CN218974383U - Automatic control device for electroplating liquid - Google Patents
Automatic control device for electroplating liquid Download PDFInfo
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- CN218974383U CN218974383U CN202223133077.5U CN202223133077U CN218974383U CN 218974383 U CN218974383 U CN 218974383U CN 202223133077 U CN202223133077 U CN 202223133077U CN 218974383 U CN218974383 U CN 218974383U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model discloses an automatic electroplating liquid control device, which comprises: the utility model provides an automatic electroplating liquid management and control device capable of automatically sampling, automatically detecting, automatically adding and automatically uploading data.
Description
Technical Field
The utility model relates to the field of semiconductor electroplating, in particular to an automatic electroplating liquid management and control device.
Background
Electroplating refers to the deposition of a plating layer on the surface of a frame by electrochemical principles. Is an important process in the manufacturing process of semiconductor integrated circuits, so parameters such as components, concentration and the like of the electroplating solution are critical to the quality of the plating layer.
At present, concentration control of electroplating liquid is detected and controlled through a laboratory, firstly, manual sampling is needed, then data of each control project are detected manually, then the addition amount required by adjustment is calculated by a computer according to the control target value of each project, finally, various liquid medicines are added into an electroplating tank manually, production can be started after uniform mixing is achieved, and data recording and storing work is needed.
The following disadvantages are mainly present:
1. manual sampling is time-consuming and laborious, and the plating solution is corrosive and is at risk of contact with the skin. Different electroplating solutions have different temperature use requirements, when the manual sampling is detected, the temperature of the electroplating solution is changed, the detected concentration is also influenced, and residual electroplating solution in a part of pipelines needs to be discharged before sampling, so that detection data is prevented from being influenced.
2. When manual detection is performed, a large amount of standard solution needs to be prepared in advance, pretreatment work is performed on a sample, and human errors exist in sampling, so that a final detection result can be influenced to a certain extent.
3. When the liquid medicine is manually added, each component is pumped into the tank by the electric pump, the electroplating machine is required to be stopped for production during addition, then the addition is carried out, the circulation is required to be sufficient after the addition is finished, the corresponding item is detected again, the continuous production of the data can be ensured after the data is within the control range, the addition period is long, and the production is influenced by the suspension of the production.
4. When the data is recorded, manual operation is needed, different projects need to be recorded, the data is firstly recorded to a local archive and then uploaded to an SPC system, and the time and the labor are wasted after repeated data recording work.
Disclosure of Invention
In order to solve the problems, the utility model aims to provide an automatic electroplating liquid management and control device capable of automatically sampling, automatically detecting, automatically adding and automatically uploading data.
According to an aspect of the present utility model, there is provided an automatic plating liquid control apparatus comprising: electroplating liquid groove, circulating pump subassembly, filter core jar subassembly, automatic analysis subassembly and fluid replacement subassembly, electroplating liquid groove connect circulating pump subassembly, and circulating pump subassembly connects filter core jar subassembly, connects filter core jar subassembly to connect automatic analysis subassembly and electroplating liquid groove, and the fluid replacement subassembly is connected electroplating liquid groove, and automatic analysis subassembly and fluid replacement subassembly are connected a set of electroplating liquid groove, circulating pump subassembly and filter core jar subassembly at least. The electroplating liquid is pumped by a circulating pump for analysis, and the electroplating liquid fed in the liquid supplementing assembly is simultaneously refluxed to the electroplating liquid tank; analyzing and recording the extracted electroplating liquid by utilizing an automatic analysis component, and simultaneously controlling a liquid supplementing component to add a proper amount of liquid supplementing, so as to realize the function of uploading data and automatically managing and controlling the electroplating liquid; the electroplating solution is filtered by the filter element tank assembly, and the flow of the inlet water of the automatic analysis assembly is regulated.
