CN218959192U

CN218959192U - Heat radiation structure of circuit board in shell

Info

Publication number: CN218959192U
Application number: CN202223599453.XU
Authority: CN
Inventors: 张真明; 彭文; 罗东文
Original assignee: Shenzhen Julishen Electric Co ltd
Current assignee: Shenzhen Julishen Electric Co ltd
Priority date: 2022-12-27
Filing date: 2022-12-27
Publication date: 2023-05-02
Anticipated expiration: 2032-12-27

Abstract

The utility model discloses a heat radiation structure of a circuit board in a shell, which comprises: the concave heat dissipation bottom shell and the circuit board are provided with a plurality of heating electronic elements. The circuit board is embedded with heat conducting fins which are tightly attached to the heating electronic components in a one-to-one correspondence manner, the heat conducting fins are positioned at the bottoms of the heating electronic components, and two ends of the heat conducting fins penetrate through the circuit board and are tightly attached to the concave heat dissipation bottom shell. The side wall of the concave radiating bottom shell is provided with a plurality of strip-shaped through holes, the top end of the concave radiating bottom shell is provided with a radiating top plate, the radiating top plate is provided with a radiating fan electrically connected with the circuit board, and the radiating fan is positioned right above the circuit board. The utility model has the beneficial effects that: the bottom of the heating electronic element can be directly conducted to the concave heat dissipation bottom shell, the shell of the frequency converter is conducted through the concave heat dissipation bottom shell, and in addition, the heat dissipation fan is adopted for heat dissipation of the side wall and the top of the heating electronic element, so that the omnibearing heat dissipation of the heating electronic element is realized, and the heat dissipation efficiency is greatly improved.

Description

Heat radiation structure of circuit board in shell

Technical Field

The utility model relates to the technical field of heat dissipation of circuit boards, in particular to a heat dissipation structure of a circuit board in a shell.

Background

A circuit board is usually built in a shell of an electric device (such as a frequency converter), and electronic elements with higher heating values are usually arranged on the circuit board, and the untimely discharge of the heat can influence the working performance of the electronic elements, so that the electric device frequently generates faults in the using process. At present, a circuit board of an electric device is generally directly fixed at a plastic clamping position of a shell, or is suspended and fixed through a heat conducting column, so that the heat dissipation performance of the circuit board is poor, and heat emitted by electronic elements with higher heating values cannot be timely discharged.

Disclosure of Invention

Aiming at the problems existing in the prior art, the utility model provides a heat dissipation structure of a circuit board in a shell.

In order to achieve the above object, the heat dissipation structure of a circuit board in a shell according to the present utility model includes: the concave heat dissipation bottom shell and the circuit board fixed in the concave heat dissipation bottom shell are provided with a plurality of heating electronic elements. The circuit board is embedded with heat conducting fins which are tightly attached to the heating electronic components in a one-to-one correspondence manner, the heat conducting fins are positioned at the bottoms of the heating electronic components, and two ends of the heat conducting fins penetrate through the circuit board and are tightly attached to the concave heat dissipation bottom shell. The side wall of the concave radiating bottom shell is provided with a plurality of strip-shaped through holes, the top end of the concave radiating bottom shell is provided with a radiating top plate, the radiating top plate is provided with a radiating fan electrically connected with the circuit board, and the radiating fan is positioned right above the circuit board.

Preferably, the concave heat dissipation bottom shell and the circuit board are both disc-shaped, and the heat dissipation fan is located right above the circuit board.

Preferably, the plurality of strip-shaped through holes are uniformly arranged along the circumferential direction of the side wall of the concave heat dissipation bottom shell.

Preferably, a heat conductive gel layer is provided between the bottom of the heat conductive sheet and the circuit board.

Preferably, the bottom end surface of the circuit board is provided with a containing groove, and two ends of the heat conducting fin are pressed in the containing groove by the concave heat dissipation bottom shell.

Preferably, the concave heat dissipation bottom shell, the heat conduction sheet and the heat dissipation top plate are all processed by adopting aluminum materials.

Preferably, the top of the heat dissipation top plate is integrally connected with a plurality of heat dissipation fins.

Compared with the prior art, the utility model has the beneficial effects that: the heat conduction structure can conduct heat to the bottom of the heating electronic element directly to the concave heat dissipation bottom shell, conduct heat to the shell of the frequency converter through the concave heat dissipation bottom shell and dissipate heat to the outside, and in addition, the heat dissipation fans are adopted for the side wall and the top of the heating electronic element to dissipate heat, so that the omnibearing heat dissipation of the heating electronic element is realized, and the heat dissipation efficiency is greatly improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a cross-sectional structural view of an embodiment of the present utility model.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The utility model provides a heat dissipation structure of a circuit board in a shell.

Referring to fig. 1, fig. 1 is a cross-sectional structural view of an embodiment of the present utility model.

As shown in fig. 1, in an embodiment of the present utility model, the heat dissipation structure of the circuit board in the case includes: the concave heat dissipation bottom shell 1 and the circuit board 2 fixed in the concave heat dissipation bottom shell 1 are provided with a plurality of heating electronic elements 3. The circuit board 2 is embedded with the conducting strip 4 that pastes closely with a plurality of heating electronic component 3 one-to-one, and the conducting strip 4 is located the bottom of heating electronic component 3, and the both ends of conducting strip 4 pass circuit board 2 and paste closely with spill heat dissipation drain pan 1 to the realization is with the heat of heating electronic component 3 bottom to spill heat dissipation drain pan 1 through conducting strip 4 conduction, is again conducted to the converter casing by spill heat dissipation drain pan 1, dispels the heat to the external world again. The bottom of the heat conducting fin 4 and the circuit board 2 are provided with the heat conducting gel layer 5, when the heat conducting fin 4 is assembled, the heat conducting fin 4 is guaranteed to be higher than the circuit board 2, and then the heat generating electronic element 3 is pressed to a welding surface when the heat generating electronic element 3 is soldered, so that the bottom of the heat generating electronic element 3 can be guaranteed to be clung to the heat conducting fin 4, and the heat conducting performance is guaranteed. The contact area of the heat conductive sheet 4 and the bottom of the heat generating electronic component 3 is smaller than the bottom area of the heat generating electronic component 3 so as to ensure that there is a sufficient soldering surface between the heat generating electronic component 3 and the circuit board 2. Be equipped with a plurality of bar through-holes 6 on the lateral wall of spill heat dissipation drain pan 1, the top of spill heat dissipation drain pan 1 is equipped with heat dissipation roof 7, is equipped with on the heat dissipation roof 7 with circuit board 2 electric connection's radiator fan 8, and radiator fan 8 is located circuit board 2 directly over, and radiator fan 8 heat dissipation is adopted at the lateral wall and the top of heating electronic component 3 to the omnidirectional heat dissipation to heating electronic component 3 has been realized, and the radiating efficiency improves greatly.

The concave heat dissipation bottom shell 1 and the circuit board 2 are disc-shaped, and the heat dissipation fan 8 is positioned right above the circuit board 2, so that the heat dissipation airflow path of each electronic element through the heat dissipation fan 8 is shorter, and the heat dissipation efficiency is higher. The plurality of strip-shaped through holes 6 are uniformly arranged along the circumferential direction of the side wall of the concave heat dissipation bottom shell 1, so that heat dissipation airflow more uniformly passes through the side wall and the top of each heating electronic element 3. The bottom end face of the circuit board 2 is provided with a containing groove, and two ends of the heat conducting fin 4 are pressed in the containing groove by the concave heat dissipation bottom shell 1, so that the concave heat dissipation bottom shell 1 can be contacted with the bottoms of the heat conducting fin 4 and the circuit board 2, and overall heat conducting efficiency is improved.

The concave heat dissipation bottom shell 1, the heat conduction sheet 4 and the heat dissipation top plate 7 are all processed by adopting aluminum materials so as to ensure heat dissipation performance. The top of the heat dissipation top plate 7 is integrally connected with a plurality of heat dissipation fins 9 so as to further improve the heat dissipation performance of the heat dissipation top plate 7.

Compared with the prior art, the utility model has the beneficial effects that: the heat conduction structure can conduct heat to the bottom of the heating electronic element 3 directly to the concave heat dissipation bottom shell 1, conduct heat to the shell of the frequency converter through the concave heat dissipation bottom shell 1 and dissipate heat to the outside, and in addition, the heat dissipation fan 8 is adopted for heat dissipation to the side wall and the top of the heating electronic element 3, so that the omnibearing heat dissipation of the heating electronic element 3 is realized, and the heat dissipation efficiency is greatly improved.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims

1. A heat dissipation structure for a circuit board within a housing, comprising: the heat dissipation device comprises a concave heat dissipation bottom shell and a circuit board fixed in the concave heat dissipation bottom shell, wherein a plurality of heating electronic elements are arranged on the circuit board; the circuit board is embedded with heat conducting fins which are tightly attached to the heating electronic components in a one-to-one correspondence manner, the heat conducting fins are positioned at the bottom of the heating electronic components, and two ends of the heat conducting fins penetrate through the circuit board and are tightly attached to the concave heat dissipation bottom shell; the side wall of the concave radiating bottom shell is provided with a plurality of strip-shaped through holes, the top end of the concave radiating bottom shell is provided with a radiating top plate, the radiating top plate is provided with a radiating fan electrically connected with the circuit board, and the radiating fan is positioned right above the circuit board.

2. The heat dissipating structure of the circuit board in the case of claim 1, wherein the concave heat dissipating bottom case and the circuit board are both disc-shaped, and the heat dissipating fan is located directly above the circuit board.

3. The heat dissipating structure of the circuit board in the case of claim 2, wherein the plurality of strip-shaped through holes are uniformly arranged along the circumferential direction of the side wall of the concave heat dissipating bottom case.

4. The heat dissipating structure of the circuit board in a housing of claim 1, wherein a layer of thermally conductive gel is disposed between the bottom of the thermally conductive sheet and the circuit board.

5. The heat dissipating structure of the circuit board in a housing of claim 1, wherein a receiving groove is provided on a bottom end surface of the circuit board, and both ends of the heat conductive sheet are pressed in the receiving groove by the concave heat dissipating bottom shell.

6. The heat dissipating structure of the circuit board in the shell according to claim 1, wherein the concave heat dissipating bottom shell, the heat conducting fin and the heat dissipating top plate are all made of aluminum materials.

7. The heat dissipating structure of the circuit board in a housing as recited in any one of claims 1 to 6, wherein a plurality of heat dissipating fins are integrally connected to a top of the heat dissipating top plate.