed between the board card and the middle heat conducting plate to realize efficient heat transfer; when the board card is required to be pulled out, the heat conduction gasket is prevented from being damaged or falling off due to the special inclined plane matching structure and the special design of the two sides of the heat conduction gasket, and the phenomenon of mutual cutting and scratching caused by plane matching can not occur.
2) In this nature cooling module, if not set up the heat conduction gasket, can't guarantee the close contact under the prerequisite that can realize the assembly between integrated circuit board and the heat conduction board, can't ensure heat conduction efficiency. The cross section of the board card must be wedge-shaped, if the cross section of the board card is rectangular, the elastic heat conduction gasket is easy to damage and scrape, or equipment cannot be realized.
Drawings
FIG. 1 is a three-dimensional view of a main assembly structure of a chassis;
FIG. 2 is a side cross-sectional view of the main assembly structure of the chassis;
FIG. 3 is a front cross-sectional view of the main assembly structure of the chassis;
in the figure, a 1-chassis shell, a 2-chassis heat dissipation outer cover, a 3-board card track frame, a 4-heat conducting plate, a 5-heat conducting gasket, a 6-board card, a 7-track, an 8-first inclined plane, a 9-second inclined plane, a 10-bonding surface, an 11-dry smooth surface, a 12-heat dissipation skirt, a 13-main board and a 14-locking mechanism.
Detailed Description
The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by a person skilled in the art without any inventive effort, are intended to be within the scope of the present utility model, based on the embodiments of the present utility model.
Referring to fig. 1-3, the present utility model provides a technical solution:
the utility model provides a support totally closed quick-witted case natural heat dissipation subassembly of fast maintenance, including chassis housing 1, chassis heat dissipation enclosing cover 2, integrated circuit board track frame 3, heat conduction board 4, heat conduction gasket 5 and integrated circuit board 6, chassis heat dissipation enclosing cover 2 sets up on chassis housing 1 and cooperates with chassis housing 1, the inside symmetry of chassis housing 1 is provided with two integrated circuit board track frames 3, opposite side on two integrated circuit board track frames 3 is provided with the track 7 that is used for mounting integrated circuit board 6, track 7 level sets up, chassis housing 1 inside is provided with mainboard 13 that links to each other with integrated circuit board 6 interface, be provided with the heat conduction board 4 that the cross-section is wedge between two integrated circuit board track frames 3, the thickness of heat conduction board 4 is less than the thickness of inboard at the opening side, heat conduction board 4 is installed on the inner wall side of chassis heat dissipation enclosing cover 2, be equipped with first inclined plane 8 on the heat conduction board 4, be provided with elastic heat conduction gasket 5 on the first inclined plane 8, the cross-section of integrated circuit board 6 is wedge, be equipped with second inclined plane 9 that cooperates with first inclined plane 8 on integrated circuit board 6; in the process of horizontally inserting the board 6 along the track 7, the first inclined plane 8 and the second inclined plane 9 are gradually close, and when the board 6 is inserted in place, the heat conduction gasket 5 is pressed between the first inclined plane 8 and the second inclined plane 9. The plane of the board track frame 3 is perpendicular to the plane of the chassis heat dissipation outer cover 2. The main board 13 is in the prior art, an end cover matched with the chassis housing 1 is arranged on the chassis housing 1, and the end cover is arranged on the insertion side of the board card 6, so that the chassis is a closed chassis, and dust in the chassis is reduced. The plane of the board track frame 3 is perpendicular to the plane of the chassis heat dissipation outer cover 2. A plurality of groups of tracks 7 are arranged on the board track frame 3, and a board 6 can be placed in each group of tracks 7. The heat conductive plate 4 is arranged in a wedge shape, which facilitates insertion and removal of the board card 6. The heat-conducting plate 4 is arranged on the inner wall side of the case heat-radiating outer cover 2, and the mounting finger at the place is in direct contact connection to realize efficient heat transfer, or is connected through heat-conducting components such as a heat-conducting gasket, heat-conducting glue and the like to realize efficient heat transfer. The cross sections of the heat conducting plate 4 and the board card 6 are wedge-shaped, so that the pressure between the board card 6 and the heat conducting plate 4 is larger and larger in the inserting process of the board card 6, and the heat conducting gasket 5 is elastically deformed, so that the heat conducting gasket can be fully contacted with the board card 6 to fully transfer heat on the board card 6. In this nature cooling subassembly, if not set up heat conduction gasket 5, can't guarantee the close contact under the prerequisite that can realize the assembly between integrated circuit board 6 and the heat conduction board 4, can't ensure heat conduction efficiency. The cross section of the board 6 must be wedge-shaped, if the cross section of the board 6 is rectangular, the elastic heat conducting pad 5 is easily scratched or the board 6 cannot be equipped.