In some embodiments, the circulation pump assembly includes a first drain pipe connecting the circulation pump and the electroplating bath, a circulation pump, and a second drain pipe connecting the circulation pump and the cartridge tank assembly. The electroplating liquid tank and the filter element tank are connected through the pipeline to form a filtering circulation through the circulating pump, so that the electroplating liquid can be conveniently added and analyzed.
In some embodiments, the cartridge tank assembly comprises: the device comprises a filter element tank, a flow regulating valve, a third liquid outlet pipe and a fourth liquid outlet pipe, wherein the third liquid outlet pipe is connected with the filter element tank and the electroplating liquid tank, and the fourth liquid outlet pipe is connected with an automatic analysis component and a liquid supplementing component and finally flows back to the electroplating liquid tank. The electroplating solution flowing through the filter element tank is necessarily filtered, and the flow of the inlet liquid of the automatic analysis component is regulated through the flow regulating valve.
In some embodiments, a second outlet pipe connects the circulation pump and the cartridge tank. The circulating pump and the filter element tank are communicated through the second liquid outlet pipe, so that the circulation of the electroplating liquid is realized.
In some embodiments, the automated analysis component comprises: the liquid filling device comprises a fifth liquid outlet pipe, a liquid filling device and a plating solution analyzer, wherein one end of the fifth liquid outlet pipe is communicated with a fourth liquid outlet pipe, the other end of the fifth liquid outlet pipe is communicated with the liquid filling device, and the liquid filling device is connected with at least one plating solution analyzer. And extracting the electroplating liquid in the electroplating liquid tank to an electroplating liquid analyzer through a fifth liquid outlet pipe and a liquid filling device for detection analysis, and then transmitting the obtained data to a control computer for data recording and analysis by the electroplating liquid analyzer.
In some embodiments, the fluid replacement assembly comprises: peristaltic pump, fluid infusion bucket and sixth drain pipe, peristaltic pump intercommunication fluid infusion bucket, the output of peristaltic pump passes through sixth drain pipe and connects fourth drain pipe, and the access point of sixth drain pipe on fourth drain pipe is located the rear of the access point of fifth drain pipe on fourth drain pipe. And the peristaltic pump is used for supplementing the electroplating liquid in the liquid supplementing barrel to the fourth liquid outlet pipe, so that the electroplating liquid flows back to the electroplating liquid tank, and the components of the electroplating liquid are ensured.
In some embodiments, the liquid filler and plating solution analyzer are connected to a control computer, the control computer is connected to and controls the peristaltic pump to operate or stop, and the control computer controls the liquid filler to operate or stop. The control computer realizes the record analysis of the analysis data of the electroplating liquid, and the peristaltic pump is controlled by calculation to pump the corresponding electroplating liquid replenishing liquid to be injected into the four liquid outlet pipes, and then the electroplating liquid is refluxed into the electroplating liquid tank, so as to adjust Chen Fen or concentration of the electroplating liquid.
In some embodiments, the peristaltic pump, the fluid-filled barrel, and the sixth outlet tube are each provided with multiple sets. The control computer, the fluid supplementing assembly and the automatic analysis assembly are conveniently connected with one or more pipelines of the electroplating liquid tanks, so that the efficiency is improved.
Compared with the prior art, the utility model has the beneficial effects of automatic sampling, automatic detection, automatic addition and automatic data uploading of the structure; the utility model comprises: 1. the on-line analyzer directly samples from analysis circulation without manual sampling, saves time and labor, avoids the risk of direct contact with the electroplating solution, ensures that the liquid in the circulation pipeline flows in real time, and ensures the consistency of detection sampling and the electroplating solution in the electroplating tank;
2. the on-line analyzer samples through the automatic liquid feeder, is more accurate than manual sampling, automatically pre-processes the incoming line of the sample after sampling, automatically analyzes the concentration of each component, saves labor and has small analysis error;
3. after the concentration of each component of the electroplating solution is detected by the online analyzer, the addition amount of each component can be automatically calculated according to a set formula, and then the components are accurately and slowly added into a liquid inlet pipeline through a peristaltic pump, and are added into the electroplating bath along with the analysis cycle, and the components are added and circulated, so that the influence on the electroplating solution is small, manual addition is not needed, and the wrong liquid addition is avoided;
4. the online analyzer has a data uploading function, and can automatically upload data to the SPC system after detection is completed without manual uploading by personnel.
