CN218951544U - Wafer hanging type electroplating cathode clamp - Google Patents
Wafer hanging type electroplating cathode clamp Download PDFInfo
- Publication number
- CN218951544U CN218951544U CN202223555697.8U CN202223555697U CN218951544U CN 218951544 U CN218951544 U CN 218951544U CN 202223555697 U CN202223555697 U CN 202223555697U CN 218951544 U CN218951544 U CN 218951544U
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- Prior art keywords
- wafer
- base
- annular electrode
- electroplating
- electroplating cathode
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- 238000009713 electroplating Methods 0.000 title claims abstract description 44
- 239000000872 buffer Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000003139 buffering effect Effects 0.000 claims abstract description 3
- 230000008569 process Effects 0.000 abstract description 9
- 238000005299 abrasion Methods 0.000 abstract description 4
- 230000035772 mutation Effects 0.000 abstract description 4
- 230000008859 change Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 68
- 238000007747 plating Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
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- Electrodes Of Semiconductors (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides a wafer hanging type electroplating cathode clamp which comprises a base and an annular electrode, wherein the annular electrode is arranged on the base and can be covered on one side of the base; the device further comprises a buffer part, wherein the buffer part is arranged between the base and the annular electrode and is used for buffering the pressure of the annular electrode covered on the base. According to the wafer hanging type electroplating cathode clamp, the buffer part is arranged to be matched with the base to clamp a wafer in the process of clamping the wafer, the buffer part and the base are in contact with the annular electrode, and the pressure between the base and the annular electrode is buffered, so that the pressure change born by the wafer is smoother, and the wafer is prevented from being damaged due to the fact that the pressure mutation is large. The anti-sticking groove is arranged, so that a gap is reserved between the base and the contact surface of the wafer, the base and one surface of the wafer are prevented from being completely attached, the wafer is conveniently taken down from the base after being coated with the film, and the wafer is prevented from being adsorbed on the base to cause difficult taking down or cause larger abrasion to the wafer.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a wafer hanging type electroplating cathode clamp.
Background
In the modern semiconductor wafer manufacturing process, electroplating is a commonly used metal electrode manufacturing method, and common metal electrodes such as gold, copper, aluminum and the like can be processed and produced through an electroplating process. The electroplating process has the technical advantages of low cost, high productivity, mature process and the like, is widely applied to the semiconductor electronic industry and similar related industries, has the advantages of maximum production productivity, highest equipment utilization and the like of vertical hanging type electroplating in a plurality of metal electroplating methods, and is the electroplating scheme most widely used in industry.
The publication number is CN110387571A, which discloses an electroplating clamp for an electroplating device, wherein the electroplating clamp is used for fixing a wafer by locking an upper cover, but because a pressing structure is a rigid structure, in the pressing process, the situation that the edge of the wafer is damaged due to overlarge pressure during pressing exists, so that the yield of the wafer is reduced, and raw materials are wasted.
Disclosure of Invention
In view of the above, the present utility model provides a wafer hanging type electroplating cathode fixture, which buffers the pressure applied to the wafer by a buffer component in the fixture, so as to improve the stability of the wafer, thereby greatly reducing the probability of wafer damage.
The technical scheme of the utility model is realized as follows: the utility model provides a wafer hanging type electroplating cathode fixture, which comprises a base and an annular electrode, wherein,
the annular electrode is arranged on the base and can be covered on one side of the base, and the annular electrode and the base are used for clamping a wafer;
and also comprises a buffer part, wherein,
the buffer part is arranged between the base and the annular electrode and is used for buffering the pressure of the annular electrode covered on the base.
On the basis of the technical scheme, preferably, the annular electrode is provided with a lug and is hinged with the base through the lug.
On the basis of the technical scheme, preferably, the annular electrode is provided with an electroplating port for electroplating by contacting the electroplating liquid with the wafer.
On the basis of the technical scheme, the wafer protection device preferably further comprises a protection part, wherein the protection part is arranged on the annular electrode and is used for protecting the wafer.
Further preferably, the guard portion is provided in a grid shape.
On the basis of the above technical scheme, preferably, the base is provided with an anti-sticking groove, and the anti-sticking groove is positioned on one side of the base facing the annular electrode and is used for preventing the wafer from being completely stuck on the base.
Further preferably, the anti-sticking groove is arranged in a circular ring shape.
On the basis of the technical scheme, preferably, the buffer part is an elastic rubber backing ring.
Compared with the prior art, the wafer hanging type electroplating cathode clamp has the following beneficial effects:
(1) Through setting up the buffer unit at the in-process that annular electrode cooperation base pressed from both sides tight wafer, buffer unit and base and annular electrode contact to the pressure between buffer base and the annular electrode makes the pressure variation that the wafer receives smoother, avoids the pressure mutation great to lead to the wafer to produce the damage.
(2) The anti-sticking groove is arranged, so that a gap is reserved between the base and the contact surface of the wafer, the base and one surface of the wafer are prevented from being completely attached, the wafer is conveniently taken down from the base after being coated with the film, and the wafer is prevented from being adsorbed on the base to cause difficult taking down or cause larger abrasion to the wafer.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view of a wafer-mounted electroplating cathode fixture of the present utility model;
FIG. 2 is a schematic view of the annular electrode cover of the wafer-mounted electroplating cathode fixture of the present utility model.
Detailed Description
The following description of the embodiments of the present utility model will clearly and fully describe the technical aspects of the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, are intended to fall within the scope of the present utility model.
As shown in fig. 1-2, the wafer hanging type electroplating cathode clamp of the utility model comprises a base 1, a ring electrode 2 and a buffer part 3.
The whole base 1 is made of insulating and corrosion-resistant materials, can be made of plastic materials, and is preferably engineering plastic, the base 1 has the functions of supporting and fixing wafers, the whole shape of the base 1 is a disc, and the size of the base is larger than that of the wafers to be installed.
The whole annular electrode 2 is flat ring-shaped, it installs on base 1 to can move about on base 1, through removing annular electrode 2, can cover to one side of base 1 on, thereby fix the wafer centre gripping between annular electrode 2 and base 1, in the fixed in-process of centre gripping, one side of annular electrode 2 and the outer lane contact of wafer, thereby make output current distribution even, guarantee electroplating film thickness homogeneity, improve the quality of wafer electroplating, it is noted that the material that annular electrode 2 adopted needs to be unanimous with the required metal of wafer coating film, conventional electroplated metal has gold, tin, copper, nickel etc..
The buffer part 3 is arranged between the base 1 and the annular electrode 2, and in the process that the annular electrode 2 is matched with the base 1 to clamp the wafer, the buffer part 3 and the base 1 are in contact with the annular electrode 2, and the pressure between the base 1 and the annular electrode 2 is buffered, so that the pressure change born by the wafer is smoother, and the wafer is prevented from being damaged due to the fact that the pressure mutation is large.
As a preferred embodiment, the bump 21 is provided on the ring electrode 2 and hinged to the base 1 by the bump 21, and the ring electrode 2 is hinged to the base 1 by the bump 21 to rotate, so that the wafer is fixed on the base 1 by covering, the wafer is conveniently fixed and removed, the wafer mounting and dismounting efficiency is improved, and meanwhile, the hanging fixture can also be directly hung on equipment by the bump 21 to carry out moving and electroplating operations.
In this embodiment, the opening at the middle of the ring electrode 2 is a plating opening 201, and when performing plating operation, the plating solution can contact the surface of the wafer to be plated through the plating opening 201, so as to perform plating on the outside of the wafer, and the plating solution is used to contact the wafer to perform plating, where the opening size of the plating opening 201 is the size of the plating surface on the wafer.
As a preferred embodiment, the wafer electroplating device further comprises a protection part 4, wherein the protection part 4 is arranged on the annular electrode 2 and is specifically fixed in the electroplating port 201, so that after the wafer is installed, external objects can be blocked, the wafer is prevented from being contacted with external objects, and meanwhile, the wafer is prevented from being partially outwards turned out through the electroplating port 201 due to improper operation in the operation process, so that the wafer is damaged.
Specifically, the whole protection part 4 is a flat disc, and is consistent with the size of the electroplating port 201, a plurality of openings for supplying electroplating liquid to circulate are formed in the protection part 4, the width of each opening is equal and distributed at equal intervals, and the length of each opening is gradually reduced from the middle part to the two sides, so that the whole disc forms a grid shape, and the electroplating liquid is not blocked from being contacted with the surface of a wafer for coating while the whole disc has good protection performance.
As a preferred embodiment, the base 1 is provided with the anti-sticking groove 11, the anti-sticking groove 11 is positioned on one side of the base 1 facing the annular electrode 2, when the wafer is clamped and fixed on the base 1, the anti-sticking groove 11 can enable a gap to be reserved between the base 1 and the wafer contact surface, the base 1 and one side of the wafer are prevented from being completely attached, after the wafer is coated, the wafer is taken down from the base 1 conveniently, and the wafer is prevented from being adsorbed on the base 1 to cause difficult removal or cause larger abrasion to the wafer.
Specifically, the anti-sticking groove 11 is in a circular ring shape, a complete closed ring-shaped groove is formed in the base 1, the diameter of the ring-shaped groove is slightly smaller than that of the wafer, the wafer is prevented from being located in the middle of the ring-shaped groove, one surface of the wafer is prevented from being completely contacted with the base 1, and meanwhile, compared with other shapes, the anti-sticking groove is more convenient for taking down the wafer.
As a preferred embodiment, the buffer portion 3 is an elastic rubber backing ring, that is, a flat ring gasket made of rubber, the middle of the buffer portion is provided with an opening, a wafer is placed into the buffer portion 3 and contacted with the base 1, meanwhile, the buffer portion 3 is hinged with the base 1, and is specifically hinged between the base 1 and the ring electrode 2, meanwhile, the buffer portion 3 can be disassembled, in the processing process, the buffer portion 3 has limited buffer effect after aging due to repeated extrusion and abrasion, and the protection effect on the wafer is reduced linearly, so that the yield of the wafer can be continuously maintained by replacing the buffer portion 3.
The working principle of the utility model is described as follows: in the process that the annular electrode 2 is matched with the base 1 to clamp the wafer, the buffer part 3 and the base 1 are in contact with the annular electrode 2, and the pressure between the base 1 and the annular electrode 2 is buffered, so that the pressure change born by the wafer is smoother, the wafer is prevented from being damaged due to large pressure mutation, after the wafer is fixed, the clamp and the wafer can be placed into electroplating liquid together, and the wafer is electroplated through the annular electrode 2.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (8)
1. A wafer hanging type electroplating cathode fixture comprises a base (1) and a ring electrode (2), wherein,
the annular electrode (2) is arranged on the base (1) and can be covered on one side of the base (1), and the annular electrode (2) and the base (1) are used for clamping a wafer;
the method is characterized in that: also comprises a buffer part (3), wherein,
the buffer part (3) is arranged between the base (1) and the annular electrode (2) and is used for buffering the pressure of the annular electrode (2) covered on the base (1).
2. The wafer-mounted electroplating cathode fixture as claimed in claim 1, wherein: the annular electrode (2) is provided with a lug (21) and is hinged with the base (1) through the lug (21).
3. The wafer-mounted electroplating cathode fixture as claimed in claim 1, wherein: the annular electrode (2) is provided with an electroplating port (201) for enabling the electroplating solution to contact the wafer for electroplating.
4. The wafer-mounted electroplating cathode fixture as claimed in claim 1, wherein: the wafer protection device further comprises a protection part (4), wherein the protection part (4) is arranged on the annular electrode (2) and is used for protecting the wafer.
5. The wafer-mounted electroplating cathode fixture as claimed in claim 4, wherein: the protection part (4) is arranged in a grid shape.
6. The wafer-mounted electroplating cathode fixture as claimed in claim 1, wherein: the anti-sticking groove (11) is formed in the base (1), and the anti-sticking groove (11) is located on one side, facing the annular electrode (2), of the base (1) and used for preventing a wafer from being completely attached to the base (1).
7. The wafer-mounted electroplating cathode fixture as claimed in claim 6, wherein: the anti-sticking groove (11) is arranged in a circular ring shape.
8. The wafer-mounted electroplating cathode fixture as claimed in claim 1, wherein: the buffer part (3) is an elastic rubber backing ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223555697.8U CN218951544U (en) | 2022-12-29 | 2022-12-29 | Wafer hanging type electroplating cathode clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223555697.8U CN218951544U (en) | 2022-12-29 | 2022-12-29 | Wafer hanging type electroplating cathode clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218951544U true CN218951544U (en) | 2023-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223555697.8U Active CN218951544U (en) | 2022-12-29 | 2022-12-29 | Wafer hanging type electroplating cathode clamp |
Country Status (1)
| Country | Link |
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| CN (1) | CN218951544U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117448927A (en) * | 2023-12-26 | 2024-01-26 | 苏州智程半导体科技股份有限公司 | Anti-fatigue electric ring for wafer electroplating |
-
2022
- 2022-12-29 CN CN202223555697.8U patent/CN218951544U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117448927A (en) * | 2023-12-26 | 2024-01-26 | 苏州智程半导体科技股份有限公司 | Anti-fatigue electric ring for wafer electroplating |
| CN117448927B (en) * | 2023-12-26 | 2024-03-15 | 苏州智程半导体科技股份有限公司 | Anti-fatigue electric ring for wafer electroplating |
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