Preferably, the heat conductive pad 5 is provided with a bonding surface 10 and a dry smooth surface 11 opposite to the bonding surface 10, the bonding surface 10 is bonded to the first inclined surface 8, and the dry smooth surface 11 is in contact with the second inclined surface 9. An adhesive heat conducting glue layer is arranged on the bonding surface 10. A graphite powder layer is provided on the dry smooth surface 11. The sticky heat conduction glue layer enables the heat conduction gasket 5 not to fall off from the heat conduction plate 4, the elastic heat conduction gasket prevents the board card 6 from being scratched during installation and disassembly, meanwhile, the heat conduction gasket 5 is prevented from being too hard, the board card 6 is difficult to install in the track 7, and the graphite powder layer can conduct heat and also has a lubricating effect. The heat conducting pad 5 can be a pad which can meet the function in the prior art.
Preferably, the first inclined plane 8 and the second inclined plane 9 have the same inclination, and the inclination is 1.5-2.5 degrees. The board card 6 is arranged in a wedge shape, so that the board card 6 is convenient to insert and take out, and under the general condition, the included angle between the opposite surface of the second inclined surface 9 and the second inclined surface 9 is 2 degrees, and the shell of the board card 6 is a metal shell with good heat conduction.
Preferably, the heat dissipation skirt 12 is arranged on the heat dissipation outer cover 2 of the chassis. The heat dissipation skirt 12 is arranged to enable the case to dissipate heat better, so that heat on the case is fully dissipated into the air. Meanwhile, the two ends of the heat conducting plate 4 extend to the positions of the board card track frames 3 on the two sides as far as possible, so that the heat conducting plate 4 has a larger heat conducting surface, and the heat radiating effect of the board card 6 is better.
Preferably, the board 6 is provided with a locking mechanism 14 for locking the board 6 to the rail 7. The locking mechanism 14 adopts the prior art, because the cross sections of the heat conducting plate 4 and the board card 6 are both arranged into a wedge shape, and the heat conducting gasket 5 is provided with a dry smooth surface 11, in order to prevent the board card 6 from separating from the track 7 under the elastic action of the heat conducting gasket 5, the locking mechanism 14 is arranged, two sides of the board card 6 are respectively provided with the locking mechanism 14, the locking mechanisms 14 slide to two sides simultaneously and then are inserted into the board card track frame 3, so that the board card 6 can be quickly fixed in the track 7, and the purpose of preventing the board card 6 from separating from the track 7 is achieved.
The natural heat dissipation assembly adopts the heat conduction gasket to realize the contact and heat conduction between the heat-generating plate card and the middle heat-conducting plate, in order to realize the quick maintenance function of the plate card, the opposite surfaces of the middle heat-conducting plate and the heat-generating plate card are set to be mutually matched inclined surfaces, the heat conduction gasket is elastic, one surface of the heat conduction gasket is provided with back glue with extremely high viscosity and is adhered and fixed on the heat-conducting plate, and the other surface contacted with the heat-generating plate card is a dry and smooth surface. When the board card is inserted in place, the elastic heat conducting gasket is pressed between the board card and the middle heat conducting plate to realize efficient heat transfer; when the board card is required to be pulled out, the heat conduction gasket is prevented from being damaged or falling off due to the special inclined plane matching structure and the special design of the two sides of the heat conduction gasket, and the phenomenon of mutual cutting and scratching caused by plane matching can not occur.
The foregoing is merely a preferred embodiment of the utility model, and it is to be understood that the utility model is not limited to the form disclosed herein but is not to be construed as excluding other embodiments, but is capable of numerous other combinations, modifications and environments and is capable of modifications within the scope of the inventive concept, either as taught or as a matter of routine skill or knowledge in the relevant art. And that modifications and variations which do not depart from the spirit and scope of the utility model are intended to be within the scope of the appended claims.
