CN218975421U

CN218975421U - Wafer adsorption device and wafer processing equipment

Info

Publication number: CN218975421U
Application number: CN202320088886.4U
Authority: CN
Inventors: 刘盛; 巫礼杰; 仰瑞; 文洪; 陆育梃; 王金生; 卢庆勇; 龙小详; 尹建刚; 高云峰
Original assignee: Shenzhen Hans Semiconductor Equipment Technology Co Ltd
Current assignee: Shenzhen Hans Semiconductor Equipment Technology Co Ltd
Priority date: 2023-01-31
Filing date: 2023-01-31
Publication date: 2023-05-05
Anticipated expiration: 2033-01-31

Abstract

The application discloses a wafer adsorption equipment and wafer processing equipment. The wafer adsorption device comprises a sucker assembly, the sucker assembly comprises a sucker and a sealing ring, the sealing ring is arranged on the sucker, an adsorption hole is formed in the sucker and used for adsorbing a wafer, the sealing ring is arranged around the adsorption hole in a surrounding mode, and the sealing ring protrudes out of an adsorption surface of the sucker. The application provides a wafer adsorption device and wafer processing equipment capable of firmly adsorbing a wafer and preventing the wafer from falling.

Description

Wafer adsorption device and wafer processing equipment

Technical Field

The application relates to the technical field of wafer processing, in particular to a wafer adsorption device and wafer processing equipment.

Background

A wafer is a silicon wafer used to fabricate silicon semiconductor circuits. The processing of semiconductor devices is complicated, and different processes need to be performed on different processing surfaces of a wafer, for example, wafer dicing is performed on the front surface of the wafer, and bar codes for identifying wafer information are imprinted on the back surface of the wafer. Thus requiring the wafer to be flipped during processing. In the related art, the wafer is not firmly adsorbed in the overturning process and is easy to drop.

Disclosure of Invention

In order to solve the technical problems, the application provides a wafer adsorbing device and wafer processing equipment capable of firmly adsorbing wafers and preventing the wafers from falling.

To achieve the purpose, the application adopts the following technical scheme:

the utility model provides a wafer adsorption equipment, includes the sucking disc subassembly, the sucking disc subassembly includes sucking disc and sealing washer, the sealing washer is located on the sucking disc, be equipped with the absorption hole on the sucking disc, the absorption hole is used for adsorbing the wafer, the sealing washer encloses and locates around the absorption hole, just the sealing washer protrusion the adsorption face of sucking disc.

As an alternative scheme of the wafer adsorption device, the sucker comprises a connecting part and a tray body, wherein the tray body is arranged at one end of the connecting part, the tray body is provided with the adsorption hole, the connecting part is internally provided with the vacuum runner, and the vacuum runner is communicated with the adsorption hole.

As an alternative scheme of the wafer adsorption device, the adsorption hole is arranged at the middle position of the tray body, and the sealing ring is arranged at the edge of the tray body.

As an alternative to the wafer suction apparatus described above, the wafer suction apparatus further includes:

the anti-falling assemblies are arranged on two sides of the sucker assembly; the anti-falling component comprises an opening and closing driving piece and an anti-falling piece connected with the opening and closing driving piece, and the opening and closing driving piece can drive the anti-falling piece to be close to or far away from the sucker component; the anti-falling piece is arranged on one side, close to the sucker assembly, of the anti-falling piece, and when the anti-falling piece is close to the sucker assembly, the edge of the wafer on the sucker assembly stretches into the anti-falling groove.

As an alternative to the above wafer suction apparatus, the dimension of the drop prevention groove is larger than the dimension of the portion of the wafer that extends into the drop prevention groove, so that the drop prevention groove is not in contact with the wafer.

As an alternative scheme of the wafer adsorption device, the falling-preventing piece is a falling-preventing rod, one end of the falling-preventing rod is connected with the opening and closing driving piece, and the other end of the falling-preventing rod is provided with the falling-preventing groove.

As an alternative scheme of the wafer adsorption device, the wafer adsorption device further comprises an installation seat, and the sucker component and the anti-drop component are both arranged on the installation seat;

the anti-falling rod comprises a first edge and a second edge which are perpendicular to each other, the first edge is parallel to the mounting seat and is in sliding connection with the mounting seat, and the first edge is connected with the opening and closing driving piece; the second edge is perpendicular to the mounting seat, and the anti-falling groove is formed in the second edge.

As an alternative to the wafer adsorption apparatus, the anti-drop assembly further includes:

the connecting block is arranged in the vertical direction, the top end of the connecting block is connected with the first edge, and the bottom end of the connecting block is connected with the opening and closing driving piece.

the sucker assembly and the anti-drop assembly are arranged on the mounting seat;

the installation seat is connected with the rotary driving piece, and the rotary driving piece can drive the installation seat to rotate around the horizontal rotating shaft.

A wafer processing apparatus comprising a wafer adsorbing device as described above.

The embodiment of the application has the advantages that: the sealing ring is arranged on the sucker, the sealing ring is arranged around the adsorption hole on the sucker in a surrounding mode, the sealing ring protrudes out of the adsorption surface of the sucker, when the wafer is placed on the sucker, the wafer is contacted with the sealing ring, the sealing ring wraps the bottom surface of the wafer until the bottom surface of the wafer is contacted with the sucker for adsorption, so that the wafer is firmly adsorbed, and the wafer is prevented from falling. Especially when the wafer has little deformation, take place the warpage, the wafer adsorption equipment of this application embodiment makes the sealing washer flexible by the soft plasticity of sealing washer own material to can wrap up the wafer bottom, firm absorption wafer.

Drawings

FIG. 1 is a schematic diagram of a wafer chucking apparatus according to an embodiment of the present application;

FIG. 2 is a schematic diagram of an adsorption module according to one embodiment of the present application;

FIG. 3 is a schematic diagram of an exploded view of an adsorbent assembly according to an embodiment of the present application;

FIG. 4 is a schematic cross-sectional view of an adsorption module according to one embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of an adsorption assembly according to an embodiment of the present disclosure;

FIG. 6 is a schematic structural view of a drop prevention assembly according to an embodiment of the present application;

FIG. 7 is a schematic view of a structure of an anti-falling assembly in an open state after a wafer is adsorbed by a wafer adsorption device according to an embodiment of the present application;

FIG. 8 is a schematic view of a structure of an anti-falling assembly in a folded state after a wafer is adsorbed by a wafer adsorption device according to an embodiment of the present disclosure;

FIG. 9 is a schematic cross-sectional view of the structure of FIG. 8;

fig. 10 is a schematic structural view of a wafer processing apparatus according to an embodiment of the present application.

In the figure:

100. a wafer adsorption device; 101. a wafer; 102. a horizontal rotating shaft;

110. a suction cup assembly; 111. a suction cup; 1111. adsorption holes; 1112. a connection part; 11121. a vacuum flow path; 1114. an adsorption tank; 1113. a tray body; 112. a seal ring; 113. a joint; 114. a pressing plate;

120. an anti-drop assembly; 121. an opening and closing driving member; 122. an anti-falling member; 1221. an anti-falling groove; 1222. a first edge; 1223. a second side; 123. a slide rail and slide block structure; 124. a connecting block;

130. a mounting base;

140. a rotary driving member;

150. a lifting driving member;

200. wafer processing equipment; 201. wafer robot.

Detailed Description

The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings.

In the description of the present application, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium. The meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween.

In the description of the present embodiment, the terms "upper", "lower", and the like are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. The terms "first" and "second" are used merely to distinguish between the descriptions and have no special meaning.

The technical solution of the present application is further described below by means of specific embodiments in conjunction with the accompanying drawings.

The application provides a wafer adsorption device. Referring to fig. 1, the wafer chucking apparatus 100 includes a chuck assembly 110, and as shown in fig. 2 to 5, the chuck assembly 110 includes a chuck 111 and a sealing ring 112, and the sealing ring 112 is disposed on the chuck 111. As shown in fig. 2 and 5, the suction cup 111 is provided with suction holes 1111, and the suction holes 1111 are used for sucking the wafer 101. The sealing ring 112 is disposed around the adsorption hole 1111 to enclose the adsorption hole 1111. Moreover, as shown in fig. 4, the sealing ring 112 protrudes from the suction surface of the suction cup 111, so that the top end of the sealing ring 112 is higher than the suction surface of the suction cup 111, and as shown in fig. 5, when the wafer 101 is placed on the suction cup 111, the wafer 101 is first contacted with the sealing ring 112, and the bottom surface of the wafer 101 is wrapped by the sealing ring 112 due to the gravity of the wafer 101 until the bottom surface of the wafer 101 is contacted and sucked with the suction cup 111.

The above design is particularly suitable for the case where the wafer 101 is slightly deformed and warped. As the packaging technology of the wafer 101 advances, the wafer 101 becomes thin and large in size, so that the packaged wafer 101 is slightly deformed due to the thermal effect during packaging, and warpage occurs, and as shown in fig. 5, the wafer 101 is warped in a smile shape. Due to warpage, the conventional planar carrier has a risk that the wafer 101 cannot be completely adsorbed due to warpage of the wafer 101, and the wafer 101 is lost in vacuum due to incomplete adsorption during the overturning process of the wafer 101. In this embodiment, the sealing ring 112 is deformable by using the soft plasticity of the material of the sealing ring 112, so that the bottom of the wafer 101 can be wrapped and the wafer 101 can be firmly adsorbed.

In one embodiment, as shown in FIG. 2, the suction cup 111 includes a connection portion 1112 and a cup body 1113. The tray 1113 is provided at one end of the connection portion 1112. The adsorption hole 1111 is provided on the tray 1113. As shown in fig. 4, a vacuum flow passage 11121 is provided in the connection portion 1112, and the vacuum flow passage 11121 communicates with the adsorption hole 1111. As shown in fig. 4, the vacuum flow path 11121 is connected to an external vacuum apparatus through the joint 113, and the suction hole 1111 is connected to the vacuum flow path 11121, so that the external vacuum apparatus can vacuum the suction hole 1111 through the vacuum flow path 11121 to suck the wafer 101 through the suction hole 1111. The suction cup 111 is designed to include a connection 1112 and a tray body 1113 to facilitate placement of the vacuum flow path 11121 to facilitate connection of the suction cup 111 to an external vacuum apparatus.

In one embodiment, as shown in fig. 2, the adsorption holes 1111 are disposed in the middle of the tray 1113, and the sealing ring 112 is disposed at the edge of the tray 1113, so that the sealing ring 112 encloses all the adsorption holes 1111 on the tray 1113 in the sealing ring 112, thereby improving the adsorption effect.

Referring to fig. 2 and 3, the suction cup 111 may further be provided with a suction groove 1114, the suction groove 1114 is communicated with the suction hole 1111, as shown in fig. 4, the suction hole 1111 is arranged substantially along a vertical direction, one end of the suction hole 1111 is communicated with the vacuum flow channel 11121, and the other end of the suction hole 1111 is communicated with a bottom of the suction groove 1114. The adsorption grooves 1114 are arranged to adsorb the wafer 101, so that the adsorption area can be increased, and the adsorption effect can be improved. When the suction cup 111 is provided with the suction groove 1114, the seal ring 112 is surrounded around the suction groove 1114. A plurality of adsorption grooves 1114 and adsorption holes 1111 may be provided.

As shown in fig. 2 and 3, the disc body 1113 of the suction disc 111 is circular, and the seal ring 112 is annular. The suction cup assembly 110 further includes a pressure plate 114, the pressure plate 114 being disposed against the inner race of the seal ring 112, thereby securing the seal ring 112 to the cup 1113. The platen 114 may also be annular in shape. As shown in fig. 4, the outer ring of the sealing ring 112 is bowl-shaped, so that the outer ring of the sealing ring 112 extends upward and outward to support the bottom of the wafer 101. As shown in fig. 4, the disc 1113 may be provided with a mounting groove for mounting the seal ring 112, and the seal ring 112 is mounted in the mounting groove.

In one embodiment, as shown in fig. 1, the wafer suction apparatus 100 further includes a drop prevention component 120. As shown in fig. 1, the drop prevention assembly 120 is disposed at both sides, e.g., left and right sides, of the suction cup assembly 110. Referring to fig. 1 and 6, the drop prevention assembly 120 includes an opening and closing driving member 121 and a drop prevention member 122. The falling preventing member 122 is connected with the opening and closing driving member 121, and the opening and closing driving member 121 can drive the falling preventing member 122 to be close to or far away from the sucker assembly 110. As shown in fig. 1, an anti-falling groove 1221 is formed on one side, close to the suction cup assembly 110, of the anti-falling member 122, as shown in fig. 8, when the anti-falling member 122 is close to the suction cup assembly 110, the edge of the wafer 101 on the suction cup assembly 110 stretches into the anti-falling groove 1221, the anti-falling member 122 wraps the edges of the two ends of the wafer 101, and once the wafer 101 is adsorbed and not tightly fallen, the wafer 101 falls into the anti-falling groove 1221 and cannot be directly crashed into a machine, so that the wafer 101 is prevented from being damaged; as shown in fig. 7, when the anti-falling member 122 is far away from the chuck assembly 110, the wafer 101 is separated from the anti-falling groove 1221, and at this time, the loading and unloading operations can be performed, so as to avoid the interference of the anti-falling member 122 to loading and unloading of the wafer 101. The opening and closing driving member 121 may employ an air cylinder.

In one embodiment, as shown in fig. 8 and 9, the dimensions of the anti-drop slot 1221 are larger than the dimensions of the portion of the wafer 101 that extends into the anti-drop slot 1221 such that the anti-drop slot 1221 does not contact the wafer 101. That is, the anti-falling groove 1221 only wraps the wafer 101 in the anti-falling groove 1221, and is not actually contacted with the edge of the wafer 101, so that the wafer 101 is prevented from being scratched by the anti-falling groove 1221, and the anti-falling groove 1221 wraps the wafer 101, so that the wafer 101 can be fallen in the anti-falling groove 1221 when falling. The dimensions herein refer to dimensions in all directions, that is, the anti-drop grooves 1221 in all directions have a gap with the wafer 101, and the bottoms and walls of the anti-drop grooves 1221 do not contact the wafer 101. In other embodiments, the dimensions of the drop-off prevention groove 1221 may be substantially the same as the wafer 101, without limitation.

In an embodiment, as shown in fig. 6, the falling preventing member 122 is a falling preventing rod, one end of the falling preventing rod is connected to the opening and closing driving member 121, and the other end of the falling preventing rod is provided with a falling preventing groove 1221. As shown in fig. 6, the drop prevention groove 1221 is provided on the inner side of the drop prevention lever, that is, on the side of the drop prevention lever near the wafer 101, and the notch of the drop prevention groove 1221 faces the wafer 101. The falling-off prevention rod is adopted as the falling-off prevention piece 122, so that the structure is simple and the installation is convenient.

As shown in fig. 1, the wafer chucking apparatus 100 may further include a mounting base 130. The suction cup assembly 110 and the anti-drop assembly 120 are both disposed on the mount 130. As shown in fig. 6, the drop bar (drop member 122) is generally L-shaped, including a first edge 1222 and a second edge 1223 perpendicular to each other. The first edge 1222 is parallel to the mounting base 130, and the first edge 1222 is slidably connected to the mounting base 130, and the first edge 1222 is connected to the opening/closing driving element 121. The second side 1223 is perpendicular to the mounting base 130, and the second side 1223 is provided with a drop preventing groove 1221. The anti-falling rod is designed into an L shape, so that the anti-falling rod is connected with the base by a longer section (namely, the first edge 1222), the anti-falling rod is conveniently connected onto the base through the sliding rail and sliding block structure 123, and the stability of the anti-falling rod during moving is enhanced.

Further, as shown in FIG. 6, the drop prevention assembly 120 may also include a connection block 124. The connection block 124 is disposed along a vertical direction, a top end of the connection block 124 is connected to the first edge 1222, and a bottom end of the connection block 124 is connected to the opening and closing driving member 121. The opening and closing driving member 121 adopts a cylinder, and the bottom end of the connecting block 124 is connected with the piston of the cylinder. In the embodiment of the application, the connecting block 124 is provided to connect the falling preventing rod ((falling preventing member 122) and the opening and closing driving member 121, so that the falling preventing rod and the opening and closing driving member 121 can be staggered in the vertical direction, and installation space is saved.

In one embodiment, as shown in fig. 10, the wafer chucking apparatus 100 further includes a rotation driving member 140. The mounting base 130 is connected to a rotation driving member 140, and referring to fig. 6 and 10, the rotation driving member 140 can drive the mounting base 130 to rotate about the horizontal rotation axis 102, so that the chuck assembly 110 and the anti-drop assembly 120 are turned over, that is, the wafer 101 on the chuck assembly 110 is turned over. The rotary driving member 140 may employ a rotary cylinder.

Further, as shown in fig. 10, the wafer chuck 100 may further include a lift driving member 150. The rotation driving member 140 is connected to an output end of the elevation driving member 150, so that the elevation driving member 150 can drive the rotation driving member 140 to elevate, that is, the mounting base 130, the chuck assembly 110 and the drop prevention assembly 120 to elevate, thereby driving the wafer 101 to elevate. The lifting driving member 150 may be a motor screw rod structure, a linear motor, a cylinder or other linear driving member.

In this embodiment, the working steps of the wafer adsorption apparatus 100 include:

the suction surface of the suction cup 111 faces upwards, and the opening and closing driving piece 121 of the falling preventing assembly 120 drives the falling preventing piece 122 to open;

as shown in fig. 10, the wafer robot 201 places the wafer 101 on the chuck 111 of the chuck assembly 110, the wafer 101 contacts the sealing ring 112 on the chuck 111, the sealing ring 112 wraps the bottom surface of the wafer 101 until the bottom surface of the wafer 101 contacts the chuck 111, and the chuck 111 vacuum-sucks the wafer 101;

the opening and closing driving piece 121 of the falling preventing assembly 120 drives the falling preventing piece 122 to be folded, the wafer 101 stretches into the falling preventing groove 1221 on the falling preventing piece 122, and the falling preventing piece 122 wraps the wafer 101;

the wafer manipulator 201 retreats, the rotary driving piece 140 drives the mounting seat 130 to rotate 180 degrees around the horizontal rotating shaft 102, and the mounting seat 130 drives the sucker assembly 110 and the anti-drop assembly 120 to synchronously rotate, so that the wafer 101 is turned over, and the adsorption surface of the sucker 111 faces downwards;

after the wafer 101 is turned over, the back surface of the wafer 101 faces upwards, and the back surface of the wafer 101 is processed;

after the processing is completed, the wafer manipulator 201 extends to the lower part of the wafer 101 to catch the wafer 101; breaking vacuum by the suction cup 111 to loosen the wafer 101, and simultaneously starting vacuum suction by suction nozzles on the wafer manipulator 201 to suck the wafer 101; the opening and closing driving member 121 of the falling preventing assembly 120 drives the falling preventing member 122 to be opened; the wafer robot 201 removes the wafer 101.

The embodiment of the application also discloses wafer processing equipment. As shown in fig. 10, the wafer processing apparatus 200 includes the above-described wafer chucking apparatus 100. Since the wafer processing apparatus 200 in the embodiment of the present application includes the wafer adsorption device 100, at least the beneficial effects of the wafer adsorption device 100 are provided, and the detailed description is not repeated here.

It is apparent that the above examples of the present application are merely illustrative examples of the present application and are not limiting of the embodiments of the present application. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the application. It is not necessary here nor is it exhaustive of all embodiments. Any modifications, equivalent substitutions, improvements, etc. that fall within the spirit and principles of the present application are intended to be included within the scope of the claims of this application.

Claims

1. The wafer adsorption device is characterized by comprising a sucker assembly, wherein the sucker assembly comprises a sucker and a sealing ring, the sealing ring is arranged on the sucker, an adsorption hole is formed in the sucker and used for adsorbing a wafer, the sealing ring is arranged around the adsorption hole in a surrounding mode, and the sealing ring protrudes out of an adsorption surface of the sucker.

2. The wafer suction device according to claim 1, wherein the suction cup comprises a connection portion and a disk body, the disk body is disposed at one end of the connection portion, the suction hole is disposed on the disk body, a vacuum flow passage is disposed in the connection portion, and the vacuum flow passage is communicated with the suction hole.

3. The wafer adsorbing device as set forth in claim 2, wherein said adsorbing hole is provided at a middle position of said tray body, and said sealing ring is provided at an edge of said tray body.

4. The wafer chucking apparatus of claim 1, further comprising:

5. The wafer chucking apparatus of claim 4, wherein said drop-prevention groove has a size greater than a size of a portion of said wafer extending into said drop-prevention groove so that said drop-prevention groove does not contact said wafer.

6. The wafer adsorbing device as set forth in claim 4, wherein the drop preventing member is a drop preventing lever, one end of the drop preventing lever is connected to the opening and closing driving member, and the other end of the drop preventing lever is provided with the drop preventing groove.

7. The wafer chucking apparatus of claim 6, further comprising a mounting base, wherein said chuck assembly and said anti-drop assembly are both disposed on said mounting base;

8. The wafer chucking apparatus of claim 7, wherein the anti-drop assembly further comprises:

9. The wafer chucking apparatus of claim 4, further comprising:

10. Wafer processing apparatus comprising a wafer adsorption device according to any one of claims 1 to 9.