Drawings
FIG. 1 is a schematic view of an automatic electroplating liquid control device.
Detailed Description
The present utility model will be described in detail below with reference to the embodiments shown in the drawings, but it should be understood that the embodiments are not limited to the utility model, and equivalent changes or substitutions of functions, methods or structures according to the embodiments by those skilled in the art are included in the scope of the present utility model.
In the description of the present utility model, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, mechanically or electrically connected, may be in communication with each other between two elements, may be directly connected, or may be indirectly connected through an intermediate medium, and the specific meaning of the terms may be understood by those skilled in the art according to circumstances.
As shown in fig. 1, the automatic electroplating liquid control device of the present utility model comprises: electroplating solution groove 1, circulating pump subassembly 2, filter core jar subassembly 3, automatic analysis subassembly 4 and fluid replacement subassembly 5, electroplating solution groove 1 connects circulating pump subassembly 2, and filter core jar subassembly 3 is connected to circulating pump subassembly 2, connects filter core jar subassembly 3 to connect automatic analysis subassembly 4 and electroplating solution groove 1, and electroplating solution replacement subassembly 5 connects electroplating solution groove 1, and automatic analysis subassembly 4 and fluid replacement subassembly 5 connect a set of electroplating solution groove 1 at least, circulating pump subassembly 2 and filter core jar subassembly 3. The plating solution is pumped by the circulating pump 22 for analysis and the plating solution fed in the solution feeding module 5 is simultaneously fed back to the plating solution tank 1; the automatic analysis component 4 is utilized to analyze and record the extracted electroplating liquid, and meanwhile, the liquid supplementing component 5 is controlled to add a proper amount of liquid supplementing, so that the function of uploading data is realized, and the electroplating liquid is automatically managed and controlled; the electroplating solution is filtered by the filter element tank assembly 3, and the flow rate of the inlet solution of the automatic analysis assembly 4 is regulated.
The method is concretely implemented as follows:
the electroplating solution in the electroplating solution tank 1 is pumped out by the circulating pump 22 through the first liquid outlet pipe 21, is pumped into the filter element tank 31 from the second liquid outlet pipe 23 for filtering, the filtered electroplating solution is divided into two paths, one path is pumped back into the electroplating solution tank 1 through the third liquid outlet pipe 33 to form filtering circulation, the other path is connected to the liquid inlet of the automatic analysis assembly 4 through the fourth liquid outlet pipe 34 after the flow rate of the electroplating solution is regulated by the flow rate regulating valve 32, and then the liquid outlet of the liquid supplementing assembly 5 is connected with the liquid inlet of the electroplating solution tank 1.
The automatic analysis assembly 4, the fluid replacement assembly 5 and the control computer 6 may be considered as a whole. That is to say, the automatic analysis component 4, the fluid infusion component 5 and the control computer 6 can be provided with one group, and can be connected with a plurality of groups of electroplating liquid tanks 1, the circulating pump component 2 and the filter element tank component 3, so that the production efficiency is improved.
The circulating pump assembly 2 comprises a first liquid outlet pipe 21, a circulating pump 22 and a second liquid outlet pipe 23, wherein the first liquid outlet pipe 21 is connected with the circulating pump 22 and the electroplating liquid tank 1, and the second liquid outlet pipe 23 is connected with the circulating pump 22 and the filter element tank assembly 3. The three parts of the electroplating liquid tank 1 and the filter element tank 31 are connected through pipelines to form a filtering circulation through the circulating pump 22, so that the electroplating liquid can be conveniently added and analyzed.
The cartridge tank assembly 3 includes: the automatic analysis device comprises a filter element tank 31, a flow regulating valve 32, a third liquid outlet pipe 33 and a fourth liquid outlet pipe 34, wherein the third liquid outlet pipe 33 is connected with the filter element tank 31 and the electroplating liquid tank 1, and the fourth liquid outlet pipe 34 is connected with the automatic analysis component 4 and the liquid supplementing component 5 and finally flows back to the electroplating liquid tank 1. The flow rate of the incoming liquid to the automatic analyzer unit 4 is regulated by the flow rate regulating valve 32 by necessarily filtering the flowing plating liquid by the cartridge tank 31.
The second liquid outlet pipe 23 connects the circulation pump 22 and the cartridge tank 31. The circulation pump 22 and the filter element tank 31 are communicated through the second liquid outlet pipe 23, so that the circulation of the electroplating solution is realized.
The automatic analysis component 4 comprises: the fifth drain pipe 41, the liquid adding device 42 and the plating solution analyzer 43, one end of the fifth drain pipe 41 is communicated with the fourth drain pipe 34, the other end of the fifth drain pipe 41 is communicated with the liquid adding device 42, and the liquid adding device 42 is connected with at least one plating solution analyzer 43. The plating liquid in the plating liquid tank 1 is extracted to the plating liquid analyzer 43 through the fifth liquid outlet pipe 41 and the liquid filler 42 for detection analysis, and then the plating liquid analyzer 43 transmits the obtained data to the control computer 6 for recording and analysis of the data. The automatic analysis component 4 comprises a liquid feeder 42 and a plating solution analyzer 43, samples by the liquid feeder 42, adjusts the position of a valve to control the liquid feeding direction, sends the plating solution to the corresponding plating solution analyzer 43 for concentration analysis, and then automatically calculates the addition amount of each component by the control computer 6.
The fluid replacement assembly 5 includes: peristaltic pump 51, fluid infusion bucket 52 and sixth drain pipe 53, peristaltic pump 51 intercommunication fluid infusion bucket 52, and the output of peristaltic pump 51 passes through sixth drain pipe 53 and connects fourth drain pipe 34, and the access point of sixth drain pipe 53 on fourth drain pipe 34 is located the rear of the access point of fifth drain pipe 41 on fourth drain pipe 34. The peristaltic pump 51 is used for delivering the plating solution in the solution replenishing barrel 52 to the fourth liquid outlet pipe 34, and then the plating solution is refluxed to the plating solution tank 1, so that the concentration of each component of the plating solution is ensured. According to the calculated addition amount by the control computer 6, the peristaltic pump 51 of the corresponding component is controlled, the liquid medicine in the chemical agent liquid supplementing barrel 52 is added into the sixth liquid outlet pipe 53, and the liquid medicine is pumped back into the electroplating liquid tank 1 along with the analysis cycle.
Since the sixth liquid outlet pipe 53 is added with the replenishing solutions of the various plating liquids at the time of the access point on the fourth liquid outlet pipe 34, if the plating liquid analyzer 43 provided in front of the access point of the fifth liquid outlet pipe 41 on the fourth liquid outlet pipe 34 detects and analyzes the plating liquid to which the replenishing solution is added, the plating liquid replenishing solution can be directly set up as the plating liquid tank 1 only behind the access point of the fifth liquid outlet pipe 41 on the fourth liquid outlet pipe 34.
The liquid filler 42 and the plating liquid analyzer 43 are connected with the control computer 6, the control computer 6 is connected with the peristaltic pump 51 to be operated or stopped, and the control computer 6 controls the liquid filler 42 to be operated or stopped. The control computer 6 realizes the record analysis of the analysis data of the plating solution, and the peristaltic pump 51 is controlled by calculation to pump the corresponding plating solution to supplement the solution and pour the solution into the fourth liquid outlet pipe 34, and then the solution flows back into the plating solution tank 1, so that the composition or concentration of the plating solution is adjusted.
It should be noted that: the minimum flow rate requirement of the plating liquid analyzer 43 is satisfied by adjusting the flow rate of the liquid through the flow rate adjusting valve 32; the circulation pump 22 is operated to circulate the plating solution to the plating solution analyzer 43.
While only certain embodiments of the present utility model have been described, it will be apparent to those skilled in the art that other modifications and improvements can be made without departing from the inventive concept of the present utility model.
Claims (8)
1. Automatic control device of plating solution, its characterized in that includes: electroplating liquid groove, circulating pump subassembly, filter core jar subassembly, automatic analysis subassembly and fluid replacement subassembly, the circulating pump subassembly is connected to the electroplating liquid groove, the filter core jar subassembly is connected to the circulating pump subassembly, connect filter core jar subassembly to connect automatic analysis subassembly and electroplating liquid groove, the fluid replacement subassembly is connected the electroplating liquid groove, automatic analysis subassembly and fluid replacement subassembly connect a set of electroplating liquid groove, circulating pump subassembly and filter core jar subassembly at least.
2. The automatic plating solution control device according to claim 1, wherein the circulating pump assembly comprises a first liquid outlet pipe, a circulating pump and a second liquid outlet pipe, the first liquid outlet pipe is connected with the circulating pump and the plating solution tank, and the second liquid outlet pipe is connected with the circulating pump and the filter element tank assembly.
3. The automatic plating solution management apparatus according to claim 2, wherein said cartridge tank assembly comprises: the automatic electroplating device comprises a filter element tank, a flow regulating valve, a third liquid outlet pipe and a fourth liquid outlet pipe, wherein the third liquid outlet pipe is connected with the filter element tank and the electroplating liquid tank, and the fourth liquid outlet pipe is connected with an automatic analysis component and a liquid supplementing component and finally flows back to the electroplating liquid tank.
4. The apparatus according to claim 3, wherein the second drain pipe connects the circulation pump and the cartridge tank.
5. The automated plating solution management apparatus according to claim 3, wherein said automated analysis assembly comprises: the electroplating device comprises a fifth liquid outlet pipe, a liquid charger and an electroplating liquid analyzer, wherein one end of the fifth liquid outlet pipe is communicated with a fourth liquid outlet pipe, the other end of the fifth liquid outlet pipe is communicated with the liquid charger, and the liquid charger is connected with at least one electroplating liquid analyzer.
6. The automatic plating solution control device according to claim 5, wherein the fluid replacement assembly comprises: peristaltic pump, fluid infusion bucket and sixth drain pipe, peristaltic pump intercommunication fluid infusion bucket, the output of peristaltic pump passes through sixth drain pipe and connects fourth drain pipe, the access point of sixth drain pipe on fourth drain pipe is located the rear of the access point of fifth drain pipe on fourth drain pipe.
7. The automatic plating liquid control device according to claim 6, wherein the liquid filler and the plating liquid analyzer are connected to a control computer, the control computer is connected to and controls the peristaltic pump to operate or stop, and the control computer controls the liquid filler to operate or stop.
8. The automatic electroplating liquid control device according to claim 6, wherein the peristaltic pump, the liquid replenishing barrel and the sixth liquid outlet pipe are all provided with a plurality of groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202223133077.5U CN218974383U (en) | 2022-11-24 | 2022-11-24 | Automatic control device for electroplating liquid |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202223133077.5U CN218974383U (en) | 2022-11-24 | 2022-11-24 | Automatic control device for electroplating liquid |
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| CN218974383U true CN218974383U (en) | 2023-05-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117574296A (en) * | 2023-11-23 | 2024-02-20 | 清远市信和实业有限公司 | Plating bath liquid flow distribution detection system and method thereof |
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- 2022-11-24 CN CN202223133077.5U patent/CN218974383U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117574296A (en) * | 2023-11-23 | 2024-02-20 | 清远市信和实业有限公司 | Plating bath liquid flow distribution detection system and method thereof |
| CN117574296B (en) * | 2023-11-23 | 2024-04-23 | 清远市信和实业有限公司 | Plating bath liquid flow distribution detection system and method thereof |
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