Claims (8)
1. Support totally closed quick-witted case natural heat dissipation subassembly of fast dimension, its characterized in that: the heat-conducting plate comprises a chassis shell (1), a chassis heat-radiating outer cover (2), a plate card track frame (3), heat-conducting plates (4), heat-conducting gaskets (5) and plate cards (6), wherein the chassis heat-radiating outer cover (2) is arranged on the chassis shell (1) and matched with the chassis shell (1), two plate card track frames (3) are symmetrically arranged in the chassis shell (1), tracks (7) for installing the plate cards (6) are arranged on opposite sides of the plate card track frames (3), the tracks (7) are horizontally arranged, a main plate (13) connected with an interface of the plate cards (6) is arranged in the chassis shell (1), wedge-shaped heat-conducting plates (4) are arranged between the two plate card track frames (3), the thickness of each heat-conducting plate (4) on the opening side is smaller than that of the inner side, the heat-conducting plates (4) are arranged on the inner wall sides of the chassis outer cover (2), first inclined surfaces (8) are arranged on the plate (4), the heat-conducting plates (8) are provided with wedge-shaped heat-conducting gaskets (9) on the first inclined surfaces (8), and the heat-conducting gaskets (6) are arranged on the first inclined surfaces (9);
in the process of horizontally inserting the board card (6) along the track (7), the first inclined plane (8) is gradually close to the second inclined plane (9), and when the board card (6) is inserted in place, the heat conduction gasket (5) is tightly pressed between the first inclined plane (8) and the second inclined plane (9).
2. The natural heat dissipation assembly for a fully enclosed enclosure supporting fast dimensions of claim 1, wherein: the heat conducting gasket (5) is provided with a bonding surface (10) and a dry smooth surface (11) opposite to the bonding surface (10), the bonding surface (10) is bonded with the first inclined surface (8), and the dry smooth surface (11) is in contact with the second inclined surface (9).
3. The natural heat dissipation assembly for a fully enclosed enclosure supporting fast dimensions according to claim 2, wherein: an adhesive heat conducting glue layer is arranged on the bonding surface (10).
4. A totally enclosed cabinet natural heat dissipation assembly supporting fast dimensions according to claim 2 or 3, wherein: the dry smooth surface (11) is provided with a graphite powder layer.
5. The natural heat dissipation assembly for a fully enclosed enclosure supporting fast dimensions of claim 1, wherein: the plane of the board card track frame (3) is perpendicular to the plane of the chassis heat dissipation outer cover (2).
6. The natural heat dissipation assembly for a fully enclosed enclosure supporting fast dimensions according to claim 1 or 2, wherein: the first inclined plane (8) and the second inclined plane (9) are identical in inclination, and the inclination is 1.5-2.5 degrees.
7. The natural heat dissipation assembly for a fully enclosed enclosure supporting fast dimensions of claim 1, wherein: and the radiating skirt band (12) is arranged on the radiating outer cover (2) of the chassis.
8. The natural heat dissipation assembly for a fully enclosed enclosure supporting fast dimensions of claim 1, wherein: the board card (6) is provided with a locking mechanism (14) for locking the board card (6) on the track (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120525679.1U CN218977086U (en) | 2021-03-12 | 2021-03-12 | Quick-maintenance supporting natural heat dissipation assembly of totally-enclosed machine case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120525679.1U CN218977086U (en) | 2021-03-12 | 2021-03-12 | Quick-maintenance supporting natural heat dissipation assembly of totally-enclosed machine case |
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| Publication Number | Publication Date |
|---|---|
| CN218977086U true CN218977086U (en) | 2023-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120525679.1U Active CN218977086U (en) | 2021-03-12 | 2021-03-12 | Quick-maintenance supporting natural heat dissipation assembly of totally-enclosed machine case |
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| CN (1) | CN218977086U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112839470A (en) * | 2021-03-12 | 2021-05-25 | 成都前锋信息技术股份有限公司 | Quick-maintenance-supporting totally-enclosed chassis natural heat dissipation assembly |
-
2021
- 2021-03-12 CN CN202120525679.1U patent/CN218977086U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112839470A (en) * | 2021-03-12 | 2021-05-25 | 成都前锋信息技术股份有限公司 | Quick-maintenance-supporting totally-enclosed chassis natural heat dissipation assembly |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.1179 Baicao Road, high tech Zone, Chengdu, Sichuan 610000 Patentee after: Chengdu Qianfeng Information Technology Co.,Ltd. Address before: No.1179 Baicao Road, high tech Zone, Chengdu, Sichuan 610000 Patentee before: Chengdu Qianfeng Information Technology Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |